DE112006000160T5 - Production of structures with a high surface / volume ratio and their integration into micro heat exchangers for liquid cooling systems - Google Patents

Abstract

Method for producing a microstructure having heat exchanger with the following steps:
a. Forming a plurality of microapertures through a plurality of heat conductive sheets using a material removing method to form a plurality of windowed sheets; and
b. Coupling the windowed layers together to form a layered composite microstructure.

Description

Related registrations

These Registration is a (= based on a) continuation-in-part application a pending U.S. Patent Application S.N. 10/680 584 of 6 October 2003 with the Name "METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE ", which is a continuation-in-part application of U.S. Patent Application S.N. 10/439 635 of 16 May 2003 entitled "METHODS FOR FLEXIBLE FLUID DELIVERY AND HOTSPOT COOLING BY MICROCHANNEL HEAT SINKS "is what a priority according to 35 U.S.C. Section 119 (e) the pending U.S. Provisional Patent Applications S.N. 60/423 009 of 1 November 2002 "METHODS FOR FLEXIBLE FLUID DELIVERY AND HOTSPOT COOLING BY MICROCHANNEL HEAT SINKS ", pp. 60/442 382 of 24 January 2003 "OPTIMIZED PLATE FIN HEAT EXCHANGER FOR CPU COOLING "and S.N. 60/455 729 of 17 March 2003" MICROCHANNEL HEAT EXCHANGER APPARATUS WITH POROUS CONFIGURATION AND METHOD OF MANUFACTURING THEREOF "is what thereby all be incorporated by reference. This application is also a Continuation-in-part application of pending U.S. patent application S.N. 10/439 912 of 16 May 2003 "INTERWOVEN MANIFOLDS FOR PRESSURE DROP REDUCTION IN MICROCHANNEL HEAT EXCHANGERS ", which is the priority according to 35 U.S.C. Section 119 (e) the pending U.S. Provisional Patent Applications S.N. 60/423 009 of 1 November 2002 "METHODS FOR FLEXIBLE FLUID DELIVERY AND HOTSPOT COOLING BY MICROCHANNEL HEAT SINKS ", p.N. 60/442 382 of 24 January 2003 "" OPTIMIZED PLATE FIN HEAT EXCHANGER FOR CPU COOLING "and S.N. 60/455 729 of 17 March 2003 "MICROCHANNEL HEAT EXCHANGER APPARATUS WITH POROUS CONFIGURATION AND METHOD OF MANUFACTURING THEREOF "claims which thereby complete with appropriate reference.

These Application is also a continuation-in-part application of pending U.S. patent application S.N. 10/612 241 of 1 July 2003 "MULTI-LEVEL MICROCHANNEL HEAT EXCHANGERS ", which is the priority according to 35 U.S.C. Section 119 (e) the pending U.S. Provisional Patent Application S.N. 60/455 729 of 17 March 2003 "MICROCHANNEL HEAT EXCHANGE WITH POROUS CONFIGURATION AND METHOD OF MANUFACTURING THEREOF "claims which both are hereby incorporated by reference. Further claimed this application takes priority according to 35 U.S.C. Section 119 (e) the pending U.S. Provisional Patent Application S.N. 60/642 284 of 7 January 2005 "FABRICATION OF HIGH SURFACE TO VOLUME RATIO STRUCTURES AND THEIR INTEGRATION IN MICRO-HEAT EXCHANGES FOR LIQUID COOLING SYSTEMS ", which are hereby incorporated by reference is included.

Territory of invention

These The invention relates to the field of heat exchangers. More precisely This invention relates to a method of fabricating structures a material with a high surface / volume ratio multiple layers, and the integration of such structures in microstructured heat exchangers for the purpose of effective heat dissipation in liquid cooling systems.

background the invention

A effective heat transfer in a liquid cooling system requires a flowing liquid, as much as possible in contact with the surface area of the material which is thermally coupled to the cooled device or Device heat to withdraw. A production of a reliable and efficient structure made of a material with a high surface-to-volume ratio (HSVRM) is therefore extremely critical or extremely important an effective micro heat exchanger to develop. A use of silicon microchannels is a heat-receiving structure of liquid cooling systems previously used by the Purchaser of the present invention has been proposed. For this is, for example, on the pending U.S. Patent Application S.N. 10/643 684 of 18 August 2003 "APPARATUS AND METHOD OF FORMING CHANNELS IN A HEAT EXCHANGING DEVICE ".

Channels under The aspect of such a high ratio is determined by an isotropic etching of Silicon produced, which is a widespread application in micromachining and MEMS has found. Silicon has, however, relative to many other materials, especially relative to real metals, a low thermal Conductivity. Although in the prior art methods of manufacturing and training for micro heat exchangers made of materials with higher conductivity are present, they either use expensive manufac turing technologies or write complicated structures, without economic to specify acceptable manufacturing methods.

For example, US Pat. No. 6,415,860 to KW Kelly et al. Describes the use of LIGA-formed microchannels in a cross-flow micro heat exchanger. The method described in the Kelley patent, incorporated herein by reference, uses LIGA, a type of im State of the art well-known micro-machining with a high surface / volume ratio (HARM). LIGA is a multi-step process involving lithography, electroplating and microforms which results in a HSVRM structure, but is costly because of its use of exotic materials and the requirement for synchrotron radiation.

The Process according to the U.S. patent 5,274,920 to J.A. Matthews describes a method of manufacturing a micro heat exchanger by laminating several plates with recessed ones Sections. This creates a microstructure with a plurality or variety of microscopic slots. Although the structure of each Plate carefully describes Matthews issued patent, to which referred to, is not a cost effective, authoritative one Manufacturing process for the plates.

The J. Schulz-Hader u. a. U.S. Patent 6,014,312 a heat sink due to a set of layers each containing openings. The layers are each one above the other stacked and create a flow path. The Patent, which is hereby incorporated by reference, describes polygonal Ring structure openings, describes however, no method for making the layers.

Short Summary the invention

One heat exchangers circulates a cooling material like a fluid, which heat from a heat-producing Source absorbs and heat from the heat-producing Source moved, causing the heat-generating Source cooled becomes. The heat exchanger can therefore be used for cooling from different heat sources such as semiconductor devices, batteries, motors, walls of Process chambers and any source that generates heat.

According to the present The invention will provide a method of making a microstructure containing heat exchanger proposed. In one embodiment, the method includes the steps forming a plurality of microdimensional openings by a plurality of heat-conducting layers using a material removing process, to form a plurality of windowed layers; and the A step of interconnecting the plurality of fenestrated ones Layers to form a composite microstructure.

at of the preferred embodiment of the present invention the heat-conducting layers Copper, and the majority of windowed layers, the from the heat-conducting Layers are formed, are coupled together by a brazing process. The soldering is preferably carried out in an oven under a vacuum or a reducing atmosphere, wherein Gas or pure hydrogen is formed. This is preferably done Solder with a silver-containing solder material. When using silver, the furnace is preferably heated to about 850 ° C, a Temperature at which silver diffuses into copper and a Cu-Ag metallic Alloy forms, which melts and thereby an excellent thermal and creates mechanical connection.

Because of the microscopic length dimensions in the heat-conducting Layers formed openings the soldering process is carefully controlled, so that Solders the openings not complete or partially blocked. Preference is given to silver on the heat-conducting before soldering Plies plated in a thickness ranging between about 0.25 and about 2 μ at thermally conductive Layers of about 150 μ thickness varied.

The Method for producing a heat exchanger comprises preferably further comprising a step of aligning the openings in each of the plurality of windowed layers in front of Coupling together the plurality of windowed layers. This alignment ensures that the composite microstructure, which results from the combination of the plurality of heat-conducting layers, the desired Features. For example, the alignment ensures When microchannel structures are formed, their desired ratios primary from the number of thermally conductive Depend on layers which are interconnected.

The present invention a wide range of methods for forming the windowed Lays, including those who rely on material removal and those who based on a material deposit. Exemplary methods include without being limited to laser drilling, laser machining, wet etching, LIGA, beam lithography, ion beam etching, chemical vapor deposition (CVD), physical vapor deposition (PVD), sputter deposition, evaporative deposition, molecular beam epitaxy, electroless and electrolytic plating. Although many of these procedures are HARM procedures The present invention does not require a HARM method.

Preferably, the micro-openings are formed by a wet etching process. The preferred wet etching process is an isotropic wet etching process. In the preferred embodiment in which the heat-conductive layers contain copper, the process of forming the micro-openings by chemical masking (also known as fotoche mixing or PCM) by electrochemical masking (also known as electroetching or electrochemical micromachining) or other suitable wet etching techniques.

The Composite microstructure formed by coupling the plurality of thermally conductive Layers is formed, contains a micro-mesh, a variety of microchannels or another structure with a high surface / volume material ratio. at In the present invention, a microstructure is formed by forming from micro-openings each of the several heat-conducting Layers are formed, preferably using a wet etching process, which is the formation of a first micropattern in a first page every heat-conducting Situation includes and a second micropattern in a second side of each thermally conductive one Location. In this way, the first and second micropatterns are complementary to continuous microchannels in the heat-conducting Able to form. Alternatively, the first and second micropatterns are so educated that she an overlapping one Micromesh structure in the heat-conducting Make up position.

The Plurality of thermally conductive Layers preferably have a thickness between about 50 and about 250 μ. Farther have those in the heat-conducting Laying micro-openings formed preferably dimensions between about 50 and about 300 μ.

Under Another aspect of the present invention includes a method for making a micro heat exchanger a thermally conductive structure with a high surface / volume ratio (HSVRM) on. The method comprises the Steps of providing a lid structure consisting of a first Material consists of coupling a distributor structure, which consists of a second material and is formed so that they coolant from the lid structure distributed, forming a plurality of micro-openings by a plurality of heat-conducting Layers containing a thermally conductive Material using a material removing process, to form a plurality of windowed layers. The Method includes Furthermore a coupling together of the plurality of windowed layers, to form a HSVRM composite structure, which is the heat-conducting material having the respective micro-openings in each of the several heat-conducting layers are formed so as to form an HSVRM structure, when the heat-conducting layers are coupled together. The method further comprises coupling the composite HSVRM structure to the manifold structure and the lid structure, So that the Distributor layer is designed so that it delivers fluid to the HSVRM structure, and coupling a planar base structure, which is a third Material has, to the HSVRM composite structure, the distribution structure and the lid structure to form a micro heat exchanger.

Under In this aspect, the HSVRM structure is preferred according to the above formed method, wherein the heat-conductive layers are preferred made of copper, and preferably coupled together by a soldering process are. Furthermore, the lid, the distributor and the flat base structure preferably with the HSVRM structure by a brazing process under Use of a silver-based soldering material coupled together. silver is preferred to the lid, distributor and base structures in a thickness between about 1 and about 10μ plated. To be favoured the heat-conducting Layers forming the HSVRM structure with about 1μ silver and the manifold, lid and base structures are plated with about 4μ silver. In other embodiments of the soldering process, the distributor with about 4μ silver plated and the heat-conducting HSVRM structure with 1μ silver, while the lid and the flat base structure remain unplated.

Prefers the planar base structure becomes a fine finish following the assembly of the micro heat exchanger subjected. Furthermore, the assembled micro heat exchanger provides a fluid-tight structure for one made possible by the fluid heat exchange with the exception of a plurality of terminals, which are preferred in the Cover or distributor structure are adapted to a fluid flow preferably from an external To allow fluid network.

at the preferred embodiment of the present invention are the Number and thickness of the plurality of heat conductive layers, from which the HSVRM structure is composed, chosen so that it the pressure loss and the thermal resistance characteristics of the micro heat exchanger optimize.

Under Another aspect of the present invention includes a microstructured one heat exchangers a plurality of heat-conducting Layers, each having a variety of trained by them microopenings have, wherein the plurality of elongated micro-openings is aligned and the plurality of heat conductive layers coupled together is to form a HSVRM structure, with each elongated opening in a first heat-conducting Location with more than three oblong openings of at least one adjacent heat conductive layer communicates.

