DE112008001201T5 - Verfahren zum Wachsenlassen eines Silizium-Einkristalls - Google Patents
Verfahren zum Wachsenlassen eines Silizium-Einkristalls Download PDFInfo
- Publication number
- DE112008001201T5 DE112008001201T5 DE112008001201T DE112008001201T DE112008001201T5 DE 112008001201 T5 DE112008001201 T5 DE 112008001201T5 DE 112008001201 T DE112008001201 T DE 112008001201T DE 112008001201 T DE112008001201 T DE 112008001201T DE 112008001201 T5 DE112008001201 T5 DE 112008001201T5
- Authority
- DE
- Germany
- Prior art keywords
- carbon
- single crystal
- silicon single
- crucible
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/02—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt
- C30B15/04—Single-crystal growth by pulling from a melt, e.g. Czochralski method adding crystallising materials or reactants forming it in situ to the melt adding doping materials, e.g. for n-p-junction
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-142988 | 2007-05-30 | ||
| JP2007142988A JP5061728B2 (ja) | 2007-05-30 | 2007-05-30 | シリコン単結晶の育成方法 |
| PCT/JP2008/001029 WO2008146443A1 (ja) | 2007-05-30 | 2008-04-18 | シリコン単結晶の育成方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE112008001201T5 true DE112008001201T5 (de) | 2010-08-05 |
Family
ID=40074721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE112008001201T Ceased DE112008001201T5 (de) | 2007-05-30 | 2008-04-18 | Verfahren zum Wachsenlassen eines Silizium-Einkristalls |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20100116195A1 (https=) |
| JP (1) | JP5061728B2 (https=) |
| KR (1) | KR101465425B1 (https=) |
| DE (1) | DE112008001201T5 (https=) |
| WO (1) | WO2008146443A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5510359B2 (ja) * | 2011-02-21 | 2014-06-04 | 信越半導体株式会社 | 炭素ドープシリコン単結晶の製造方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11302099A (ja) | 1998-04-21 | 1999-11-02 | Sumitomo Metal Ind Ltd | シリコン単結晶の製造方法 |
| JPH11312683A (ja) | 1998-04-28 | 1999-11-09 | Sumitomo Metal Ind Ltd | 半導体単結晶シリコンの製造方法 |
| JP2002293691A (ja) | 2001-03-30 | 2002-10-09 | Shin Etsu Handotai Co Ltd | シリコン単結晶の製造方法及びシリコン単結晶並びにシリコンウエーハ |
| JP2003146796A (ja) | 2001-10-30 | 2003-05-21 | Hynix Semiconductor Inc | 半導体ウェーハの製造方法 |
| JP2005320203A (ja) | 2004-05-10 | 2005-11-17 | Shin Etsu Handotai Co Ltd | シリコン単結晶の製造方法及びシリコン単結晶 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3980854A (en) * | 1974-11-15 | 1976-09-14 | Rca Corporation | Graphite susceptor structure for inductively heating semiconductor wafers |
| JPS58151392A (ja) * | 1982-02-26 | 1983-09-08 | Sumitomo Metal Mining Co Ltd | かさ比重の大きい酸化物単結晶引上げ用原料の調整方法 |
| JPS6033210A (ja) * | 1983-08-02 | 1985-02-20 | Komatsu Denshi Kinzoku Kk | 半導体用シリコンの破砕方法 |
| DE4106589C2 (de) * | 1991-03-01 | 1997-04-24 | Wacker Siltronic Halbleitermat | Kontinuierliches Nachchargierverfahren mit flüssigem Silicium beim Tiegelziehen nach Czochralski |
| TW429273B (en) * | 1996-02-08 | 2001-04-11 | Shinetsu Handotai Kk | Method for feeding garnular silicon material, feed pipe used in the method, and method of manufacturing a silicon monocrystal |
| DE69701126T2 (de) * | 1996-07-30 | 2000-06-21 | Sony Corp., Tokio/Tokyo | Sekundärbatterie mit nichtwässrigem elektrolyten |
| JP4256576B2 (ja) * | 2000-08-31 | 2009-04-22 | 信越半導体株式会社 | 半導体単結晶製造装置 |
| CN1543518A (zh) * | 2001-07-05 | 2004-11-03 | Axt | 以坚固支座、碳掺杂和电阻率控制及温度梯度控制来生长半导体晶体的方法和装置 |
| DE10133635A1 (de) * | 2001-07-11 | 2003-02-06 | Sgl Carbon Ag | Mehrschichtiger Keramik-Verbund |
| US20030101924A1 (en) * | 2001-11-15 | 2003-06-05 | Memc Electronic Materials, Inc. | Intermittent feeding technique for increasing the melting rate of polycrystalline silicon |
| US20090214954A1 (en) * | 2004-08-30 | 2009-08-27 | Mitsubishi Chemical Corporation | Negative electrode material for nonaqueous secondary cells, negative electrode for nonaqueous secondary cells, and nonaqueous secondary cell |
-
2007
- 2007-05-30 JP JP2007142988A patent/JP5061728B2/ja active Active
-
2008
- 2008-04-18 DE DE112008001201T patent/DE112008001201T5/de not_active Ceased
- 2008-04-18 KR KR1020097024707A patent/KR101465425B1/ko active Active
- 2008-04-18 WO PCT/JP2008/001029 patent/WO2008146443A1/ja not_active Ceased
- 2008-04-18 US US12/450,807 patent/US20100116195A1/en not_active Abandoned
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11302099A (ja) | 1998-04-21 | 1999-11-02 | Sumitomo Metal Ind Ltd | シリコン単結晶の製造方法 |
| JPH11312683A (ja) | 1998-04-28 | 1999-11-09 | Sumitomo Metal Ind Ltd | 半導体単結晶シリコンの製造方法 |
| JP2002293691A (ja) | 2001-03-30 | 2002-10-09 | Shin Etsu Handotai Co Ltd | シリコン単結晶の製造方法及びシリコン単結晶並びにシリコンウエーハ |
| JP2003146796A (ja) | 2001-10-30 | 2003-05-21 | Hynix Semiconductor Inc | 半導体ウェーハの製造方法 |
| JP2005320203A (ja) | 2004-05-10 | 2005-11-17 | Shin Etsu Handotai Co Ltd | シリコン単結晶の製造方法及びシリコン単結晶 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100116195A1 (en) | 2010-05-13 |
| KR20100017406A (ko) | 2010-02-16 |
| JP2008297139A (ja) | 2008-12-11 |
| WO2008146443A1 (ja) | 2008-12-04 |
| JP5061728B2 (ja) | 2012-10-31 |
| KR101465425B1 (ko) | 2014-11-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed | ||
| R012 | Request for examination validly filed |
Effective date: 20141219 |
|
| R016 | Response to examination communication | ||
| R002 | Refusal decision in examination/registration proceedings | ||
| R003 | Refusal decision now final |