DE1167452C2 - Verfahren zur Herstellung eines elektrischen Anschlusses an einer Halbleiterscheibe - Google Patents

Verfahren zur Herstellung eines elektrischen Anschlusses an einer Halbleiterscheibe

Info

Publication number
DE1167452C2
DE1167452C2 DE1962R0033739 DER0033739A DE1167452C2 DE 1167452 C2 DE1167452 C2 DE 1167452C2 DE 1962R0033739 DE1962R0033739 DE 1962R0033739 DE R0033739 A DER0033739 A DE R0033739A DE 1167452 C2 DE1167452 C2 DE 1167452C2
Authority
DE
Germany
Prior art keywords
plate
semiconductor wafer
disk
disc
electron beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE1962R0033739
Other languages
German (de)
English (en)
Other versions
DE1167452B (de
Inventor
Joseph Henry Mccusker
Richard Edward Quinn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RCA Corp
Original Assignee
RCA Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RCA Corp filed Critical RCA Corp
Publication of DE1167452B publication Critical patent/DE1167452B/de
Application granted granted Critical
Publication of DE1167452C2 publication Critical patent/DE1167452C2/de
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/24—Alloying of impurity materials, e.g. doping materials, electrode materials, with a semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/70—Tunnel-effect diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/02—Contacts, special
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/071—Heating, selective
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00—Metal treatment
    • Y10S148/134—Remelt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Welding Or Cutting Using Electron Beams (AREA)
  • Electrodes Of Semiconductors (AREA)
DE1962R0033739 1961-10-24 1962-10-23 Verfahren zur Herstellung eines elektrischen Anschlusses an einer Halbleiterscheibe Expired DE1167452C2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US147238A US3179542A (en) 1961-10-24 1961-10-24 Method of making semiconductor devices

Publications (2)

Publication Number Publication Date
DE1167452B DE1167452B (de) 1964-04-09
DE1167452C2 true DE1167452C2 (de) 1964-11-12

Family

ID=22520786

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1962R0033739 Expired DE1167452C2 (de) 1961-10-24 1962-10-23 Verfahren zur Herstellung eines elektrischen Anschlusses an einer Halbleiterscheibe

Country Status (6)

Country Link
US (1) US3179542A (en, 2012)
BE (1) BE623962A (en, 2012)
DE (1) DE1167452C2 (en, 2012)
FR (1) FR1343800A (en, 2012)
GB (1) GB989444A (en, 2012)
NL (1) NL284623A (en, 2012)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1350402A (fr) * 1962-03-16 1964-01-24 Gen Electric Dispositifs à semiconducteurs et méthodes de fabrication
US3340601A (en) * 1963-07-17 1967-09-12 United Aircraft Corp Alloy diffused transistor
US3271637A (en) * 1963-07-22 1966-09-06 Nasa Gaas solar detector using manganese as a doping agent
US3295185A (en) * 1963-10-15 1967-01-03 Westinghouse Electric Corp Contacting of p-nu junctions
GB1112992A (en) * 1964-08-18 1968-05-08 Texas Instruments Inc Three-dimensional integrated circuits and methods of making same
US3323198A (en) * 1965-01-27 1967-06-06 Texas Instruments Inc Electrical interconnections
US3351503A (en) * 1965-09-10 1967-11-07 Horizons Inc Production of p-nu junctions by diffusion
US3434894A (en) * 1965-10-06 1969-03-25 Ion Physics Corp Fabricating solid state devices by ion implantation
FR1474973A (fr) * 1966-02-16 1967-03-31 Radiotechnique Coprim Rtc Procédé de fabrication d'une couche de contact pour dispositifs semi-conducteurs et produits obtenus
US3543394A (en) * 1967-05-24 1970-12-01 Sheldon L Matlow Method for depositing thin films in controlled patterns
JPS5147144B2 (en, 2012) * 1972-04-28 1976-12-13
US4394183A (en) * 1981-11-18 1983-07-19 Bell Telephone Laboratories, Incorporated Solidification of molten materials
FR2523369B1 (fr) * 1982-03-12 1985-11-29 Telecommunications Sa Detecteur infrarouge matriciel
US4660066A (en) * 1982-09-08 1987-04-21 Texas Instruments Incorporated Structure for packaging focal plane imagers and signal processing circuits
US7476606B2 (en) * 2006-03-28 2009-01-13 Northrop Grumman Corporation Eutectic bonding of ultrathin semiconductors
DE102014004035A1 (de) * 2014-03-21 2015-10-08 Probeam Ag & Co. Kgaa Verfahren zum Erzeugen kleiner Bohrungen in Werkstücken

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE903017C (de) * 1951-01-31 1954-02-01 Sueddeutsche Lab G M B H Herstellung kleiner Kugeln aus hochschmelzbaren Materialien
DE938681C (de) * 1951-02-01 1956-02-02 Zeiss Carl Fa Verfahren zum Bohren feiner Loecher
DE896827C (de) * 1951-09-08 1953-11-16 Licentia Gmbh Verfahren zur formgebenden Bearbeitung von kristallenen Halbleiterkoerpern
BE525386A (en, 2012) * 1952-12-29
US2860251A (en) * 1953-10-15 1958-11-11 Rauland Corp Apparatus for manufacturing semi-conductor devices
NL110588C (en, 2012) * 1955-03-10
US2883544A (en) * 1955-12-19 1959-04-21 Sprague Electric Co Transistor manufacture
NL240710A (en, 2012) * 1958-07-01
NL241982A (en, 2012) * 1958-08-13 1900-01-01
US2919388A (en) * 1959-03-17 1959-12-29 Hoffman Electronics Corp Semiconductor devices

Also Published As

Publication number Publication date
FR1343800A (fr) 1963-11-22
BE623962A (en, 2012)
NL284623A (en, 2012)
US3179542A (en) 1965-04-20
GB989444A (en) 1965-04-22
DE1167452B (de) 1964-04-09

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