DE112015000595A5 - Oberflächenmontierbares Multichip-Bauelement - Google Patents

Oberflächenmontierbares Multichip-Bauelement Download PDF

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Publication number
DE112015000595A5
DE112015000595A5 DE112015000595.1T DE112015000595T DE112015000595A5 DE 112015000595 A5 DE112015000595 A5 DE 112015000595A5 DE 112015000595 T DE112015000595 T DE 112015000595T DE 112015000595 A5 DE112015000595 A5 DE 112015000595A5
Authority
DE
Germany
Prior art keywords
chip component
mountable multi
mountable
chip
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112015000595.1T
Other languages
English (en)
Other versions
DE112015000595B4 (de
Inventor
Stefan Morgott
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112015000595A5 publication Critical patent/DE112015000595A5/de
Application granted granted Critical
Publication of DE112015000595B4 publication Critical patent/DE112015000595B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Led Device Packages (AREA)
DE112015000595.1T 2014-01-31 2015-01-30 Oberflächenmontierbares Multichip-Bauelement Active DE112015000595B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102014101215.1 2014-01-31
DE102014101215.1A DE102014101215A1 (de) 2014-01-31 2014-01-31 Oberflächenmontierbares Multichip-Bauelement
PCT/EP2015/051955 WO2015114103A1 (de) 2014-01-31 2015-01-30 Oberflächenmontierbares multichip-bauelement

Publications (2)

Publication Number Publication Date
DE112015000595A5 true DE112015000595A5 (de) 2016-11-03
DE112015000595B4 DE112015000595B4 (de) 2024-03-28

Family

ID=52434834

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102014101215.1A Withdrawn DE102014101215A1 (de) 2014-01-31 2014-01-31 Oberflächenmontierbares Multichip-Bauelement
DE112015000595.1T Active DE112015000595B4 (de) 2014-01-31 2015-01-30 Oberflächenmontierbares Multichip-Bauelement

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102014101215.1A Withdrawn DE102014101215A1 (de) 2014-01-31 2014-01-31 Oberflächenmontierbares Multichip-Bauelement

Country Status (4)

Country Link
US (1) US10037979B2 (de)
JP (1) JP6393765B2 (de)
DE (2) DE102014101215A1 (de)
WO (1) WO2015114103A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107331658B (zh) * 2017-07-27 2018-09-25 旭宇光电（深圳）股份有限公司 多腔体植物照明led封装结构

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01157577A (ja) * 1987-12-14 1989-06-20 Mini Pairo Denki:Kk 半導体発光装置
JPH06196759A (ja) * 1992-12-24 1994-07-15 Sharp Corp 発光素子
US7183588B2 (en) * 2004-01-08 2007-02-27 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Light emission device
DE102004036157B4 (de) * 2004-07-26 2023-03-16 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Elektromagnetische Strahlung emittierendes optoelektronisches Bauelement und Leuchtmodul
US20070086185A1 (en) 2005-10-18 2007-04-19 Hwang Yi F Electroluminescent device having a plurality of light emitting diodes
KR100828891B1 (ko) * 2006-02-23 2008-05-09 엘지이노텍 주식회사 Ｌｅｄ 패키지
KR100735325B1 (ko) 2006-04-17 2007-07-04 삼성전기주식회사 발광다이오드 패키지 및 그 제조방법
US8531126B2 (en) * 2008-02-13 2013-09-10 Canon Components, Inc. White light emitting apparatus and line illuminator using the same in image reading apparatus
US20100244731A1 (en) * 2008-02-13 2010-09-30 Canon Components, Inc. White light emitting diode, white light emitting apparatus, and linear illuminator using the same
US8384097B2 (en) * 2009-04-08 2013-02-26 Ledengin, Inc. Package for multiple light emitting diodes
US8492777B2 (en) * 2010-04-09 2013-07-23 Everlight Electronics Co., Ltd. Light emitting diode package, lighting device and light emitting diode package substrate
US9627361B2 (en) * 2010-10-07 2017-04-18 Cree, Inc. Multiple configuration light emitting devices and methods
CN102231377B (zh) * 2010-12-18 2012-07-11 木林森股份有限公司 一种高显色性的发光二极管及其制造方法
DE102011085645B4 (de) 2011-11-03 2014-06-26 Osram Gmbh Leuchtdiodenmodul und Verfahren zum Betreiben eines Leuchtdiodenmoduls
CN102903708B (zh) 2012-09-14 2016-06-01 深圳市中庆微科技开发有限公司 一种led器件、led灯及led模组
DE102013219063A1 (de) 2013-09-23 2015-03-26 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
US20160336301A1 (en) 2016-11-17
JP6393765B2 (ja) 2018-09-19
DE112015000595B4 (de) 2024-03-28
JP2017505997A (ja) 2017-02-23
US10037979B2 (en) 2018-07-31
DE102014101215A1 (de) 2015-08-06
WO2015114103A1 (de) 2015-08-06

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R409 Internal rectification of the legal status completed
R409 Internal rectification of the legal status completed
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0033620000

Ipc: H01L0025075000

R016 Response to examination communication
R016 Response to examination communication
R016 Response to examination communication
R018 Grant decision by examination section/examining division