DE1489701A1 - Anschlusselektrode zum Kontaktieren von elektronischen,vorzugsweise Halbleiterbauelementen - Google Patents

Anschlusselektrode zum Kontaktieren von elektronischen,vorzugsweise Halbleiterbauelementen

Info

Publication number
DE1489701A1
DE1489701A1 DE19651489701 DE1489701A DE1489701A1 DE 1489701 A1 DE1489701 A1 DE 1489701A1 DE 19651489701 DE19651489701 DE 19651489701 DE 1489701 A DE1489701 A DE 1489701A DE 1489701 A1 DE1489701 A1 DE 1489701A1
Authority
DE
Germany
Prior art keywords
connection electrode
electrode
section
sonotrode
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19651489701
Other languages
English (en)
Inventor
Mueller Dipl-Ing Elmar
Anton Heller
Weimann Dipl-Ing Klaus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri France SA
Original Assignee
BBC Brown Boveri France SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri France SA filed Critical BBC Brown Boveri France SA
Publication of DE1489701A1 publication Critical patent/DE1489701A1/de
Pending legal-status Critical Current

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Description

MANNHEIM *** Dr..Sb/eo.
Anschlußelektrode zum Kontaktieren von elektronischen, vorzugsweise Halbleiterbauelementen
Die Erfindung bezieht sich auf eine Anschlußelektrode zum Kontaktieren von elektronischen, vorzugsweise Halbleiterbauelementen durch Verschweißen mittels Ultraschall.
Es ist bekannt, Aluminiumdxähte oder Drähte aus anderem geeigneten Material, wie Gold oder Silber, die im wesentlichen durchgehend den gleichen Querschnitt haben, als Anschlußelektrode mittels Ultraschall mit Halbleiterkörpern zu verschweißen* Bei dem bekannten Verfahren wird auf eine Siliziumscheibe ein Aluminiumdraht als Gateanschluß eines Thyristors gelegt und durch Ultraschalleinwirkung Über eine Sonotrode das ist eine den Ultraschall führende Vorrichtung - mit der Siliziumscheibe verschweißt. Die Sonotrode schwingt bei dem Schweißvorgang parallel zur Siliziumoberfläche.
Das bekannte Verfahren hat den Nachteil, daß die Anschlußelektrode stark verformt wird. Am Übergang zwischen der Schweißstelle und dem Übrigen Teil der Anschlußelektrode wird der Drahtquereöhnitt verringert und damit die Zug- und Biegefestigkeit der mittels Ultraschall befestigten Anschlußelektrode stark herabgesetzt. Dies führt zu Schwierigkeiten bei der Weiterverarbeitung. Hält man die Verformung der Anschlußelektrode in engeren Grenzen, so wird die Festigkeit der Schweißstelle herabgesetzt*
Es ist die Aufgabe der vorliegenden Erfindung, Ansohlußelektrodtn zu entwickeln, mit denen es möglich'ist, eine Ultraschall- \ schweißung ohne die Nachteile auszuführen, die mit der Verwendung von Drähten mit durchgehend gleichem Querschnitt verbunden sind.
$ 98 24/0 50 2
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Die Aufgabe wird erfindungsgemäß dadurch gelöst, daß die Anschlußelektrode an dem Endstück, das am Bauelement zu befestigen.ist, einen größeren Querschnitt hat, als im übrigen Teil. Der somit am Endstück der Anschlußelektrode · .* vorhandene starke Kopf wird beim Schweißvorgang allein verformt, während der Querschnitt des übrigen Teils der Anschlußelektrode erhalten bleibt.
In vorteilhafter Weiterbildung der Erfindung ist die Ansohlußelektrode so ausgebildet, daß die Übergangsstelle desjenigen Teils der Anschlußelektrode mit dem geringeren Querschnitt in denjenigen Teil mit dem größeren Querschnitt etwa im Mittelpunkt der von dem Bauelement abgewandten Fläche des Teils mit dem größeren Querschnitt liegt. Diese Form der Anschlußelektrode ist insbesondere von Vorteil im Hinblick"auf das erfindungsgemäße Verfahren zum Anbringen der Anschlußelektrode an ein Bauelement, demzufolge die Anschlußelektrode unter Verwendung einer hohlen Sonotrode mittels Ultraschall mit dem Bauelement verschweißt wird. In zweckmäßiger Ausführung des erfindungsgemäßen Verfahrens wird der Teil mit dem größeren Querschnitt durch Schmelzen oder Kaltverformung der Anschlußelektrode vor der Sonotrode hergestellt, nachdem die Anschlußelektrode durch die hohle Sonotrode geführt ist.
Beim Schweißvorgang ist zu beachten, daß Sonotrode und Halbleiteroberfläche so beschaffen sind, daß die Haftreibung zwischen Sonotrode und Anschlußelektrode größer ist, als die zwischen Anschlußelektrode und Halbleiteroberfläche. Duron geeignete Wahl von Anpressdruck, Ültraschalleistung und Schweißzeit kann erreicht werden, daß sich eine echte legierung aus der Anschlußelektrode und dem Halbleitermaterial bildet.
Wählt man die miteinander zu verbindenden Materialien entspreohend, eo Bind auf dem Halbleitermaterial sowohl sperrfreie als auch sperrende Kontakte herstellbar. Es ergibt sich z. B. bei der Verwendung einer Anschlußelektrode aus Aluminium und eines p-leitenden Siliziums ein sperrfreier Eontakt. Bringt man dagegen eine Anschlußelektrode aus Aluminium auf n-leitendem
909824/050 2,
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Halbleitermaterial an, so erhält man einen sperrenden Kontakt. Es ist mit dem erfindungsgemäßen Verfahren auch möglich,. die Anschlußelektrode durch dünne Metallüberzüge - die etwa aus Nickel und/oderxGold bestehen können - hindurch mit dem \ Halbleiter zu verschweißen, ebenso wie durch eine auf dem Halbleiter befindliche liackschutzschicht« Wählt man günstige Schweißbedingungen (höherer Anpreßdruck und größere Ultraeohalleistung, aber kürzere Schweißzeit, als bei. der Verbindung der Aneehlußelektrode durch einen vorhandenen Metall-Überzug hindurch mit dem Halbleiter), so kann die Ansehlußelektrode auch direkt auf den vorhandenen Metallüberzug aufgeschweißt werden« . . ,
Mit dem erfindungsgemäßen Verfahren unter Verwendung der Anschlußelektrode nach der Erfindung ist es möglich, auf einem Bauelement mehrere Anschlüsse anzubringen, einige Bauelemente miteinander zu verbinden, sowie Anschlüsse außer auf dem \ Halbleiterkörper auch an änderen Teilen des Bauelementes anzubringen«
Zur näheren Erläuterung der Erfindung wird auf die Zeichnung Bezug genommen, in der ein Beispiel dargestellt ist. Oberhalb einer Siliziumschelbe 1 mit η-Dotierung befindet sich eine Anschlußelektrode 2 aus Aluminium innerhalb einer hohlen | Sonotrode 4, die an dem Endstück, das an der Siliziumscheibe '■ · befestigt werden soll, einen größeren Querschnitt 3.hat, als im übrigen Teily Das Endstück mit dem größeren Querschnitt ist durch Kaltverformung vor der Sonotrode hergestellt worden, nachdem die Anschlußelektrode durch die hohle Sonotrode ge-^ führt worden ist. Im vorliegenden Falle entsteht durch das Anbringen der Anschlußelektrode aus Aluminium auf dem n-leitenden Siliziumplättchen mittels Ultraschallschweißung ein sperrender Kontakt.
ORIGINAL INSPECTED 909824/0502