The microstructured heat exchanger preferably has thermally conductive layers comprising copper and which are coupled together by a soldering process. Furthermore, the micro-openings are preferably by an isotropic wet Etching methods are formed as in the previously described embodiments of the present invention, although they may be provided by a number of alternative methods. Furthermore, the number and thickness of the plurality of heat conductive layers are preferably selected to optimize the pressure loss and thermal resistance characteristics of the microstructured heat exchanger.

Under Another aspect of the present invention includes a microstructured one heat exchangers a plurality of heat-conducting Lay on each of which has a variety of elongated micro-openings extending therethrough, the plurality being elongated Aligned micro openings is and the majority of thermally conductive Layer is coupled together to form a HSVRM structure, wherein every elongated opening in one first heat-conducting Location with only one elongated opening one adjacent heat-conducting Location communicates.

The Variety elongated microopenings is preferably the same in each of the plurality of heat conductive layers. The micro-openings are again preferred by an isotropic wet etching process formed, which at a plurality of copper-containing heat-conducting Performed layers becomes, with the situations later through a brazing process bonded together using a silver-containing solder material become. The number and thickness of the plurality of heat-conducting layers is preferred chosen so that she the pressure drop and the thermal resistance properties of the microstructured heat exchanger optimize.

at alternative embodiments of the present invention will be the Plurality of windowed layers through material-segregating layers Processes formed, such as CVD, PVD, molecular beam epitaxy, sputter deposition, evaporative deposition or plating, and in the above described Way coupled together.

The The present invention can be used to a great variety of heat exchanging To form structures. For example, the present invention includes an education by the ones discussed above and in more detail below described heat exchange structures, those in the older applications being taught. These include the structures disclosed in pending U.S. Patent Application S.N. 10/439 635 of 16 May 2003 "METHODS FOR FLEXIBLE FLUID DILIVERY AND HOTSPOT COOLING OF MICROCHANNEL HEAT SINKS ", in co-pending U.S. patent application S.N. 10/439 912 of 16 May 2003 "INTERVOWEN MANIFOLDS FOR PRESSURE DROP REDUCTION IN MICROCHANEL HEAT EXCHANGERS ", in pending U.S. patent application S.N. 10/680 584 of 6 October 2003 "METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR COOLING HEAT PRODUCTION DEVICE ", and in the pending U.S. patent application S.N. 10/612 241 of 1 July 2003 "MULTI-LEVEL MICROCHANNEL HEAT EXCHANGERS " become.

Short description the different views of the drawings

1A FIG. 12 shows a partial cross-sectional view of two heat conductive layers formed using two micropatterns according to an embodiment of the present invention. FIG.

1B FIG. 12 shows a perspective view of a thermally conductive layer formed using two micropatterns according to an embodiment of the present invention. FIG.

1C shows a perspective view of a HSVRM structure, which is formed from a plurality of heat conductive layers according to the present invention.

2A shows an exploded view of a micro heat exchanger according to the embodiments of the present invention.

2 B shows a perspective view of an assembled micro heat exchanger according to the embodiments of the present invention.

3A shows a plan view of the alternative distribution layer or layer of the heat exchanger according to the present invention.

3B shows an exploded view of the alternative heat exchanger with the alternative distribution layer according to the present invention.

4 shows a perspective view of a braided distribution layer according to the present invention.

5 shows a plan view of the intertwined distribution layer with a boundary layer according to the present invention.

6A shows a cross-sectional view of the intertwined distribution layer or layer with the boundary layer according to the present invention seen along the lines AA.

6B shows a cross-sectional view of the braided distribution layer with the boundary layer according to the present invention seen along the lines BB.

6C shows a cross-sectional view of the intertwined distribution layer with the boundary layer according to the present invention seen along the lines CC.

7A shows an exploded view of the braided distribution layer with the boundary layer according to the present invention.

7B shows a perspective view of an alternative embodiment of the boundary layer or layer according to the present invention.

8A shows a plan view of an alternative distribution layer according to the present invention.

8B shows a plan view of the boundary layer according to the present invention.

8C shows a plan view of the boundary layer according to the present invention.

9A shows a side view of the alternative embodiment of the three-level heat exchanger according to the present invention.

9B shows a side view of the alternative embodiment of the two-level heat exchanger according to the present invention.

10A - 10E show perspective views of the interface with different micro-pin assemblies according to the present invention.

11 shows a cutaway perspective view of the alternative heat exchanger according to the present invention.

12A shows an exploded view of a heat exchanger according to the present invention.

12B shows an exploded view of an alternative heat exchanger according to the present invention.

12C shows a perspective view of the alternative circulation level according to the present invention.

12D shows a perspective view of the bottom of an inlet level according to the present invention.

12E shows a perspective view of the bottom of an alternative inlet level according to the present invention.

12F shows a perspective view of the bottom of an outlet level according to the present invention.

12G shows a perspective view of the bottom of an alternative outlet level according to the present invention.

12H shows a cross-sectional view of a heat exchanger according to the present invention.

12I shows a cross-sectional view of the alternative heat exchanger according to the present invention.

13 Figure 11 is a plan view of the circulation level with an arrangement of inlet and outlet ports for single-phase fluid flow according to the present invention.

14 shows a plan view of the circulation level with an arrangement of inlet and outlet ports for a two-phase fluid flow according to the present invention.

detailed Description of the embodiments of the invention

The present invention describes a method for forming thermally conductive layers and coupling together several such layers to form a three-dimensionally microstructured area. In accordance with the present invention, the microstructured region comprises micro-pockets, microchannels or other microstructures. 1A shows a first embodiment of a micro-mesh region, 2A shows a second embodiment of a micro-pocket area. 1C shows a plurality of formed and coupled layers to form microchannels according to the embodiments of the present invention.

1A shows two layers provided with windows 100 . 150 , which are formed according to the present invention of two heat-conductive layers. Preferably, the two thermally conductive layers are formed using a wet etching process, using phototool tools showing the locations and patterns of the microapertures 120 . 170 the windowed layers 100 . 150 determine. The two windowed layers have a plurality of thick, solid rods 110 . 160 and thin massive rods 130 . 180 on which the micro-openings 120 170 form.

At the in 1 illustrated embodiment are the micro-openings 120 the verse with windows Henen location 100 and the micro-openings 170 the windowed location 150 designed so that they overlap each other so that each opening 120 in the windowed position 100 with more than three openings 170 the windowed location 150 communicated. In this embodiment, the windowed position 100 formed using a first micropattern and the windowed layer 150 is formed using a second micropattern. The first and second micropatterns are designed to match the in 1A formed overlapping micro-mesh structure when the layers 100 and 150 are coupled together.

1B shows a single windowed position 200 which is formed of a heat conductive sheet according to the present invention. The location 200 contains a first backing of micro-sized thick solid straps 210 and thin massive straps 230 which the micro-openings 220 and a second backing of microdimensional thick solid straps 260 and thin massive straps 240 which the micro-openings 250 form.

At the in 1B illustrated embodiment are the micro-openings 220 and the micro-openings 250 elongated and so that they overlap each other, so that each opening 220 with more than three of the openings 250 communicated. In this embodiment, the openings 220 formed in a first side of the heat-conductive layer using a first micropattern, and the openings 250 in a second side of the heat-conducting layer, from which the windowed position 200 is formed using a second micropattern. In the formation of the windowed position 200 For example, the first and second micropatterns used are designed to correspond to those described in U.S. Pat 1B shown, overlapping micro-pocket structure within the individual windowed layer 200 form.

1C shows a microstructured material structure 300 with a plurality of windowed layers 310 which are coupled together to a variety of microchannels 320 to form with a high desired ratio. Each windowed location 310 has a microstructured area, the thick solid support 330 and thin massive straps 340 contains. The carriers 330 . 340 form the microchannels 320 when the windowed layers 310 into the structure 300 assembled. According to the present invention, the microchannels become 320 in every windowed location 310 prior to coupling together the plurality of windowed layers 310 aligned. This alignment ensures that the composite microstructure resulting from the combination of the multiple thermally conductive layers has the desired properties. Due to the orientation, the microchannel structures have 320 desired ratios, which primarily on the number of the number of windows provided with interconnected layers 310 depend.

In the preferred embodiment of the present invention, the windowed layers include 310 Copper and are coupled together by a soldering process. The brazing is preferably carried out in an oven under vacuum or reducing the atmosphere as to form a gas or pure nitrogen gas. Preferably, the soldering is carried out with a silver-containing soldering material. When using silver, the furnace is preferably heated to about 850 ° C, a temperature at which silver diffuses into copper and forms a Cu-Ag metal alloy, which melts and provides excellent thermal and mechanical bonding.

Because of the microscopic length dimensions of the apertures formed in the thermally conductive layers, the brazing process is carefully controlled so that the braze material does not completely or partially occlude the apertures. Silver is preferably applied to the windowed layers before soldering 310 plated, in a thickness of between about 0.25 and about 2 μ for windowed layers 310 a thickness of about 150 μ varies.

2A shows an exploded view of a micro-heat exchanger 400 containing a heat conductive (HSVRM) structure according to the present invention. The micro heat exchanger 400 has a lid structure 410 on, attached to a distribution structure 420 is coupled, a plurality of windowed layers 430 , and a flat base structure 440 , The distribution situation 420 is designed so that it distributes cooling fluid. All components of the micro heat exchanger are preferred 400 coupled together by brazing. The majority of windowed layers 430 each has a region provided with micro-openings 435 on. If the multiple windowed layers 430 are coupled together, the layers form a composite HSVRM structure containing a thermally conductive material, from which the windowed layers 430 are formed.

The lid structure 410 , the distribution structure 420 and the flat basic structure 440 are preferably coupled to the HSVRM structure resulting from the coupling together of the windowed layers 430 has been formed by a soldering process using a silver-based soldering material. Silver is on the De ckelstruktur 410 , the distribution structure 420 and the flat basic structure 440 plated in a thickness between about 1 and about 10μ. More preferred are the heat-conductive layers 430 , which form the HSVRM structure, with about 1 μ silver and the distribution structure 420 , the lid structure 410 and the basic structure 440 plated with about 4 μ silver. In some other embodiments, the distribution structure becomes 420 plated with about 4μ silver while the lid structure 410 and the flat basic structure 440 stay unplated.

The flat basic structure is preferred 440 following the assembly of the micro heat exchanger 400 subjected to a fine finish. Furthermore, the assembled micro-heat exchanger 400 a fluid-tight structure for a fluid-enabled heat exchange, with the exception of multiple ports 415 which are preferred in the lid structure 410 are designed to allow a fluid in the features 425 the distribution structure 420 and then to flow to the HSVRM structure. Preferably, a fluid flows from an external fluid network.

In the preferred embodiment of the present invention, the number and thickness of the plurality of windowed layers 430 , which form the composite HSVRM structure, chosen so that the pressure drop and the thermal resistance properties of the micro-heat exchanger 400 be optimized.

2 B is a perspective view of a micro heat exchanger 500 according to the present invention. The micro heat exchanger 500 contains a lid structure 510 , a distribution structure 520 , a basic structure 540 and a plurality of heat conductive layers 530 each having a plurality of elongate micro-openings extending through the layers. The plurality of elongate micro-openings are aligned and the plurality of heat-conductive layers are coupled together to form a HSVRM structure. Furthermore, the lid structure contains 510 a plurality of fluid ports 560 . 570 to allow fluid through the manifold structure 520 and to flow the HSVRM structure.

In the embodiments of the present invention are in the 1A - 2 B represented, provided with windows layers preferably formed by a wet etching process. Preferably, the wet etching process used uses an isotropic wet etching process. In the preferred embodiment in which the thermally conductive layers comprise copper, the process may be by chemical mask etching (also known as photochemical machining or PCM), by electrochemical mask etching (also known as electroetching or electrochemical micromachining), or other suitable wet etching process.

Also have according to the present invention in the 1A - 2 B shown, with windowed layers preferably has a thickness between about 50 and about 250 μ. Furthermore, the micro-openings formed in the heat-conductive layers for producing windowed layers preferably have dimensions between approximately 50 and 300 μ.

It it can be seen that the Boundary layers and the distribution layers according to the present invention can be formed and combined in other ways. For example can the windowed layers by a method of a plurality be formed by processes, including those on a Material tray based on material removal and material deformation. Although a HARM method can be used, the present invention allows Invention a construction of structures with a high desired relationship from windowed layers even if any layer is not produced by a HARM process has been. Exemplary methods include, but are not limited to, laser drilling, Laser processing, wet etching, LIGA, Radiolithography, ion beam etching, chemical vapor deposition, physical vapor deposition, sputter deposition, evaporative Storage, molecular beam epitaxy, electroless plating and electrolytic Plate. Also punching can be used. Alternatively, these can Structures through use of metal injection molding (MIM), plastic injection molding, others Forms of casting or be formed by many other means.

Heat exchangers according to the present invention provide smooth flow paths and highly branched flow patterns in which cooling materials move. Such structures reduce the load on the pumps which pump the cooling material through the heat exchanger. The method of manufacturing heat exchangers according to the embodiments of the present invention is relatively inexpensive. Wet etching is a chemical etching process which preferably uses wet chemicals to form trench-like recesses which ultimately form the flow paths. The use of wet chemicals is cheap and quick compared to other methods of making such devices. The present invention can therefore be used to inexpensively produce heat exchangers for cooling various devices, such as semiconductor devices, motors, light emitting devices, batteries, process chamber walls, MEMS, and any device that generates heat. Many forms of cooling materials can be affected by the heat Metals are traversed, including but not limited to, liquids such as water, air, other gases, vapors, refrigerants such as Freon or other materials, or combinations of materials that can absorb and efficiently transport heat.

3B shows an exploded view of the alternative three-level heat exchanger 100 with the alternative distribution layer according to the present invention. The alternative embodiment, as in 3B is shown is a heat exchanger 100 with three levels, which is a boundary layer 102 , at least one intermediate layer or layer 104 and at least one distribution layer 106 having. Alternatively, the heat exchanger 100 a two-level apparatus, which is the intermediate layer 102 and the distribution layer 106 having.

3A shows a plan view of the alternative distribution layer 106 according to the present invention. The distribution layer 106 in particular, as in 3B is shown, four sides as well as a top 130 and a bottom side 132 , The top 130 is however in 3A removed the operation of the distribution layer 106 to represent and describe. As in 3A has the distributor layer 106 a number of channels or passages 116 . 118 . 120 . 122 and connections formed therein 108 and 109 , The finger 118 . 120 extend completely through the body of the manifold layer 106 in the Z direction, as in 3B is shown. Alternatively, the fingers extend 118 and 120 partly through the distributor layer 106 in z-direction and have openings, as in 3A is shown. Furthermore passages extend 116 and 122 partly through the distributor layer 106 , The remaining areas between the inlet and outlet passages 116 . 120 , with 107 are designated, extending from the top 130 to the floor area 132 and form the body of the manifold layer 106 ,

As in 3A is shown, the fluid passes through the inlet port 108 into the distribution layer 106 and flows along the inlet channel 116 to different fingers 118 which of the channel 116 branch off in different directions in the X and / or Y direction to deliver fluid to selected areas of the interface 102 bring to. The finger 118 are arranged in different, predetermined directions to fluid to the locations of the boundary layer 102 to bring which areas correspond to, which are at or near the hot spots of the heat source. These sites of the boundary layer 102 hereinafter referred to as boundary layer hot spot areas. The fingers are configured to cool both stationary and temporary varying boundary layer hot spots. As in 3A is shown, are the channels 116 . 122 and the fingers 118 . 120 in the X and / or Y direction in the manifold layer 106 arranged. Accordingly, the different directions of the channels allow 116 . 122 and the finger 118 . 120 a delivery of fluid to hot spots of the heat source 99 to cool and / or the pressure drop within the heat exchanger 100 to minimize. Alternatively, the channels 116 . 122 and fingers 118 . 120 periodically in the distribution layer 106 arranged and form a pattern, as in the in 5 shown example is formed.

The arrangement as well as the dimensions of the fingers 118 . 120 are in the light of the hot spots of the heat source 99 determines which ones should be cooled. The hot spot locations as well as the heat generated near or at a hot spot are used around the manifold layer 106 to configure so that the fingers 118 . 120 above or adjacent to the interface hot spot areas in the boundary layer 102 are placed. The distribution layer 106 preferably permits a single-phase fluid and / or a two-phase fluid to the boundary layer 102 to circulate without a significant pressure loss or pressure drop within the heat exchanger 100 to effect. Fluid delivery to the interface hot spot areas creates a uniform temperature at the interface hot spot area as well as at areas of the heat source that are adjacent to the interface hot spot areas.

The dimensions as well as the number of channels 116 and fingers 118 depend on a number of factors. In one embodiment, the inlet and outlet fingers 118 . 120 the same width dimensions. Alternatively, the inlet and outlet fingers 118 . 120 different width dimensions. The width dimensions of the fingers 118 . 120 are within a range of (inclusive) 0.25-0.50 mm. In one embodiment, the inlet and outlet fingers 118 . 120 the same length and depth dimensions. Alternatively, the inlet and outlet fingers 118 . 120 different length and depth dimensions. In another embodiment, the inlet and outlet fingers 118 . 120 across the length of the fingers varying width dimensions. The length dimensions of the inlet and outlet fingers 118 . 120 are within a range of (inclusive) 0.5 mm to three times the size of the length of the heat source. Continue to have the fingers 118 . 120 a height or depth dimension within a range (inclusive) 0.25-0.50 mm. Furthermore, alternatively, less than 10 or more than 30 fingers per centimeter are in the manifold layer 106 intended. However, it will be apparent to one skilled in the art that an arrangement of between 10 and 30 fingers per centimeter in the manifold layer is possible.

It is within the present invention to provide the geometries of the fingers 118 . 120 and the channels 116 . 122 in a non-periodic arrangement to optimize cooling of hot spot areas of the heat source. To get a uniform temperature over the heat source 99 To achieve the spatial distribution of heat transfer to the fluid of the spatial distribution of heat generation. When the fluid along the boundary layer through the microchannels 110 As its temperature rises, it begins to evaporate under two-phase conditions. Accordingly, the fluid undergoes significant expansion resulting in a large increase in speed. Generally, heat transfer from the boundary layer to the fluid is improved at high flow rates. Accordingly, it is possible to increase the efficiency of heat transfer to the fluid by adjusting the cross-sectional dimensions of the fluid delivery and removal fingers 118 . 120 and channels 116 . 122 in the heat exchanger 100 adjust accordingly.

For example, a particular finger may be formed for a heat source at which higher heat generation occurs near the inlet. Furthermore, it may be advantageous to have a larger cross section for the areas of the fingers 118 . 120 and channels 116 . 122 to provide where a mixture of liquid and vapor is expected. Although not shown, a finger may be configured to start with a small cross-sectional area at the inlet to effect a high velocity fluid flow. The subject finger or channel may also be configured to expand to a larger cross-section at a downstream outlet to effect a lower velocity flow. This formation of the fingers or channels allows the heat exchanger to minimize pressure loss and to optimize hot spot cooling in areas where the fluid is in volume in terms of volume, acceleration and velocity due to conversion from a liquid to steam Phase flow increases.

Furthermore, the fingers can 118 . 120 and channels 116 . 122 be formed so that they widen and narrow along their length, the speed of the fluid at different locations in the microchannel heat exchanger 100 to increase. Alternatively, it is possible to frequently vary the finger and channel dimensions from large to small and back again to increase the heat transfer efficiency to the expected heat distribution across the heat source 99 adapt. It is to be understood that the foregoing discussion of a variation in the dimensions of the fingers and channels also applies to the other embodiments discussed and is not limited to this embodiment.

Alternatively, the manifold layer 106 , as in 3A shown is one or more openings 119 in the inlet fingers 118 on. In the three-level heat exchanger 100 the fluid flows along the fingers 118 flows down through the opening 119 in the liner 104 , Alternatively, the fluid flows in a two-level heat exchanger 100 along the fingers 118 down through the openings 119 directly to the boundary layer 102 , Furthermore, the distribution layer 106 , as in 3A shown is an opening 121 in the outlet fingers 120 on. In the three-level heat exchanger 100 the fluid flows from the intermediate layer 104 through the openings 121 up into the outlet fingers 120 , Alternatively, flows in a two-level heat exchanger 100 the fluid from the boundary layer 102 directly through the openings 121 into the outlet fingers 120 ,

In the alternative embodiment, the inlet and outlet fingers 118 . 120 open channels, which have no openings. The floor area 103 the distributor layer 106 lies in a three-level heat exchanger 100 at the surface of the intermediate layer 104 on, or in a two-level heat exchanger against the boundary layer 102 , Accordingly, in the three-level heat exchanger, flows 100 the fluid is free to and from the liner 104 and the distribution layer 106 , The fluid is supplied to and from the corresponding boundary layer hot spot area through lines 105 in the liner 104 directed. It will be apparent to those skilled in the art that the lines 105 are aligned directly to the fingers, as described below, or are positioned elsewhere in the three-tier heat exchanger system.

Even though 3B the alternative three-level heat exchanger 100 with the alternative distribution layer shows, the heat exchanger 100 alternatively have a two-layer structure, which is the distribution layer 106 and the boundary layer 102 having a fluid directly between the manifold layer 106 and the boundary layer 102 flows without the boundary layer 104 to happen. It will be apparent to those skilled in the art that the configuration of the distribution, interconnect and barrier layers are shown for exemplary purposes and that the configuration is not limited thereby.

As in 3B is shown, the intermediate layer 104 a plurality of conduits 105 on which extend through this. The inflow lines 105 conduct fluid, which from the distributor layer 106 flows in to the designated boundary layer hot spot areas of the boundary layer 102 , Similarly, the openings channel 105 also a fluid flow from the boundary layer 102 to the fluid outlet ports 109 , Accordingly, the intermediate layer provides 104 also a fluid delivery from the boundary layer 102 to the fluid outlet port 109 where the fluid outlet port 108 with the distribution layer 106 communicated.

The wires 105 are in the boundary layer 104 positioned in a predetermined pattern based on a number of factors including, but not limited to, the locations of the interface hot spot areas, the amount of fluid flow required in the boundary layer hot spot area around the heat source 99 to cool properly, and the temperature of the fluid. The cables have a width of 100μ, although other width dimensions up to several millimeters are possible. Furthermore, the conduits have other dimensions which depend at least on the factors mentioned above. It will be apparent to those skilled in the art that each wire 105 in the liner 104 has the same shape and / or dimension, although this is not required. For example, the leads, such as the fingers described above, alternatively have varying length and / or width dimensions. Furthermore, the lines have 105 a constant depth or height dimension through the intermediate layer 104 , Alternatively, have the wires 105 varying depth dimensions, such as a trapezoidal or nozzle-shaped dimension through the intermediate layer 104 , Although the horizontal shape of the wires 105 in 2C shown at right angles, the wires can 105 alternatively have any other shape, including (but not limited to) a circular shape ( 3A ), a curved or elliptical shape. Alternatively, one or more of the lines 105 shaped and contoured according to a portion of one or more of the above-mentioned fingers.

The liner 104 is in the heat exchanger 100 positioned horizontally, with the lines 105 are positioned vertically. Alternatively, the liner 104 in any other direction within the heat exchanger 100 positioned, including (but not limited to) diagonal and curved shapes. Alternatively, the lines 105 inside the liner 104 horizontally, diagonally, curved or positioned in another direction. Furthermore, the intermediate layer extends 104 horizontally along the entire length of the heat exchanger 100 , where the liner 104 the boundary layer 102 from the distributor layer 106 separated to force the fluid through the lines 105 to be channeled. Alternatively, a section of the heat exchanger 100 no liner 104 between the distributor layer 106 and the boundary layer 102 on, wherein the fluid can flow freely between them. Furthermore, the intermediate layer extends 104 alternately vertically between the distributor layer 106 and the boundary layer 102 to form separate specific interlayer sections. Alternatively, the intermediate layer extends 104 not full of the distribution layer 106 to the boundary layer 102 ,

The 3B shows a perspective view of another embodiment of the boundary layer 102 according to the present invention. As in 3B is shown has the boundary layer 102 a floor area 103 and a plurality of microchannel walls 110 on, being the area between the microchannel walls 110 Fluid directed along a fluid flow path. The floor area 103 is flat and has a high thermal conductivity to ensure adequate heat transfer from the heat source 99 to enable. Alternatively, the floor area indicates 103 Troughs and / or apexes adapted to collect or reject fluid from a particular location. The microchannel walls 110 are configured in parallel, like this one in 3B shown, with fluid between the microchannel walls 110 flows along a fluid path.

It will be apparent to those skilled in the art that the microchannel walls 110 alternatively may be formed in another configuration, depending on the factors discussed above Fak. For example, the boundary layer 102 alternatively grooves between sections of the microchannel walls 110 like this one in 8C is shown. Furthermore, the microchannel walls have 110 Dimensions showing the pressure drop or pressure difference within the boundary layer 102 minimize. It can also be seen that any other features besides microchannel walls 110 are also possible, including, but not limited to, rough surfaces and microporous structures such as sintered metals and silicon foam. The parallel microchannel walls 110 as they are in 3B however, are exemplified to the boundary layer 102 to describe according to the present invention. Alternatively, have the micro-channel walls 110 non-parallel configurations.

The micro-channel walls 110 allow the fluid to undergo heat exchange along the selected hot spots of the interface hot spot area around the heat source 99 to cool at this point. The micro-channel walls 110 have a width dimension within the range of 20-300 μ and a height dimension within the range of 100μ up to 1 mm, depending on the power of the heating source 99 , The micro-channel walls 110 have a length dimension that varies between 100μ and more Centimeters, depending on the dimensions of the heat source and the size of the hot spots and the heat flow density of the heat source. Alternatively, any other microchannel wall dimensions are possible. The micro-channel walls 110 are at a mutual distance of 50-500μ, depending on the power of the heat source 99 although any other separation range dimensions are possible.

Referring again to the arrangement according to 3B is carried out that the top of the manifold layer 106 is cut away to the channels 116 . 122 and the fingers 118 . 120 within the body of the distribution layer 106 to show. The places of the heat source 99 , which generate more heat, are hereby referred to as hot spots, wherein the locations of the heat source 99 , which produce less heat, hereby referred to as hot spots. As in 3B is shown has the heat source shown 99 a Hotstellenbereich, namely at the point A, and a hot spot area, namely at the point B. The areas of the boundary layer 102 which abut the hot and hot spots are accordingly referred to as boundary layer hot spots. As in 3B is shown has the boundary layer 102 a boundary layer hot spot area A, on which is located above the point A, and a boundary layer hot spot area B, which is located above the area B.

As in the 3A and 3B is shown, the fluid first passes through the inlet port 108 in the heat exchanger 100 one. The fluid then flows into an inlet channel 116 , Alternatively, the heat exchanger 100 more than one inlet channel 116 on. As in the 3A and 3B is shown, the fluid flows along the inlet channel 116 from the inlet port 108 first and branches by fingers 118D , Furthermore, the fluid flows along the remainder of the inlet channel 116 to individual fingers 118B and 118C Etc..

In 3B the fluid becomes the boundary layer hot spot area A by flowing through the fingers 118A supplied, wherein the fluid by fingers 118A to the liner 104 flows down. The fluid then flows through the inlet conduit 105A that under the finger 118A is positioned to the boundary layer 102 wherein the fluid undergoes thermal exchange with the heat source 99 is subjected. As described, the microchannels are in the boundary layer 102 to train in any direction. Accordingly, the microchannels 111 in the boundary layer region A at right angles to the rest of the microchannels 110 in the boundary layer 102 positioned. Accordingly, the fluid flows from the conduit 105A along the in 3B shown microchannels 111 Although, the fluid flow in other directions along the remaining areas of the boundary layer 102 it is possible. The heated liquid then moves upwardly through the conduit 105B to the outlet finger 120A ,

Similarly, fluid flows through the fingers 118E and 118F in Z-direction down to the liner 104 , The fluid then flows through the inlet conduit 105C in Z direction down to the boundary layer 102 , The heated fluid then moves upwardly in the Z direction from the boundary layer 102 through the outlet pipe 105D to the outlet fingers 120E and 120F , The heat exchanger 100 remove this in the manifold layer 106 heated fluid through the outlet fingers 120 , wherein the outlet fingers 120 with the outlet channel 122 communicate. The outlet channel 122 allows the fluid from the heat exchanger through an outlet port 109 to stream.

It is preferred that the inflow and outflow conduits 105 are also positioned directly or approximately directly over the respective boundary layer hot spot areas to direct fluid directly to the hot spots of the heat source 99 supply. Furthermore, each outlet finger 120 configured to be as close as possible to a corresponding inlet finger 118 for a given interface hot spot area to minimize the pressure loss therebetween. Accordingly, fluid enters the boundary layer 102 over the inlet fingers 118A and flows along the bottom surface for the shortest possible distance 103 the boundary layer 102 before they reach the boundary layer 102 to the outlet finger 120A leaves. It can be seen that the size of the gap above which the fluid is along the bottom surface 103 flows, adequately removes heat, which from the heat source 99 has been produced without generating an unnecessarily large pressure loss. Furthermore, as in the 3A and 3B shown is the corners of the fingers 118 . 120 curved to the pressure loss of the along the fingers 118 to reduce flowing fluid.

It will be apparent to those skilled in the art that in the 3A and 3B shown configuration of the distribution layer 106 serves merely exemplary purposes. The configuration of the channels 116 and fingers 118 in the distribution layer 106 depends on a number of factors including (but not limited to) the locations of the interface hot spot areas, the amount of flow to and from the interface hot spot areas, as well as the amount of heat generated by the heat source in the boundary layer hot spot areas. For example, one possible configuration of the manifold layer 106 an interconnected pattern of parallel inlet and outlet fingers, which is alternatively formed along the width of the manifold layer; like in the 4 - 7A shown and discussed below. Nevertheless, any other configuration of channels is 116 and fingers 118 possible.

4 shows a perspective view of an alternative distribution layer 406 according to the heat exchanger of the present invention. The distribution layer 406 in 4 includes a plurality of interconnected parallel fluid fingers 411 . 412 which enable one-phase and / or two-phase fluid without a substantial pressure drop within the heat exchanger 400 to the boundary layer 402 to circulate. As in 8th are shown are the inlet fingers 411 alternatively to the outlet fingers 412 arranged. However, it will be apparent to one of ordinary skill in the art that a number of inlet or outlet fingers may be disposed adjacent to each other, not the alternative configuration shown in FIG 4 is limited. Furthermore, the fingers are alternatively formed so that a parallel finger is branched from one finger or connected to another parallel finger. Accordingly, it is possible to have more outlet fingers than inlet fingers and vice versa.

The inlet fingers or passages 411 lead the entering into the heat exchanger fluid of the boundary layer 402 to, and the Auslaßfinger or passages 412 remove the fluid from the boundary layer 402 , which then from the heat exchanger 400 exit. The shown configuration of the distribution layer 406 allows the fluid to enter the boundary layer 402 to enter and over a very short distance in the boundary layer 402 to flow before entering the outlet passage 412 entry. The significantly reduced length over which the fluid travels along the boundary layer 402 flows, reduces the pressure drop in the heat exchanger 400 essential.

As in the 4 - 5 is shown has the alternative distribution layer 406 a passage 414 on, which with two inlet passages 411 communicates and a fluid flow to her be acts. As in the 8th . 9 is shown has the manifold layer 406 three outlet passages 412 on which with the passage 418 communicate. The passages 414 in the distribution layer 406 have a flat bottom surface which conveys the fluid to the fingers 411 . 412 channeled. Alternatively, the passage has 414 a certain inclination, which is channeling the fluid to selected fluid passages 411 supported. Alternatively, the inlet passage 414 one or more openings at its bottom surface, which allows a portion of the fluid, down to the boundary layer 402 to stream. Similarly, the passage has 418 in the manifold layer, a flat bottom surface containing the fluid and the fluid to the port 408 channeled. Alternatively, the passage has 418 some inclination, which channeling the fluid to selected outlet ports 408 supported. Continue to have the passages 414 . 418 a width dimension of about 2 mm, although any other width dimensions are alternatively possible.

The passages 414 . 418 communicate with connections 408 . 409 wherein the ports are coupled to fluid lines in a cooling system. The distribution situation 406 has horizontally configured fluid connections 408 . 409 on. Alternatively, the manifold layer 406 vertical and / or diagonally configured fluid connections 408 . 409 as discussed below, although this is in 4 - 7 not shown. Alternatively, the manifold layer 406 no passage 414 on. Accordingly, the fluid is directly from the ports 408 the fingers 411 fed. It is again referred to that the distribution layer 411 alternatively no passage 418 having the fluid in the fingers 412 directly from the heat exchanger 400 through connections 408 flows. It will be appreciated that any number of terminals may alternatively be used, although two terminals 408 in connection with the passages 414 . 418 are shown.

The intake passages 411 have dimensions that allow the fluid to flow to the boundary layer without a large pressure drop along the passages 411 to create. The intake passages 411 have a width dimension ranging from 0.25 to 5.00 mm, although any other width dimensions are alternatively possible. Furthermore, the inlet passages 411 a length dimension ranging from 0.5 mm to three times the length of the heat source. Alternatively, other length dimensions are possible. Furthermore, as stated above, the inlet passage extends 411 down to or slightly above the height of the microchannels 410 so that the fluid goes directly to the microchannels 410 is channeled. The intake passages 411 have a height dimension in the range of (including) 0.25-5.00 mm. It will be apparent to those skilled in the art that the passages 411 Do not go down to the microchannels 410 extend and that any other height dimensions are alternatively possible. It will be apparent to one skilled in the art that the inlet passages 411 although they have the same dimensions, they may alternatively have different dimensions. Furthermore, the inlet passages 411 alternatively varying widths, cross-sectional dimensions and / or distances between adjacent fingers. In particular, the intake passage has 411 Areas with a greater width or depth as well as areas with narrower widths and depths along their length. The varying dimensions allow more fluid to reach predetermined interface hot spot areas in the boundary layer 402 is supplied through further sections while reducing the flow to boundary layer hot spot areas through the narrower sections.

Furthermore, the outlet passages 412 Dimensions that allow the fluid to flow without generating a large pressure drop along the passages 412 to flow to the boundary layer. The outlet passages 412 have a width dimension in the range of 0.25-5.00 mm inclusive, although any other width dimensions are alternatively possible. Furthermore, the outlet passages 412 a length dimension ranging from 0.5 mm to three times the length of the heat source. Furthermore, the outlet passages extend 412 down to the height of the microchannels 410 so that the fluid rises slightly up into the outlet passages 412 after flowing horizontally along the microchannels 410 has flowed. The intake passages 411 have a height dimension in the range of 0.25-5.00 mm inclusive, although any other height dimensions are alternatively possible. Although the outlet passages 412 have the same dimensions, it will be apparent to those skilled in the art that the outlet passages 412 alternatively have different dimensions. The intake passages 412 alternatively have varying widths, cross-sectional dimensions and / or distances between adjacent fingers.

The inlet and outlet passages 411 . 412 are segmented and different from each other, as in the 4 and 5 is shown, wherein the fluid does not mix between the passages. As in 8th In particular, two outlet passages are shown along the outer edges of the manifold layer 406 arranged, and an outlet passage 412 is in the middle of the distribution layer 406 arranged. Furthermore, there are two intake passages 411 on adjacent sides of the middle outlet passage 412 educated. This particular configuration causes that in the boundary layer 402 entering fluid over a short distance in the boundary layer 402 flows before leaving the boundary layer 402 through the outlet passage 412 flows out. However, it will be apparent to those skilled in the art that the inlet passages and outlet passages may be positioned in any other suitable configuration, and that their positioning is not limited to the configuration shown and described. The number of inlet and outlet fingers 411 . 412 is greater than three within the distribution layer 406 but less than ten per centimeter across the manifold layer 406 , It will be apparent to those skilled in the art that any other number of inlet passages and outlet passages may be used, and that the number is not limited to those shown and described.

The distribution layer 406 is coupled to the intermediate layer (not shown) with the intermediate layer (not shown) to the barrier layer 402 is coupled to a three-tier heat exchanger 400 to build. On the here mentioned intermediate layer is above at the in 3B shown embodiment reference. The distribution layer 406 is alternatively to the boundary layer 402 coupled and over the boundary layer 402 positioned to a two-level heat exchanger 400 to form, as in 7A is shown. The 6A - 6C show schematic cross-sectional views of the in a two-level heat exchanger to the alternative distribution layer 406 coupled boundary layer 402 , Specially shows 6A the cross section of the heat exchanger 400 along the line AA in 5 , Further shows 6B the cross section of the heat exchanger 400 along the line BB, and 6C shows the cross section of the heat exchanger 400 along the line CC in 5 , As stated above, the inlet and outlet passages extend 411 . 412 from the top to the bottom of the manifold layer 406 , When the distribution layer and the boundary layer 402 are coupled to each other, are the inlet and outlet passages 411 . 412 at or slightly above the height of the microchannels 410 in the boundary layer 402 , This configuration causes the fluid from the inlet passages 411 easy through the Mirkokanäle 410 flows. Furthermore, this configuration causes the fluid flowing through the microchannels to easily pass upwardly through the outlet passages 412 flows after passing through the microchannels 410 has flowed.

In the alternative embodiment, the intermediate layer 104 ( 3B ) between the manifold layer 406 and the boundary layer 402 although not shown in the drawing figures. The intermediate layer 104 ( 3B ) channels the fluid flow to certain predetermined boundary layer hot spot areas in the boundary layer 402 , Furthermore, the intermediate layer 104 ( 3B ) can be used to create a uniform flow in the boundary layer 402 to create incoming fluid. Also, the intermediate layer 104 used to deliver fluid to the interface hot spot areas in the boundary layer 402 to adequately cool the hot spots, and a uniform temperature at the heat source 99 to create. The inlet and outlet passages 411 . 412 are near or above the hot spots of the heat source 99 to adequately cool the hot spots, although this is not necessary.

7A shows an exploded view of the alternative distribution layer 406 with the alternative boundary layer 102 according to the present invention. The boundary layer 102 has continuous arrangements of microchannel walls 110 on, like this one in 3B is shown. In the general Be For example, fluid occurs similar to that in FIG 3B shown distribution layer 106 , in the distribution layer 406 at the fluid connection 408 into the distribution layer 406 and flows through the passage 414 as well as to the fluid fingers or passages 411 out. The fluid enters the opening of the inlet fingers 411 and flows along the fingers 411 in the X direction, as shown by arrows. Furthermore, the fluid flows down in the Z direction to the boundary layer 402 , which are below the distributor layer 406 is positioned. As in 7A shown crosses the fluid in the boundary layer 402 the bottom surface in the X and Y direction of the boundary layer 402 and performs a heat exchange with the heat source 99 by. The heated fluid exits the boundary layer 402 by flowing up in the Z direction via the outlet fingers 412 from, with the Auslaßfinger 412 the heated fluid to the passage 418 in the distribution layer 406 Channel in the X direction. The fluid then flows along the passage 418 and leaves the heat exchanger by flowing out through the port 409 ,

The boundary layer, as in 7A is shown has a number of grooves 416 which is between grouped arrays of microchannels 410 are arranged, and the channeling of the fluid to and from the passages 411 . 412 support. In particular, the grooves 416A directly below the inlet passages 411 the alternative distribution layer 406 arranged, wherein fluid, which in the boundary layer 402 over the intake passages 411 enters, directly to the adjacent to the grooves 416A channeled microchannels is channeled. Accordingly, the grooves allow 416A the fluid, directly into specially provided flow paths from the inlet passages 411 to be channeled as in 5 is shown. Similarly, the boundary layer 402 groove 416B on which directly below the outlet passages 412 are positioned in the Z direction. Accordingly, fluid passing along the microchannels 410 flows toward the outlet passages, horizontal to the grooves 416B and vertical to the outlet passage 412 above the grooves 416B channeled.

6A shows the cross section of a heat exchanger 400 with a distribution layer 406 and a boundary layer 402 , In particular shows 6A the one with the intake passages 411 interleaved outlet passages 412 , wherein fluid through the inlet passages 411 flows down and through the outlet passages 412 flows upwards. Furthermore, the fluid flows as in 6A shown horizontally through the microchannel walls 410 disposed between the inlet passages and outlet passages and through the grooves 416A and 416B are separated. Alternatively, the microchannel walls are formed continuously ( 3B ) and not through microchannels 410 separated. As in 6A is shown, have the inlet and / or outlet passages 411 . 412 at their ends in places near the grooves 416 a curved surface 420 , The curved surface 420 conducts fluid through the passage 411 flows down to the microchannels 410 which are adjacent to the passage 411 are arranged. Accordingly, that gets into the boundary layer 102 incoming fluid easier or "gentle" to the micro-channels 410 directed, instead of directly to the grooves 416A to stream. Similarly, the curved surface supports 420 in the outlet passages 412 directing the fluid out of the microchannels 410 to the outlet passage 412 , In an alternative embodiment, as in 7B is shown has the boundary layer 402 ' the above with reference to the manifold layer 406 ( 8th - 9 ) discussed inlet passages 411 ' and outlet passages 412 ' on. In the alternative embodiment, fluid is removed from the port 408 ' directly the boundary layer 402 ' fed. The fluid flows along the passage 414 ' to the intake passages 411 ' , The fluid then flows transversely along the microchannels 410 ' and undergoes heat exchange with the heat source (not shown) and flows to the outlet passages 412 ' , The fluid then flows along the outlet passages 412 ' to the passage 418 ' wherein the fluid is the boundary layer 402 ' over the connection 409 ' leaves. The connections 408 ' . 409 ' are in the boundary layer 402 ' formed and alternatively in the distribution layer 406 ( 7A ).

It is for a person skilled in the art that the heat exchangers alternatively can work in a vertical position, though all heat exchangers shown in the present application with horizontal operation are. When the heat exchangers working in the vertical position, they are alternatively configured that each Intake passage above one adjacent outlet passage is positioned. Accordingly, occurs the fluid through the inlet passages into the boundary layer and naturally becomes an outlet passage channeled. It will also be apparent that any other configuration the distribution layer and boundary layer is alternatively usable when the heat exchanger to work in a vertical position.

The 8A - 8C show plan views of other embodiments of the heat exchanger according to the present invention. In particular shows 8A a plan view of an alternative distribution layer 206 according to the present invention. The 8B and 8C each show a plan view of an intermediate layer 204 and boundary layer 202 , Further shows 9A a three-level heat exchanger, which is the alternative distribution layer 206 used while 9B shows a two-level heat exchanger, which is the alternative distribution layer 206 used.

As in 8A and 9A is shown has the manifold layer 206 several fluid connections 208 on, which are configured horizontally and vertically. Alternatively, the fluid connections 208 diagonal or in any other direction with respect to the manifold layer 206 positioned. The fluid connections 208 are at selected points of the distribution layer 206 positioned to efficiently deliver fluid to the predetermined boundary layer hot spot areas of the heat exchanger 200 to deliver. The multiple fluid connections 208 provide a significant advantage because fluid can be delivered directly from a fluid port to a particular interface hot spot area without affecting the heat exchanger 200 a significant pressure drop is added. Furthermore, the fluid connections 208 in the distribution layer 206 Also positioned to allow the fluid to be at the interface hot spot areas the least distance from the outlet port 208 to flow so that the fluid assumes a uniform temperature, while a minimal pressure loss between the inlet and outlet ports 208 he follows. It also supports the use of the distribution layer 206 stabilizing a two-phase flow within the heat exchanger 200 when they cross the flow over the boundary layer 202 uniformly distributed. It should be noted that the heat exchanger 200 alternatively more than one distribution layer 206 may have, wherein a distribution layer 206 the fluid in and out of the heat exchanger 200 while another manifold layer (not shown) directs the amount of fluid circulation to the heat exchanger 200 controls. Alternatively, all of the multiple distribution layers circulate 206 Fluid to selected corresponding boundary layer hot spot areas in the boundary layer 202 ,

The alternative distribution layer 206 has transverse dimensions, which are closely related to the dimensions of the boundary layer 202 to match. Furthermore, the distributor layer has 206 the same dimensions as the heat source 99 , Alternatively, the distribution layer 206 bigger than the heat source 99 , The vertical dimensions of the manifold layer 206 are within the range of 0.1 and 10 mm. Furthermore, the openings are in the manifold layer 206 which the fluid connections 208 within a range between 1 mm and the entire width or length of the heat source 99 ,

10A shows a perspective view of an embodiment of the boundary layer 302 according to the present invention. As in 10A is shown has the boundary layer 302 a number of columns 303 on which is different from the bottom surface 301 the boundary layer 302 extend upwards. Further shows 10A a microporous structure 301 , which are at the bottom surface of the boundary layer 302 is trained. It can be seen that the boundary layer 302 only the microporous structure 301 as well as a combination of the microporous structure with another feature of the interface (eg, microchannels, columns, etc.).

The boundary layer 302 has the columns 303 instead of microchannels in accordance with the fluid flow from the inlet ports to the surrounding outlet ports in the manifold layer 302 ( 12A ). As will be discussed in more detail below, the fluid flows down to the boundary layer 302 via a number of inlet ports, the fluid then leaving the boundary layer 302 exits through a number of outlet openings, which are spaced at an optimum distance from the inlet openings. In other words, the fluid flows from each inlet port to the nearest outlet port. In this embodiment, each inlet opening is surrounded by outlet openings. Accordingly, this flows into the boundary layer 302 entering fluid toward the surrounding outlet ports. Accordingly, the columns create 303 in the boundary layer 302 sufficient heat transfer to the fluid and allow the fluid to flow with a low pressure loss from the inlet openings to the outlet openings.

The boundary layer 302 has a dense array of tall, closely spaced columns 303 on which is perpendicular to the floor surface 301 extend out and in contact with the bottom surface of the manifold layer. Alternatively, the columns 303 not in contact with the bottom surface of the manifold layer. Furthermore, at least one of the columns extends 303 alternatively at an angle to the ground surface 301 the boundary layer 302 , The columns 303 are also equally spaced along the boundary layer 302 , so that the heat transfer possibilities of the boundary layer 302 over the floor area 301 are uniform.

Alternatively, stand the columns 303 not at an equal distance from each other, like this one in 10B is shown, in which the columns 303 in the middle of the boundary layer 302 are farther apart than the columns 303 on the edges. These pillars 303 are dependent on the dimensions of the heat source 99 spaced from each other, and depending on the flow resistance applied to the fluid and the size and locations of the hot spots and the heat flow density from the heat source 99 , For example, provides a lower density of the columns 303 the flow has a lower resistance, but also a lower surface for heat transfer from the boundary layer 302 on the fluid. It should be noted that the configuration of the non-periodically spaced columns 303 that in the design in 10B is shown, is not limited thereto, and that other arrangements depending on the conditions of the heat source as the desired operation of the cooling system are possible.

Furthermore, the columns 303 preferably designed as a cylinder with a circular cross section, as this in 10A is shown to allow the fluid to flow from the inlet ports to the outlet ports with a least resistance. The columns 303 however, may alternatively have other shapes, including but not limited to columns 303B with square cross section ( 10B ), Diamond cross section, elliptical cross section 303C ( 10C ), hexagonal cross-section 303D ( 10D ) or another form. Furthermore, the boundary layer 302 alternatively, a combination of differently shaped columns along the bottom surface 301 exhibit.

For example, the boundary layer 302 a number of arrays of right-angled fins 303E have, as in 10E is shown, which are arranged radially to each other in their respective arrangement. Furthermore, the boundary layer 302 several columns 303B have, between the arrangements of right-angled ribs 303E are arranged. In one embodiment, the open circular regions are within the radially disposed rectangular ribs 303E arranged below each inlet opening, wherein the ribs 303E supported the flow to the outlet openings. Accordingly, the radially disposed ribs assist 303E the flow thereby minimizing the pressure drop while providing an approximately uniform distribution of the cooling fluid through the boundary layer 302 enable. Depending on the size and relative location of the inlet and outlet ports, there are many possible configurations of the columns and / or fins, and the selection of the optimal arrangement of the boundary layer 302 depends on whether the fluid is subjected to a single-phase flow or a two-phase flow. It will be apparent to those skilled in the art that the various configurations of the pillars 303 can be used in any of the embodiments and variations discussed herein.

