DE102005028902A1 - Heat exchanger for cooling heat source e.g. integrated circuit, has interface layer, and manifold layer with first set of individualized fluid paths positioned to minimize pressure drop within heat exchanger - Google Patents

Abstract

A heat exchanger comprises an interface layer in contact with a heat source and configured to pass fluid to cool the heat source; and a manifold layer coupled to the interface layer. The manifold layer has a first set of individualized fluid paths for channeling fluid to the interface layer. The fluid paths are positioned to minimize pressure drop within the heat exchanger. Independent claims are included for the following: (a) a manifold layer which can be coupled to an interface layer to form a microchannel heat exchanger; (b) a method of manufacturing a heat exchanger configured to cool a heat source, comprising: forming an interface layer configurable to be in contact with the heat source to pass fluid through it; forming the manifold layer to include inlet fluid path(s) and outlet fluid path(s); and coupling the manifold layer to the interface layer; (c) an electronic device which produces heat, comprising: an integrated circuit; an interface layer for cooling heat produced by the electronic device, integrally formed with the integrated circuit and configured to pass fluid through; and a manifold layer for circulating fluid with the interface layer; and (d) a closed loop system for cooling integrated circuit(s), comprising: heat exchanger(s) for absorbing heat generated by the integrated circuit, where the heat exchanger comprises: the interface layer and the manifold layer; pump(s) for circulating fluid through a loop, and coupled to the heat exchanger; and heat rejector(s) coupled to the pump and the heat exchanger. The inlet fluid path and the outlet fluid path are arranged to provide fluid flow at an optimal minimum fluid travel distance. The heat rejector is for cooling heated liquid output from the heat exchanger.

Description

relative Registrations

These Patent application is a continuation-in-part application of the US patent application with the serial no. 10 / 680,584, filed on October 6, 2003 was and is titled "Procedures and device for efficient vertical fluid delivery for cooling a heat-producing Device "(" METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE "), which is incorporated by reference in this document and the one continuation-in-part application the US patent application with the serial no. 10 / 439,635, which is on 16. Filed May 2003 and entitled "Method and Device for flexible fluid delivery for cooling desired hot Areas in a heat producing Device "(" METHOD AND APPARATUS FOR FLEXIBLE FLUID DELIVERY FOR COOLING DESIRED HOT SPOTS IN A HEAT PRODUCING DEVICE "), which is incorporated herein by reference and which has the priority under 35 U.S.C.119 (e) the likewise pending US provisional patent application with the serial no. 60 / 423,009 claims, filed on 01 November 2002 and entitled "Procedures for flexible fluid delivery and cooling by hot Microchannel heat sink areas "(" METHODS FOR FLEXIBLE FLUID DELIVERY AND HOTSPOT COOLING BY MICROCHANNEL HEAT SINKS ") by Reference is incorporated in this document, and the co-pending US Provisional patent application with the serial no. 60 / 442,383, the 24. January 2003, entitled "Optimized Plate-fin Heat Exchanger for cooling a CPU "(" OPTIMIZED PLATE FIN HEAT EXCHANGER FOR CPU COOLING "), which is also referred to in this document is included, and of the co-pending US Provisional patent application with the serial no. 60 / 455,729, the 17. March 2003 and is titled "microchannel heat exchanger with porous Structure and method of making the same "(" MICROCHANNEL HEAT EXCHANGER APPARATUS WITH POROUS CONFIGURATION AND METHOD OF MANUFACTURING THEREOF ") by the reference is incorporated in this document. The US patent application with the serial no. 10 / 680,584 further claims the priority under 35 U.S.C.119 (e) the likewise pending US provisional patent application with the serial no. 60 / 423,009, the filed on 01 November 2002 and entitled "Procedures for flexible fluid delivery and cooling by hot Microchannel heat sink areas "(" METHODS FOR FLEXIBLE FLUID DELIVERY AND HOT SPOT COOLING BY MICROCHANNEL HEAT SINKS ") Reference is incorporated herein, and co-pending US Provisional patent application with the serial no. 60 / 442,383, issued on January 24, 2003, entitled "Optimized Plate Rib Heat Exchanger for cooling a CPU "(" OPTIMIZED PLATE FIN HEAT EXCHANGER FOR CPU COOLING "), by reference in this document and the co-pending US Provisional Patent Application with the serial no. 60 / 455,729, filed March 17, 2003, and the title carries "microchannel heat exchanger with porous Structure and method of making same "(" MICROCHANNEL HEAT EXCHANGER APPARATUS WITH POROUS CONFIGURATION AND METHOD OF MANUFACTURING THEREOF "), which is incorporated by reference in this document.

Territory of invention

The This invention relates generally to a method and apparatus for cooling a heat producing Device, and more particularly to a method and an apparatus for efficient vertical fluid delivery when cooling an electronic device with a minimal pressure drop in the heat exchanger.

background the invention

since their introduction at the beginning of the 1880s, microchannel heat sinks or heatsinks appeared great Potential in applications for cooling with a great heat flow and were used in the industry. However, existing ones include microchannels conventional parallel Channel arrangements that are not particularly good for cooling of heat producing devices are suitable, the spatially varying heat loads exhibit. Such heat-producing devices have areas that generate more heat than others. These warmer Areas are hereby referred to as "hot areas", whereas the areas of the heat source, not so much heat produce, hereby as "warm Areas " become.

1A and 1B show a side view and a top view of a heat exchanger 10 according to the prior art, with an electronic device 99 , such as a microprocessor, via a thermal interface material 98 is coupled. As in the 1A and 1B shown fluid flows substantially from a single inlet port 12 and flows along the lower surface 11 through the parallel microchannels 14 as shown by the arrows and passes through the outlet port 16 out. Although the heat exchanger 10 the electronic device 99 cools, the fluid flows from the inlet port 12 to the outlet port 16 in a uniform way. In other words, the fluid flows substantially uniformly along the entire lower surface 11 of the heat exchanger 10 and leads areas in the lower surface 11 , the hot areas in the device 99 no longer correspond to fluid too. Further, the temperature of the liquid flowing in from the inlet generally increases as it travels along the lower surface 11 of the heat exchanger flows.

Therefore, areas become the heat source 99 located downstream or near the outlet port 16 are not supplied with cool fluid, but with warmer fluid or a two-phase fluid that has already been heated upstream. As a result, the heated fluid actually heats the heat along the entire lower surface 11 the heat exchanger and the area of the heat source 99 carries, whereby the fluid near the outlet port 16 so hot is it for cooling the heat source 99 is ineffective. This heat build-up causes two-phase flow instabilities because boiling of the fluid along the bottom surface 11 pushing the fluid away from the areas where most of the heat is generated. Furthermore, the heat exchanger forces 10 that only has one inlet 12 and an outlet 16 having the fluid move along the long parallel microchannels 14 in the lower surface 11 on the entire length of the heat exchanger 10 whereby a large pressure drop is generated due to the path length the fluid has to travel. The large pressure drop in the heat exchanger 10 is present, makes it difficult to pump the fluid to the heat exchanger 10 and increases the instabilities.

1C shows a representation of a side view of a heat exchanger 20 with several levels according to the prior art. The fluid enters the heat exchanger 20 with several levels through the connection 22 and moves in multiple fluid jets 28 in the middle layer 26 down to the lower surface 27 and an outlet port 24 , Further, the fluid flowing along the fluid jets flows 28 moves, not uniformly down to the lower surface 27 , Furthermore, the heat exchanger in 1C Same problems as above with respect to the heat exchanger 10 in the 1A and 1B were set out.

What required is a heat exchanger that is is designed to provide a small pressure drop between the inlet and to reach outlet fluid ports, while the heat source is cooled efficiently. What you want is is a microchannel heat exchanger, which is designed to ensure proper uniformity of temperature in the heat source to reach. What else desired is, is a heat exchanger, which is designed to ensure the correct temperature uniformity considering the hot Areas in the heat source to reach.

