DE112013004754A5 - Optoelektronische Vorrichtung - Google Patents

Optoelektronische Vorrichtung Download PDF

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Publication number
DE112013004754A5
DE112013004754A5 DE112013004754.3T DE112013004754T DE112013004754A5 DE 112013004754 A5 DE112013004754 A5 DE 112013004754A5 DE 112013004754 T DE112013004754 T DE 112013004754T DE 112013004754 A5 DE112013004754 A5 DE 112013004754A5
Authority
DE
Germany
Prior art keywords
optoelectronic device
optoelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE112013004754.3T
Other languages
English (en)
Inventor
Stefan Brandl
Hubert Halbritter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112013004754A5 publication Critical patent/DE112013004754A5/de
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4811—Constructional features, e.g. arrangements of optical elements common to transmitter and receiver
    • G01S7/4813—Housing arrangements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/04—Systems determining the presence of a target
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4814—Constructional features, e.g. arrangements of optical elements of transmitters alone
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481—Constructional features, e.g. arrangements of optical elements
    • G01S7/4816—Constructional features, e.g. arrangements of optical elements of receivers alone
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
    • H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • H01L31/16—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources
    • H01L31/167—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers
    • H01L31/173—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto the semiconductor device sensitive to radiation being controlled by the light source or sources the light sources and the devices sensitive to radiation all being semiconductor devices characterised by potential barriers formed in, or on, a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Remote Sensing (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Light Receiving Elements (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
DE112013004754.3T 2012-09-27 2013-09-19 Optoelektronische Vorrichtung Ceased DE112013004754A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012109183.8 2012-09-27
DE102012109183.8A DE102012109183A1 (de) 2012-09-27 2012-09-27 Optoelektronische Vorrichtung
PCT/EP2013/069499 WO2014048832A1 (de) 2012-09-27 2013-09-19 Optoelektronische vorrichtung

Publications (1)

Publication Number Publication Date
DE112013004754A5 true DE112013004754A5 (de) 2015-08-27

Family

ID=49212786

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102012109183.8A Withdrawn DE102012109183A1 (de) 2012-09-27 2012-09-27 Optoelektronische Vorrichtung
DE112013004754.3T Ceased DE112013004754A5 (de) 2012-09-27 2013-09-19 Optoelektronische Vorrichtung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102012109183.8A Withdrawn DE102012109183A1 (de) 2012-09-27 2012-09-27 Optoelektronische Vorrichtung

Country Status (3)

Country Link
US (1) US9671490B2 (de)
DE (2) DE102012109183A1 (de)
WO (1) WO2014048832A1 (de)

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US9496247B2 (en) * 2013-08-26 2016-11-15 Optiz, Inc. Integrated camera module and method of making same
KR102221599B1 (ko) * 2014-06-18 2021-03-02 엘지이노텍 주식회사 발광 소자 패키지
JP6417199B2 (ja) 2014-12-08 2018-10-31 浜松ホトニクス株式会社 量子カスケードレーザ装置
EP3059764B1 (de) * 2015-02-18 2021-04-28 Nokia Technologies Oy Vorrichtung zur Ausstrahlung von Licht und Herstellungsverfahren dafür
US10705213B2 (en) 2015-07-24 2020-07-07 Everready Precision Ind. Corp. Optical apparatus
TWI656355B (zh) * 2015-07-24 2019-04-11 高準精密工業股份有限公司 光學裝置
CN106353889A (zh) * 2015-07-24 2017-01-25 高准精密工业股份有限公司 光学装置
JP2017041467A (ja) * 2015-08-17 2017-02-23 ローム株式会社 光半導体装置
US10352764B2 (en) * 2015-09-24 2019-07-16 Ams Sensors Singapore Pte. Ltd. Concealed optoelectronic module
JP6685136B2 (ja) * 2016-01-15 2020-04-22 ローム株式会社 近接センサ
DE102016103136A1 (de) * 2016-02-23 2017-08-24 Vishay Semiconductor Gmbh Optoelektronische Vorrichtung
DE102016103144A1 (de) 2016-02-23 2017-08-24 Vishay Semiconductor Gmbh Optoelektronische Vorrichtung
DE102016103113A1 (de) 2016-02-23 2017-08-24 Vishay Semiconductor Gmbh Optoelektronische Vorrichtung
DE102016103123A1 (de) 2016-02-23 2017-08-24 Vishay Semiconductor Gmbh Optoelektronische Vorrichtung
US9911890B2 (en) * 2016-06-30 2018-03-06 Stmicroelectronics Pte Ltd Optical sensor package including a cavity formed in an image sensor die
CN107785357A (zh) * 2016-08-26 2018-03-09 意法半导体研发(深圳)有限公司 用于光学传感器封装体的防粘胶溢出帽盖
FR3055509B1 (fr) 2016-08-26 2018-09-21 Stmicroelectronics (Grenoble 2) Sas Boitier electronique comprenant un capot a rainure
DE102017105210A1 (de) * 2017-03-13 2018-09-13 Valeo Schalter Und Sensoren Gmbh Optische Abstrahlvorrichtung für Laserpulse mit selektiver Optik
US10475937B1 (en) * 2017-03-30 2019-11-12 Maxim Integrated Products, Inc. Optical sensor packages employing cloaking layers
DE102017111202A1 (de) 2017-05-23 2018-11-29 Osram Opto Semiconductors Gmbh Sensor und biosensor
JP7132502B2 (ja) * 2018-03-09 2022-09-07 日亜化学工業株式会社 光源装置
DE102018115342A1 (de) 2018-06-26 2020-01-02 Tdk Electronics Ag Bauelement
US11619828B2 (en) * 2020-01-17 2023-04-04 Stmicroelectronics (Research & Development) Limited Transmission beam splitter
DE102020101038A1 (de) * 2020-01-17 2021-07-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Lichtemittierendes Bauelement
US11353993B2 (en) * 2020-05-05 2022-06-07 Pixart Imaging Inc. Optical detection device

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Also Published As

Publication number Publication date
DE102012109183A1 (de) 2014-03-27
US20150226839A1 (en) 2015-08-13
WO2014048832A1 (de) 2014-04-03
US9671490B2 (en) 2017-06-06

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Representative=s name: ZACCO PATENTANWALTS- UND RECHTSANWALTSGESELLSC, DE

R002 Refusal decision in examination/registration proceedings
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