11 shows a broken away perspective view of a three-level heat exchanger 200 with the alternative distribution layer 200 according to the present invention. As in 11 is shown is the heat exchanger 200 divided into separate areas, depending on the heat source along the body 99 amount of heat generated. The subdivided regions are through the vertical interlayer 204 and / or microchannel wall features 210 in the boundary layer 202 separated. However, it will be apparent to those skilled in the art that the in 11 shown arrangement is not limited to the configuration shown, and serves only exemplary purposes. The heat exchanger 200 is coupled to one or more pumps, with a pump to the inlets 208A and another pump to the inlet 208B is coupled.

As in 3 shown has the heat source 99 a hot spot in area A and a hot spot in area B, the hot spot in area A producing more heat than the hot spot in area B. It can be seen that the heat source 99 alternatively, may have more than one hot spot and as a hot spot at any one point at a given time. Since the point A in the example is a hot spot and more heat at the point A on the boundary layer 202 above point A transmits (in 11 referred to as boundary layer hot spot area A), more fluid and / or a higher level of liquid flow becomes at the interface hot spot area A in the heat exchanger 200 provided to cool the point A in an adequate manner. Although the boundary layer hot spot area B is shown to be greater than the boundary layer hot spot area A, it can be seen that the boundary layer hot spot areas A and B as well as any other boundary layer hot spot areas of the heat exchanger 200 may have any size and / or configuration relative to each other.

Alternatively, the fluid enters as in 11 is shown in the heat exchanger via fluid connections 208 and becomes the interface hot spot area A by flowing along the intermediate layer 204 to the inflow lines 205A directed. The fluid then flows through the inflow lines 205A in the Z direction in the boundary layer hot spot area A of the boundary layer 202 , The fluid flows between the microchannels 210A , wherein heat from the point A to the fluid through conduction through the boundary layer 202 passes. The heated fluid flows along the boundary layer 202 in the boundary layer hot spot area A to the outlet port 209A where the fluid is the heat exchanger 200 leaves. It will be apparent to those skilled in the art that any number of inlet ports 208 and outlet connections 209 can be used for a particular boundary layer hot spot area or a number of boundary layer hot spot areas. Furthermore, the outlet port 209A alternatively, be positioned vertically at any other location, including the manifold layer 209B but not limited thereto, although the outlet port 209A near the boundary layer 202A is shown.

Similarly, the heat source has 99 at the in 11 shown example, a hot spot at the point B, which generates less heat than the point A of the heat source 99 , Fluid passing through the port 208B enters the boundary layer hot spot area B by flowing along the intermediate layer 204B to the inflow cables 205B directed. The fluid then flows through the inflow lines 205B in the Z direction down into the boundary layer hot spot area B of the boundary layer 202 , The fluid flows between the microchannels 210 in the X and Y directions, wherein heat generated by the heat source at the point B is transferred to the fluid. The heated fluid flows along the entire boundary layer 202B in the boundary layer hot spot area B up to the outlet port 209B in the Z direction via the discharge lines 205B in the liner 204 wherein the fluid is the heat exchanger 200 leaves.

Alternatively, the heat exchanger 200 , as in 9A is shown, a vapor permeable membrane 214 on which over the boundary layer 202 is positioned. The heat-permeable membrane 214 is in sealing contact with the inner side walls of the heat exchanger 200 , The membrane is configured to have a number of small apertures along the boundary layer 202 allow generated steam through the connection 209 to escape. The membrane 214 is also hydrophobic configured to prevent liquid fluid flowing along the boundary layer 202 flows through the openings of the membrane 214 can get. Further details of the vapor-permeable membrane 114 are described in pending US application SN 10/366 128 of Feb. 12, 2003 "WAVER ESCAPE MICROCHANNEL HEAT EXCHANGER", which is hereby incorporated by reference.

12A shows an exploded view of the heat exchanger 300 according to the present invention. 12B shows an exploded view of an alternative heat exchanger 300 ' according to the present invention. As in the 12A and 12B is shown, the heat exchanger 300 . 300 ' the boundary layer 302 . 302 ' and the manifold layer coupled thereto 306 . 306 ' on. As stated above, the heat exchanger is 300 . 300 ' coupled to the (not shown) heat source or alternatively fully integrated into the heat source (eg embedded in a microprocessor). It will be apparent to one skilled in the art that the boundary layer 302 . 302 ' is essentially included and in 12A is shown separately for illustrative purposes only. Preferably, the boundary layer 302 . 302 ' a plurality of columns 303 on that along the bottom surface 301 are arranged. Furthermore, the pillars alternatively have any shape, such as this with reference to FIGS 10A - 10E has been discussed, and / or consist of radially arranged ribs 303E , It should again be noted that the boundary layer 302 may alternatively have features other than those mentioned above (eg, microchannels, roughened surfaces). The boundary layer 302 as well as the characteristics within the layer or position 302 also preferably have the same thermal conductivity properties as discussed above and will not be discussed again. Although the boundary layer 302 compared with the distributor layer 306 is smaller, it will be apparent to those skilled in the art that the boundary layer 302 and the distribution layer 306 relative to each other and to the heat source 99 may have any other size. The remaining features of the boundary layer 302 . 302 ' have the same properties as the boundary layers described above and will not be described in more detail.

Generally, the heat exchanger minimizes 300 the pressure drop within the heat exchanger using the delivery channels 322 in the distribution layer 306 , The delivery channels 322 are inside the distribution layer 306 vertically positioned and provide the boundary layer 302 vertically with fluid to the pressure drop in the heat exchanger 300 to reduce. As stated above, there is a pressure drop in the heat exchanger 300 generated or increased by the flowing over a substantial time and / or a considerable distance along the boundary layer in the X and Y direction fluid. The distribution layer 306 minimizes flow in the X and Y directions by forcing the fluid vertically through multiple delivery channels 322 to the boundary layer 302 to stream. In other words, numerous individual fluid flows are made directly from the top of the boundary layer 302 given up. The delivery channels 322 are positioned at an optimum distance from each other to allow fluid, only minimally in the X and Y directions and vertically upwards out of the boundary layer 302 therefore, the force of individual fluid paths will result from the optimally positioned channels 322 naturally, that the fluid in an upward fluid path from the boundary layer 302 flows away. Furthermore, the individual channels maximize 322 the distribution of fluid flow between or in the various channels 322 in the boundary layer 302 and thereby reduce the pressure loss in the heat exchanger 300 while the heat source 99 is effectively cooled. Furthermore, the configuration of the heat exchanger allows 300 in that the heat exchanger 300 can be made smaller in size than other heat exchangers, because the fluid does not need to flow over larger distances in the lateral X and Y directions to the heat source 99 to cool adequately.

In the 12A shown distribution layer 306 has two individual levels. In particular, the distribution layer contains 306 a level 308 and a level 312 , The level 308 is at the boundary layer 302 and the level 312 coupled. Even though 12A represents that level 312 above the level 308 is positioned by a person skilled in the art that the level 308 alternatively above of the level 312 can be positioned. It will also be apparent to one skilled in the art that, alternatively, any number of levels may be provided in accordance with the present invention.

In the 12B shown alternative distribution layer 306 has three individual levels. In particular, the distribution layer contains 306 a circulation level 304 ' , a level 308 ' , and a level 312 ' , The circulation level 304 ' is at the boundary layer 302 ' coupled as well as the level 308 ' , The level 308 ' is at the circulation level 304 ' and the level 312 ' coupled. Even though 12B shows that the level 312 ' above the level 308 ' is positioned, it is obvious from a person skilled in the art that the level 308 ' alternatively above the level 312 can be arranged. It will also be appreciated by those skilled in the art that any number of levels may alternatively be provided in accordance with the present invention.

12C shows a perspective view of the circulation level 304 ' according to the present invention. The circulation level 304 ' has a top 304A ' and a floor area 304B ' on. As in the 12B and 12C is shown, indicates the circulation level 304 ' various openings 322 ' which is due to the circulation level 304 ' extend. In one embodiment, the outlet openings of the openings extend 322 ' flush with the floor surface 304B ' , Alternatively, the openings extend 322 ' to below the floor area 304B ' to get fluid closer to the boundary layer 302 ' in bringing. Furthermore, the circulation level 304 ' numerous openings 324 ' which is due to the circulation level 304 ' from the top 304A ' to the bottom side 304B ' extend and protrude as cylindrical projections in the Z direction over a predetermined distance. It will be apparent to one skilled in the art that the openings 322 ' . 324 ' Alternatively, they may extend at an angle through the circulation level and need not extend completely vertically. As stated above, in one embodiment, the boundary layer 302 ' ( 12B ) to the floor surface 304B ' of the circulation level 304 ' coupled. Accordingly, fluid enters the boundary layer 302 ' by flowing only through the openings 322 ' in the Z direction and exits the boundary layer 302 ' by flowing only through the openings 324 ' in Z direction. As mentioned above, in the boundary layer 302 ' over the openings 322 ' entering fluid separately to the boundary layer 302 ' over the openings 324 ' by the circulation level 304 ' leaving leaving fluid.

As in 12C shown has a part of the openings 324 ' preferably cylindrical parts extending from the top 304A ' in the Z direction from the circulation level 304 ' extend so that fluid through the openings 324 ' directly to the corridor 326 ' in the level 312 ' ( 12F and 12G ) flows. Preferably, the cylindrical projections are as in 12C circular, but they can alternatively have any other shape. Along the boundary layer 302 ' However, the fluid flows from each opening 322 ' to the adjacent opening 324 ' in lateral and vertical directions. It is preferred that the openings 322 ' and the openings 324 ' are thermally insulated from each other so that heat from the heated fluid, which is the boundary layer 302 ' through the distributor layer 306 leaves, which does not affect the cooled fluid passing through the manifold layer 306 ' to the boundary layer 302 ' flows.

12D shows an embodiment of the level 308 according to the present invention. As in 12D shown contains the level 308 a top 308A and a bottom 308B , The underside is preferred 308B of the level 308 directly to the boundary layer 302 hitched as in 12A is shown. The level 308 has a recessed corridor 320 on which various fluid delivery channels 322 which preferably has fluid to the boundary layer 302 deliver. The exempted corridor 320 is in sealed contact with the boundary layer 302 , wherein the fluid, which is the boundary layer 302 leaves, in the corridor 320 around the channels 322 around and between them and through the connection 314 flows. It should be noted that from the boundary layer 302 escaping fluid not in the delivery channels 322 entry.

12E shows a perspective view of the underside of an alternative embodiment of the level 308 ' according to the present invention. The level 308 ' has a top 308A ' and a bottom 308B ' on, taking the bottom of the level 308B ' directly to the circulation level 304 ' ( 12C ) is coupled. The level 308 ' preferably has a connection 314 ' a corridor 320 ' and a plurality of openings 322 ' . 324 ' in the bottom side 308B ' on. It is obvious to a person skilled in the art that the level 308 ' may have any number of terminals and corridors. The openings 322 ' . 324 ' in 12E are configured to match the circulation level 304 ' are facing or facing each other. As in 12E is shown, direct the openings 322 ' Fluid entering the corridor 320 ' so that it enters the boundary layer 302 ' flows while the openings 324 ' Fluid directly from the boundary layer 302 ' so direct it to the level 312 ' flows. The openings 324 ' extend completely through the corridor 320 ' in the level 308 ' , The openings 324 ' are individualized and separated, so that through the openings 324 ' flowing fluid does not mix or come in contact with the fluid passing through the orifices 324 ' associated cylinder flows. The openings 324 ' are also individualized to ensure that Fluid passing through each opening 324 ' enters, along the through the openings 324 ' created flow path flows. The openings are preferred 324 formed vertically. Therefore, the fluid becomes vertical through a substantial portion of the manifold layer 306 ' channeled. It can be seen that the same for the openings 322 ' is true, especially in a case where the level between the boundary layer and the level is positioned.