Summary the invention

In one embodiment of the invention, a heat exchanger comprises an intermediate layer in contact with the heat source and adapted to pass fluid therethrough to cool the heat source, the intermediate layer having a thickness of about 0.3 to about 1 mm, and a manifold layer coupled to the interface layer, the manifold layer further comprising a first group of singulated fluid paths to channel fluid to the interface layer, wherein the individual fluid paths are disposed in the first group to minimize pressure drop in the heat exchanger , The manifold layer may further include a second group of singulated fluid paths to channel fluid from the interface layer. The manifold layer may further include a first port for directing fluid to the first group of singulated fluid paths and a second port for discharging fluid channeled by the second group of singulated fluid paths. The first array of fluid paths may be arranged to provide a minimum fluid path length along the intermediate layer to cool a predetermined range of the heat source to a desired temperature. The first and second group of fluid paths may be arranged to provide a minimum fluid path length between the first and second ports to cool a predetermined range of the heat source to a desired temperature. The fluid may be in a single-phase flow condition. At least a portion of the fluid may be in a biphasic flow state. At least a portion of the fluid may undergo a transition between one- and two-phase flow conditions in the heat exchanger. The manifold layer may further include a circulation level through which the first and second fluid paths pass, wherein the circulation level is coupled to the interface layer and configured to separably channel fluid to and from the interface layer through the first and second sets of fluid paths. Each fluid path in the first group may have a cylindrical projection in communication therewith, each cylindrical projection projecting from the circulation level by a predetermined height. The manifold layer may further include a first level configured to channel fluid between the first port and the first group of fluid paths and a second level coupled to the first level and configured to transfer fluid between the second port and the first port two channel fluid paths, wherein fluid in the manifold layer, which is channeled through the first level, is kept separate from the fluid that is channeled through the second level. The first level may further include a first passageway in communication with the first port and the first group of fluid paths, wherein fluid in the first passageway flows directly to the first group of fluid paths. The second level may further include a second passageway in communication with the second port and the second set of fluid paths, the fluid in the second group flowing directly to the second passageway. The first group of fluid paths may be thermally isolated from the second group of fluid paths to avoid heat transfer therebetween. The first and second group of fluid paths may be arranged in a uniform manner along at least one dimension. The first and second group of fluid paths may be arranged in a non-uniform manner along at least one dimension. The fluid paths in the first group may have a closest optimal spacing with each other. The first and second group of fluid paths may be arranged to cool at least one hot interlayer region corresponding to a region in the heat source. At least one of the first fluid paths may flow through a plurality of first openings, wherein at least one of the first openings of the plurality has a first dimension that substantially corresponds to a second dimension of at least one opening in the second group of fluid paths. At least one of the first fluid paths may flow through a plurality of first openings, wherein at least one of the first openings of the plurality has a first dimension that is different from a second dimension of at least one second opening in the second group of fluid paths. The intermediate layer may consist of a material having a thermal conductivity of at least 100 W / mK. A coating may be formed on the intermediate layer, the coating providing a suitable thermal conductivity of at least 10 W / mK. The intermediate layer may further comprise a plurality of pillars arranged in a predetermined pattern along the intermediate layer. At least one of the plurality of columns may have a surface area within the range of and including (10 μm) ² to (100 μm) ² . At least one of the plurality of columns may have a height within the range of and including 50 μm to 2 mm. At least two of the plurality of columns may have a mutual distance within the range of and including 10 to 150 μm. A coating may be formed on the plurality of columns, the coating having a suitable thermal conductivity of at least 10 W / mK. At least one of the plurality of columns may have at least one varying dimension along a predetermined direction. A suitable number of columns may be arranged in a predetermined area along the intermediate layer. At least a portion of the intermediate layer may have a roughened surface. A coating may be formed on the plurality of pillars, the coating having a suitable thermal conductivity of at least 10 W / mK. The heat exchanger may comprise a porous microstructure disposed along the intermediate layer. The porous microstructure may have a porosity within the range of and including 50 to 80%. The porous microstructure may have an average pore size within the range of and including 10 to 200 μm. The porous microstructure may have a height within the range of and including 0.25 to 2.00 mm. The porous microstructure may include at least one pore having a varying dimension along a predetermined direction. The heat exchanger may further comprise a plurality of microchannels, which are arranged in a predetermined configuration along the intermediate layer. At least one of the plurality of microchannels may have an areal dimension within the range of and including (10 μm) ² to (100 μm) ² . At least one of the plurality of microchannels may have a height within the range of and including 50 μm to 2 mm. At least two of the plurality of microchannels may have a mutual distance within the range of and including 10 to 150 μm. At least one of the plurality of microchannels may have a width within the range of and including 10 to 100 μm. A coating may be formed on the plurality of microchannels, wherein the coating has a suitable thermal conductivity of at least 10 W / mK. The intermediate layer may be coupled to the heat source. The intermediate layer may be formed integrally with the heat source. The heat source may be an integrated circuit. An overhang dimension may be within the range of and including 0 to 15 mm.

In another embodiment of the present invention, a heat exchanger is configured to cool a heat source and includes an intermediate layer in contact with the heat source and configured to pass fluid, the intermediate layer having a thickness in a range of about 0.3 to about 1.0 mm, and a manifold layer coupled to the interface layer, the manifold layer having a first level with a plurality of substantially vertically extending inlet paths to vent fluid to the interface layer wherein the inlet paths are arranged to have an optimum mutual distance between the fluid paths and a second level having at least one outlet path for conducting fluid from the intermediate layer. The first level may further include at least one first port configured to channel fluid to the inlet paths. The second level may further include at least one second port configured to channel fluid from the at least one outlet path, the fluid in the second level flowing separately from the fluid in the first level. The second level may further include a plurality of substantially vertically extending outlet paths for directing fluid from the interface layer, the plurality of inlet and outlet paths being disposed at an optimal mutual fluid path distance from each other. The manifold layer may further have a circulation level coupled to the interface layer and having a plurality of first openings extending vertically therethrough for channeling fluid along the inlet paths to the interface layer and a plurality of second openings vertically therethrough extend to channel fluid along the at least one outlet path of the intermediate layer. In the first level, an inlet fluid passage may be provided to horizontally channel fluid from the first port to the first ports. The second level may further include an outlet fluid passageway for horizontally channeling fluid from the second ports to the second port. The first and second openings may be individually arranged in a uniform manner along at least one dimension. The first and second fluid ports may be individually arranged in a non-uniform manner along at least one dimension. The inlet paths and the at least one outlet path in the manifold layer may be sealed separately. The intermediate layer may be coupled to the heat source. The intermediate layer may be formed integrally with the heat source. The heat source may be an integrated circuit. The first and second openings may be arranged to cool at least one inter-layer area corresponding to a hot area in the heat source. At least one of the first openings may have an inlet dimension that substantially corresponds to an outlet dimension of at least a second opening of the plurality. At least one of the first openings may have an inlet dimension that differs from an outlet dimension of at least one second opening of the plurality. The intermediate layer may consist of a material having a thermal conductivity of at least 100 W / mK. A coating may be provided on the intermediate layer, the coating having a suitable thermal conductivity of at least 10 W / mK. The intermediate layer may further comprise a plurality of columns disposed thereon in a suitable pattern. At least one of the plurality of columns may have a surface area within the range of and including (10 μm) ² to (100 mm) ² . At least one of the plurality of columns may have a height within the range of and including 50 μm to 2 mm. At least two of the plurality of columns may have a mutual distance within the range of and including 10 to 150 μm. A coating may be formed on the plurality of columns, the coating having a suitable thermal conductivity of at least 10 W / mK. At least one of the plurality of columns may have at least one variable dimension along a predetermined direction. A suitable number of columns may be arranged in a predetermined area along the intermediate layer. At least a portion of the intermediate layer may have a roughened surface. A coating may be formed on the plurality of columns, the coating having a suitable thermal conductivity of at least 10 W / mK. The heat exchanger may further comprise a porous microstructure disposed along the intermediate layer. The porous microstructure may have a height within the range of and including 0.25 to 2.00 mm. The porous microstructure may include at least one pore having a variable dimension along a predetermined direction. An average pore size in the porous microstructure may be within the range of and including 10 μm to 200 μm. The porous microstructure may have a porosity within the range of and including 50 to 80%. The intermediate layer may further include a plurality of microchannels disposed thereon in a suitable pattern. At least one of the plurality of microchannels may have an areal dimension within the range of and including (10 μm) ² to (100 μm) ² . At least one of the plurality of microchannels may have a height within the range of and including 50 μm to 2 mm. At least two of the plurality of microchannels may have a mutual distance within the range of and including 10 to 150 μm. At least one of the plurality of microchannels may have a width within the range of and including 10 to 100 μm. A coating may be formed on the plurality of microchannels, the coating having a suitable thermal conductivity of at least 10 W / mK. An overhang dimension may be provided within the range of and including 0 to 15 mm. The heat exchanger may further include a plurality of cylindrical protrusions having an appropriate height from the circulation level projecting, each projection is in communication with the first openings.

In a further embodiment of the present invention an electronic device that produces heat, an integrated circuit, an intermediate layer to heat dissipate, which produces the electronic device, wherein the intermediate layer has a thickness in a range of about 0.3 to about 1.0 mm, the intermediate layer is integrally formed with the integrated circuit is and is adapted to pass fluid, and a distributor layer, to circulate fluid in the intermediate layer, wherein the distributor layer at least one inlet fluid path to fluid to the intermediate layer and at least one outlet fluid path to remove fluid from the Intermediate layer, wherein the at least one inlet fluid path and the at least one outlet fluid path are arranged to an optimal mutual minimum fluid path distance provide.

