DE1514230B2 - Halbleiterbauelement und Verfahren zu seiner Herstellung - Google Patents

Halbleiterbauelement und Verfahren zu seiner Herstellung

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Publication number
DE1514230B2
DE1514230B2 DE1514230A DE1514230A DE1514230B2 DE 1514230 B2 DE1514230 B2 DE 1514230B2 DE 1514230 A DE1514230 A DE 1514230A DE 1514230 A DE1514230 A DE 1514230A DE 1514230 B2 DE1514230 B2 DE 1514230B2
Authority
DE
Germany
Prior art keywords
electrodes
semiconductor
semiconductor body
metal
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE1514230A
Other languages
German (de)
English (en)
Other versions
DE1514230A1 (de
Inventor
Koichiro Suita Shoda (Japan)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Publication of DE1514230A1 publication Critical patent/DE1514230A1/de
Publication of DE1514230B2 publication Critical patent/DE1514230B2/de
Withdrawn legal-status Critical Current

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DE1514230A 1964-10-26 1965-10-26 Halbleiterbauelement und Verfahren zu seiner Herstellung Withdrawn DE1514230B2 (de)

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Application Number Priority Date Filing Date Title
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DE1514230B2 true DE1514230B2 (de) 1974-01-24

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DE (1) DE1514230B2 (enrdf_load_stackoverflow)
FR (1) FR1457006A (enrdf_load_stackoverflow)
GB (1) GB1113217A (enrdf_load_stackoverflow)
NL (1) NL6513813A (enrdf_load_stackoverflow)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1909480C2 (de) * 1968-03-01 1984-10-11 General Electric Co., Schenectady, N.Y. Trägeranordnung und Verfahren zur elektrischen Kontaktierung von Halbleiterchips
GB2147457A (en) * 1983-09-28 1985-05-09 Philips Electronic Associated Encapsulated semiconductor device with composite conductive leads

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DE1514230A1 (de) 1969-08-14
FR1457006A (fr) 1966-07-08
NL6513813A (enrdf_load_stackoverflow) 1966-04-27
GB1113217A (en) 1968-05-08

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