Although the apertures shown are the same size, the apertures may be 322 have different or varying diameters along a length. For example, at the connection 314 arranged holes 322 have a smaller diameter to restrict the fluid flow therethrough. The smaller holes 322 accordingly force the fluid through the openings 322 to flow down, which continues from the port 314 are removed. This variation of the diameter of the holes 322 allows a more even division of the fluid into the boundary layer 302 , It will be apparent to one skilled in the art that the diameters of the holes 322 alternatively, may be varied to provide selective cooling in known boundary layer hot spots of the boundary layer 302 make. It will be apparent to those skilled in the art that the above discussion also applies to the apertures 324 ' applicable, the dimensions of the openings 324 ' vary or are different in order to uniformly flow out of the boundary layer 302 to effect.

In one embodiment, the connection leads 314 Fluid to the level 308 and the boundary layer 302 , The connection 314 in 12D preferably extends from the surface 308A through a section of the body of the level 308 to the corridor 320 , Alternatively, the terminal extends 314 to the corridor 320 from the side or bottom of the level 308 , It is preferred that the terminal 314 to the connection 315 in the level 312 is coupled ( 12A - 12B ). The connection 314 leads to the corridor 320 which is included as in 12C is shown or excluded, as in 12D is shown. The corridor 320 preferably serves to remove fluid from the boundary layer 302 to the connection 314 to channel. The corridor 320 Alternatively, it channels fluid from the port 314 to the boundary layer 302 ,

As in 12F and 12G shown is the connection 315 in the level 312 preferably to the terminal 314 aligned and communicates with this. With reference to 12a Fluid preferably enters the heat exchanger 300 via a connection 316 and flows through the corridor 328 down to the distribution channels 322 in the level 308 , optionally to the boundary layer 302 , In relation to 12B Alternatively, fluid enters the heat exchanger 300 ' preferably over the connection 315 ' and flows through the connection 314 ' in the level 308 ' and optionally to the boundary layer 302 ' , The connection 315 in 12F preferably extends from the top 312a out through the body of the level 312 , Alternatively, the terminal extends 315 from one side of the level 312 , Alternatively, the level contains 312 no connection 315 , wherein the fluid in the heat exchanger 300 over the connection 314 ( 12D and 12E ) entry. Furthermore, the level indicates 312 a connection 316 which prefers the fluid to the corridor 328 ' channeled. It will be apparent to one skilled in the art that the level may include any number of terminals and corridors. The corridor 328 preferably channels fluid to the delivery channels 322 and optionally to the boundary layer 302 ,

12G shows a bottom perspective view of an alternative embodiment of the level 312 ' according to the present invention. The level 312 ' is preferred to the level 308 ' in 12E coupled. As in 12F shown is the level 312 ' a recessed corridor area 328 ' inside the body, which is along the bottom side 312B ' is arranged. The exempted corridor 328 ' communicates with the connection 316 ' where fluid is directly from the gutted corridor 328 ' to the connection 316 ' flows. The exempted corridor 328 ' is over the top 308A ' of the level 308 ' positioned to allow the fluid a free upward flow from the openings 324 ' to the corridor 328 ' to enable. The extent of the recessed corridor 320 ' and the floor area 312B ' is against the top 308A ' of the level 312 ' sealed so that all the fluid from the openings 324 ' over the corridor 328 ' to the connection 316 ' flows. Each of the openings 330 ' in the floor area 312B ' is aligned with and communicates with a corresponding opening 321 ' in the level 308 ' ( 12E ), with the openings 330 ' are positioned so that they are flush with the top 308A ' of the level 308 ' ( 12E ) to lock. Alternatively have the openings 330 a diameter slightly larger than the diameter of the corresponding opening 324 ' is, taking care of the openings 324 ' through the openings 330 in the corridor 328 ' extend.

12H shows a cross-sectional view of the heat exchanger according to 12A along the lines HH according to the present invention. As in 12H is shown is the boundary layer 302 to a heat source 99 coupled. As stated above, the heat exchanger is 300 alternatively integral with the heat source 99 formed as a component. The boundary layer 302 is at the bottom 308B of the level 308 coupled. Furthermore, this is the level 312 preferably at the level 308 coupled, being the top 308A of the level 308 against the bottom 312B of the level 312 is sealed. The size of the corridor 320 of the level 308 communicates with the boundary layer 302 , The corridor continues to communicate 328 in the level 312 with the openings 322 in the level 308 , The bottom side 312B of the level 312 is against the surface 308A of the level 308 sealed so that it is not between the two levels 308 . 312 comes to fluid leaks.

The 12I shows a cross section of the alternative heat exchanger according to 12B along the lines II according to the present invention. As in 12I is shown is the boundary layer 302 ' to a heat source 99 ' hitched. The boundary layer 302 ' is at the bottom surface or underside 304B ' of the circulation level 304 ' coupled. Also, the circulation level 304 to the level 308 ' coupled, the top 304A ' of the circulation level 304 ' against the bottom 308B ' of the level 308 ' is sealed. Still, the level is 312 ' preferably at the level 308 ' coupled, the top 308A ' of the level 308 ' against the bottom 312B ' of the level 312 ' is sealed. The size of the corridor 320 ' of the level 308 ' communicates with the openings in the surface 304A ' of the circulation level 304 ' so that fluid between the two levels can not escape through leaks. Furthermore, the scope of the corridor communicates 328 ' in the level 312 ' with the openings in the top 308A ' of the circulation level 308 ' so that fluid does not escape between the two levels due to leakage.

During operation, cooled fluid enters the heat exchanger 300 through the connection 316 in the level 312 ' like in the 12A and 12H shown by arrows. The cooled fluid flows through the port 316 down to the corridor 328 and flows down to the boundary layer 302 over the distribution channels 322 , The cooled fluid in the corridor 320 does not mix and does not come into contact with any heated fluid containing the heat exchanger 300 leaves. That in the boundary layer 302 inflowing fluid undergoes heat exchange and removes that from the heat source 99 generated heat. The openings 322 are optimally arranged so that the fluid over the smallest possible distance in the X and Y direction in the boundary layer 302 flows to the pressure drop in the heat exchanger 300 to minimize it while the heat source 99 effectively cools. The heated fluid then flows upwardly in the Z direction from the boundary layer 302 to the corridor 320 in the level 308 , The heated fluid coming from the manifold layer 306 exits, does not mix and does not come in contact with cooled fluid which enters the manifold layer 306 entry. The heated fluid flows into the corridor after entering 320 to the connections 314 and 315 and exits the heat exchanger 300 out. It will be apparent to one skilled in the art that the fluid may alternatively be used in the manner contemplated in U.S. Pat 12A and 12H flowed away, without departing from the scope of the present invention.

In the alternative mode of operation, as indicated by arrows in the 12B and 12I is shown, cooled fluid passes through the port 316 ' in the level 312 ' of the heat exchanger 300 ' one. The cooled fluid flows through the port 315 ' down to the terminal 314 ' in the level 308 ' , The fluid then flows into the corridor 320 ' and flows down to the boundary layer 302 ' over the openings 322 ' in the circulation level 304 ' , The cooled liquid in the corridor 320 ' However, does not mix with heated fluid, which is the heat exchanger 300 ' leaves, and does not come in contact with this. That in the boundary layer 302 ' Incoming fluid is subjected to heat exchange and takes in the heat source 99 generated heat. As discussed below, the openings are 322 ' and 324 ' arranged so that the fluid over the optimal shortest distance along the boundary layer 302 ' from every opening 322 ' to an adjacent opening 324 ' flows to reduce the intervening pressure drop while it is the heat source 99 effectively cools. The heated fluid then flows upwardly in the Z direction from the boundary layer 302 ' through the level 308 ' over the various openings 324 to the corridor 328 ' of the level 312 ' , The heated fluid does not mix and does not come in contact with a cooled fluid entering the manifold layer 306 ' enters when passing through the openings 324 ' flows upwards. The heated fluid flows into the corridor after entering 328 ' in the level 312 ' to the connection 316 ' and leaves the heat exchanger 300 ' , It will be apparent to one of ordinary skill in the art that the fluid may alternatively be used in opposition to that described in U.S. Pat 12B and 12I flow directions shown can flow without departing from the scope of the present invention.

In the distribution layer 306 are the openings 322 arranged so that the distance over which the fluid in the boundary layer 302 flows, is minimized while adequately cooling the heat source 99 he follows. In the alternative distribution layer 306 ' are the openings 322 ' and 324 ' arranged so that the distance over which the fluid in the boundary layer 302 ' flows, is minimized while adequately cooling the heat source 99 he follows. In particular, create the openings 322 ' . 324 ' significant vertical fluid paths, so that the flow in the X and Y transverse direction in the heat exchanger 300 is minimized. Accordingly, the heat exchangers reduce 300 . 300 ' the distance considerably over which the fluid must flow to the heat source 99 to cool adequately, which in turn inside the heat exchanger 300 . 300 ' generated pressure drop significantly reduced.

The special arrangement and the cross-sectional sizes of the openings 322 and / or the openings 324 depend on a number of factors, including, but not limited to, the flow conditions, the temperature, that of the heat source 99 generated heat and the flow rate of the fluid. It is to be understood that it is apparent, though the following discussion is directed to apertures 322 and 324 relates that even only openings 322 or 324 can be provided.

The openings 322 . 324 are arranged at an optimum distance from each other, whereby the pressure drop is minimized when the heat source 99 adequately cooled to a desired temperature. This arrangement and optimal distance of the openings 322 and / or the openings 324 In this embodiment also allows an independent optimization of the openings 32 . 324 and fluid paths generally through the boundary layer 302 by changing the dimensions and locations of the individual openings. Furthermore, the arrangement of the openings in this embodiment also significantly increases the distribution of the total flow entering the boundary layer as well as the circumference of the fluid cooled area passing through each opening 322 entry.

In one embodiment, the openings 322 . 324 in an alternating configuration or "black and white" pattern in the distribution layer 306 arranged as in the 13 and 14 is shown. Each of the openings 322 . 324 is separated by the smallest distance that the fluid must travel in the "black-and-white pattern." The openings 322 . 324 However, they must be separated by a distance which is large enough to ensure that the cooling liquid of the boundary layer 302 is supplied over a sufficient time. As the 13 and 14 show, it is preferably provided that one or more of the openings 322 adjacent to a corresponding number of openings or vice versa are provided so that in the boundary layer 302 entering fluid the least required distance along the boundary layer 302 travels before there is the boundary layer 302 leaves. Accordingly, as shown in the figures, it is preferable that the openings 322 . 324 are distributed radially around each other to help in that the fluid over the least necessary distance from an opening 322 to the next opening 324 flows. For example, fluid occurs as in 13 is shown in the boundary layer 302 over a special opening 322 and flows over the path with minimal resistance to an adjacent opening 324 , Furthermore, the openings have 322 . 324 preferably a circular shape, although the openings may have any other shape.

Further, alternatively, the openings may not be from any of the levels of the manifold layer 306 protrude, as stated above, although the openings shown in the figures 324 from the circulation level 304 or the levels 308 . 312 project as cylindrical parts. It is also preferred that the distribution layer 306 Rounded surfaces around the areas where the fluid changes direction to help, the pressure drop in the heat exchanger 300 to reduce.

The optimal spacing configuration as well as the dimensions of the openings 322 . 324 depend on the temperature of the fluid along the boundary layer 302 is exposed. It is also important that the cross-sectional dimensions for the liquid paths in the openings 322 . 324 are large enough to reduce the pressure drop in the heat exchanger 300 to reduce. In the event that the fluid along the boundary layer 302 is only one-phase flow, is every opening 322 preferably by a plurality of adjacent openings 324 surrounded in a symmetrical hexagonal arrangement, as in 13 is shown. Furthermore, in a single-phase flow, it is preferable that the number of orifices in the circulation level 304 is approximately equal. Furthermore, the openings have 322 . 324 for a single-phase flow, preferably the same diameter. It will be apparent to one skilled in the art that other arrangements as well as any ratios of openings 322 . 324 alternatively possible.