In a further embodiment of the present invention a closed loop for cooling at least one integrated circuit at least one heat exchanger for Absorbing heat, which produces the integrated circuit, the heat exchanger Furthermore, an intermediate layer in contact with the integrated Circuit is and is designed to pass fluid, wherein the intermediate layer has a thickness in a range of about 0.3 to about 1.0 mm, and a distribution layer with the intermediate layer coupled comprises wherein the manifold layer has at least one inlet fluid path To direct fluid to the interface, and at least one outlet fluid path, to conduct fluid from the intermediate layer, wherein the at least one inlet fluid path and the at least one outlet fluid path are arranged to an optimal mutual minimum fluid path distance provide at least one pump to fluid through the control loop to circulate, the pump with the at least one heat exchanger is coupled, and at least one device for heat extraction, with the pump and the heat exchanger is coupled to from the heat exchanger directed, warmed up liquid to cool.

Further Features and advantages of the present invention will become apparent after reviewing the detailed description of preferred and alternative embodiments, the ones listed below are.

Short description the figures

1A shows a side view of a conventional heat exchanger.

1B shows a plan view of the conventional heat exchanger.

1C shows a side view of a representation of a heat exchanger with multiple levels according to the prior art.

2A FIG. 12 is a schematic representation of a closed loop for cooling incorporating an alternate embodiment of the flexible fluid delivery microchannel heat exchanger of the present invention. FIG.

2 B FIG. 12 is a schematic representation of a closed loop for cooling incorporating an alternate embodiment of the flexible fluid delivery microchannel heat exchanger of the present invention. FIG.

3A shows a plan view of the alternative distribution layer of the heat exchanger according to the present invention.

3B shows an exploded view of the alternative heat exchanger with the alternative distribution layer according to the present invention.

4 shows a perspective view of a braided manifold layer according to the present invention.

5 shows a plan view of the braided distribution layer with an intermediate layer according to the present invention.

6A Figure 12 shows a cross-sectional view of the interleaved distribution layer with the interlayer of the present invention taken along the line AA.

6B FIG. 12 shows a cross-sectional view of the intertwined manifold layer with the interlayer of the present invention taken along the line BB. FIG.

6C Figure 12 shows a cross-sectional view of the interleaved distribution layer with the interlayer of the present invention taken along the line CC.

7A shows an exploded view of the braided distribution layer with the intermediate layer of the present invention.

7B shows a perspective view of an alternative embodiment of the intermediate layer of the present invention.

8A shows a representation of a plan view of an alternative distribution layer according to the present invention.

8B shows a representation of a plan view of the intermediate layer according to the present invention.

8C shows a representation of a plan view of the intermediate layer according to the present invention.

9A shows a representation of a side view of the alternative embodiment of the three-layer heat exchanger according to the present invention.

9B shows a representation of a side view of the alternative embodiment of the two-layer heat exchanger according to the present invention.

10A to 10E show a perspective view of the intermediate layer with various arrangements of micro-pins according to the present invention.

11 shows a representation of a partially broken away perspective view of an alternative heat exchanger according to the present invention.

12A shows an exploded view of a preferred heat exchanger according to the present invention.

12B shows an exploded view of an alternative heat exchanger according to the present invention.

12C shows a perspective view of the alternative circulation level according to the present invention.

12D shows a perspective view of the bottom of the preferred inlet level according to the present invention.

12E shows a perspective view of the bottom of an alternative inlet level according to the present invention.

12F shows a perspective view of the bottom of the preferred outlet level according to the present invention.

12G shows a perspective view of the bottom of an alternative outlet level according to the present invention.

12H shows a cross-sectional view of the preferred heat exchanger according to the present invention.

12I shows a cross-sectional view of the alternative heat exchanger according to the present invention.

13 Figure 11 is a plan view of the circulation level with the preferred arrangement of inlet and outlet ports for single-phase fluid flow in accordance with the present invention.

14 Figure 11 is a plan view of the circulation level with the preferred arrangement of inlet and outlet ports for a two-phase fluid flow in accordance with the present invention.

15 shows a representation of a side view of the intermediate layer of the heat exchanger, on which a coating material is arranged, according to the present invention.

16 shows a flowchart of an alternative method of manufacturing the heat exchanger according to the present invention.

17 shows a schematic representation of an alternative embodiment of the present invention, in which two heat exchangers are coupled to a heat source.

detailed Description of the present invention

The heat exchanger essentially absorbs thermal energy generated by a heat source by flowing fluid through certain areas of the interface layer, the interface layer preferably being coupled to the heat source. Specifically, the fluid is directed to particular areas in the interface layer to cool the hot areas and areas around the hot areas to produce substantially uniformity of temperature along the heat source while maintaining a low pressure drop in the heat exchanger. As described in the various embodiments below, the heat exchanger uses a plurality of orifices, channels, and / or fingers in the manifold layer as well as conduits in the interface layer to direct and circulate fluid from and to selected hot areas in the interface layer. Alternatively, the heat exchanger comprises a plurality of terminals, the especially at predetermined locations to supply and remove fluid directly to the hot areas to effectively cool the heat source.

It is for a person skilled in the art will appreciate that, although the microchannel heat exchanger the present invention in conjunction with a cooling of be called Areas in a device is described and explained, the heat exchanger alternatively for heating cold areas in a device can be used. It should also be noted that, although the present invention preferably as a microchannel heat exchanger is described, the present invention in other applications can be used and not on the description in this document limited is.

2A shows a schematic representation of a closed loop 30 for cooling, which is hermetically sealed, this being an alternative microchannel heat exchanger 100 for flexible fluid delivery according to the present invention. Additionally shows 2 B a schematic representation of a closed loop 30 for cooling, an alternative microchannel heat exchanger 100 for flexible fluid delivery with multiple connections 108 . 109 according to the present invention. It should be noted that the control loop alternatively includes other embodiments of the heat exchanger and not the alternative heat exchanger 100 is limited.

As in 2A shown are the fluid connections 108 . 109 with fluid lines 38 coupled with a pump 32 and a heat condenser 30 are coupled. The pump 32 pumps and circulates fluid in the closed loop 30 , In an alternative embodiment, a fluid connection 108 used to fluid the heat exchanger 100 supply. Furthermore, a fluid connection 109 used to remove fluid from the heat exchanger 100 to remove. In one embodiment, a uniform constant amount of fluid flow enters the heat exchanger 100 through the fluid connections 108 . 109 in and out. Alternatively, various fluid flow rates pass through the inlet and outlet ports. 108 . 109 on and off at a given time. Alternatively, as in 2 B As shown, a pump provides fluid for various particular inlet ports 108 ready. Alternatively, a plurality of pumps (not shown) provide fluid for their respective inlet and outlet ports 108 . 109 ready. Furthermore, the dynamic measuring and control module 34 alternatively, in the control loop used to vary and dynamically control the amount and flow rate of the fluid entering or leaving the preferred or alternative heat exchanger in response to varying hot areas or changes in the amount of heat in a hot area such as also the positions of the hot areas.

3B shows an exploded view of the alternative three-layer heat exchanger 100 with the alternative distribution layer according to the present invention. The alternative embodiment, as in 3B is a three-layer heat exchanger 100 who is an intermediate layer 102 , at least one intermediate layer 104 and at least one distribution layer 106 includes. Alternatively, as described below, the heat exchanger is 100 a two-layer device, which is the intermediate layer 102 and the distribution layer 106 includes. As in the 2A and 2 B shown is the heat exchanger 100 with a heat source 99 , such as, for example, an electronic device coupled to, but not limited to, a microchip and an integrated circuit, wherein a thermal interface material 98 preferably between the heat source 99 and the heat exchanger 100 is arranged. Alternatively, the heat exchanger 100 directly to the surface of the heat source 99 coupled. It is obvious to a person skilled in the art that the heat exchanger 100 alternatively integral in the heat source 99 is formed, whereby the heat exchanger 100 and the heat source 99 are formed in one piece. This is the intermediate layer 102 integral with the heat source 99 is formed and is formed as a part with the heat source.

It is preferred that the microchannel heat exchanger of the present invention is designed to directly or indirectly contact the heat source 99 to stand, which has a rectangular shape, as shown in the figures. However, it is obvious to a person skilled in the art that the heat exchanger 100 may have any other shape, that of the shape of the heat source 99 equivalent. For example, the heat exchanger of the present invention may be configured to have an outer semi-circular shape that allows the heat exchanger (not shown) to be directly or indirectly in contact with a corresponding semicircular shaped heat source (not shown). Further, it is preferable that the heat exchanger has a slightly larger dimension than the heat source, within the range of and including 0.5 to 5 mm.

