DE146877C - - Google Patents

Info

Publication number
DE146877C
DE146877C DENDAT146877D DE146877DA DE146877C DE 146877 C DE146877 C DE 146877C DE NDAT146877 D DENDAT146877 D DE NDAT146877D DE 146877D A DE146877D A DE 146877DA DE 146877 C DE146877 C DE 146877C
Authority
DE
Germany
Prior art keywords
prism
paper
trimming
trimmed
scissors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DENDAT146877D
Other languages
German (de)
English (en)
Publication of DE146877C publication Critical patent/DE146877C/de
Active legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/01Means for holding or positioning work
    • B26D7/015Means for holding or positioning work for sheet material or piles of sheets

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Photographic Processing Devices Using Wet Methods (AREA)
  • Details Of Cutting Devices (AREA)
DENDAT146877D Active DE146877C (fr)

Publications (1)

Publication Number Publication Date
DE146877C true DE146877C (fr)

Family

ID=414111

Family Applications (1)

Application Number Title Priority Date Filing Date
DENDAT146877D Active DE146877C (fr)

Country Status (1)

Country Link
DE (1) DE146877C (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5051377A (en) * 1988-09-01 1991-09-24 International Business Machines Corporation Method for forming a thin dielectric layer on a substrate
US5086004A (en) * 1988-03-14 1992-02-04 Polaroid Corporation Isolation of layered P-N junctions by diffusion to semi-insulating substrate and implantation of top layer
US5139869A (en) * 1988-09-01 1992-08-18 Wolfgang Euen Thin dielectric layer on a substrate
US5268311A (en) * 1988-09-01 1993-12-07 International Business Machines Corporation Method for forming a thin dielectric layer on a substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5086004A (en) * 1988-03-14 1992-02-04 Polaroid Corporation Isolation of layered P-N junctions by diffusion to semi-insulating substrate and implantation of top layer
US5051377A (en) * 1988-09-01 1991-09-24 International Business Machines Corporation Method for forming a thin dielectric layer on a substrate
US5139869A (en) * 1988-09-01 1992-08-18 Wolfgang Euen Thin dielectric layer on a substrate
US5268311A (en) * 1988-09-01 1993-12-07 International Business Machines Corporation Method for forming a thin dielectric layer on a substrate

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