DE112006004136A5 - Leiterplatte, insbesondere Keramikleiterplatte - Google Patents

Leiterplatte, insbesondere Keramikleiterplatte Download PDF

Info

Publication number
DE112006004136A5
DE112006004136A5 DE112006004136T DE112006004136T DE112006004136A5 DE 112006004136 A5 DE112006004136 A5 DE 112006004136A5 DE 112006004136 T DE112006004136 T DE 112006004136T DE 112006004136 T DE112006004136 T DE 112006004136T DE 112006004136 A5 DE112006004136 A5 DE 112006004136A5
Authority
DE
Germany
Prior art keywords
circuit board
particular ceramic
printed circuit
ceramic circuit
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE112006004136T
Other languages
English (en)
Inventor
Walter Apfelbacher
Rainer Kreutzer
Heinz WÖLLMER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Publication of DE112006004136A5 publication Critical patent/DE112006004136A5/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10946—Leads attached onto leadless component after manufacturing the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
DE112006004136T 2006-09-13 2006-09-13 Leiterplatte, insbesondere Keramikleiterplatte Withdrawn DE112006004136A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE2006/001598 WO2008031366A1 (de) 2006-09-13 2006-09-13 Leiterplatte, insbesondere keramikleiterplatte

Publications (1)

Publication Number Publication Date
DE112006004136A5 true DE112006004136A5 (de) 2009-08-20

Family

ID=37691811

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112006004136T Withdrawn DE112006004136A5 (de) 2006-09-13 2006-09-13 Leiterplatte, insbesondere Keramikleiterplatte

Country Status (2)

Country Link
DE (1) DE112006004136A5 (de)
WO (1) WO2008031366A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY163440A (en) * 2009-11-09 2017-09-15 Zeiss Carl Vision Int Gmbh Ophthalmic lens element
DE102013227003A1 (de) * 2013-12-20 2015-06-25 Robert Bosch Gmbh Elektronisches Steuermodul und Verfahren zur Herstellung eines elektronischen Steuermoduls
DE102018213639A1 (de) 2018-08-14 2020-02-20 Te Connectivity Germany Gmbh Verfahren zum Anbringen wenigstens eines insbesondere stiftförmigen Kontaktelements auf einer Leiterbahn einer Leiterplatte, Stiftleiste zur Anbringung auf einer Leiterplatte, Verbindungsanordnung
DE102022204292A1 (de) 2022-05-02 2023-11-02 Robert Bosch Gesellschaft mit beschränkter Haftung Kontaktanordnung mit einer verschweißten flexiblen Leiterplatte

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59114849A (ja) * 1982-12-22 1984-07-03 Toshiba Corp 混成集積回路の製造方法
JPH05261579A (ja) * 1992-03-10 1993-10-12 Fujitsu Ten Ltd 溶着装置
TW555722B (en) * 2002-01-30 2003-10-01 Leu-Wen Tsay A method of manufacturing high-temperature sensor with metal/ceramic joint

Also Published As

Publication number Publication date
WO2008031366A1 (de) 2008-03-20

Similar Documents

Publication Publication Date Title
DE602006017908D1 (de) Leiterplatte
DE602007011692D1 (de) Leiterplatte
DE602007000582D1 (de) Leiterplatte
EP2013937A4 (de) Planare mischsignalplatine
DK2036062T3 (da) Elektronisk informationstavle
GB2453083B (en) Printed circuit boards
DE602007001847D1 (de) Flexible Leiterplatte
EP2071907A4 (de) Flex-rigid-leiterplatte und verfahren zur herstellung der flex-rigid-leiterplatte
DE602005024783D1 (de) Verbinder für Leiterplatte
FI20060256L (fi) Piirilevyn valmistaminen ja komponentin sisältävä piirilevy
DE502007002763D1 (de) Schaltungsmodul
EP2023171A4 (de) Anbringplatte für optische elemente, optische leiterplatte und anbringplatte für optische elemente
DE602006000514D1 (de) Leiterplatte und Herstellungsverfahren dafür
TWI372008B (en) Printed circuit board
DE602006019994D1 (de) Leiterplatte
FI20075593A0 (fi) Menetelmä valmistaa komponenttiin upotettu piirilevy
GB0806424D0 (en) Quasi-waveguide printed circuit board structure
DE502006009152D1 (de) Leiterplatte
GB0806423D0 (en) Printed circuit board waveguide
BRPI0813123A2 (pt) Terminal de bilheteria de embarque
DE112006004136A5 (de) Leiterplatte, insbesondere Keramikleiterplatte
NL2001706A1 (nl) Printed circuit board assembly and manufacturing method for the same.
DE602007004373D1 (de) Leiterplatte
TWI367058B (en) Circuit board
DE112006000630A5 (de) Leiterplatte

Legal Events

Date Code Title Description
8139 Disposal/non-payment of the annual fee