3A shows a plan view of the alternative distribution layer 106 of the present invention. As in 3B shown comprises the manifold layer 106 especially four side surfaces as well as an upper surface 130 and a lower surface 132 , The upper surface 130 is however in 3A removed the features of the distribution layer 106 easy to present and describe. As in 3A shown, the distributor layer 106 a row of Ducts or pipes 116 . 118 . 120 . 122 as well as connections 108 . 109 on that are formed in this. The finger 118 . 120 pass completely through the body of the manifold layer 106 in the Z direction, as in 3B shown. Alternatively, the fingers run 118 and 120 partly through the distributor layer 106 in the Z direction and have openings, as in 3A shown. Furthermore, the lines run 116 and 122 partly through the distributor layer 106 , The remaining areas between the inlet and outlet ducts 116 . 120 , with 107 are designated, extend from the upper surface 130 to the lower surface 132 and form the body of the manifold layer 106 ,

As in 3A shown, the fluid passes through the inlet port 108 into the distribution layer 106 and flows along the inlet channel 116 to different fingers 118 coming from the channel 116 branch off in different directions in the X and / or Y direction to fluid selected areas in the intermediate layer 102 supply.

The finger 118 are arranged in different predetermined directions to fluid the areas in the intermediate layer 102 supply corresponding to the areas at or near the hot areas in the heat source. These areas in the interlayer 102 are referred to herein as an intermediate layer region corresponding to a hot region in the heat source. The fingers are designed to cool an interlayer region corresponding to a hot region in the heat source, as locally and temporally. As in 3A represented are the channels 116 . 122 and fingers 118 . 120 in the X and / or Y direction in the manifold layer 106 arranged. The different directions of the channels 116 . 122 and fingers 118 . 120 allow the delivery of the fluid to the hot areas in the heat source 99 to cool and / or a pressure drop in the heat exchanger 100 to minimize. Alternatively, the channels 116 . 122 and fingers 118 . 120 periodically in the distribution layer 106 arranged and have a pattern, as in the in the 4 and 5 shown example.

The arrangement as well as the dimensions of the fingers 118 . 120 are considering the hot areas in the heat source 99 which are to be cooled. The locations of the hot areas as well as the amount of heat produced near or at each hot area are used around the manifold layer 106 so interpreted that the fingers 118 . 120 above or near the hot areas in the heat source corresponding intermediate layer areas in the intermediate layer 102 are arranged. The distribution layer 106 preferably allows a single-phase and / or two-phase fluid to the intermediate layer 102 to circulate without the occurrence of a significant pressure drop in the heat exchanger 100 and the control loop 30 ( 2A ) to allow. The fluid delivery to the hot regions in the heat source corresponding interlayer regions produces a uniform temperature at the interlayer region corresponding to a hot region in the heat source as well as regions in the heat source adjacent the hot regions in the heat source corresponding interlayer regions.

The dimensions as well as the number of channels 116 and fingers 118 depend on a number of factors. In one embodiment, the inlet and outlet fingers 118 . 120 the same width. Alternatively, the inlet and outlet fingers 118 . 120 different widths. The widths of the fingers 118 . 120 are within the range of and including 0.25 to 0.50 mm. In one embodiment, the inlet and outlet fingers 118 . 120 the same length and depth. Alternatively, the inlet and outlet fingers 118 . 120 different lengths and depths. In another embodiment, the inlet and outlet fingers 118 . 120 different widths along the length of the fingers. The length of the inlet and outlet fingers 118 . 120 is within the range of and including 0.5 mm to three times the size of the length of the heat source. Furthermore, the fingers point 118 . 120 a height or depth within the range of and including 0.25 to 0.5 mm. Further alternatively, less than 10 or more than 30 fingers per centimeter are in the manifold layer 106 arranged. However, it will be apparent to those skilled in the art that between 10 and 30 fingers per centimeter in the manifold layer are also contemplated.

In the present invention it is further contemplated that the geometries of the fingers 118 . 120 and channels 116 . 122 are tailored to be provided in a non-periodic arrangement to assist in optimized cooling of hot areas of the heat source. To a uniform temperature along the heat source 99 To achieve the local distribution of heat transfer to the fluid is adapted to the local distribution of heat generation. While the fluid passes along the intermediate layer through the microchannels 110 its temperature rises and it begins to change into vapor under two-phase conditions. The fluid is therefore subject to significant expansion, resulting in a significant increase in speed. In general, the efficiency of heat transfer from the intermediate layer to the fluid is improved due to the high flow rate. Therefore, it is possible to adjust the efficiency of the heat transfer to the fluid by the cross-sectional dimensions of the Fluid delivery and the dissipative finger 118 . 120 and channels 116 . 122 in the heat exchanger 100 is set.

For example, a particular finger may be designed for a heat source where greater heat generation occurs near the inlet. Furthermore, it may be advantageous to have a larger cross section for the areas of the fingers 118 . 120 and channels 116 . 122 provide where a mixture of fluid and vapor is expected. Although not shown, a finger may be designed to start with a small cross-sectional area at the inlet to achieve a high velocity fluid flow. The particular finger or channel may also be designed to expand to a larger cross-section at a downstream outlet to effect a lower flow rate. This design of the finger or channel allows the heat exchanger to minimize pressure drop and optimize cooling of the hot areas where the fluid increases in volume, acceleration, and velocity due to a change from liquid to vapor in a biphasic flow.

Furthermore, the fingers can 118 . 120 and channels 116 . 122 be designed to expand along its length and then narrow again to the speed of the fluid at ver different locations in the microchannel heat exchanger 100 to increase. Alternatively, it is convenient to change the dimensions of the finger and the channel from large to small and back several times to increase the heat transfer efficiency to the expected heat dissipation distribution along the heat source 99 tailor. It should be noted that the above description of the varying dimensions of the fingers and channels also applies to other described embodiments and is not limited to this embodiment.

As in 3A shown comprises the manifold layer 106 alternatively one or more openings 119 in the inlet fingers 118 , In the three-layer heat exchanger 100 the fluid flows along the fingers 118 flows through the openings 119 down to the intermediate layer 104 , Alternatively, flows in the two-layer heat exchanger 100 the fluid that runs along the fingers 118 flows through the openings 119 directly down to the intermediate layer 102 , As in 3A shown comprises the manifold layer 106 openings 121 in the outlet fingers 120 , In the three-layer heat exchanger 100 the fluid flows out of the intermediate layer 104 flows through the openings 121 up into the outlet fingers 120 , Alternatively, flows in the two-layer heat exchanger 100 the fluid that comes from the interlayer 102 flows, directly through the openings 121 into the outlet fingers 120 ,

In the alternative embodiment, the inlet and outlet fingers are 118 . 120 open channels that have no openings. The lower surface 103 the distributor layer 106 lies on the upper surface of the intermediate layer 104 in the three-layer exchanger 100 at or lies at the intermediate layer 102 in the two-layer exchanger. In the three-layer heat exchanger 100 Therefore, the fluid flows freely to and from the intermediate layer 104 and the intermediate layer 106 , The fluid is supplied to and from the appropriate inter-layer area corresponding to a hot area in the heat source through conduits 105 in the intermediate layer 104 directed. It is obvious to a person skilled in the art that the lines 105 are aligned directly on the fingers, as described below, or at a different location in the three-layer system are arranged.

Even though 3B the alternative three-layer heat exchanger 100 with the alternative manifold layer is the heat exchanger 100 alternatively, a two-layered structure covering the manifold layer 106 and the intermediate layer 102 comprising, whereby the fluid directly between the distributor layer 106 and the intermediate layer 102 flows without passing through the interlayer 104 to flow. It is obvious to a person skilled in the art that the structure of the distribution layers, the intermediate layers and the intermediate layers is shown for the purpose of exemplifying only, and therefore is not limited to the illustrated construction.

As in 3B shown comprises the intermediate layer 104 a variety of wires 105 that run through them. The inflow lines 105 conduct fluid coming from the manifold layer 106 enters, at the particular a hot area in the heat source corresponding intermediate layer areas in the intermediate layer 102 , Similarly, the openings channel 105 as well as a fluid flow from the intermediate layer 102 to the outlet fluid port (outlet fluid ports) 109 , In this way, the intermediate layer provides 104 as well as a fluid delivery from the intermediate layer 102 to the outlet fluid port 109 ready, with the outlet fluid port 108 in connection with the distributor layer 106 stands.

