DE112013001011A5 - Thermopile Infrarot-Sensorstruktur mit hohem Füllgrad - Google Patents

Thermopile Infrarot-Sensorstruktur mit hohem Füllgrad Download PDF

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Publication number
DE112013001011A5
DE112013001011A5 DE112013001011.9T DE112013001011T DE112013001011A5 DE 112013001011 A5 DE112013001011 A5 DE 112013001011A5 DE 112013001011 T DE112013001011 T DE 112013001011T DE 112013001011 A5 DE112013001011 A5 DE 112013001011A5
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DE
Germany
Prior art keywords
filling
high degree
infrared sensor
sensor structure
thermopile infrared
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112013001011.9T
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English (en)
Other versions
DE112013001011B4 (de
Inventor
Frank Herrmann
Marion Simon
Bodo FORG
Karlheinz Storck
Wilhelm Leneke
Michael Müller
Jörg Schieferdecker
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HEIMANN Sensor GmbH
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HEIMANN Sensor GmbH
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Publication date
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Publication of DE112013001011A5 publication Critical patent/DE112013001011A5/de
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G01J5/023—Particular leg structure or construction or shape; Nanotubes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0815—Light concentrators, collectors or condensers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0853—Optical arrangements having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Nanotechnology (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
DE112013001011.9T 2012-02-16 2013-01-18 Thermopile Infrarot-Sensorstruktur mit hohem Füllgrad Active DE112013001011B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102012202415 2012-02-16
DE102012202415.8 2012-02-16
PCT/EP2013/050881 WO2013120652A1 (de) 2012-02-16 2013-01-18 Thermopile infrarot-sensorstruktur mit hohem füllgrad

Publications (2)

Publication Number Publication Date
DE112013001011A5 true DE112013001011A5 (de) 2014-11-13
DE112013001011B4 DE112013001011B4 (de) 2017-07-27

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE112013001011.9T Active DE112013001011B4 (de) 2012-02-16 2013-01-18 Thermopile Infrarot-Sensorstruktur mit hohem Füllgrad

Country Status (6)

Country Link
US (1) US9945725B2 (de)
JP (1) JP5934809B2 (de)
KR (1) KR101701275B1 (de)
CN (1) CN104246457B (de)
DE (1) DE112013001011B4 (de)
WO (1) WO2013120652A1 (de)

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* Cited by examiner, † Cited by third party
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US9219185B2 (en) * 2013-12-19 2015-12-22 Excelitas Technologies Singapore Pte. Ltd CMOS integrated method for the fabrication of thermopile pixel with umbrella absorber on semiconductor substrate
US9373772B2 (en) 2014-01-15 2016-06-21 Excelitas Technologies Singapore Pte. Ltd. CMOS integrated method for the release of thermopile pixel on a substrate by using anisotropic and isotropic etching
US9324760B2 (en) 2014-01-21 2016-04-26 Excelitas Technologies Singapore Pte. Ltd CMOS integrated method for fabrication of thermopile pixel on semiconductor substrate with buried insulation regions
CN113008385B (zh) * 2015-10-05 2023-04-07 海曼传感器有限责任公司 具有单片集成信号处理的高分辨率热电堆红外传感器阵列
EP3380820B1 (de) 2015-11-27 2021-09-15 Heimann Sensor GmbH Thermischer infrarot-sensorarray im wafer-level-package
CN107290067B (zh) * 2016-04-01 2021-07-30 上海巨哥科技股份有限公司 一种低时间常数的非制冷红外探测器
DE102017113023A1 (de) * 2016-06-21 2017-12-21 Heimann Sensor Gmbh Thermopile Infrarot Einzelsensor für Temperaturmessungen oder zur Gasdetektion
US10605632B2 (en) * 2016-07-01 2020-03-31 Teledyne Scientific & Imaging, Llc Stackable dual-threaded bushing and spacer assembly
FR3056292B1 (fr) * 2016-09-22 2020-11-20 Commissariat Energie Atomique Structure de detection de rayonnements electromagnetiques de type bolometre et procede de fabrication d'une telle structure
WO2020185970A2 (en) 2019-03-11 2020-09-17 Flir Commercial Systems, Inc. Microbolometer systems and methods
WO2021005150A1 (de) 2019-07-09 2021-01-14 Heimann Sensor Gmbh Verfahren zum herstellen eines thermischen infrarot-sensor arrays in einem vakuumgefüllten waferlevel gehäuse
CN111504480B (zh) * 2020-06-30 2020-10-09 北京北方高业科技有限公司 一种红外探测器
CN111947787B (zh) * 2020-07-06 2021-07-13 北京北方高业科技有限公司 红外探测器及其制备方法
US11808633B2 (en) * 2021-08-16 2023-11-07 Oriental System Technology Inc. Infrared thermopile sensor
KR102364226B1 (ko) 2021-09-06 2022-02-17 (주)이지템 온도측정장치 및 그 장치의 써모파일 어레이 센서의 크로스토크 간섭 보정 방법
WO2023128782A1 (ru) * 2021-12-29 2023-07-06 Общество с ограниченной ответственностью "СТЭК-М" Инфракрасный одноэлементный термопарный сенсор температуры
CN115072651B (zh) * 2022-06-24 2022-12-20 深圳市兆兴博拓科技股份有限公司 一种mems红外热传感芯片
CN116940203A (zh) * 2023-09-07 2023-10-24 深圳市美思先端电子有限公司 一种热释电红外传感器

