WO2015124145A1 - Device for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped items such as semiconductor slices, substrates, or the like - Google Patents

Device for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped items such as semiconductor slices, substrates, or the like Download PDF

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Publication number
WO2015124145A1
WO2015124145A1 PCT/DE2015/100064 DE2015100064W WO2015124145A1 WO 2015124145 A1 WO2015124145 A1 WO 2015124145A1 DE 2015100064 W DE2015100064 W DE 2015100064W WO 2015124145 A1 WO2015124145 A1 WO 2015124145A1
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WO
WIPO (PCT)
Prior art keywords
drum
objects
wet
spray nozzles
chemical
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PCT/DE2015/100064
Other languages
German (de)
French (fr)
Inventor
Egon Ramgraber
Original Assignee
Ramgraber Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ramgraber Gmbh filed Critical Ramgraber Gmbh
Priority to EP15715139.0A priority Critical patent/EP3111471A1/en
Priority to DE112015000939.6T priority patent/DE112015000939A5/en
Publication of WO2015124145A1 publication Critical patent/WO2015124145A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Definitions

  • the invention relates to a device for wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates or the like according to claim 1.
  • SAT Spray Acid Tool
  • SST Spray Solvent Tool
  • a process chamber is semi-or fully automatically loaded with a stack of semiconductor wafers, for example a horde of wafers; after loading, the process chamber is closed; then the wafers are rotated and sprayed for treatment with high purity acidic, alkaline or solvent containing chemicals.
  • 1 shows a SAT / SST installation with a process chamber and FIG.
  • FIG. 2 shows a SAT / SST installation with two process chambers, both of which originate from the Applicant and are intended for various tasks, such as FEOL (Front End Of Line) or BEOL (Back End of Line) wafer cleaning, metal lift-off, polymer removal, paint stripping, substrate cleaning, spray development, etching, ozone-based processing of wafers.
  • Both systems are suitable for manual or fully automatic loading and can accommodate 2 "to 12" wafers or individual substrates in their process chambers.
  • As a substrate holder standard horde or individual Horden cages can be used.
  • SST and SAT systems such as the systems shown in FIGS. 1 and 2, as shown in FIG. 3 as a process chamber typically a drum 10, in which a rack 12 with multiple wafers 12 in a holder of a generally circular bottom plate 16 is mounted with a plurality of holding rods 18 mounted thereon.
  • the holder 16, 18 is arranged during the treatment process via an outside of the drum 10 Motor 20 is rotated so that the wafers rotate in the process chamber.
  • the treatment chemicals are sprayed into the process chamber via chemical spray nozzles 22 mounted in the drum wall to wet the rotating wafers 14.
  • the motor 20 is attached directly to the bottom 24 of the drum 10.
  • the drive shaft 26 of the motor 20 protrudes through an opening in the drum base 24 into the process chamber, where it is coupled to the disc 16 of the holder in order to enable them to rotate.
  • the drum opening through which the drive shaft 26 passes is sealed accordingly, for example with a labyrinth seal 28 and sealing rings.
  • the object of the present invention is now to further improve the device shown in FIG. 3 for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped objects such as semiconductor wafers, substrates or the like.
  • An essential idea of the invention is to provide additional nozzles in a drum for the wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates, for example ceramic or glass substrates, or the like, which are specially provided for rinsing the process chamber and are formed accordingly.
  • objects in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates, for example ceramic or glass substrates, or the like, which are specially provided for rinsing the process chamber and are formed accordingly.
  • chemical residues from one process step can be flushed out of the process chamber efficiently before a further process step is carried out.
  • these special cleaning nozzles are designed differently than those for spraying chemicals into the process chamber, as they are Do not spray the objects to be treated in the middle of the process chamber, but above all the inner wall of the process chamber or the drum and wash off any chemical residues on the inner wall efficiently.
  • deionized water is used as the cleaning agent to be sprayed by the cleaning nozzles.
