DE1279798B - Flachgepackte integrierte Schaltung - Google Patents

Flachgepackte integrierte Schaltung

Info

Publication number
DE1279798B
DE1279798B DEJ30584A DEJ0030584A DE1279798B DE 1279798 B DE1279798 B DE 1279798B DE J30584 A DEJ30584 A DE J30584A DE J0030584 A DEJ0030584 A DE J0030584A DE 1279798 B DE1279798 B DE 1279798B
Authority
DE
Germany
Prior art keywords
integrated circuit
melting glass
glass
low
circuit according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DEJ30584A
Other languages
German (de)
English (en)
Inventor
Charles Robert Cook Jun
Ronald William Mohnkern
Salvatore Michael Sampiere
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Micronas GmbH
Original Assignee
Deutsche ITT Industries GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche ITT Industries GmbH filed Critical Deutsche ITT Industries GmbH
Publication of DE1279798B publication Critical patent/DE1279798B/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • H10W70/421—
    • H10W74/43—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H10W72/5449—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
DEJ30584A 1965-03-17 1966-03-02 Flachgepackte integrierte Schaltung Withdrawn DE1279798B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US44052565A 1965-03-17 1965-03-17

Publications (1)

Publication Number Publication Date
DE1279798B true DE1279798B (de) 1968-10-10

Family

ID=23749099

Family Applications (1)

Application Number Title Priority Date Filing Date
DEJ30584A Withdrawn DE1279798B (de) 1965-03-17 1966-03-02 Flachgepackte integrierte Schaltung

Country Status (5)

Country Link
BE (1) BE677962A (enExample)
DE (1) DE1279798B (enExample)
ES (1) ES324355A1 (enExample)
GB (1) GB1117675A (enExample)
NL (1) NL6603525A (enExample)

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

Also Published As

Publication number Publication date
BE677962A (enExample) 1966-09-19
NL6603525A (enExample) 1966-09-19
ES324355A1 (es) 1967-02-01
GB1117675A (en) 1968-06-19

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Legal Events

Date Code Title Description
E771 Valid patent as to the heymanns-index 1977, willingness to grant licences
EHJ Ceased/non-payment of the annual fee