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EP0122526B1 (de) 1983-04-13 1987-05-20 BBC Aktiengesellschaft Brown, Boveri & Cie. Brennstofflanze für die Brennkammer einer Gasturbine
US5426412A (en) 1992-10-27 1995-06-20 Matsushita Electric Works, Ltd. Infrared detecting device and infrared detecting element for use in the device
JP3529596B2 (ja) * 1997-08-06 2004-05-24 株式会社東芝 赤外線固体撮像装置及びその製造方法
JP2001074549A (ja) * 1999-06-29 2001-03-23 Denso Corp 赤外線センサ及びその製造方法
JP3514681B2 (ja) * 1999-11-30 2004-03-31 三菱電機株式会社 赤外線検出器
JP3921320B2 (ja) * 2000-01-31 2007-05-30 日本電気株式会社 熱型赤外線検出器およびその製造方法
JP4144204B2 (ja) * 2001-09-20 2008-09-03 日産自動車株式会社 光吸収膜およびその製造方法
FR2839150B1 (fr) * 2002-04-29 2004-05-28 Commissariat Energie Atomique Dispositif de detection thermique de rayonnement a nombre de points d'ancrage reduit
JP2004239708A (ja) * 2003-02-05 2004-08-26 Mitsubishi Electric Corp 赤外線検出装置およびその製造方法
JP3944465B2 (ja) * 2003-04-11 2007-07-11 三菱電機株式会社 熱型赤外線検出器及び赤外線フォーカルプレーンアレイ
JP2004340719A (ja) * 2003-05-15 2004-12-02 Mitsubishi Electric Corp 赤外線センサ
JP4315832B2 (ja) * 2004-02-17 2009-08-19 三菱電機株式会社 熱型赤外センサ素子および熱型赤外センサアレイ
JP5308814B2 (ja) * 2005-05-17 2013-10-09 ハイマン・ゼンゾル・ゲゼルシャフト・ミト・ベシュレンクテル・ハフツング サーモパイル赤外線センサアレイ
EP2034285B1 (de) * 2006-05-24 2013-04-03 The Ritsumeikan Trust Infrarot-array-sensor
JP4839977B2 (ja) * 2006-06-21 2011-12-21 パナソニック電工株式会社 赤外線センサ装置
US7622717B2 (en) * 2007-08-22 2009-11-24 Drs Sensors & Targeting Systems, Inc. Pixel structure having an umbrella type absorber with one or more recesses or channels sized to increase radiation absorption
JP5760297B2 (ja) * 2009-03-06 2015-08-05 日本電気株式会社 熱型赤外線センサ、及び熱型赤外線センサの製造方法
JP2011027650A (ja) * 2009-07-28 2011-02-10 Panasonic Electric Works Co Ltd 赤外線センサ
DE102010042108B4 (de) * 2010-01-18 2013-10-17 Heimann Sensor Gmbh Thermopile-Infrarot-Sensor in monolithischer Si-Mikromechanik

Also Published As

Publication number Publication date
CN104246457A (zh) 2014-12-24
KR20140136450A (ko) 2014-11-28
US9945725B2 (en) 2018-04-17
DE112013001011B4 (de) 2017-07-27
US20160025571A1 (en) 2016-01-28
JP5934809B2 (ja) 2016-06-15
JP2015507206A (ja) 2015-03-05
KR101701275B1 (ko) 2017-02-01
CN104246457B (zh) 2018-07-20
WO2013120652A1 (de) 2013-08-22

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