  • An embodiment of the invention now relates to an apparatus for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped objects such as semiconductor wafers, substrates or the like with a drum having a loading opening and a drum base, a holder for the objects, which is rotatable about an axis of rotation in the drum, a motor having a drive shaft passing through the drum bottom for driving the support, one or more chemical spray nozzles for spraying the objects stored in the support with chemicals, and one or more cleaning spray nozzles for spraying at least part of the inside the drum with a detergent.
  • the one or more cleaning spray nozzles may be configured to generate detergent spray jets toward the inside of the drum.
  • the one or more cleaning spray nozzles can each have a slot-shaped spray opening for producing a fan-shaped spray of cleaning agent.
  • a plurality of cleaning spray nozzles arranged one behind the other can be provided in a row on the inside of the drum approximately parallel to a series of successively arranged chemical spray nozzles.
  • a further embodiment of the invention relates to a SAT or SST system for wet-chemical spray treatment of semiconductor wafers having at least one process chamber, which is provided by a device according to the Invention and formed as described herein.
  • a system has the advantage that due to the device according to the invention the risk of engine damage is reduced due to emerging from the or the process chambers chemicals.
  • an embodiment of the invention also relates to the use of a device according to the invention and as described herein for the wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates or the like.
  • FIG. 1 and 2 each a SAT / SST system with one or two process chambers
  • Fig. 3 is a sectional view of a drum as a process chamber of the SAT / SST system shown in Figs. 1 and 2 with a rotating holder for a wafer rack driven by a motor directly mounted to the bottom of the drum;
  • FIGS. 1 and 2 shows a plan view of an exemplary embodiment of the device according to the invention with a drum as the process chamber for the SAT / SST systems shown in FIGS. 1 and 2.
  • identical and / or functionally identical elements can be provided with the same reference numerals.
  • Fig. 4 shows an embodiment of the device according to the invention with a drum 10, which is suitable and provided as a process chamber for the SAT / SST system shown in Figs. 1 and 2, from the front, i. the drum loading opening 1 1.
  • a drum 10 which can be manually, semi or fully automatically equipped with a tray 12 with wafers 14 for wet chemical treatment.
  • a plurality of the already mentioned chemical spray nozzles 22 for the most uniform wetting of the wafer 14 with chemicals in a row are arranged one behind the other.
  • a further row 36 (FIG. 3) with cleaning spray nozzles 30 is arranged.
  • the cleaning spray nozzles 30 are each provided, as can be seen in FIG. 4, with a slot-shaped spray opening 32 which generates a fan-shaped spray 34 of cleaning agent directed towards the inner wall of the drum 10 around the drum inner wall of chemicals - to clean residues.
  • the advantage of this orientation of the fan-shaped spray jet 34 is, above all, that the cleaning agent is sprayed substantially onto the inner wall of the drum 10, and the support from the base plate 16 and support rods 18 and wafer 14 located therein only slightly, or ideally not at all is wetted with detergent.
  • cleaning agent may be sprayed via the cleaning spray nozzles 30 after completion of a preceding processing cycle with chemicals to treat the wafers 14 to remove residual process chemical residue prior to a subsequent processing step Preventing influence of the subsequent processing section by chemical residues largely to avoid.

Abstract

The invention relates to a device for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped items such as semiconductor wafers, substrates, or the like (12, 14), comprising: a drum (10), which has a loading opening (11) and a drum bottom (24); a retainer (16, 18) for the objects (12, 14), which retainer is arranged in the drum (10) in such a way that the retainer can be rotated about an axis of rotation; a motor (20) having a drive shaft (26) for driving the retainer (16, 18), which drive shaft passes through the drum bottom (24); one or more chemical spray nozzles (22) for spraying the objects (14) held in the retainer (16, 18) with chemicals; and one or more cleaning spray nozzles (30) for spraying at least part of the inside of the drum (10) with a cleaning agent.

Description

VORRICHTUNG ZUR NASSCHEMISCHEN BEHANDLUNG VON OBJEKTEN, INSBESONDERE VON FLACHEN, INSBESONDERE SCHEIBENFÖRMIGEN GEGENSTÄNDEN WIE HALBLEITERSCHEIBEN,  DEVICE FOR THE WET-CHEMICAL TREATMENT OF OBJECTS, ESPECIALLY FLAT, PARTICULARLY DISC-SHAPED OBJECTS SUCH AS SEMICONDUCTOR DISCS,
SUBSTRATEN ODER DERGLEICHEN  SUBSTRATES OR THE SAME
Die Erfindung betrifft eine Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen gemäß Anspruch 1. The invention relates to a device for wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates or the like according to claim 1.
SAT (Spray Acid Tool)- oder SST (Spray Solvent Tool)-Systeme werden zur nasschemischen Sprüh-Behandlung von Halbleiterscheiben (Wafern) in geschlossenen Prozesskammern eingesetzt. Bei derartigen Systemen wird eine Prozesskammer halb- oder auch vollautomatisch mit einem Stapel von Halbleiterscheiben, beispielsweise einer Horde mit Wafern, beladen; nach der Beladung wird die Prozesskammer geschlossen; anschließend werden die Wafer in Rotation versetzt und zur Behandlung mit hochreinen sauren, alkalischen oder lösemittelhaltigen Chemikalien besprüht. Fig. 1 zeigt eine SAT/SST-Anlage mit einer Prozesskammer und Fig. 2 eine SAT/SST-Anlage mit zwei Prozesskammern, die beide von der Anmelderin stammen und für verschiedene Aufgaben vorgesehen ist, wie FEOL (Front End Of Line)- oder BEOL- (Back End of Line)-Wafer-Reinigung, Metal-Lift-Off, Polymerentfernung, Lack Strippen, Substratreinigung, Sprühentwickeln, Ätzen, Ozon-basierte Prozessierung von Wafern. Beide Anlagen sind für eine manuelle oder vollautomatische Beladung geeignet und können 2" bis 12" große Wafer oder individuelle Substrate in ihren Prozesskammern aufnehmen. Als Substrathalter können Standardhorden oder individuelle Hordenkäfige verwendet werden. SAT (Spray Acid Tool) or SST (Spray Solvent Tool) systems are used for wet-chemical spray treatment of semiconductor wafers in closed process chambers. In such systems, a process chamber is semi-or fully automatically loaded with a stack of semiconductor wafers, for example a horde of wafers; after loading, the process chamber is closed; then the wafers are rotated and sprayed for treatment with high purity acidic, alkaline or solvent containing chemicals. 1 shows a SAT / SST installation with a process chamber and FIG. 2 shows a SAT / SST installation with two process chambers, both of which originate from the Applicant and are intended for various tasks, such as FEOL (Front End Of Line) or BEOL (Back End of Line) wafer cleaning, metal lift-off, polymer removal, paint stripping, substrate cleaning, spray development, etching, ozone-based processing of wafers. Both systems are suitable for manual or fully automatic loading and can accommodate 2 "to 12" wafers or individual substrates in their process chambers. As a substrate holder standard horde or individual Horden cages can be used.
SST- und SAT-Systeme wie die in Fig. 1 und 2 gezeigten Anlagen weisen wie in Fig. 3 dargestellt als Prozesskammer typischerweise eine Trommel 10 auf, in der eine Horde 12 mit mehreren Wafern 12 in einer Halterung aus einer in der Regel kreisrunden Bodenplatte 16 mit mehreren darauf befestigten Haltestäben 18 gelagert wird. Die Halterung 16, 18 wird während des Behandlungsprozesses über einen außerhalb der Trommel 10 angeordneten Motor 20 in Rotationen versetzt, so dass die Wafer in der Prozesskammer rotieren. Die Behandlungs-Chemikalien werden über in der Trommelwand angebrachte Chemikalien-Sprühdüsen 22 in die Prozesskammer gesprüht, um die rotierenden Wafer 14 zu benetzen. Zum Antreiben der Halterung 16, 18 ist der Motor 20 direkt am Boden 24 der Trommel 10 befestigt. Die Antriebswelle 26 des Motors 20 ragt durch eine Öffnung im Trommelboden 24 in die Prozesskammer hinein, wo sie mit der Scheibe 16 der Halterung gekoppelt ist, um diese in Rotationen versetzen zu können. Um ein Austreten von Chemikalien aus der Trommel 10 zu vermeiden, ist die Trommelöffnung, durch welche die Antriebswelle 26 hindurchtritt, entsprechend abgedichtet, beispielsweise mit einer Labyrinth-Dichtung 28 und Dichtungsringen. SST and SAT systems such as the systems shown in FIGS. 1 and 2, as shown in FIG. 3 as a process chamber typically a drum 10, in which a rack 12 with multiple wafers 12 in a holder of a generally circular bottom plate 16 is mounted with a plurality of holding rods 18 mounted thereon. The holder 16, 18 is arranged during the treatment process via an outside of the drum 10 Motor 20 is rotated so that the wafers rotate in the process chamber. The treatment chemicals are sprayed into the process chamber via chemical spray nozzles 22 mounted in the drum wall to wet the rotating wafers 14. To drive the holder 16, 18, the motor 20 is attached directly to the bottom 24 of the drum 10. The drive shaft 26 of the motor 20 protrudes through an opening in the drum base 24 into the process chamber, where it is coupled to the disc 16 of the holder in order to enable them to rotate. To avoid leakage of chemicals from the drum 10, the drum opening through which the drive shaft 26 passes is sealed accordingly, for example with a labyrinth seal 28 and sealing rings.
Aufgabe der vorliegenden Erfindung ist es nun, die in Fig. 3 beispielhaft gezeigte Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen weiter zu verbessern. The object of the present invention is now to further improve the device shown in FIG. 3 for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped objects such as semiconductor wafers, substrates or the like.
Diese Aufgabe wird durch eine Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben mit den Merkmalen von Anspruch 1 gelöst. Weitere Ausgestaltungen der Erfindung ergeben sich aus den abhängigen Ansprüchen. This object is achieved by a device for the wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers with the features of claim 1. Further embodiments of the invention will become apparent from the dependent claims.
Ein wesentlicher Gedanke der Erfindung besteht darin, zusätzliche Düsen in einer Trommel zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten, beispielsweise Keramik- oder Glas- Substraten, oder dergleichen vorzusehen, die speziell zum Ausspülen der Prozesskammer vorgesehen und entsprechend ausgebildet sind. Hierdurch können Chemikalien-Rückstände von einem Prozessschritt vor Durchführung eines weiteren Prozessschrittes effizient aus der Prozesskammer ausgespült werden. Vor allem sind diese speziellen Reinigungs-Düsen anders als die zum Einsprühen von Chemikalien in die Prozesskammer ausgebildet, da sie nicht die zu behandelnden Objekte in der Mitte der Prozesskammer, sondern vor allem die Innenwand der Prozesskammer bzw. der Trommel besprühen und Chemikalienrückstände an der Innenwand effizient abwaschen sollen. Als von den Reinigungs-Düsen zu versprühendes Reinigungsmittel wird insbesondere deionisiertes Wasser eingesetzt. An essential idea of the invention is to provide additional nozzles in a drum for the wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates, for example ceramic or glass substrates, or the like, which are specially provided for rinsing the process chamber and are formed accordingly. As a result, chemical residues from one process step can be flushed out of the process chamber efficiently before a further process step is carried out. Above all, these special cleaning nozzles are designed differently than those for spraying chemicals into the process chamber, as they are Do not spray the objects to be treated in the middle of the process chamber, but above all the inner wall of the process chamber or the drum and wash off any chemical residues on the inner wall efficiently. In particular, deionized water is used as the cleaning agent to be sprayed by the cleaning nozzles.
Eine Ausführungsform der Erfindung betrifft nun eine Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiter-Wafern, Substraten oder dergleichen mit einer Trommel mit einer Beladungsöffnung und einem Trommelboden, einer Halterung für die Objekte, die um eine Rotationsachse drehbar in der Trommel angeordnet ist, einem Motor mit einer durch den Trommelboden hindurchtretenden Antriebswelle zum Antreiben der Halterung, einer oder mehreren Chemikalien-Sprühdüsen zum Besprühen der in der Halterung gelagerten Objekte mit Chemikalien und einer oder mehreren Reinigungs-Sprühdüsen zum Besprühen zumindest eines Teils der Innenseite der Trommel mit einem Reinigungsmittel. An embodiment of the invention now relates to an apparatus for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped objects such as semiconductor wafers, substrates or the like with a drum having a loading opening and a drum base, a holder for the objects, which is rotatable about an axis of rotation in the drum, a motor having a drive shaft passing through the drum bottom for driving the support, one or more chemical spray nozzles for spraying the objects stored in the support with chemicals, and one or more cleaning spray nozzles for spraying at least part of the inside the drum with a detergent.
Die eine oder mehreren Reinigungs-Sprühdüsen kann bzw. können derart ausgebildet sein, dass sie Reinigungsmittel-Sprühstrahlen in Richtung der Innenseite der Trommel erzeugt bzw. erzeugen. The one or more cleaning spray nozzles may be configured to generate detergent spray jets toward the inside of the drum.
Die eine oder mehreren Reinigungs-Sprühdüsen kann bzw. können jeweils eine schlitzförmige Sprühöffnung zum Erzeugen eines fächerförmigen Reinigungsmittel-Sprühstrahls aufweisen. The one or more cleaning spray nozzles can each have a slot-shaped spray opening for producing a fan-shaped spray of cleaning agent.
Ferner können mehrere Reinigungs-Sprühdüsen hintereinander angeordnet in einer Reihe an der Innenseite der Trommel etwa parallel zu einer Reihe von hintereinander angeordneten Chemikalien-Sprühdüsen vorgesehen sein. Furthermore, a plurality of cleaning spray nozzles arranged one behind the other can be provided in a row on the inside of the drum approximately parallel to a series of successively arranged chemical spray nozzles.
Eine weitere Ausführungsform der Erfindung betrifft eine SAT- oder SST- Anlage zur nasschemischen Sprüh-Behandlung von Halbleiterscheiben mit mindestens einer Prozesskammer, die durch eine Vorrichtung nach der Erfindung und wie hierin beschrieben gebildet ist. Eine derartige Anlage besitzt den Vorteil, dass aufgrund der erfindungsgemäßen Vorrichtung die Gefahr von Motorschäden aufgrund von aus der oder den Prozesskammern austretenden Chemikalien reduziert wird. A further embodiment of the invention relates to a SAT or SST system for wet-chemical spray treatment of semiconductor wafers having at least one process chamber, which is provided by a device according to the Invention and formed as described herein. Such a system has the advantage that due to the device according to the invention the risk of engine damage is reduced due to emerging from the or the process chambers chemicals.
Schließlich betrifft eine Ausführungsform der Erfindung noch die Verwendung einer Vorrichtung nach der Erfindung und wie hierin beschrieben zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiter-Wafern, Substraten oder dergleichen. Finally, an embodiment of the invention also relates to the use of a device according to the invention and as described herein for the wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates or the like.
Weitere Vorteile und Anwendungsmöglichkeiten der vorliegenden Erfindung ergeben sich aus der nachfolgenden Beschreibung in Verbindung mit den in den Zeichnungen dargestellten Ausführungsbeispielen. Further advantages and possible applications of the present invention will become apparent from the following description in conjunction with the embodiments illustrated in the drawings.
In der Beschreibung, in den Ansprüchen, in der Zusammenfassung und in den Zeichnungen werden die in der hinten angeführten Liste der Bezugszeichen verwendeten Begriffe und zugeordneten Bezugszeichen verwendet. Die Zeichnungen zeigen in In the description, in the claims, in the abstract and in the drawings, the terms and associated reference numerals used in the list of reference numerals recited below are used. The drawings show in
Fig. 1 und 2 jeweils eine SAT/SST-Anlage mit einer bzw. zwei Prozesskammern; Fig. 3 eine Schnittansicht einer Trommel als Prozesskammer der in Fig. 1 und 2 gezeigten SAT/SST-Anlage mit einer rotierenden Halterung für eine Wafer- Horde, die über einen direkt am Boden der Trommel montierten Motor angetrieben wird; und 1 and 2 each a SAT / SST system with one or two process chambers; Fig. 3 is a sectional view of a drum as a process chamber of the SAT / SST system shown in Figs. 1 and 2 with a rotating holder for a wafer rack driven by a motor directly mounted to the bottom of the drum; and
Fig. 4 eine Draufsicht auf ein Ausführungsbeispiel der erfindungsgemäßen Vorrichtung mit einer Trommel als Prozesskammer für die in Fig. 1 und 2 gezeigte SAT/SST-Anlagen. Im Folgenden können gleiche und/oder funktional gleiche Elemente mit den gleichen Bezugszeichen versehen sein. 4 shows a plan view of an exemplary embodiment of the device according to the invention with a drum as the process chamber for the SAT / SST systems shown in FIGS. 1 and 2. In the following, identical and / or functionally identical elements can be provided with the same reference numerals.
Fig. 4 zeigt ein Ausführungsbeispiel der erfindungsgemäßen Vorrichtung mit einer Trommel 10, die als Prozesskammer die für die in Fig. 1 und 2 gezeigte SAT/SST-Anlage geeignet und vorgesehen ist, von vorne, d.h. der Trommel- Beladungsöffnung 1 1 . In der Trommel 10 ist die bereits in Zusammenhang mit Fig. 3 oben erwähnte Halterung angeordnet, die manuell, halb- oder vollautomatisch mit einer Horde 12 mit Wafern 14 zur nasschemischen Behandlung bestückt werden kann. Fig. 4 shows an embodiment of the device according to the invention with a drum 10, which is suitable and provided as a process chamber for the SAT / SST system shown in Figs. 1 and 2, from the front, i. the drum loading opening 1 1. In the drum 10 already mentioned above in connection with FIG. 3 holder is arranged, which can be manually, semi or fully automatically equipped with a tray 12 with wafers 14 for wet chemical treatment.
An der Innenwand der Trommel 10 sind mehrere der bereits erwähnten Chemikalien-Sprühdüsen 22 zum möglichst gleichmäßigen Benetzen der Wafer 14 mit Chemikalien in einer Reihe hintereinander angeordnet. On the inner wall of the drum 10, a plurality of the already mentioned chemical spray nozzles 22 for the most uniform wetting of the wafer 14 with chemicals in a row are arranged one behind the other.