Claims (4)

t -4- 28.7.1965 623/65 Patentansprüche ■ ' 1 4 8 9 ¥ O 1 \
1. Anachlußelektrode zum Kontaktieren von elektronischen, vorzugsweise Halbleiterbauelementen durch Anschweiß-en mittels Ultraschall, dadurch gekennzeichnet, daß die Anschlußelektrode an dem Endstück, das am Bauelement zu befestigen ist, einen größeren Querschnitt hat, als im Übrigen Teil.
2. Anschlußelektrode nach Anspruch 1, dadurch gekennzeichnet, daß die Übergangsstelle desjenigen Teils der Anschlußelektrode mit dem geringeren Querschnitt in denjenigen Teil
' mit dem größeren Querschnitt etwa im Mittelpunkt der von dem Bauelement abgewandten Fläche des Teiles mit dem größeren Querschnitt liegt.
;"
3. Verfahren zum Anbringen der Anschlußelektrode nach Anspruch oder 2 an ein Bauelement, dadurch gekennzeichnet, daß die Anschlußelektrode unter Verwendung einer hohlen Sonotrode mittels Ultraschall mit dem Bauelement verschweißt wird.
4. Verfahren nach Anspruch 3, dadurch gekennzeichnet, daß der Teil mit dem größeren Querschnitt durch Schmelzen oder Kaltverformung der Anschlußelektrode vor der Sonotrode hergestellt wird, nach-xdem die Anschlußelektrode durch die hohle Sonotrode geführt ist.
5· Verfahren nach Anspruch 3 oder 4, dadurch gekennzeichnet, daß durch das Anbringen der Anschlußelektrode mittels Ultraschallschweißung sperrfreie Kontakte auf Halbleitermaterial bzw. einem metallischen Überzug des Halbleitermaterials hergestellt werden..
6, Verfahren nach Anspruch 3 oder 4, dadurch gekennzeichnet, daß durch das Anbringen der Anschlußelektrode mittels Ultraschallschweißung sperrende Kontakte auf Halbleitermaterial hergestellt werden.
309824/0502
DE19651489701 1965-07-31 1965-07-31 Anschlusselektrode zum Kontaktieren von elektronischen,vorzugsweise Halbleiterbauelementen Pending DE1489701A1 (de)

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