DE1279798B - Flachgepackte integrierte Schaltung - Google Patents
Flachgepackte integrierte SchaltungInfo
- Publication number
- DE1279798B DE1279798B DEJ30584A DEJ0030584A DE1279798B DE 1279798 B DE1279798 B DE 1279798B DE J30584 A DEJ30584 A DE J30584A DE J0030584 A DEJ0030584 A DE J0030584A DE 1279798 B DE1279798 B DE 1279798B
- Authority
- DE
- Germany
- Prior art keywords
- integrated circuit
- melting glass
- glass
- low
- circuit according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/121—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US44052565A | 1965-03-17 | 1965-03-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1279798B true DE1279798B (de) | 1968-10-10 |
Family
ID=23749099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEJ30584A Withdrawn DE1279798B (de) | 1965-03-17 | 1966-03-02 | Flachgepackte integrierte Schaltung |
Country Status (5)
| Country | Link |
|---|---|
| BE (1) | BE677962A (enExample) |
| DE (1) | DE1279798B (enExample) |
| ES (1) | ES324355A1 (enExample) |
| GB (1) | GB1117675A (enExample) |
| NL (1) | NL6603525A (enExample) |
-
1966
- 1966-03-02 DE DEJ30584A patent/DE1279798B/de not_active Withdrawn
- 1966-03-11 GB GB10804/66A patent/GB1117675A/en not_active Expired
- 1966-03-17 ES ES0324355A patent/ES324355A1/es not_active Expired
- 1966-03-17 BE BE677962D patent/BE677962A/xx unknown
- 1966-03-17 NL NL6603525A patent/NL6603525A/xx unknown
Non-Patent Citations (1)
| Title |
|---|
| None * |
Also Published As
| Publication number | Publication date |
|---|---|
| NL6603525A (enExample) | 1966-09-19 |
| BE677962A (enExample) | 1966-09-19 |
| ES324355A1 (es) | 1967-02-01 |
| GB1117675A (en) | 1968-06-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE1300788C2 (de) | Verfahren zur herstellung kugeliger loetperlen auf traegerplatten | |
| DE69832324T2 (de) | Herstellungsverfahren für einen Halbleiter | |
| DE3127457C2 (de) | Stromrichtermodul | |
| DE2314731C3 (de) | Halbleiteranordnung mit höckerartigen Vorsprüngen auf Kontaktflecken und Verfahren zur Herstellung einer solchen Halbleiteranordnung | |
| DE4135189B4 (de) | Verfahren zur Montage des Gehäuses eines Halbleiter-Bauelements | |
| DE2749848B2 (de) | Wärmebrücke einer in einem Gehäuse eingekapselten integrierten Schaltung | |
| EP3055095B1 (de) | Verfahren zur herstellung einer metall-keramiklötverbindung | |
| DE1489781A1 (de) | Verfahren zur Herstellung eines elektronischen Bauelementes und nach diesem Verfahren hergestelltes Bauelement | |
| DE3733304A1 (de) | Vorrichtung und verfahren zum versiegeln eines hermetisch dichten keramikgehaeuses mit einem keramikdeckel | |
| DE2236007A1 (de) | Elektronischer schaltungsblock und verfahren zu seiner herstellung | |
| DE2318727B2 (de) | Verfahren zum Verbinden eines kermaischen Körpers mit einem anderen Körper | |
| DE1260034B (de) | Verfahren zur Herstellung eines Dichtungsrahmens zum Einkapseln einer Halbleiteranordnung | |
| DE2248303C2 (de) | Halbleiterbauelement | |
| DE1239020B (de) | Verfahren zum Herstellen einer Halbleiteranordnung mit Zufuehrungsleitungen, die mitdem Gehaeuse dicht verschmolzen sind | |
| DE1907567A1 (de) | Elektrische Schaltungseinheit | |
| DE3913066A1 (de) | Verfahren zur herstellung eines hermetisch dichten gehaeuses sowie nach diesem verfahren hergestelltes gehaeuse | |
| DE2350725A1 (de) | Halbleitereinrichtungen | |
| DE1279798B (de) | Flachgepackte integrierte Schaltung | |
| DE2824426C2 (de) | Gehäuse zur Kapselung von elektrischen und/oder elektronischen Bauelementen | |
| DE2136201C3 (de) | Verfahren zum Anbringen metallischer Zuleitungen an einem elektrischen Festkörper-Bauelement | |
| DE2028821B2 (de) | Gehaeuse fuer ein halbleiterbauelement | |
| DE69511992T2 (de) | Halbleiteranordnung und Verfahren zur Herstellung | |
| DE2010429A1 (de) | Elektrische Schaltungsanordnung mit hermetischer Abdichtung | |
| DE2244708C3 (de) | Elektronische Miniaturschaltung | |
| DE2008496A1 (de) | Packungssystem für hybrid integrierte Schaltungen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E771 | Valid patent as to the heymanns-index 1977, willingness to grant licences | ||
| EHJ | Ceased/non-payment of the annual fee |