The wires 105 are in the interlayer 104 arranged in a predetermined pattern, based on a number of factors, including, but not limited to, the positions of the intermediate layer regions corresponding to a hot region in the heat source, the amount of fluid flow needed in the intermediate layer region corresponding to a hot region in the heat source the heat source 99 suitable too cool, and the temperature of the fluid. The lines have a width of 100 microns, although other widths up to several millimeters are considered as well. Furthermore, the lines have 105 other dimensions which depend at least on the aforementioned factors. It is obvious to a professional that every line 105 in the intermediate layer 104 the same shape and / or dimension, although this is not necessary.

For example, the leads alternatively have a varying length and / or width, such as the fingers described above. Furthermore, the lines have 105 a constant depth or height in the intermediate layer 104 on. Alternatively, show the wires 105 a varying depth in the intermediate layer 104 on, such as a trapezoidal shape or a nozzle shape. Although the horizontal shape of the wires 105 in 2C shown at right angles, point the lines 105 alternatively, any other shape, including but not limited to circular ( 3A ), arcuate and elliptical. Alternatively, one or more lines 105 formed with a portion of one or all of the above fingers and have the same contour.

The intermediate layer 104 is horizontal in the heat exchanger 100 arranged, with the lines 105 are arranged vertically. Alternatively, the intermediate layer 104 in another direction in the heat exchanger 100 arranged, including, but not limited to, diagonal and curved shapes. Alternatively, the lines 105 in the intermediate layer 104 arranged in a horizontal, diagonal, curved or other direction. Furthermore, the intermediate layer runs 104 horizontally along the entire length of the heat exchanger 100 , wherein the intermediate layer 104 the intermediate layer 102 completely from the distributor layer 106 separates to force the fluid through the lines 105 to be channeled. Alternatively, a portion of the heat exchanger comprises 100 not the intermediate layer 104 between the distributor layer 106 and the intermediate layer 102 , whereby the fluid can flow freely between them. Furthermore, the intermediate layer runs 104 alternatively vertically between the distributor layer 106 and the intermediate layer 102 to form separate, distinct intermediate layer regions. Alternatively, the intermediate layer runs 104 not completely from the distributor layer 106 up to the intermediate layer 102 ,

10A shows a perspective view of the preferred embodiment of the intermediate layer 302 in accordance with the present invention. As in 10A shown comprises the intermediate layer 302 a row of columns 303 coming from the bottom surface 301 to the intermediate layer 302 go up. Further shows 10A a microporous structure 301 placed on the lower surface of the intermediate layer 302 is arranged. It is obvious that the intermediate layer 302 only the microporous structure 301 or may comprise a combination of the microporous structure with any other interlayer feature (e.g., microchannels, columns, etc.).

The preferred intermediate layer 302 includes the columns 303 and not the microchannels due to fluid flow from the inlet ports to the surrounding outlet ports in the preferred manifold layer 302 ( 12A ). As will be described in more detail below, the fluid moves down to the intermediate layer 302 through a series of inlet ports, the fluid then being from the intermediate layer 302 through a series of outlet openings, which have an optimal distance from the inlet openings. In other words, the fluid moves away from each inlet port to the next outlet port. Preferably, each inlet opening is surrounded by outlet openings. In this way, fluid enters the intermediate layer 302 enters, flow in the direction of the surrounding outlet openings. Therefore, the pillars 303 in the interlayer 302 preferably to allow sufficient heat transfer to the fluid and to allow the fluid to experience the least pressure drop as it flows from the inlet ports to the outlet ports.

The intermediate layer 302 preferably comprises a dense arrangement of large, narrow columns 303 that is perpendicular to the lower surface 301 protrude and are in contact with the lower surface of the manifold layer. Alternatively, the columns 303 not in contact with the lower surface of the manifold layer. Furthermore, at least one of the columns runs 303 alternatively at an angle to the lower surface 301 the intermediate layer 302 , The columns 303 preferably have an equal distance from each other along the intermediate layer 302 so that the heat transfer capacities of the intermediate layer 302 uniform along its lower surface 301 are. Alternatively, the columns have 303 not the same distance between each other as in 10B shown in the columns 303 in the middle of the intermediate layer 302 spaced farther apart than the columns 303 on the edges. The columns 303 have a distance from each other, which depends on the dimensions of the heat source 99 and the flow resistance of the fluid as well as the size and positions of the hot areas and the heat flow density from the heat source 99 depends. For example, offers a lower density of columns 303 a lower flow resistance, but also offers a lower surface area for heat transfer from the intermediate layer 302 to the fluid. It should be noted that the structure of not perio physically spaced columns 303 in the embodiment of the 10B is shown, is not limited thereto and can be arranged in any other arrangement, depending on the conditions of the heat source as well as the desired operation of the cooling control loop 30 ( 2A ).

Further, the columns 303 preferably circular cylinders, as in 10A shown to allow the fluid to flow from the inlet openings to the outlet openings with a lowest resistance value. The columns 303 however, alternatively have other shapes including, but not limited to, square 303B ( 10B ), diamond-shaped, elliptical 303C ( 10C ), hexagonal 303D ( 10D ) or any other shape. Furthermore, the intermediate layer 302 alternatively, a combination of differently shaped columns along the lower surface 301 on.

The intermediate layer 302 For example, there are several groups of right-angled ribs 303E on, which are arranged radially to each other in their respective group, such as in 10E shown. The intermediate layer 302 further includes various columns 303B that exist between the groups of right-angled ribs 303E are arranged. In one embodiment, the open circular regions are within the radially disposed rectangular ribs 303E arranged under each inlet opening, whereby the ribs 303E assist in guiding the flow to the outlet openings. In this way, the radially arranged ribs support 303E minimizing the pressure drop while at the same time providing a nearly uniform distribution of the cooling fluid along the intermediate layer 302 he reaches. Depending on the size and relative arrangement of the inlet and outlet ports, there are many possible arrangements of the columns and / or ribs, and the selection of the optimal arrangement of the intermediate layer 302 depends on whether the fluid is subject to single-phase or two-phase flow conditions. It is obvious to a person skilled in the art that the various arrangements of the columns 303 in any of the embodiments and variants thereof described in this document may be provided.

It is preferred that the heat exchanger 100 of the present invention larger than the heat source 99 is. In the case where the heat exchanger 100 bigger than the heat source 99 is, there is an overhang dimension. The overhang dimension is the farthest distance between an outer wall of the heat source 99 and the inner fluid channel wall of the heat exchanger 100 , such as the inner wall of the inlet port 316 ( 12A ). In the preferred embodiment, the overhang dimension is within the range of and including 0 to 5 mm for single phase and 0 to 15 mm for biphasic fluids. Furthermore, the intermediate layer 302 of the present invention preferably has a thickness within the range of and including 0.3 to 0.7 mm for single-phase fluids and 0.3 to 1.0 mm for biphasic fluids.

In the embodiment of the heat exchanger in which a microporous structure 301 on the interlayer 302 is arranged, has the microporous structure 301 a mean pore size within the range of and including 10 to 200 μm for single-phase and two-phase fluids. Furthermore, the microporous structure 301 a porosity within the range of and including 50 to 80% for single phase as well as for two phase fluids. The height of the microporous structure 301 is within the range of and including 0.25 to 2.00 mm for single-phase and two-phase fluids.

In the embodiment, the columns and / or microchannels along the intermediate layer 302 used, indicates the intermediate layer 302 of the present invention has a thickness within the range of and including 0.3 to 0.7 mm for single-phase fluids and 0.3 to 1.0 mm for biphasic fluids. Further, the area of each pillar or microchannel is within the range of and including 100 μm ² to 10 mm ² for single-phase as well as two-phase fluids. Further, the range of the separation distance between each of the columns and / or the microchannels is within the range of and including 100 μm ² to 22.5 mm ² for single-phase as well as for two-phase fluids. The width of the microchannels is within the range of and including 10 to 100 μm for single-phase and two-phase fluids. The height of the microchannels and / or columns is within the range of and including 50 to 800 μm for single-phase fluid and 50 μm to 2 mm for biphasic fluid. One skilled in the art will recognize that other dimensions may alternatively be used.

3B shows a perspective view of another embodiment of the intermediate layer 102 according to the present invention. As in 3B shown comprises the intermediate layer 102 a lower surface 103 and a plurality of microchannel walls 110 where the area between the microchannel walls 110 Fluid is channeled or routed along a fluid flow path. The lower surface 103 is even and has a high thermal conductivity to ensure adequate heat transfer from the heat source 99 to ensure. Alternatively, the lower surface comprises 103 Troughs and / or combs, which are designed to collect fluid at a certain point or to force it back. The microchannel walls 110 are arranged in parallel, as in 3B shown, whereby fluid between the microchannel walls 110 flows along a fluid path.