In the case where the fluid along the boundary layer 302 is subject to two-phase flow are non-symmetrical arrangements of the openings 322 . 324 preferred to adapt to the acceleration of the two-phase fluid. However, symmetrical arrangements of the openings may also be used 322 . 324 be provided for a two-phase flow.

For example, the openings 322 . 324 in the circulation level 304 be arranged symmetrically, with the openings 324 larger openings than the openings 322 exhibit. Alternatively, the hexagonal symmetric arrangement as shown in FIG 13 is shown in the circulation level 204 be used for a two-phase flow, with more openings 324 as openings 322 in the circulation level 304 available.

It should be noted that the openings 322 . 324 in the circulation level may alternatively be arranged to heat the heat source 99 to cool. Accordingly, for example, two openings 322 alternatively immediately adjacent to each other in the circulation level 304 provided, with both openings 322 be positioned near or above a boundary layer hot spot area. It can be seen that the appropriate number of openings 324 adjacent to both openings 322 is positioned to reduce the pressure drop in the boundary layer 302 to reduce. Accordingly, the two openings supply 322 the boundary layer hot spot area with cooling liquid to subject it, as stated above, a uniform, substantially equal temperature.

As stated above, the heat exchanger has 300 significant advantages over other heat exchangers. The configuration of the heat exchanger 300 Alternatively, due to the reduction of the pressure loss caused by the vertical fluid paths, alternatively, it is operated with a correspondingly low power pump. Furthermore, the configuration of the heat exchanger allows 300 an independent optimization of the inlet and the fluid paths along the boundary layer 302 , Furthermore, the separate levels allow customization to optimize the uniformity of heat transfer, the reduction in pressure drop, and the dimensions of the individual components contained therein. The configuration of the heat exchanger 300 also reduces pressure drop in systems in which the fluid undergoes two-phase flow, and can be used in single-phase and two-phase systems. Furthermore, the heat exchanger made possible numerous different production methods and allows adjustment of the component geometry for tolerance purposes.

The details about how the heat exchanger 100 as well as the individual layers in the heat exchanger 100 are discussed below. The following discussion refers to the heat exchangers according to the present invention, although expressly referring to the heat exchanger 100 in 3B and individual layers or layers contained therein are expressly referred to for the sake of simplicity. It will also be apparent to one skilled in the art that the manufacturing details, although described in relation to the present invention, may alternatively be applied to conventional heat exchangers as well as to two and three deck heat exchangers employing an inlet port and an outlet port like this in the 1A - 1C is shown.

Preferably, the boundary layer has a thermal expansion coefficient (CTE) equal to or approximately equal to that of the heat source 99 is. Accordingly, the boundary layer preferably expands according to the heat source 99 and pulls together according to this. Alternatively, the material of the boundary layer 302 have a CTE different from the CTE of the heat source material. A boundary layer made of a material such as silicon 302 has a CTE, which is that of the heat source 99 corresponds to and has a sufficiently high thermal conductivity to allow adequate heat transfer from the heat source 99 to effect on the fluid. However, other materials may alternatively be used for the boundary layer 302 which have CTEs which are the heat source 99 correspond.

The boundary layer preferably has a high thermal conductivity to provide sufficient conduction between the heat source 99 and along the boundary layer 302 allow flowing fluid, so that the heat source 99 not overheated. The boundary layer is preferably made of a material having a high thermal conductivity of 100 W / mK. However, it will be apparent to one skilled in the art that the boundary layer 302 may have a thermal conductivity of more or less than 100 W / mK and is not limited thereto.

In order to achieve the preferred high thermal conductivity, the barrier layer is preferably made of copper. Alternatively, the barrier layer is made of any other material including, but not limited to, single crystalline dielectric materials, metals, aluminum, nickel, a semiconductor substrate such as silicon, kovar, graphite, diamond, composites, and any other suitable alloys. An alternative material of the boundary layer 302 is patterned or cast with an organic meshwork.

The The present invention is made with reference to specific embodiments been described, including details to the understanding the principles of construction and operation of the invention understandable close. In that regard, references to specific embodiments and details do not limit the scope of the appended claims. It is for the One skilled in the art will recognize that modifications in terms of for explanatory purposes selected Embodiments possible without departing from the spirit and scope of the invention.

Summary

There is disclosed a structure and method for making a microstructure for use in a heat exchanger. The heat exchanger contains a distribution layer and a mi cro-structured area. The manifold layer includes a structure to deliver a fluid to the microstructured area. The microstructured region is formed of a plurality of windowed layers of thermally conductive layers through which a plurality of microapertures are formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.

Claims (43)

Method for producing a microstructure having heat exchanger with the following steps: a. Forming a plurality of micro-openings by a plurality of heat-conducting Layers using a material removal process to form a plurality of windowed layers; and b. Coupling the windowed layers to one layered composite composite microstructure to form. A method of manufacturing a heat exchanger according to claim 1, wherein the heat conductive layers Copper included. A method of manufacturing a heat exchanger according to claim 1, wherein the plurality of windowed layers are coupled together by brazing becomes. A method of manufacturing a heat exchanger according to claim 3, with soldering with a silver-containing soldering material he follows. A method of manufacturing a heat exchanger according to claim 3, wherein one or more of the layers before soldering with a solder material be clad. A method of manufacturing a heat exchanger according to claim 1, further comprising a step of aligning openings in each of the plurality of windowed layers prior to coupling together the plurality of windowed layers. A method of manufacturing a heat exchanger according to claim 1, wherein the material removing process is an isotropic wet etching process is. A method of manufacturing a heat exchanger according to claim 7, wherein the isotropic wet etching process selected from a group which is a photochemical processing or ablation, a chemical Mask etching, an electrochemical mask etching, an electric etching and electrochemical micromachining. A method of manufacturing a heat exchanger according to claim 1, wherein the composite microstructure comprises a micro-mesh. A method of manufacturing a heat exchanger according to claim 1, wherein the step of forming micro-openings through each of the plurality of heat-conducting Layers using a material removing process Forming a first micropattern in a first side of each thermally conductive one Location and forming a second micropattern in a second Side of each thermally conductive layer includes. A method of manufacturing a heat exchanger according to claim 10, wherein the first and second micropatterns are complementary, around continuous microchannels in the heat-conducting Able to form. A method of manufacturing a heat exchanger according to claim 10, wherein the first and second micropatterns are formed that she an overlapping one Micromesh structure in the heat-conducting Make up position. A method of manufacturing a heat exchanger according to claim 1, wherein the composite microstructure comprises a plurality of microchannels. A method of manufacturing a heat exchanger according to claim 1, wherein the heat conductive layers have a thickness between about 50 and about 250 μ. A method of manufacturing a heat exchanger according to claim 1, wherein in the heat-conducting Laying micro-openings formed Have dimensions between about 50 and about 300 μ. A method of manufacturing a micro heat exchanger having a heat conductive structure of high surface area to volume ratio (HSVRM) material comprising the steps of: a. Providing a cover structure consisting of a first material; b. Coupling a manifold structure to the lid structure, wherein the manifold structure is made of a second material and configured to distribute a cooling fluid; c. Forming a plurality of microapertures through a plurality of heat conductive layers made of a thermally conductive material using a material removing method to form a plurality of windowed layers; d. Coupling together the plurality of windowed layers to form an HSVRM composite structure forming the thermally conductive material, wherein the HSVRM structure formed in each of the plurality of heat conductive sheets is formed so as to form the HSVRM composite structure when the heat conductive sheets are coupled together; e. Coupling the HSVRM composite structure to the manifold structure and the lid structure such that the manifold structure is configured to deliver fluid to the HSVRM structure; and f. Coupling a flat base structure of a third material to the HSVRM composite structure, the manifold structure, and the lid structure to form a micro heat exchanger. Method for manufacturing a micro heat exchanger according to claim 16, wherein the thermally conductive Material is copper. Method for manufacturing a micro heat exchanger according to claim 16, wherein the cover structure, the distributor structure, the plurality of windowed layers and the planar base structure sämtlichst by brazing be coupled together. Method for manufacturing a micro heat exchanger according to claim 18, wherein the soldering with a silver-containing soldering material he follows. Method for manufacturing a micro heat exchanger according to claim 16, further comprising a step of aligning of openings in each of the plurality of windowed layers prior to coupling together the windowed layers. Method for manufacturing a micro heat exchanger according to claim 16, wherein the micro-openings in the heat-conducting Layers are formed by an isotropic wet etching process. Method for manufacturing a micro heat exchanger according to claim 21, wherein the material removing process from a Group is selected, which a photochemical processing or ablation, a chemical Mask etching, an electrochemical mask etching, an electric etching and electrochemical micromachining. Method for manufacturing a micro heat exchanger according to claim 16, wherein the HSVRM composite structure is a micro-mesh formation having. Method for manufacturing a micro heat exchanger according to claim 23, wherein forming the microapertures through each of the plurality thermally conductive Laying by a material removing method forming a first micropattern in a first side of each thermally conductive Location and forming a second micropattern in a second Side of each thermally conductive Location includes. A method of manufacturing a heat exchanger according to claim 24, wherein the first and second micropatterns are complementary are to form continuous microchannels in the heat-conducting layer. A method of manufacturing a heat exchanger according to claim 24, wherein the first and second micropatterns are formed that she an overlapping one Micromesh structure in the heat-conducting Make up position. Method for manufacturing a micro heat exchanger according to claim 16, wherein the HSVRM composite structure comprises a plurality of microchannels having. Method for manufacturing a micro heat exchanger according to claim 16, further comprising the step of finishing the planar basic structure. Method for manufacturing a micro heat exchanger according to claim 16, further comprising a formation of a plurality of fluid connections in the lid structure. Method for manufacturing a micro heat exchanger according to claim 16, wherein the number and thickness of the plurality of heat-conducting Layers showing the HSVRM composite structure form, so chosen they are the pressure loss and the thermal resistance characteristics of the micro heat exchanger optimize. A method of manufacturing a heat exchanger according to claim 16, wherein the heat-conducting layers have a thickness between about 50 and about 250 μ. A method of manufacturing a heat exchanger according to claim 16, where in the heat-conducting Lay trained micro-openings Have dimensions between about 50 and about 300 μ. A microstructured heat exchanger having a plurality of heat conductive layers each having a plurality of elongate micro-openings formed by removing material therefrom, wherein the plurality of elongate micro-openings are aligned and the plurality of heat-conductive layers are coupled together to form an HSVRM structure each elongate opening being in a first heat conducting layer having more than three elongated openings of at least one communicates adjacent heat conductive layer. Microstructured heat exchanger according to claim 33, the thermally conductive Layers of copper included. Microstructured heat exchanger according to claim 33, wherein the windowed layers are coupled together by brazing are. Microstructured heat exchanger according to claim 33, the material removal is isotropic. Microstructured heat exchanger according to claim 33, wherein the number and thickness of the plurality of heat conductive layers is selected that the pressure drop and the thermal resistance characteristics of the microstructured heat exchanger are optimized. Microstructured heat exchanger with a plurality of thermally conductive Layers, each containing a variety of elongated micro-openings which are formed by material removal, wherein the plurality of oblong microopenings is aligned and the plurality of heat conductive layers coupled together is to form a HSVRM structure, with each elongated opening in a first heat-conducting Location with only one elongated opening one adjacent heat-conducting Location communicates. Microstructured heat exchanger according to claim 38, being the variety of elongated ones microopenings in each of the several heat-conducting Layers is the same. Microstructured heat exchanger according to claim 38, the material removal is isotropic. Microstructured heat exchanger according to claim 38, wherein the windowed layers are coupled together by brazing are. Microstructured heat exchanger according to claim 38, wherein the number and thickness of the plurality of heat conductive layers are selected that she the pressure loss and the thermal resistance characteristics of the microstructured heat exchanger. Method for producing a microstructure having heat exchanger with the following process steps: a. Forming a plurality of windowed layers using a material separating or settling method, with the windows provided layers a thermally conductive Containing material and having a plurality of micro-openings; and b. Coupling together the plurality of windowed layers, to form a composite microstructure.