DE102014101154A8 - Optoelektronische Anordnung - Google Patents
Optoelektronische Anordnung Download PDFInfo
- Publication number
- DE102014101154A8 DE102014101154A8 DE102014101154.6A DE102014101154A DE102014101154A8 DE 102014101154 A8 DE102014101154 A8 DE 102014101154A8 DE 102014101154 A DE102014101154 A DE 102014101154A DE 102014101154 A8 DE102014101154 A8 DE 102014101154A8
- Authority
- DE
- Germany
- Prior art keywords
- optoelectronic arrangement
- optoelectronic
- arrangement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F13/00—Inhibiting corrosion of metals by anodic or cathodic protection
- C23F13/02—Inhibiting corrosion of metals by anodic or cathodic protection cathodic; Selection of conditions, parameters or procedures for cathodic protection, e.g. of electrical conditions
- C23F13/06—Constructional parts, or assemblies of cathodic-protection apparatus
- C23F13/08—Electrodes specially adapted for inhibiting corrosion by cathodic protection; Manufacture thereof; Conducting electric current thereto
- C23F13/16—Electrodes characterised by the combination of the structure and the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014101154.6A DE102014101154A1 (de) | 2014-01-30 | 2014-01-30 | Optoelektronische Anordnung |
PCT/EP2015/051784 WO2015114041A1 (de) | 2014-01-30 | 2015-01-29 | Optoelektronische anordnung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014101154.6A DE102014101154A1 (de) | 2014-01-30 | 2014-01-30 | Optoelektronische Anordnung |
Publications (2)
Publication Number | Publication Date |
---|---|
DE102014101154A1 DE102014101154A1 (de) | 2015-07-30 |
DE102014101154A8 true DE102014101154A8 (de) | 2015-10-22 |
Family
ID=52434808
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102014101154.6A Withdrawn DE102014101154A1 (de) | 2014-01-30 | 2014-01-30 | Optoelektronische Anordnung |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102014101154A1 (de) |
WO (1) | WO2015114041A1 (de) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016208489A1 (de) | 2016-05-18 | 2017-11-23 | Osram Opto Semiconductors Gmbh | Verfahren zur herstellung eines optoelektronischen bauteils und optoelektronisches bauteil |
DE102018110954A1 (de) * | 2018-05-07 | 2019-11-07 | Optics Balzers Ag | Lift-Off Verfahren mittels Jetten |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020079517A1 (en) * | 2000-12-22 | 2002-06-27 | Hyung-Jun Kim | Semiconductor device capable of preventing corrosion of metal wires from CMP (chemical mechanical polishing) process |
US20080122081A1 (en) * | 2006-11-23 | 2008-05-29 | Samsung Electronics Co., Ltd. | Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same |
US20110121326A1 (en) * | 2009-11-26 | 2011-05-26 | Dsem Holdings Sdn. Bhd. | Submount Having Reflective Cu-Ni-Ag Pads Formed Using Electroless Deposition |
US20120145219A1 (en) * | 2010-12-09 | 2012-06-14 | Ppg Industries Ohio, Inc | Corrosion resistant solar mirror |
US20130298983A1 (en) * | 2010-08-11 | 2013-11-14 | Korea University Research And Business Foundation | Corrosion-resistant photovoltaic module |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112004000155B4 (de) * | 2003-01-16 | 2019-06-19 | Panasonic Intellectual Property Management Co., Ltd. | Anschlussrahmen für ein Halbleiterbauelement |
JP4758976B2 (ja) * | 2007-12-03 | 2011-08-31 | 日立ケーブルプレシジョン株式会社 | 半導体発光素子搭載用リードフレーム及びその製造方法並びに発光装置 |
JP2010206034A (ja) * | 2009-03-05 | 2010-09-16 | Panasonic Corp | 光半導体装置用リードフレーム,光半導体装置用パッケージ,光半導体装置,光半導体装置用リードフレームの製造方法,光半導体装置用パッケージの製造方法および光半導体装置の製造方法 |
DE102010003321A1 (de) * | 2010-03-26 | 2011-09-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
-
2014
- 2014-01-30 DE DE102014101154.6A patent/DE102014101154A1/de not_active Withdrawn
-
2015
- 2015-01-29 WO PCT/EP2015/051784 patent/WO2015114041A1/de active Application Filing
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020079517A1 (en) * | 2000-12-22 | 2002-06-27 | Hyung-Jun Kim | Semiconductor device capable of preventing corrosion of metal wires from CMP (chemical mechanical polishing) process |
US20080122081A1 (en) * | 2006-11-23 | 2008-05-29 | Samsung Electronics Co., Ltd. | Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same |
US20110121326A1 (en) * | 2009-11-26 | 2011-05-26 | Dsem Holdings Sdn. Bhd. | Submount Having Reflective Cu-Ni-Ag Pads Formed Using Electroless Deposition |
US20130298983A1 (en) * | 2010-08-11 | 2013-11-14 | Korea University Research And Business Foundation | Corrosion-resistant photovoltaic module |
US20120145219A1 (en) * | 2010-12-09 | 2012-06-14 | Ppg Industries Ohio, Inc | Corrosion resistant solar mirror |
Also Published As
Publication number | Publication date |
---|---|
DE102014101154A1 (de) | 2015-07-30 |
WO2015114041A1 (de) | 2015-08-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R163 | Identified publications notified | ||
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |