DE112021001827T5 - Laserbearbeitungsvorrichtung, Laserbearbeitungsverfahren und Transmissionsinhibitionsflüssigkeit - Google Patents

Laserbearbeitungsvorrichtung, Laserbearbeitungsverfahren und Transmissionsinhibitionsflüssigkeit Download PDF

Info

Publication number
DE112021001827T5
DE112021001827T5 DE112021001827.2T DE112021001827T DE112021001827T5 DE 112021001827 T5 DE112021001827 T5 DE 112021001827T5 DE 112021001827 T DE112021001827 T DE 112021001827T DE 112021001827 T5 DE112021001827 T5 DE 112021001827T5
Authority
DE
Germany
Prior art keywords
laser processing
laser
liquid
transmission
workpiece
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021001827.2T
Other languages
German (de)
English (en)
Inventor
Yoshihiro Yamaguchi
Shigeru Nozaki
Kyohei Okamoto
Nobuhiro Takata
Keita Kondou
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Komatsu Industries Corp
Original Assignee
Komatsu Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Industries Corp filed Critical Komatsu Industries Corp
Publication of DE112021001827T5 publication Critical patent/DE112021001827T5/de
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/706—Protective screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/21—Bonding by welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • B23K26/0884—Devices involving movement of the laser head in at least one axial direction in at least two axial directions in at least in three axial directions, e.g. manipulators, robots
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/10—Devices involving relative movement between laser beam and workpiece using a fixed support, i.e. involving moving the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
    • B23K26/122—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in a liquid, e.g. underwater
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/704—Beam dispersers, e.g. beam wells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work for planar work

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Robotics (AREA)
  • Laser Beam Processing (AREA)
DE112021001827.2T 2020-07-10 2021-05-21 Laserbearbeitungsvorrichtung, Laserbearbeitungsverfahren und Transmissionsinhibitionsflüssigkeit Pending DE112021001827T5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020118893 2020-07-10
JP2020-118893 2020-07-10
PCT/JP2021/019283 WO2022009535A1 (fr) 2020-07-10 2021-05-21 Dispositif et procédé de traitement au laser, et liquide d'inhibition de transmission

Publications (1)

Publication Number Publication Date
DE112021001827T5 true DE112021001827T5 (de) 2023-01-26

Family

ID=79552904

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021001827.2T Pending DE112021001827T5 (de) 2020-07-10 2021-05-21 Laserbearbeitungsvorrichtung, Laserbearbeitungsverfahren und Transmissionsinhibitionsflüssigkeit

Country Status (5)

Country Link
US (1) US20230191538A1 (fr)
JP (2) JP7312328B2 (fr)
CN (1) CN115702057A (fr)
DE (1) DE112021001827T5 (fr)
WO (1) WO2022009535A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023040727A (ja) * 2021-09-10 2023-03-23 コマツ産機株式会社 熱加工装置および熱加工方法
JP2023167158A (ja) * 2022-05-11 2023-11-24 株式会社小松製作所 レーザ加工機、及び、レーザ加工機用のノズルユニット

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62168692A (ja) 1986-01-21 1987-07-24 Mitsubishi Electric Corp レ−ザ加工装置
JPH08132270A (ja) 1994-11-08 1996-05-28 Amada Co Ltd レーザ加工方法およびその装置
JP5940582B2 (ja) 2014-04-22 2016-06-29 小池酸素工業株式会社 レーザ加工装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4984000A (fr) * 1972-12-19 1974-08-13
JPS62267095A (ja) * 1986-05-15 1987-11-19 Toshiba Corp レ−ザ加工方法
JP2998517B2 (ja) * 1992-10-23 2000-01-11 三菱電機株式会社 加工ヘッド及びレーザ加工装置
JPH0727903A (ja) * 1993-07-13 1995-01-31 Sumitomo Metal Mining Co Ltd レーザー光用パワーダンパー
JP2012164974A (ja) 2011-01-21 2012-08-30 Tokyo Seimitsu Co Ltd レーザー加工装置、及びレーザー加工方法
JP6961326B2 (ja) 2016-03-30 2021-11-05 古河電気工業株式会社 レーザ光遮蔽材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62168692A (ja) 1986-01-21 1987-07-24 Mitsubishi Electric Corp レ−ザ加工装置
JPH08132270A (ja) 1994-11-08 1996-05-28 Amada Co Ltd レーザ加工方法およびその装置
JP5940582B2 (ja) 2014-04-22 2016-06-29 小池酸素工業株式会社 レーザ加工装置

Also Published As

Publication number Publication date
JP2023130450A (ja) 2023-09-20
WO2022009535A1 (fr) 2022-01-13
CN115702057A (zh) 2023-02-14
JPWO2022009535A1 (fr) 2022-01-13
JP7312328B2 (ja) 2023-07-20
US20230191538A1 (en) 2023-06-22

Similar Documents

Publication Publication Date Title
DE112021001827T5 (de) Laserbearbeitungsvorrichtung, Laserbearbeitungsverfahren und Transmissionsinhibitionsflüssigkeit
DE69837379T2 (de) Verfahren und Vorrichtung zur Prüfung des Zustandes eines Schutzglases bei der Laserbearbeitung
DE10325906B4 (de) Vorrichtung zur Abschirmung von kohärenter elektromagnetischer Strahlung sowie Laserkabine mit einer solchen Vorrichtung
DE102010015739B4 (de) Laserstrahlbearbeitungsvorrichtung
DE112009001200B4 (de) Laserbearbeitungsverfahren und Laserbearbeitungsvorrichtung hierfür
DE102007049553B4 (de) Laserbearbeitungsverfahren für Galliumarsenid-Wafer
DE102006014852A1 (de) Halbleiter-Wafer mit mehrfachen Halbleiterelementen und Verfahren zu ihrem Dicen
DE19742590C2 (de) Laserwartungs- und Reparatureinrichtung
DE102018218370B4 (de) Laserbearbeitungsvorrichtung
EP2119531B1 (fr) Dispositif de protection contre les radiations laser
DE112015003917T5 (de) Querstrahl-Laserschweißdüse
DE102018218563A1 (de) Laserbearbeitungsvorrichtung
DE102018217293B4 (de) Laserbearbeitungsvorrichtung
DE10152401B4 (de) Fräsmaschine mit einem Spanabsauggehäuse
DE10033785C2 (de) Vorrichtung zum Einkoppeln von Laserstrahlen in eine Lichtleitfaser
DE19840934B4 (de) Anordnung zum Entfernen von Material, das durch eine Laserstrahlungsquelle bei der Materialbearbeitung von einer Bearbeitungsfläche abgetragen wird
DE2718711C2 (fr)
DE8227494U1 (de) Vorrichtung zur messung der intensitaet eines laserstrahls
DE102018210573A1 (de) Laserbearbeitungsvorrichtung und laserbearbeitungsverfahren
DE102020213612A1 (de) Laserbearbeitungsvorrichtung
DE102020002743A1 (de) Strahlenschutzeinrichtung
DE102020106140A1 (de) Laserbearbeitungsmaschine zum Bearbeiten von Werkstücken
DE102004043167B4 (de) Laserschneidanlage
DE102011083250A1 (de) Laserbeschriftungssystem und Verfahren zur Gewährleistung der Lasersicherheit des Laserbeschriftungssystems
DE102018200033A1 (de) Laserbearbeitungskopf und -maschine mit einem Röntgensensor sowie Verfahren zum röntgensicheren Betrieb der Laserbearbeitungsmaschine

Legal Events

Date Code Title Description
R012 Request for examination validly filed