It is obvious to a person skilled in the art that the microchannel walls 110 alternatively in any other suitable arrangement, depending on the factors described above. For example, the intermediate layer 102 alternatively, grooves between sections of the microchannel walls 110 on, like in 8C shown. Furthermore, the microchannel walls have 110 Dimensions based on a pressure drop or pressure difference within the interlayer 102 minimize. It is also obvious that any other features besides the microchannel walls 110 are also considered, including, but not limited to, roughened surfaces and a microporous structure such as sintered metal and silicon foam. For purposes of exemplification, the parallel microchannel walls will become 110 , in the 3B are shown, however, used to the intermediate layer 102 in the present invention. Alternatively, the microchannel walls 110 a non-parallel construction.

The microchannel walls 110 allow the fluid to undergo heat exchange along selected locations of hot areas of the interlayer region corresponding to a hot region in the heat source, to the heat source 99 to cool at this point. The microchannel walls 110 have a width within the range of 10 to 100 μm and a height within the range of 50 μm to 2 mm, depending on the heat source power 99 , The microchannel walls 110 have a length that is between 100 microns and several centimeters, depending on the dimensions of the heat source as well as the size of the hot areas and the heat flow density of the heat source. Alternatively, any other microchannel wall dimension can be considered. The microchannel walls 110 are separated from each other by a separation dimension in the range of 50 to 500 μm, depending on the power of the heat source 99 although every other range of separation distance is considered as well.

Referring again to the arrangement in 3B is the top surface of the manifold layer 106 Broken off to the channels 116 . 122 and fingers 118 . 120 in the body of the manifold layer 106 to show. The places in the heat source 99 , which generate more heat, are hereby called hot areas, which causes the places in the heat source 99 , which produce less heat, hereby called warm areas. The heat source 99 is shown with a hot region, namely at point A, and shown with a warm region, namely at point B, as in FIG 3B shown. The areas of the intermediate layer 102 which abut the hot and hot areas are correspondingly referred to as a hot area in the heat source corresponding Zwischenschichtbe rich. As in 3B shown comprises the intermediate layer 102 an intermediate layer region A corresponding to a hot region in the heat source, which is disposed above the point A, and an intermediate layer region B corresponding to a hot region in the heat source, which is disposed above the point B.

As in the 3A and 3B shown, the fluid initially passes through an inlet port 108 in the heat exchanger 100 one. The fluid then flows to an inlet channel 116 , Alternatively, the heat exchanger includes 100 more than one inlet channel 116 , As in the 3A and 3B shown, the fluid branches along the inlet channel 116 from the inlet port 108 flows, in the beginning in the finger 118D , Further, the fluid flows along the other inlet channel 116 continues to flow, in the individual fingers 118B and 118C etc.

In 3B Fluid is supplied to an intermediate layer area A corresponding to a hot area in the heat source by being brought to the finger 118A flows, causing the fluid down through the finger 118A to the intermediate layer 104 flows. The fluid then flows through the inlet conduit 105A that under the finger 118A is arranged, to the intermediate layer 102 , whereby the fluid undergoes thermal exchange with the heat source 99 subject. As described, the microchannels in the intermediate layer 102 be arranged in each direction. Because of this, the microchannels 111 in the intermediate layer region A perpendicular to the other microchannels 110 in the interlayer 102 arranged. Therefore, the fluid flows from the conduit 105A along the microchannels 111 , as in 3B shown despite the fluid flow in other directions along the remaining areas of the intermediate layer 102 , The heated liquid then flows up through the conduit 105B to the outlet finger 120A ,

Similarly, fluid flows down the Z direction through the fingers 118E and 118F to the intermediate layer 104 , The fluid then flows through the inlet conduit 105C down in the Z direction to the intermediate layer 102 , The heated fluid then flows upwardly in the Z direction from the intermediate layer 102 through the outlet pipe 105D to the Auslaßfin like 120E and 120F , The heat exchanger 100 removes the heated fluid in the manifold layer 106 through the outlet fingers 120 , wherein the outlet fingers 120 in connection with the outlet channel 122 are. The outlet channel 122 allows the fluid to pass out of the heat exchanger through an outlet port 109 to stream.

It is preferred that also the inflow and outflow lines 105 are arranged directly or almost directly above suitable hot areas in the heat source corresponding intermediate layer areas to fluid the hot areas in the heat source 99 feed directly. Furthermore, each outlet finger 120 designed, closest to a corresponding inlet finger 118 for a particular intermediate layer area corresponding to a hot area in the heat source to be arranged to reduce a pressure drop between them. Therefore, the fluid enters the intermediate layer 102 through the inlet finger 118A and flows the least distance along the lower surface 103 the intermediate layer 102 before leaving the interlayer 102 to the outlet finger 120A exit. It is obvious that the distance traveled by the fluid along the lower surface 103 flows, suitably dissipates heat from the heat source 99 is generated without generating an unnecessary pressure drop. As in the 3A and 3B shown are the corners in the fingers 118 . 120 further curved to a pressure drop of the fluid along the finger 118 flows, reduce.

It is obvious to a person skilled in the art that the structure of the distributor layer 106 in the 3A and 3B is shown, only the exemplary representation is used. The structure of the channels 116 and fingers 118 in the distribution layer 106 depends on a number of factors, including, but not limited to, the positions of the hot areas in the heat source corresponding interlayer areas, the flow rate to and from the hot areas in the heat source corresponding interlayer areas, and the amount of heat from the heat source into the hot areas in the heat source corresponding intermediate layer areas is generated. For example, one possible construction includes the manifold layer 106 an intermeshing pattern of parallel inlet and outlet fingers, alternatively arranged along the width of the manifold layer, as in FIG 4 to 7A shown and described below. Regardless, any other structure of the channels 116 and fingers 118 to be viewed as.

4 shows a perspective view of an alternative distribution layer 406 according to the heat exchanger of the present invention. The distribution layer 406 in 4 comprises a plurality of interlaced or intermeshing parallel fluid fingers 411 . 412 that enable a single-phase and / or two-phase fluid to the intermediate layer 402 to circulate without the occurrence of a significant pressure drop in the heat exchanger 400 and the control loop 30 ( 2A ). As in 8th shown are the inlet fingers 411 alternately to the outlet fingers 412 arranged. However, one skilled in the art will recognize that a certain number of inlet or outlet fingers may be located close to one another, and therefore not limited to the alternate configuration found in Figs 4 is shown. Furthermore, the fingers are alternatively configured so that a parallel finger has a branch to or a connection to another parallel finger. In this way it is possible to provide many more inlet fingers than outlet fingers and vice versa.

The inlet fingers or inlet pipes 411 lead the fluid entering the heat exchanger, the intermediate layer 402 to, and the exhaust fingers or outlet pipes 412 remove the fluid from the intermediate layer 402 that then out of the heat exchanger 400 exit. The shown construction of the distributor layer 406 allows the fluid to enter the interlayer 402 to enter and a very short path length in the intermediate layer 402 to flow before it into the outlet pipe 412 entry. The significant reduction in the path length of the fluid along the intermediate layer 402 flows, significantly reduces the pressure drop in the heat exchanger 400 and the control loop 30 ( 2A ).

As in the 4 to 5 shows, includes the alternative distribution layer 406 a line 414 , which in conjunction with two inlet pipes 411 is and supplies fluid thereto. As in the 8th to 9 shown comprises the manifold layer 406 three outlet pipes 412 that in conjunction with the line 418 are. The wires 414 in the distribution layer 406 have a flat bottom surface, the fluid to the fingers 411 . 412 channeled. Alternatively, the line 414 a slight tendency to channeling the fluid to selected fluid lines 411 supported. Alternatively, the inlet conduit comprises 414 one or more openings in its lower surface that allow part of the fluid down to the intermediate layer 402 to stream. Similarly, the line points 418 in the manifold layer, a flat lower surface containing the fluid and the fluid to the port 408 channeled. Alternatively, the line 418 a slight tendency to channel the fluid to selected outlet ports 408 supported. Furthermore, the lines have 414 . 418 a width of about 2 mm, although any other width is considered alternative.