Parallel zu der Reihe mit den Chemikalien-Sprühdüsen 22 ist eine weitere Reihe 36 (Fig. 3) mit Reinigungs-Sprühdüsen 30 angeordnet. Die Reinigungs- Sprühdüsen 30 sind jeweils - wie in Fig. 4 erkennbar ist - mit einer schlitzförmigen Sprühöffnung 32 versehen, die einen fächerförmigen Sprühstrahl 34 von Reinigungsmittel erzeugt, der in Richtung zur Innenwand der Trommel 10 gerichtet ist, um die Trommel-Innenwand von Chemikalien- Rückständen zu reinigen. Der Vorteil dieser Ausrichtung des fächerförmigen Sprühstrahls 34 besteht vor allem darin, dass das Reinigungsmittel im Wesentlichen auf die Innenwand der Trommel 10 gesprüht wird, und die Halterung aus Bodenplatte 16 und Halterungsstäbe 18 und darin befindliche Wafer 14 nur in geringem Maße oder im Idealfall überhaupt nicht mit Reinigungsmittel benetzt wird. Dadurch kann bewerkstelligt werden, dass im Wesentlichen die Trommel-Innenwand von Chemikalien-Rückständen gereinigt wird, an der in der Regel die größte Menge von Chemikalien- Rückständen aufgrund der vergleichsweise großen Fläche nach einem Prozessierungsschritt zurückbleibt. Zudem kann der Verbrauch an Reinigungsmittel reduziert werden, da die Trommel 1 0 effizienter von Chemikalien-Rückstände gereinigt werden kann. Im Betrieb der Vorrichtung zur nasschemischen Behandlung von Wafern 14 kann Reinigungsmittel über die Reinigungs-Sprühdüsen 30 nach Abschluss eines vorangehenden Prozessierungsschnttes mit Chemikalien zur Behandlung der Wafer 14 eingesprüht werden, um vor einem nachfolgenden Prozessierungsschritt Chemikalien-Rückstände des abgeschlossenen Prozessierungsschnttes zu entfernen und so eine mögliche Beeinflussung des nachfolgenden Prozessierungsschnttes durch Chemikalien-Rückstände weitgehend zu vermeiden. Parallel to the row of chemical spray nozzles 22, a further row 36 (FIG. 3) with cleaning spray nozzles 30 is arranged. The cleaning spray nozzles 30 are each provided, as can be seen in FIG. 4, with a slot-shaped spray opening 32 which generates a fan-shaped spray 34 of cleaning agent directed towards the inner wall of the drum 10 around the drum inner wall of chemicals - to clean residues. The advantage of this orientation of the fan-shaped spray jet 34 is, above all, that the cleaning agent is sprayed substantially onto the inner wall of the drum 10, and the support from the base plate 16 and support rods 18 and wafer 14 located therein only slightly, or ideally not at all is wetted with detergent. Thereby, it can be accomplished that substantially the drum inner wall is cleaned of chemical residues, which usually leaves the largest amount of chemical residues due to the comparatively large area after a processing step. In addition, the consumption of cleaning agents can be reduced because the drum 1 0 can be cleaned more efficiently from chemical residues. In operation of the wet-chemical wafer treating apparatus 14, cleaning agent may be sprayed via the cleaning spray nozzles 30 after completion of a preceding processing cycle with chemicals to treat the wafers 14 to remove residual process chemical residue prior to a subsequent processing step Preventing influence of the subsequent processing section by chemical residues largely to avoid.
Bezugszeichen reference numeral
10 Trommel 10 drum
1 1 Trommel-Beladungsöffnung  1 1 drum loading opening
12 Horde  12 Horde
14 Wafer  14 wafers
16 Halterungs-Bodenplatte  16 Bracket base plate
18 Halterungsstab  18 support rod
20 Motor  20 engine
22 Chemikalien-Sprühdüse  22 Chemical spray nozzle
31 Chemikalien-Zuleitung  31 Chemical supply line
24 Trommelboden  24 drum bottom
26 Motor-Antriebswelle  26 motor drive shaft
28 Labyrinth-Dichtung  28 labyrinth seal
30 Reinigungs-Sprühdüse  30 cleaning spray nozzle
32 schlitzförmige Sprühöffnung  32 slot-shaped spray opening
34 fächerförmiger Reinigungsmittel-Sprühstrahl  34 Fan-shaped detergent spray
36 Reihe von Reinigungs-Sprühdüsen 30  36 series of cleaning spray nozzles 30

