DE112024001418T5 - Schaltungsplatine - Google Patents

Schaltungsplatine

Info

Publication number
DE112024001418T5
DE112024001418T5 DE112024001418.6T DE112024001418T DE112024001418T5 DE 112024001418 T5 DE112024001418 T5 DE 112024001418T5 DE 112024001418 T DE112024001418 T DE 112024001418T DE 112024001418 T5 DE112024001418 T5 DE 112024001418T5
Authority
DE
Germany
Prior art keywords
section
conductor
layer
conductor layer
height
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112024001418.6T
Other languages
German (de)
English (en)
Inventor
Tomohiro Furumura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of DE112024001418T5 publication Critical patent/DE112024001418T5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4647—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits by applying an insulating layer around previously made via studs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/421—Blind plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE112024001418.6T 2023-04-20 2024-04-09 Schaltungsplatine Pending DE112024001418T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023-069297 2023-04-20
JP2023069297 2023-04-20
PCT/JP2024/014342 WO2024219285A1 (ja) 2023-04-20 2024-04-09 回路基板

Publications (1)

Publication Number Publication Date
DE112024001418T5 true DE112024001418T5 (de) 2026-01-08

Family

ID=93152457

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112024001418.6T Pending DE112024001418T5 (de) 2023-04-20 2024-04-09 Schaltungsplatine

Country Status (5)

Country Link
US (1) US20260032811A1 (https=)
JP (1) JPWO2024219285A1 (https=)
CN (1) CN121003013A (https=)
DE (1) DE112024001418T5 (https=)
WO (1) WO2024219285A1 (https=)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11330654A (ja) * 1998-05-12 1999-11-30 Matsushita Electric Ind Co Ltd 配線基板及びその製造方法
JP4331331B2 (ja) * 1999-07-12 2009-09-16 イビデン株式会社 多層プリント配線板用の片面回路基板およびその製造方法
JP2006049434A (ja) * 2004-08-02 2006-02-16 Hitachi Metals Ltd 接着シート及びその接着シートの製造方法並びにその接着シートを用いたプリント基板
JP4341588B2 (ja) * 2005-06-09 2009-10-07 株式会社デンソー 多層基板及びその製造方法
WO2018079198A1 (ja) * 2016-10-28 2018-05-03 株式会社村田製作所 樹脂回路基板
WO2018216597A1 (ja) * 2017-05-26 2018-11-29 株式会社村田製作所 多層配線基板、電子機器、及び、多層配線基板の製造方法
WO2022202322A1 (ja) * 2021-03-26 2022-09-29 株式会社村田製作所 配線基板、積層基板及び配線基板の製造方法
JP2022150717A (ja) * 2021-03-26 2022-10-07 株式会社村田製作所 配線基板、積層基板及び配線基板の製造方法

Also Published As

Publication number Publication date
US20260032811A1 (en) 2026-01-29
CN121003013A (zh) 2025-11-21
WO2024219285A1 (ja) 2024-10-24
JPWO2024219285A1 (https=) 2024-10-24

Similar Documents

Publication Publication Date Title
DE60131677T2 (de) I-kanal-oberflächenmontage-verbinder
DE68921732T2 (de) Verfahren zur Herstellung von gedruckten Mehrschicht-Leiterplatten.
DE69408432T2 (de) Keramisches Mehrschichtschaltungssubstrat, Verfahren zu seiner Herstellung und elektrisch leitfähiges Material zur Verwendung in keramischem Mehrschichtschaltungssubstrat
DE69104750T2 (de) Verfahren zur Herstellung von Mehrschichtplatinen.
DE69730629T2 (de) Leiterplatte und Elektronikkomponente
DE102016112289B4 (de) Leiterrahmen und Verfahren zur Herstellung desselben
DE69233232T2 (de) Elektrischer Verbindungskörper und Herstellungsverfahren dafür
DE19811870B4 (de) Thermistorelement
DE69935051T2 (de) BGA Widerstandsnetzwerk mit geringem Übersprechen
DE69215377T2 (de) Aufschmeltzlötsverfahren zum bilden von einem löthocker auf einer printplatte
DE69836944T2 (de) Verbesserte luftisolierte Kreuzungsstruktur
DE112015005031T5 (de) Substrate und verfahren zu ihrer herstellung
EP0193127A1 (de) Filmmontierter Schaltkreis und Verfahren zu seiner Herstellung
EP1371273B1 (de) Verbund aus flächigen leiterelementen
DE69630169T2 (de) Herstellungsverfahren eines Verdrahtungssubstrates zur Verbindung eines Chips zu einem Träger
DE10245688A1 (de) Mehrschichtkeramikelektronikteil, Elektronikteilaggregat und Verfahren zum Herstellen eines Mehrschichtkeramikelektronikteils
DE102023110740A1 (de) Mehrschichtige Kerne, Durchkontaktierungen variabler Breite und versetzte Durchkontaktierungen
DE2510757A1 (de) Verfahren zum herstellen von traegersubstraten fuer hochintegrierte halbleiter-schaltungsplaettchen und durch dieses verfahren hergestellte substrate
DE112017002883T5 (de) Verfahren zum Herstellen eines Mehrschichtsubstrats
DE3544539A1 (de) Halbleiteranordnung mit metallisierungsbahnen verschiedener staerke sowie verfahren zu deren herstellung
DE102018215686A1 (de) Leiterplatte und Planer Transformatorgebiet der Erfindung
DE112024001418T5 (de) Schaltungsplatine
DE112024001376T5 (de) Schaltungsplatine und verfahren zum herstellen einer schaltungsplatte
EP0193128A2 (de) Filmmontierter Schaltkreis und Verfahren zu seiner Herstellung
DE102021100177B4 (de) Leistungshalbleitervorrichtung und Herstellungsverfahren für diese

Legal Events

Date Code Title Description
R012 Request for examination validly filed