The wires 414 . 418 stand in connection with connections 408 . 409 , where the connections to the fluid lines 38 in the control loop 30 ( 2A ) are coupled. The distribution layer 406 comprises horizontally arranged fluid connections 408 . 409 , Alternatively, the manifold layer comprises 406 vertically and / or diagonally arranged fluid connections 408 . 409 as described below, although not in the 4 to 7 shown. Alternatively, the manifold layer 406 no line 414 on. Then the flu id right to the fingers 411 from the terminals 408 directed. Again, the distributor layer has 411 alternatively no line 418 on, eliminating the fluid in your fingers 412 directly from the heat exchanger 400 through the connections 408 flows. It is obvious that, though two connections 408 in connection with the pipes 414 . 418 shown, any further number of terminals can alternatively be used.

The inlet pipes 411 have dimensions that allow the fluid to flow to the interface without a large pressure drop along the lines 411 and the control loop 30 ( 2A ) to create. The inlet pipes 411 have a width within the range of and including 0.25 to 5.00 mm, although any other width is considered alternative. Furthermore, the inlet pipes 411 a length within the range of and including 0.5 mm up to three times the length of the heat source. Alternatively, other lengths are considered. As previously stated, the inlet ducts are run 411 further down to or slightly above the height of the microchannels 410 so that the fluid goes directly to the microchannels 410 is channeled. The inlet pipes 411 have a height within the range of and including 0.25 to 5.00 mm. It is obvious to a person skilled in the art that the lines 411 not down to the microchannels 410 run and that any other height is considered alternative. It is obvious to a person skilled in the art that although the inlet pipes 411 have the same dimensions, it is also considered that the inlet ducts 411 alternatively have different dimensions. Furthermore, the inlet pipes 411 alternatively varying widths, cross-sectional dimensions and / or distances between adjacent fingers. In particular, the line 411 Areas with a greater width or depth as well as areas with a smaller width or depth along their length. The varying dimensions enable more fluid to reach the predetermined, hot regions in the heat source corresponding interlayer regions in the intermediate layer 402 is passed through the wider portions while reducing flow to the hot areas of the hot areas in the heat source corresponding inter-layer areas through the narrow portions.

The outlet pipes 412 Also have dimensions that allow the fluid to flow to the intermediate layer without a large pressure drop along the lines 412 as well as along the control loop 30 ( 2A ) to create. The outlet pipes 412 have a width within the range of and including 0.25 to 5.00 mm, although any other width is considered alternative. Furthermore, the outlet ducts 412 a length within the range of and including 0.5 mm up to three times the length of the heat source. Furthermore, the outlet conduits extend 412 down to the height of the microchannels 410 so that the fluid flows slightly upwards into the outlet ducts 412 flows after moving horizontally along the microchannels 410 has flowed. The inlet pipes 411 have a height within the range of and including 0.25 to 5.00 mm, although any other height is considered alternative. It is obvious to a person skilled in the art that, although the exhaust ducts 412 have the same dimensions, is also considered that the outlet ducts 412 alternatively have different dimensions. Again, the inlet pipes 412 alternatively different widths, cross-sectional dimensions and / or distances between adjacent fingers.

The inlet and outlet pipes 411 . 412 are separate sections and different from each other, as in the 4 and 5 shown, whereby fluid of the lines is not mixed with each other. As in 8th In particular, two outlet conduits are shown along the outer edge of the manifold layer 406 arranged, and an outlet conduit 412 is in the middle of the distribution layer 406 arranged. There are also two inlet pipes 411 on adjacent sides of the middle outlet conduit 412 arranged. This particular arrangement causes the fluid entering the intermediate layer 402 enters, a short distance in the interlayer 402 flows before leaving the intermediate layer 402 through the outlet pipe 412 flows. However, it will be apparent to those skilled in the art that the inlet and outlet ducts may be arranged in any other suitable arrangement, and therefore are not limited to the arrangement shown and described in the present disclosure. The number of inlet and outlet fingers 411 . 412 is greater than three in the manifold layer 406 but less than 10 per centimeter along the distribution layer 406 , It will also be apparent to one skilled in the art that any other number of inlet and outlet conduits may be used, and thus is not limited to the number shown and described in the present disclosure.

The distribution layer 406 is coupled to the intermediate layer (not shown), thereby forming the intermediate layer (not shown) with the intermediate layer 402 coupled to a three-layer heat exchanger 400 to build. The intermediate layer described in this document is referred to above in the embodiment described in U.S. Pat 3B is shown. The distribution layer 406 is alternatively with the intermediate layer 402 coupled and above the intermediate layer 402 arranged to a two-layer heat exchanger 400 to form, as in 7A shown. The 6A to 6C show schematic cross-sectional views of alternative distribution layers 406 that with the interlayer 402 are coupled in the two-layer heat exchanger. 6A shows in particular the cross section of the heat exchanger 400 along the line AA in 5 , Further shows 6B the cross section of the heat exchanger 400 along the line BB, and 6C shows the cross section of the heat exchanger 400 along the line CC in 5 , As stated above, the inlet and outlet conduits extend 411 . 412 from the upper surface to the lower surface of the manifold layer 406 , If the distribution layer 406 and the intermediate layer 402 coupled to each other, are the inlet and outlet ducts 411 . 412 at or near above the height of the microchannels 410 in the interlayer 402 arranged. This construction causes the fluid from the inlet conduits 411 slightly off the wires 411 through the microchannels 410 flows. This construction also causes the fluid flowing through the microchannels to rise slightly upwardly through the outlet conduits 412 flows after passing through the microchannels 410 has flowed.

In the alternative embodiment, the intermediate layer is 104 ( 3B ) between the manifold layer 406 and the intermediate layer 402 although not shown in the figures. The intermediate layer 104 ( 3B ) channels the fluid flow to specific, hot areas in the heat source corresponding interlayer areas in the intermediate layer 402 , Furthermore, the intermediate layer 104 ( 3B ) are used to create a uniform flow of fluid into the intermediate layer 402 to provide. The intermediate layer 104 is also used to fluid at hot areas in the heat source corresponding interlayer regions in the intermediate layer 402 to direct to cool hot areas suitable and a uniformity of the temperature in the heat source 99 to create. The inlet and outlet pipes 411 . 412 are near or above hot areas in the heat source 99 arranged to cool these hot areas suitable, although this is not necessary.

7A shows an exploded view of the alternative distribution layer 406 with an alternative intermediate layer 102 of the present invention. The intermediate layer 102 includes continuous arrays of microchannel walls 110 , as in 3B shown. In a normal operation, similar to the preferred distribution layer used in 3B is shown, fluid enters the distributor layer 40b at the fluid port 408 and flows through the pipe 414 and to the fluid fingers or fluid lines 411 , The fluid enters the opening of the inlet fingers 411 and flows along the length of the fingers 411 in the X direction, as shown by the arrows. Further, the fluid flows down in the Z direction to the intermediate layer 402 located below the distribution layer 406 is arranged. As in 7A shown, traverses the fluid in the intermediate layer 402 along the lower surface in the X and Y direction, the intermediate layer 402 and performs a thermal exchange with the heat source 49 out. The heated fluid exits the intermediate layer 402 by moving it upwards in the Z direction via the outlet fingers 412 flows, causing the outlet fingers 412 the heated fluid to the line 418 in the distribution layer 406 Channel in the X direction. The fluid then flows along the conduit 418 and exits the heat exchanger by passing through the port 409 flows.

As in 7A As shown, the intermediate layer comprises a series of grooves 416 that exist between groups of microchannels 410 arranged, which is a channeling of the fluid to and from the lines 411 . 412 support. The grooves 416A in particular directly below the inlet ducts 411 the alternative distribution layer 406 arranged, whereby fluid, which in the intermediate layer 402 over the inlet pipes 411 enters, directly to the microchannels adjacent to the grooves 416A is channeled. The grooves 416A thus allow the fluid directly into certain selected flow paths from the inlet conduits 411 to channel, as in 5 shown. Similarly, the intermediate layer comprises 402 grooves 416B that are directly below the outlet pipes 412 are arranged in the Z direction. In this way, fluid will flow horizontally along the microchannels 410 flows to the outlet ducts, horizontal to the grooves 416B and vertical to the outlet conduit 412 above the grooves 416B channeled.

