DE112015000939A5 - Apparatus for the wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates or the like - Google Patents

Apparatus for the wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates or the like Download PDF

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Publication number
DE112015000939A5
DE112015000939A5 DE112015000939.6T DE112015000939T DE112015000939A5 DE 112015000939 A5 DE112015000939 A5 DE 112015000939A5 DE 112015000939 T DE112015000939 T DE 112015000939T DE 112015000939 A5 DE112015000939 A5 DE 112015000939A5
Authority
DE
Germany
Prior art keywords
objects
substrates
wet
chemical treatment
semiconductor wafers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112015000939.6T
Other languages
German (de)
Inventor
Egon Ramgraber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
RAMGRABER GmbH
Original Assignee
RAMGRABER GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by RAMGRABER GmbH filed Critical RAMGRABER GmbH
Publication of DE112015000939A5 publication Critical patent/DE112015000939A5/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
DE112015000939.6T 2014-02-24 2015-02-16 Apparatus for the wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates or the like Withdrawn DE112015000939A5 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE202014100815.2 2014-02-24
DE202014100815.2U DE202014100815U1 (en) 2014-02-24 2014-02-24 Apparatus for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped objects such as semiconductor wafers, substrates or the like
PCT/DE2015/100064 WO2015124145A1 (en) 2014-02-24 2015-02-16 Device for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped items such as semiconductor slices, substrates, or the like

Publications (1)

Publication Number Publication Date
DE112015000939A5 true DE112015000939A5 (en) 2016-11-24

Family

ID=50556445

Family Applications (2)

Application Number Title Priority Date Filing Date
DE202014100815.2U Expired - Lifetime DE202014100815U1 (en) 2014-02-24 2014-02-24 Apparatus for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped objects such as semiconductor wafers, substrates or the like
DE112015000939.6T Withdrawn DE112015000939A5 (en) 2014-02-24 2015-02-16 Apparatus for the wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates or the like

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE202014100815.2U Expired - Lifetime DE202014100815U1 (en) 2014-02-24 2014-02-24 Apparatus for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped objects such as semiconductor wafers, substrates or the like

Country Status (3)

Country Link
EP (1) EP3111471A1 (en)
DE (2) DE202014100815U1 (en)
WO (1) WO2015124145A1 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3300112B2 (en) * 1993-07-20 2002-07-08 富士通株式会社 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
KR101025323B1 (en) * 2004-01-13 2011-03-29 가부시키가이샤 아루박 Etching apparatus and etching method
US20100024847A1 (en) * 2008-08-01 2010-02-04 Breese Ronald G Semiconductor wafer cleaning with dilute acids

Also Published As

Publication number Publication date
DE202014100815U1 (en) 2014-03-14
EP3111471A1 (en) 2017-01-04
WO2015124145A1 (en) 2015-08-27

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Legal Events

Date Code Title Description
R082 Change of representative

Representative=s name: BUCHER, RALF, DIPL.-ING. UNIV., DE

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee