DE112017004383A5 - Anordnung mit träger und optoelektronischem bauelement - Google Patents
Anordnung mit träger und optoelektronischem bauelement Download PDFInfo
- Publication number
- DE112017004383A5 DE112017004383A5 DE112017004383.2T DE112017004383T DE112017004383A5 DE 112017004383 A5 DE112017004383 A5 DE 112017004383A5 DE 112017004383 T DE112017004383 T DE 112017004383T DE 112017004383 A5 DE112017004383 A5 DE 112017004383A5
- Authority
- DE
- Germany
- Prior art keywords
- arrangement
- support
- optoelectronic component
- optoelectronic
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000005693 optoelectronics Effects 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Led Device Packages (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102016116298.1A DE102016116298A1 (de) | 2016-09-01 | 2016-09-01 | Anordnung mit Träger und optoelektronischem Bauelement |
| DE102016116298.1 | 2016-09-01 | ||
| PCT/EP2017/071711 WO2018041865A1 (de) | 2016-09-01 | 2017-08-30 | Anordnung mit träger und optoelektronischem bauelement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112017004383A5 true DE112017004383A5 (de) | 2019-05-23 |
Family
ID=59859039
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102016116298.1A Withdrawn DE102016116298A1 (de) | 2016-09-01 | 2016-09-01 | Anordnung mit Träger und optoelektronischem Bauelement |
| DE112017004383.2T Pending DE112017004383A5 (de) | 2016-09-01 | 2017-08-30 | Anordnung mit träger und optoelektronischem bauelement |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102016116298.1A Withdrawn DE102016116298A1 (de) | 2016-09-01 | 2016-09-01 | Anordnung mit Träger und optoelektronischem Bauelement |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10629578B2 (de) |
| CN (1) | CN109729746B (de) |
| DE (2) | DE102016116298A1 (de) |
| WO (1) | WO2018041865A1 (de) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102018122572A1 (de) * | 2018-09-14 | 2020-03-19 | Osram Opto Semiconductors Gmbh | VORRICHTUNG UND VERFAHREN ZUR HERSTELLUNG EINER SCHICHT AUS EINEM IN EINEM FLIEßFÄHIGEN ZUSTAND BEREITGESTELLTEN MATERIAL AUF EINER OPTOELEKTRONISCHEN LEUCHTVORRICHTUNG |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19755734A1 (de) | 1997-12-15 | 1999-06-24 | Siemens Ag | Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelementes |
| EP1114845B1 (de) * | 1998-08-21 | 2004-07-28 | Hitachi Chemical Company, Ltd. | Pastenzusammensetzung, schutzfilm und daraus hergestellte halbleitervorrichtung |
| DE10319782B4 (de) | 2003-04-30 | 2009-01-02 | Osram Opto Semiconductors Gmbh | Optoelektronisches Halbleiterbauelement mit einem Chipträgerelement |
| JP4708755B2 (ja) * | 2004-10-04 | 2011-06-22 | 富士通テン株式会社 | 放熱材の規制構造 |
| US7365371B2 (en) | 2005-08-04 | 2008-04-29 | Cree, Inc. | Packages for semiconductor light emitting devices utilizing dispensed encapsulants |
| CN1949487A (zh) * | 2005-10-10 | 2007-04-18 | 南茂科技股份有限公司 | 可防止密封材料溢流的膜上倒装片封装结构 |
| KR100809263B1 (ko) | 2006-07-10 | 2008-02-29 | 삼성전기주식회사 | 직하 방식 백라이트 장치 |
| US20080029775A1 (en) | 2006-08-02 | 2008-02-07 | Lustrous Technology Ltd. | Light emitting diode package with positioning groove |
| US7473940B2 (en) | 2006-11-27 | 2009-01-06 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Compact LED with a self-formed encapsulating dome |
| US8885127B2 (en) | 2010-06-10 | 2014-11-11 | Sharp Kabushiki Kaisha | Liquid crystal display device and method for fabricating the same |
| US20120097985A1 (en) | 2010-10-21 | 2012-04-26 | Wen-Huang Liu | Light Emitting Diode (LED) Package And Method Of Fabrication |
| CN102130235B (zh) | 2010-12-31 | 2012-12-26 | 深圳中景科创光电科技有限公司 | 一种led芯片的封装方法及封装器件 |
| US8878215B2 (en) * | 2011-06-22 | 2014-11-04 | Lg Innotek Co., Ltd. | Light emitting device module |
| AT14124U1 (de) * | 2012-02-13 | 2015-04-15 | Tridonic Jennersdorf Gmbh | LED-Modul mit Flächenverguß |
| JP6432416B2 (ja) * | 2014-04-14 | 2018-12-05 | 日亜化学工業株式会社 | 半導体装置 |
| US9859480B2 (en) * | 2015-08-20 | 2018-01-02 | Nichia Corporation | Light emitting device and method of manufacturing light emitting device |
-
2016
- 2016-09-01 DE DE102016116298.1A patent/DE102016116298A1/de not_active Withdrawn
-
2017
- 2017-08-30 US US16/329,821 patent/US10629578B2/en active Active
- 2017-08-30 CN CN201780051798.4A patent/CN109729746B/zh active Active
- 2017-08-30 DE DE112017004383.2T patent/DE112017004383A5/de active Pending
- 2017-08-30 WO PCT/EP2017/071711 patent/WO2018041865A1/de active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| US20190189605A1 (en) | 2019-06-20 |
| CN109729746A (zh) | 2019-05-07 |
| US10629578B2 (en) | 2020-04-21 |
| WO2018041865A1 (de) | 2018-03-08 |
| CN109729746B (zh) | 2020-07-10 |
| DE102016116298A1 (de) | 2018-03-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE112016004248A5 (de) | Optoelektronisches Halbleiterbauteil und 3D-Drucker damit | |
| DE112015004033A5 (de) | Optoelektronisches Halbleiterbauteil und Blitzlicht | |
| DK3207909T3 (da) | Støttestruktur | |
| DE112016001966A5 (de) | Optoelektronische Anordnung | |
| DK3258994T3 (da) | Injetionsanordning med hjælpeanordning | |
| DE112014003539A5 (de) | Fahrzeug mit riemenscheibe und standklimatisierung | |
| DE112017002652A5 (de) | Filament und Leuchtvorrichtung | |
| DK3414181T3 (da) | Enkeltvirkende aftapningsanordning med glidende hylster | |
| DE112017000994A5 (de) | Laserbarren mit gräben | |
| DE112016004712A5 (de) | Optoelektronische Anordnung | |
| BR112016003017A2 (pt) | Estrutura de suporte e transportador | |
| DE112017006351A5 (de) | Optoelektronisches bauelement | |
| DE112017006349A5 (de) | Optoelektronisches bauelement | |
| MA42956A (fr) | Structure de support | |
| DE112018003308A5 (de) | Optoelektronisches halbleiterbauteil und anordnung mit einem optoelektronischen halbleiterbauteil | |
| DE112014001166A5 (de) | Optoelektronisches Bauelement und elektronisches Gerät mit optoelektronischem Bauelement | |
| DK3237777T3 (da) | Forbedringer af eller i forbindelse med spændeanordninger | |
| DK2944309T3 (da) | Anvendelse af palmitoylethanolamid i kombination med opioider | |
| DE112017004383A5 (de) | Anordnung mit träger und optoelektronischem bauelement | |
| DE112015005147A5 (de) | Optoelektronisches Bauelement und Beleuchtungsvorrichtung | |
| DE112016002001A5 (de) | Anordnung mit einem Substrat und einem Halbleiterlaser | |
| DE112015005128A5 (de) | Optoelektronisches Halbleiterbauelement und Vorrichtung mit einem optoelektronischen Halbleiterbauelement | |
| DE102014101154A8 (de) | Optoelektronische Anordnung | |
| DE112015003980A5 (de) | Optoelektronische Anordnung und Beleuchtungsvorrichtung | |
| DK3297292T3 (da) | Ørekop med fastgørelsesenhed |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed | ||
| R079 | Amendment of ipc main class |
Free format text: PREVIOUS MAIN CLASS: H01L0033620000 Ipc: H01L0023130000 |
|
| R016 | Response to examination communication | ||
| R016 | Response to examination communication |