DE1169114B - Verwendung von Epoxyharzen zur Verbindung und/oder Formung von Konstruktionsteilen - Google Patents
Verwendung von Epoxyharzen zur Verbindung und/oder Formung von KonstruktionsteilenInfo
- Publication number
- DE1169114B DE1169114B DEM41464A DEM0041464A DE1169114B DE 1169114 B DE1169114 B DE 1169114B DE M41464 A DEM41464 A DE M41464A DE M0041464 A DEM0041464 A DE M0041464A DE 1169114 B DE1169114 B DE 1169114B
- Authority
- DE
- Germany
- Prior art keywords
- epoxy resins
- structural parts
- join
- resins
- shape structural
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 9
- 229920000647 polyepoxide Polymers 0.000 title claims description 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title claims description 8
- 238000000034 method Methods 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 7
- 238000010276 construction Methods 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000007493 shaping process Methods 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 241001076195 Lampsilis ovata Species 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 238000000465 moulding Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000004848 polyfunctional curative Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000007792 addition Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- DYDNPESBYVVLBO-UHFFFAOYSA-N formanilide Chemical compound O=CNC1=CC=CC=C1 DYDNPESBYVVLBO-UHFFFAOYSA-N 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/66—Connections with the terrestrial mass, e.g. earth plate, earth pin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/06—Manufacture of commutators
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL251275D NL251275A (enrdf_load_stackoverflow) | 1959-05-08 | ||
| DEM41464A DE1169114B (de) | 1959-05-08 | 1959-05-08 | Verwendung von Epoxyharzen zur Verbindung und/oder Formung von Konstruktionsteilen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEM41464A DE1169114B (de) | 1959-05-08 | 1959-05-08 | Verwendung von Epoxyharzen zur Verbindung und/oder Formung von Konstruktionsteilen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1169114B true DE1169114B (de) | 1964-04-30 |
Family
ID=7304027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEM41464A Pending DE1169114B (de) | 1959-05-08 | 1959-05-08 | Verwendung von Epoxyharzen zur Verbindung und/oder Formung von Konstruktionsteilen |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE1169114B (enrdf_load_stackoverflow) |
| NL (1) | NL251275A (enrdf_load_stackoverflow) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE559783A (enrdf_load_stackoverflow) * | 1956-08-03 | 1900-01-01 | ||
| DE1038752B (de) * | 1956-04-04 | 1958-09-11 | Ciba Geigy | Verwendung eines Arylamin-Formaldehyd-Harzes als Haertungsmittel fuer Epoxyharze |
| DE1046877B (de) * | 1956-08-30 | 1958-12-18 | Bataafsche Petroleum | Waermehaertbare Form-, UEberzugs- und Klebmasse auf Epoxyharzbasis |
| DE1050538B (de) * | 1959-02-12 | LICENTIA Patent-Verwaltungs GmbH Hamburg | Verfahren zur Herstellung von IsoIiLrkorpcrn aus Glimmer fur elektrotechnische Zwecke | |
| DE1054705B (de) * | 1958-01-20 | 1959-04-09 | Leuna Werke Veb | Verfahren zum gegebenenfalls mehrstufigen Haerten von Epoxyharzen |
-
0
- NL NL251275D patent/NL251275A/xx unknown
-
1959
- 1959-05-08 DE DEM41464A patent/DE1169114B/de active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1050538B (de) * | 1959-02-12 | LICENTIA Patent-Verwaltungs GmbH Hamburg | Verfahren zur Herstellung von IsoIiLrkorpcrn aus Glimmer fur elektrotechnische Zwecke | |
| DE1038752B (de) * | 1956-04-04 | 1958-09-11 | Ciba Geigy | Verwendung eines Arylamin-Formaldehyd-Harzes als Haertungsmittel fuer Epoxyharze |
| BE559783A (enrdf_load_stackoverflow) * | 1956-08-03 | 1900-01-01 | ||
| DE1046877B (de) * | 1956-08-30 | 1958-12-18 | Bataafsche Petroleum | Waermehaertbare Form-, UEberzugs- und Klebmasse auf Epoxyharzbasis |
| DE1054705B (de) * | 1958-01-20 | 1959-04-09 | Leuna Werke Veb | Verfahren zum gegebenenfalls mehrstufigen Haerten von Epoxyharzen |
Also Published As
| Publication number | Publication date |
|---|---|
| NL251275A (enrdf_load_stackoverflow) | 1900-01-01 |
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