ES324355A1 - Dispositivo de placa con circuito integrado y metodo para la fabricacion del mismo. - Google Patents

Dispositivo de placa con circuito integrado y metodo para la fabricacion del mismo.

Info

Publication number
ES324355A1
ES324355A1 ES0324355A ES324355A ES324355A1 ES 324355 A1 ES324355 A1 ES 324355A1 ES 0324355 A ES0324355 A ES 0324355A ES 324355 A ES324355 A ES 324355A ES 324355 A1 ES324355 A1 ES 324355A1
Authority
ES
Spain
Prior art keywords
integrated circuit
members
plate device
manufacture
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
ES0324355A
Other languages
English (en)
Spanish (es)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Spain SA
Original Assignee
Alcatel Espana SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alcatel Espana SA filed Critical Alcatel Espana SA
Publication of ES324355A1 publication Critical patent/ES324355A1/es
Expired legal-status Critical Current

Links

Classifications

    • H10W74/121—
    • H10W70/421—
    • H10W74/43—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H10W72/5449—

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
ES0324355A 1965-03-17 1966-03-17 Dispositivo de placa con circuito integrado y metodo para la fabricacion del mismo. Expired ES324355A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US44052565A 1965-03-17 1965-03-17

Publications (1)

Publication Number Publication Date
ES324355A1 true ES324355A1 (es) 1967-02-01

Family

ID=23749099

Family Applications (1)

Application Number Title Priority Date Filing Date
ES0324355A Expired ES324355A1 (es) 1965-03-17 1966-03-17 Dispositivo de placa con circuito integrado y metodo para la fabricacion del mismo.

Country Status (5)

Country Link
BE (1) BE677962A (enExample)
DE (1) DE1279798B (enExample)
ES (1) ES324355A1 (enExample)
GB (1) GB1117675A (enExample)
NL (1) NL6603525A (enExample)

Also Published As

Publication number Publication date
DE1279798B (de) 1968-10-10
BE677962A (enExample) 1966-09-19
NL6603525A (enExample) 1966-09-19
GB1117675A (en) 1968-06-19

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