WO2015124145A1 - Dispositif de traitement chimique par voie humide d'objets, en particulier d'objets plats, en particulier en forme de disques, tels que des tranches de semi-conducteur, des substrats ou similaires - Google Patents

Dispositif de traitement chimique par voie humide d'objets, en particulier d'objets plats, en particulier en forme de disques, tels que des tranches de semi-conducteur, des substrats ou similaires Download PDF

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Publication number
WO2015124145A1
WO2015124145A1 PCT/DE2015/100064 DE2015100064W WO2015124145A1 WO 2015124145 A1 WO2015124145 A1 WO 2015124145A1 DE 2015100064 W DE2015100064 W DE 2015100064W WO 2015124145 A1 WO2015124145 A1 WO 2015124145A1
Authority
WO
WIPO (PCT)
Prior art keywords
drum
objects
wet
spray nozzles
chemical
Prior art date
Application number
PCT/DE2015/100064
Other languages
German (de)
English (en)
Inventor
Egon Ramgraber
Original Assignee
Ramgraber Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ramgraber Gmbh filed Critical Ramgraber Gmbh
Priority to DE112015000939.6T priority Critical patent/DE112015000939A5/de
Priority to EP15715139.0A priority patent/EP3111471A1/fr
Publication of WO2015124145A1 publication Critical patent/WO2015124145A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like

Definitions

  • the invention relates to a device for wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates or the like according to claim 1.
  • SAT Spray Acid Tool
  • SST Spray Solvent Tool
  • a process chamber is semi-or fully automatically loaded with a stack of semiconductor wafers, for example a horde of wafers; after loading, the process chamber is closed; then the wafers are rotated and sprayed for treatment with high purity acidic, alkaline or solvent containing chemicals.
  • 1 shows a SAT / SST installation with a process chamber and FIG.
  • FIG. 2 shows a SAT / SST installation with two process chambers, both of which originate from the Applicant and are intended for various tasks, such as FEOL (Front End Of Line) or BEOL (Back End of Line) wafer cleaning, metal lift-off, polymer removal, paint stripping, substrate cleaning, spray development, etching, ozone-based processing of wafers.
  • Both systems are suitable for manual or fully automatic loading and can accommodate 2 "to 12" wafers or individual substrates in their process chambers.
  • As a substrate holder standard horde or individual Horden cages can be used.
  • SST and SAT systems such as the systems shown in FIGS. 1 and 2, as shown in FIG. 3 as a process chamber typically a drum 10, in which a rack 12 with multiple wafers 12 in a holder of a generally circular bottom plate 16 is mounted with a plurality of holding rods 18 mounted thereon.
  • the holder 16, 18 is arranged during the treatment process via an outside of the drum 10 Motor 20 is rotated so that the wafers rotate in the process chamber.
  • the treatment chemicals are sprayed into the process chamber via chemical spray nozzles 22 mounted in the drum wall to wet the rotating wafers 14.
  • the motor 20 is attached directly to the bottom 24 of the drum 10.
  • the drive shaft 26 of the motor 20 protrudes through an opening in the drum base 24 into the process chamber, where it is coupled to the disc 16 of the holder in order to enable them to rotate.
  • the drum opening through which the drive shaft 26 passes is sealed accordingly, for example with a labyrinth seal 28 and sealing rings.
  • the object of the present invention is now to further improve the device shown in FIG. 3 for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped objects such as semiconductor wafers, substrates or the like.
  • An essential idea of the invention is to provide additional nozzles in a drum for the wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates, for example ceramic or glass substrates, or the like, which are specially provided for rinsing the process chamber and are formed accordingly.
  • objects in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates, for example ceramic or glass substrates, or the like, which are specially provided for rinsing the process chamber and are formed accordingly.
  • chemical residues from one process step can be flushed out of the process chamber efficiently before a further process step is carried out.
  • these special cleaning nozzles are designed differently than those for spraying chemicals into the process chamber, as they are Do not spray the objects to be treated in the middle of the process chamber, but above all the inner wall of the process chamber or the drum and wash off any chemical residues on the inner wall efficiently.
  • deionized water is used as the cleaning agent to be sprayed by the cleaning nozzles.
  • An embodiment of the invention now relates to an apparatus for the wet-chemical treatment of objects, in particular flat, in particular disk-shaped objects such as semiconductor wafers, substrates or the like with a drum having a loading opening and a drum base, a holder for the objects, which is rotatable about an axis of rotation in the drum, a motor having a drive shaft passing through the drum bottom for driving the support, one or more chemical spray nozzles for spraying the objects stored in the support with chemicals, and one or more cleaning spray nozzles for spraying at least part of the inside the drum with a detergent.
  • the one or more cleaning spray nozzles may be configured to generate detergent spray jets toward the inside of the drum.
  • the one or more cleaning spray nozzles can each have a slot-shaped spray opening for producing a fan-shaped spray of cleaning agent.
  • a plurality of cleaning spray nozzles arranged one behind the other can be provided in a row on the inside of the drum approximately parallel to a series of successively arranged chemical spray nozzles.
  • a further embodiment of the invention relates to a SAT or SST system for wet-chemical spray treatment of semiconductor wafers having at least one process chamber, which is provided by a device according to the Invention and formed as described herein.
  • a system has the advantage that due to the device according to the invention the risk of engine damage is reduced due to emerging from the or the process chambers chemicals.
  • an embodiment of the invention also relates to the use of a device according to the invention and as described herein for the wet-chemical treatment of objects, in particular flat, in particular disc-shaped objects such as semiconductor wafers, substrates or the like.
  • FIG. 1 and 2 each a SAT / SST system with one or two process chambers
  • Fig. 3 is a sectional view of a drum as a process chamber of the SAT / SST system shown in Figs. 1 and 2 with a rotating holder for a wafer rack driven by a motor directly mounted to the bottom of the drum;
  • FIGS. 1 and 2 shows a plan view of an exemplary embodiment of the device according to the invention with a drum as the process chamber for the SAT / SST systems shown in FIGS. 1 and 2.
  • identical and / or functionally identical elements can be provided with the same reference numerals.
  • Fig. 4 shows an embodiment of the device according to the invention with a drum 10, which is suitable and provided as a process chamber for the SAT / SST system shown in Figs. 1 and 2, from the front, i. the drum loading opening 1 1.
  • a drum 10 which can be manually, semi or fully automatically equipped with a tray 12 with wafers 14 for wet chemical treatment.
  • a plurality of the already mentioned chemical spray nozzles 22 for the most uniform wetting of the wafer 14 with chemicals in a row are arranged one behind the other.
  • a further row 36 (FIG. 3) with cleaning spray nozzles 30 is arranged.
  • the cleaning spray nozzles 30 are each provided, as can be seen in FIG. 4, with a slot-shaped spray opening 32 which generates a fan-shaped spray 34 of cleaning agent directed towards the inner wall of the drum 10 around the drum inner wall of chemicals - to clean residues.
  • the advantage of this orientation of the fan-shaped spray jet 34 is, above all, that the cleaning agent is sprayed substantially onto the inner wall of the drum 10, and the support from the base plate 16 and support rods 18 and wafer 14 located therein only slightly, or ideally not at all is wetted with detergent.
  • cleaning agent may be sprayed via the cleaning spray nozzles 30 after completion of a preceding processing cycle with chemicals to treat the wafers 14 to remove residual process chemical residue prior to a subsequent processing step Preventing influence of the subsequent processing section by chemical residues largely to avoid.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

L'invention concerne un dispositif de traitement chimique par voie humide d'objets, en particulier d'objets plats, en particulier en forme de disques, tels que des tranches de semi-conducteur, des substrats ou similaires (12, 14). Ledit dispositif comprend un tambour (10) pourvu d'une ouverture de chargement (11) et d'un fond (24), un élément de retenue (16, 18) pour les objets (12, 14), qui est disposé dans le tambour (10) de manière à pouvoir tourner autour d'un axe de rotation, un moteur (20) pourvu d'un arbre d'entraînement (26) passant à travers le fond (24) du tambour et servant à entraîner l'élément de retenue (16, 18), une ou plusieurs buses de pulvérisation (22) de produits chimiques, servant à pulvériser des produits chimiques sur les objets (14) logés dans l'élément de retenue (16, 18), et une ou plusieurs buses de pulvérisation de nettoyage (30) servant à pulvériser un produit nettoyant sur au moins une partie de la face intérieure du tambour (10).
PCT/DE2015/100064 2014-02-24 2015-02-16 Dispositif de traitement chimique par voie humide d'objets, en particulier d'objets plats, en particulier en forme de disques, tels que des tranches de semi-conducteur, des substrats ou similaires WO2015124145A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE112015000939.6T DE112015000939A5 (de) 2014-02-24 2015-02-16 Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen
EP15715139.0A EP3111471A1 (fr) 2014-02-24 2015-02-16 Dispositif de traitement chimique par voie humide d'objets, en particulier d'objets plats, en particulier en forme de disques, tels que des tranches de semi-conducteur, des substrats ou similaires

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE202014100815.2U DE202014100815U1 (de) 2014-02-24 2014-02-24 Vorrichtung zur nasschemischen Behandlung von Objekten, insbesondere von flachen, insbesondere scheibenförmigen Gegenständen wie Halbleiterscheiben, Substraten oder dergleichen
DE202014100815.2 2014-02-24

Publications (1)

Publication Number Publication Date
WO2015124145A1 true WO2015124145A1 (fr) 2015-08-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2015/100064 WO2015124145A1 (fr) 2014-02-24 2015-02-16 Dispositif de traitement chimique par voie humide d'objets, en particulier d'objets plats, en particulier en forme de disques, tels que des tranches de semi-conducteur, des substrats ou similaires

Country Status (3)

Country Link
EP (1) EP3111471A1 (fr)
DE (2) DE202014100815U1 (fr)
WO (1) WO2015124145A1 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2709377A1 (fr) * 1993-07-20 1995-03-03 Fujitsu Ltd Dispositif semiconducteur ayant une pellicule mince de stabilisation de l'état de surface du substrat et son procédé de fabrication.
US20050150861A1 (en) * 2004-01-13 2005-07-14 Kwang-Myung Lee Etching apparatus and etching method
US20100024847A1 (en) * 2008-08-01 2010-02-04 Breese Ronald G Semiconductor wafer cleaning with dilute acids

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2709377A1 (fr) * 1993-07-20 1995-03-03 Fujitsu Ltd Dispositif semiconducteur ayant une pellicule mince de stabilisation de l'état de surface du substrat et son procédé de fabrication.
US20050150861A1 (en) * 2004-01-13 2005-07-14 Kwang-Myung Lee Etching apparatus and etching method
US20100024847A1 (en) * 2008-08-01 2010-02-04 Breese Ronald G Semiconductor wafer cleaning with dilute acids

Also Published As

Publication number Publication date
EP3111471A1 (fr) 2017-01-04
DE112015000939A5 (de) 2016-11-24
DE202014100815U1 (de) 2014-03-14

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