DE112020004090A5 - Halbleiterbauelement, vorrichtung mit einem halbleiterbauelement und verfahren zur herstellung von halbleiterbauelementen - Google Patents

Halbleiterbauelement, vorrichtung mit einem halbleiterbauelement und verfahren zur herstellung von halbleiterbauelementen Download PDF

Info

Publication number
DE112020004090A5
DE112020004090A5 DE112020004090.9T DE112020004090T DE112020004090A5 DE 112020004090 A5 DE112020004090 A5 DE 112020004090A5 DE 112020004090 T DE112020004090 T DE 112020004090T DE 112020004090 A5 DE112020004090 A5 DE 112020004090A5
Authority
DE
Germany
Prior art keywords
semiconductor
semiconductor device
manufacturing
devices
semiconductor devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112020004090.9T
Other languages
English (en)
Inventor
Berthold Hahn
Georg Bogner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112020004090A5 publication Critical patent/DE112020004090A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/22—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/40—Materials therefor
    • H01L33/405—Reflective materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0016—Processes relating to electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • H01L33/38—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
    • H01L33/382—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape the electrode extending partially in or entirely through the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Polarising Elements (AREA)
DE112020004090.9T 2019-08-28 2020-08-19 Halbleiterbauelement, vorrichtung mit einem halbleiterbauelement und verfahren zur herstellung von halbleiterbauelementen Pending DE112020004090A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019212944.7A DE102019212944A1 (de) 2019-08-28 2019-08-28 Halbleiterbauelement, vorrichtung mit einem halbleiterbauelement und verfahren zur herstellung von halbleiterbauelementen
DE102019212944.7 2019-08-28
PCT/EP2020/073200 WO2021037633A1 (de) 2019-08-28 2020-08-19 Halbleiterbauelement, vorrichtung mit einem halbleiterbauelement und verfahren zur herstellung von halbleiterbauelementen

Publications (1)

Publication Number Publication Date
DE112020004090A5 true DE112020004090A5 (de) 2022-05-19

Family

ID=72178525

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102019212944.7A Withdrawn DE102019212944A1 (de) 2019-08-28 2019-08-28 Halbleiterbauelement, vorrichtung mit einem halbleiterbauelement und verfahren zur herstellung von halbleiterbauelementen
DE112020004090.9T Pending DE112020004090A5 (de) 2019-08-28 2020-08-19 Halbleiterbauelement, vorrichtung mit einem halbleiterbauelement und verfahren zur herstellung von halbleiterbauelementen

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102019212944.7A Withdrawn DE102019212944A1 (de) 2019-08-28 2019-08-28 Halbleiterbauelement, vorrichtung mit einem halbleiterbauelement und verfahren zur herstellung von halbleiterbauelementen

Country Status (3)

Country Link
US (1) US20220328738A1 (de)
DE (2) DE102019212944A1 (de)
WO (1) WO2021037633A1 (de)

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5779924A (en) * 1996-03-22 1998-07-14 Hewlett-Packard Company Ordered interface texturing for a light emitting device
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
EP2420873A3 (de) * 2001-12-14 2013-01-16 QUALCOMM MEMS Technologies, Inc. Einförmiges Beleuchtungssystem
JP4184189B2 (ja) * 2003-08-13 2008-11-19 株式会社 日立ディスプレイズ 発光型表示装置
WO2005122223A1 (en) * 2004-06-11 2005-12-22 Showa Denko K.K. Production method of compound semiconductor device wafer
US20070285000A1 (en) * 2004-09-10 2007-12-13 Luminus Devices, Inc. Polarization recycling illumination assembly and methods
WO2007002476A2 (en) * 2005-06-28 2007-01-04 Lamina Ceramics, Inc. Backlight module display with optical coupler and lightguide
US8257987B2 (en) * 2006-02-02 2012-09-04 Trustees Of Boston University Planarization of GaN by photoresist technique using an inductively coupled plasma
EP1887634A3 (de) * 2006-08-11 2011-09-07 OSRAM Opto Semiconductors GmbH Strahlungsemittierendes Halbleiterbauelement
KR101585239B1 (ko) * 2007-10-25 2016-01-22 코닌클리케 필립스 엔.브이. 편광 광 방출 장치
DE102008005497A1 (de) * 2008-01-22 2009-07-23 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements und eines Wafers
US20100051983A1 (en) * 2008-08-29 2010-03-04 Frank Shum Polarization recycling optics for leds
DE102009001505A1 (de) * 2008-11-21 2010-05-27 Vertilas Gmbh Oberflächenemittierende Halbleiterlaserdiode und Verfahren zur Herstellung derselben
US7957621B2 (en) * 2008-12-17 2011-06-07 3M Innovative Properties Company Light extraction film with nanoparticle coatings
US8299473B1 (en) * 2009-04-07 2012-10-30 Soraa, Inc. Polarized white light devices using non-polar or semipolar gallium containing materials and transparent phosphors
US10043946B2 (en) * 2009-08-25 2018-08-07 Soraa, Inc. Methods and devices for light extraction from a group III-nitride volumetric LED using surface and sidewall roughening
KR101047639B1 (ko) * 2010-04-19 2011-07-07 엘지이노텍 주식회사 반도체 발광소자, 발광 소자 패키지 및 반도체 발광 소자 제조방법
KR101671793B1 (ko) * 2010-07-01 2016-11-04 삼성전자주식회사 반도체 발광소자 및 그 제조방법
EP2763195A3 (de) * 2013-01-30 2016-04-06 LG Innotek Co., Ltd. Lichtemittierende Vorrichtung
JP6394052B2 (ja) * 2013-05-13 2018-09-26 日亜化学工業株式会社 発光装置及びその製造方法
DE102013107971A1 (de) * 2013-07-25 2015-01-29 Osram Opto Semiconductors Gmbh Optoelektronischer Halbleiterchip, Halbleiterbauelement und Verfahren zur Herstellung von optoelektronischen Halbleiterchips
FR3027440B1 (fr) * 2014-10-15 2017-05-05 Sunpartner Technologies Module photovoltaique polarisant integrant dans l'ecran d'un dispositif electronique d'affichage
DE102015120642A1 (de) * 2015-11-27 2017-06-01 Osram Opto Semiconductors Gmbh Vorrichtung mit zumindest einem optoelektronischen Halbleiterbauelement
KR102476137B1 (ko) * 2016-02-25 2022-12-12 삼성전자주식회사 발광소자 패키지의 제조 방법
KR102661474B1 (ko) * 2016-04-11 2024-04-29 삼성디스플레이 주식회사 디스플레이 장치
KR20180081378A (ko) * 2017-01-06 2018-07-16 엘지전자 주식회사 반도체 발광소자를 이용한 디스플레이 장치
KR102618811B1 (ko) * 2017-01-23 2023-12-28 삼성디스플레이 주식회사 색변환 패널 및 이를 포함하는 표시 장치
KR102378083B1 (ko) * 2017-05-24 2022-03-25 삼성디스플레이 주식회사 표시 장치