Claims

Ansprüche claims
1 . Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiter-1 . Device for the wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor
Wafern, Substraten oder dergleichen (12, 14) mit Wafern, substrates or the like (12, 14) with
einer Trommel (10) mit einer Beladungsöffnung (1 1 ) und einem a drum (10) with a loading opening (1 1) and a
Trommelboden (24),  Drum bottom (24),
einer Halterung (16, 18) für die Objekte (12, 14), die um eine Rotationsachse drehbar in der Trommel (10) angeordnet ist, a support (16, 18) for the objects (12, 14) which is arranged rotatably about an axis of rotation in the drum (10),
einem Motor (20) mit einer durch den Trommelboden (24) hindurchtretendena motor (20) having a through the drum bottom (24) passing
Antriebswelle (26) zum Antreiben der Halterung (16, 18), Drive shaft (26) for driving the holder (16, 18),
einer oder mehreren Chemikalien-Sprühdüsen (22) zum Besprühen der in derone or more chemical spray nozzles (22) for spraying in the
Halterung (16, 18) gelagerten Objekte (14) mit Chemikalien und Holder (16, 18) mounted objects (14) with chemicals and
einer oder mehreren Reinigungs-Sprühdüsen (30) zum Besprühen zumindest eines Teils der Innenseite der Trommel (10) mit einem Reinigungsmittel. one or more cleaning spray nozzles (30) for spraying at least a part of the inside of the drum (10) with a cleaning agent.
2. Vorrichtung nach Anspruch 1 , dadurch gekennzeichnet, dass die eine oder mehreren Reinigungs-Sprühdüsen (30) derart ausgebildet ist bzw. sind, dass sie Reinigungsmittel-Sprühstrahlen in Richtung der Innenseite der Trommel (10) erzeugt bzw. erzeugen. 2. Apparatus according to claim 1, characterized in that the one or more cleaning spray nozzles (30) is or are formed such that they generate detergent sprays toward the inside of the drum (10) or produce.
3. Vorrichtung nach Anspruch 2, dadurch gekennzeichnet, dass die eine oder mehreren Reinigungs-Sprühdüsen (30) jeweils eine schlitzförmige 3. A device according to claim 2, characterized in that the one or more cleaning spray nozzles (30) each have a slot-shaped
Sprühöffnung (32) zum Erzeugen eines fächerförmigen Reinigungsmittel- Sprühstrahls aufweist bzw. aufweisen. Spray orifice (32) for generating a fan-shaped detergent spray jet or have.
4. Vorrichtung nach Anspruch 1 , 2 oder3, dadurch gekennzeichnet, dass mehrere Reinigungs-Sprühdüsen (30) hintereinander angeordnet in einer Reihe (36) an der Innenseite der Trommel (10) etwa parallel zu einer Reihen von hintereinander angeordneten Chemikalien-Sprühdüsen (22) vorgesehen sind. 4. Apparatus according to claim 1, 2 or 3, characterized in that a plurality of cleaning spray nozzles (30) arranged one behind the other in a row (36) on the inside of the drum (10) approximately parallel to a series of successively arranged chemical spray nozzles (22 ) are provided.
5. SAT- oder SST-Anlage zur nasschemischen Sprüh-Behandlung von Halbleiterscheiben mit mindestens einer Prozesskammer, die durch eine Vorrichtung nach einem der vorhergehenden Ansprüche gebildet ist. 5. SAT or SST system for wet-chemical spray treatment of semiconductor wafers with at least one process chamber, which is formed by a device according to one of the preceding claims.
6. Verwendung einer Vorrichtung nach einem der Ansprüche 1 bis 4 zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiter-Wafern, Substraten oder dergleichen. 6. Use of a device according to one of claims 1 to 4 for the wet-chemical treatment of objects, in particular of flat, in particular disc-shaped objects such as semiconductor wafers, substrates or the like.
PCT/DE2015/100064 2014-02-24 2015-02-16 Device for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped items such as semiconductor slices, substrates, or the like WO2015124145A1 (en)

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EP15715139.0A EP3111471A1 (en) 2014-02-24 2015-02-16 Device for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped items such as semiconductor slices, substrates, or the like
DE112015000939.6T DE112015000939A5 (en) 2014-02-24 2015-02-16 Apparatus for the wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates or the like

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DE202014100815.2 2014-02-24
DE202014100815.2U DE202014100815U1 (en) 2014-02-24 2014-02-24 Apparatus for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped objects such as semiconductor wafers, substrates or the like

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2709377A1 (en) * 1993-07-20 1995-03-03 Fujitsu Ltd Semiconductor device having a thin film for stabilising the surface state of the substrate, and method of manufacturing it
US20050150861A1 (en) * 2004-01-13 2005-07-14 Kwang-Myung Lee Etching apparatus and etching method
US20100024847A1 (en) * 2008-08-01 2010-02-04 Breese Ronald G Semiconductor wafer cleaning with dilute acids

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2709377A1 (en) * 1993-07-20 1995-03-03 Fujitsu Ltd Semiconductor device having a thin film for stabilising the surface state of the substrate, and method of manufacturing it
US20050150861A1 (en) * 2004-01-13 2005-07-14 Kwang-Myung Lee Etching apparatus and etching method
US20100024847A1 (en) * 2008-08-01 2010-02-04 Breese Ronald G Semiconductor wafer cleaning with dilute acids

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DE112015000939A5 (en) 2016-11-24
EP3111471A1 (en) 2017-01-04

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