Also Published As

Publication number Publication date
US20220328738A1 (en) 2022-10-13
DE102019212944A1 (de) 2021-03-04
WO2021037633A1 (de) 2021-03-04

Similar Documents

Publication Publication Date Title
DE112017006471A5 (de) Vorrichtung und verfahren zur herstellung von bipolarplatten
DE102018102542A8 (de) Vorrichtung zur Handhabung von Fluiden sowie Verfahren zur Herstellung derselben
DE112019000537A5 (de) Optoelektronisches halbleiterbauteil und verfahren zur herstellung von optoelektronischen halbleiterbauteilen
DE112018003036A5 (de) Verfahren und Vorrichtung zur Herstellung von Reifen
DE112018002183A5 (de) Beleuchtungsvorrichtung und Verfahren zur Herstellung einer Beleuchtungsvorrichtung
DE112018004455A5 (de) Lichtemittierendes bauteil, anzeigevorrichtung und verfahren zur herstellung einer anzeigevorrichtung
DE112016001544A5 (de) Optoelektronischer Halbleiterchip, optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
DE112019002689A5 (de) Verfahren und vorrichtung zur herstellung von kunststeinplatten
DE112020003879A5 (de) Leuchtstoff, verfahren zur herstellung eines leuchtstoffs und strahlungsemittierendes bauelement
DE112015004781A5 (de) Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung
DE112020000398A5 (de) Strahlungsemittierender halbleiterchip und verfahren zur herstellung eines strahlungsemittierenden halbleiterchips
DE112017001117A5 (de) Anschlussträger, optoelektronisches Bauteil und Verfahren zur Herstellung eines Anschlussträgers oder eine optoelektronischen Bauteils
DE112018005496A5 (de) Strahlungsemittierendes halbleiterbauelement und verfahren zur herstellung von strahlungsemittierenden halbleiterbauelementen
DE112017001958A5 (de) Lichtemittierender Halbleiterchip, lichtemittierendes Bauelement und Verfahren zur Herstellung eineslichtemittierenden Bauelements
DE112018000064A5 (de) Transporteinrichtung sowie Verfahren und Vorrichtung zur Herstellung der Transporteinrichtung
DE112016005214A5 (de) Strahlungsemittierender Halbleiterchip, optoelektronisches Bauelement mit einem strahlungsemittierenden Halbleiterchip und Verfahren zur Beschichtung eines strahlungsemittierenden Halbleiterchips
DE112019004099A5 (de) Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
DE112016002401A5 (de) Verfahren zur Herstellung eines elektronisches Bauelements mit einem Trägerelement und elektronisches Bauelement mit einem Trägerelement
DE112019003634T8 (de) Optoelektronisches bauelement und das verfahren zur herstellung eines optoelektronischen bauelements
DE112015003463A5 (de) Halbleiterbauelement, Beleuchtungsvorrichtung und Verfahren zur Herstellung eines Halbleiterbauelements
DE112020004090A5 (de) Halbleiterbauelement, vorrichtung mit einem halbleiterbauelement und verfahren zur herstellung von halbleiterbauelementen
DE112015001765A5 (de) Optoelektronisches Halbleiterelement, optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung einer Mehrzahl von optoelektronischen Halbleiterelementen
DE112018003926A5 (de) Optoelektronisches Halbleiterbauelement mit einer Kontaktstruktur und Verfahren zur Herstellung einer Kontaktstruktur für ein optoelektronisches Halbleiterbauelement
DE112020005345A5 (de) Optoelektronisches halbleiterbauelement, anordnung von optoelektronischen halbleiterbauelementen, optoelektronische vorrichtung und verfahren zur herstellung eines optoelektronischen halbleiterbauelementes
DE112019001100A5 (de) Transporteinrichtung mit wenigstens einem Transportgerät sowie Verfahren zur Herstellung, zum Betrieb, und zur Wartung der Transporteinrichtung

Legal Events

Date Code Title Description
R012 Request for examination validly filed