6A shows the cross section of the heat exchanger 400 with the distribution layer 406 and the intermediate layer 402 , 6A shows in particular the inlet pipes 411 connected to the outlet pipes 412 are intertwined, whereby fluid the inlet lines 411 flows down and the outlet pipes 412 flows upwards. As in 6A Further, the fluid flows horizontally through the microchannel walls 410 , which are arranged between the inlet ducts and the outlet ducts and through the grooves 416A . 416B are separated. Alternatively, the microchannel walls are not interrupted ( 3B ) and are not through the microchannels 410 separated. As in 6A show either one or both lines 411 . 412 (Inlet and outlet lines) an arcuate surface 420 at their ends at the point near the grooves 416 on. The arcuate surface 420 conducts fluid down through the pipe 411 flows to the microchannels 410 which is adjacent to the line 411 are arranged. In this way, fluid enters the intermediate layer 102 enters, easier to the microchannels 410 directed, instead of directly to the groove 416A to stream. Similarly, the arcuate surface supports 420 in the outlet pipes 412 passing the fluid from the microchannels 410 to the outer lines 412 ,

As in 7B shown comprises the intermediate layer 402 ' in an alternative embodiment, the inlet conduits 411 ' and the outlet pipes 412 ' above with reference to the manifold layer 406 ( 8th to 9 ) are described. In the alternative embodiment, the fluid directly becomes the intermediate layer 402 ' from the terminal 408 ' directed. The fluid flows along the conduit 414 ' to the inlet pipes 411 ' , The fluid then flows laterally along the groups of microchannels 410 ' and undergoes heat exchange with the heat source (not shown) and flows to the outlet ducts 412 ' , The fluid then flows along the outlet conduits 412 ' to the line 418 ' , wherein the fluid through the port 409 ' from the intermediate layer 402 ' exit. The connections 408 ' . 409 ' are in the interlayer 402 ' arranged and alternatively in the distribution layer 406 ( 7A ) arranged.

It is for a person skilled in the art will appreciate that, although all heat exchangers in the present application are shown to be horizontal be operated, the heat exchanger alternatively operated in a vertical position. The heat exchangers are alternatively designed so that each Inlet conduit is disposed above an adjacent outlet conduit, during this is operated in the vertical position. Therefore, the fluid enters the intermediate layer through the inlet lines and is on natural way to an exhaust pipe channeled. It is also obvious that any other arrangement of the manifold layer and the intermediate layer is used alternatively to the heat exchanger to enable to be operated in a vertical position.

8A to 8C show representations of plan views of another alternative embodiment of the heat exchanger according to the present invention. In particular shows 8A a representation of a plan view of an alternative distribution layer 206 according to the present invention. 8B and 8C show a plan view of an intermediate layer 204 and an intermediate layer 202 , Further shows 9A a three-layer heat exchanger, the alternative distribution layer 206 used, whereas 9B a two-layer heat exchanger showing the alternative distribution layer 206 used.

As in the 8A and 9A shown comprises the manifold layer 206 a variety of fluid connections 208 which are arranged horizontally and vertically. Alternatively, the fluid connections 208 diagonal or in any other direction relative to the manifold layer 206 arranged. The fluid connections 208 are at selected locations in the distribution layer 206 arranged to effectively fluid to the predetermined, hot areas in the heat source corresponding intermediate areas in the heat exchanger 200 to lead. The multiple fluid connections 208 provide a significant advantage in that fluid can be delivered directly from a fluid port to a particular inter-layer area corresponding to a hot area in the heat source, without significantly affecting the pressure drop in the heat exchanger 200 contribute. Furthermore, the fluid connections 208 also in the distribution layer 206 arranged to allow the fluid in the hot areas in the heat source corresponding intermediate layer areas, the smallest distance to the outlet port 208 to flow so that the fluid reaches the temperature uniformity, while a minimum pressure drop between the inlet and outlet ports 208 preserved. It also supports the use of the distribution layer 206 stabilizing a two-phase flow in the heat exchanger 200 while a uniform flow along the intermediate layer 202 is evenly distributed. It should be noted that the heat exchanger 200 alternatively more than one distribution layer 206 having a distributor layer 206 Fluid in and out of the heat exchanger 200 and another distributor layer (not shown) controls the fluid circulation rate of the heat exchanger 200 controls. Alternatively, all of the plurality of manifold layers circulate 206 Fluid to selected corresponding, hot areas in the heat source corresponding intermediate layer areas in the intermediate layer 202 ,

The alternative distribution layer 206 has lateral dimensions that are close to the dimensions of the intermediate layer 202 to match. Furthermore, the distributor layer has 206 the same dimensions as the heat source 99 on. Alternatively, the distribution layer 206 bigger than the heat source 99 , The vertical dimensions of the manifold layer 206 are within the range of 0.1 to 10 mm. Furthermore, the openings are located in the manifold layer 206 that the fluid connections 208 within the range of 1 mm to the entire width or length of the heat source 99 ,

11 shows a broken away perspective view of a three-layer heat exchanger 200 with the alternative distribution layer 200 according to the present invention. As in 11 shown is the heat exchanger 200 divided into separate areas, depending on the amount of heat flowing along the body of the heat source 99 is produced. The subdivided areas are through the vertical intermediate layer 204 and / or microchannel wall features 210 in the interlayer 202 separated. However, it will be apparent to one skilled in the art that the in 11 shown arrangement is not limited to the arrangement shown be and is merely an exemplary illustration. The heat exchanger 200 is coupled to one or more pumps, with a pump to the inlets 208A is coupled and another pump with the inlets 208B is coupled.

As in 3 shown, indicates the heat source 99 a hot area at location A and a warm area, location B, where the hot area at location A produces more heat than the warm area at location B. It is obvious that the heat source 99 alternatively, has more than one hot area and one warm area at any point at any given time. Because the point A is a hot area and more heat at the point A to the intermediate layer 202 above point A (in 11 is referred to as an intermediate layer area A corresponding to a hot area in the heat source), in this example, more fluid and / or a higher liquid flow rate for the interlayer area A in the heat exchanger corresponding to the hot area in the heat source 200 provided to cool the point A suitable. It is obvious that, although the interlayer area B corresponding to the hot area in the heat source is shown larger than the interlayer area A corresponding to the hot area in the heat source, the interlayer areas A and B corresponding to the hot areas in the heat source are called any others Regions in the heat source corresponding interlayer regions in the heat exchanger 200 may have any size and / or arrangement relative to each other.

As in 11 alternatively, the fluid enters the heat exchanger through fluid ports 208A and is supplied to the intermediate layer area A corresponding to a hot area in the heat source, passing along the intermediate layer 204 to the inflow lines 205A flows. The fluid then flows down along the inflow lines 205A in the Z direction in the intermediate layer region A of the intermediate layer corresponding to a hot region in the heat source 202 , The fluid flows between the microchannels 210A a, wherein heat from the point A to the fluid by heat conduction through the intermediate layer 202 is transmitted. The heated fluid flows along the intermediate layer 202 in the intermediate region A corresponding to a hot area in the heat source to the outlet port 209A where the fluid from the heat exchanger 200 exit. It will be apparent to one skilled in the art that any number of inlet ports 208 and outlet connections 209 may be used for a particular intermediate layer region corresponding to a hot region in the heat source, or a group of hot regions in the heat source corresponding interlayer regions. Although the outlet port 209A near the interlayer 202A is shown, is the outlet port 209A further alternatively disposed vertically at any other location, including, but not limited to, the manifold layer 209B ,

Similarly, in the example of FIG 11 shown heat source 99 a warm area at the point B, which is less heat than the point A of the heat source 99 generated. Through the connection 208B entering fluid is supplied to the intermediate layer region B corresponding to a hot region in the heat source by passing along the intermediate layer 204B to the inflow lines 205B flows. The fluid then flows down along the inflow lines 205B in the Z direction in the intermediate layer region B of the intermediate layer corresponding to a hot region in the heat source 202 , The fluid flows between the microchannels 210 in the X and Y directions, wherein heat generated by the heat source at the point B is transferred to the fluid. The heated fluid flows along the entire intermediate layer 202B in the intermediate layer area B corresponding to a hot area in the heat source up to the outlet ports 209B in Z-direction through the Auströmleitungen 205B in the intermediate layer 204 , which removes the fluid from the heat exchanger 200 exit.

As in 9A shown, includes the heat exchanger 200 alternatively a vapor permeable membrane 214 above the intermediate layer 202 is arranged. The vapor permeable membrane 214 is in sealable contact with the inner sidewalls of the heat exchanger 200 , The membrane is designed to have several small openings that allow it to steam along the intermediate layer 202 allow, through this to the terminal 209 to get. The membrane 214 is further designed to be water repellent to liquid fluid flowing along the intermediate layer 202 flows to prevent it from passing through the openings of the membrane 214 to get. More details of the vapor-permeable membrane 114 are described in co-pending U.S. Application Serial No. 10 / 366,128, filed February 12, 2003, entitled "Vapor Removal Microchannel Heat Exchanger", incorporated herein by reference Scripture is included.

12A shows an exploded view of a preferred heat exchanger 300 according to the present invention. 12B shows an explosion onsansicht of an alternative heat exchanger 300 ' according to the present invention. As in the 12A and 12B shown, includes the heat exchanger 300 . 300 ' the intermediate layer 302 . 302 ' and the distribution layer 306 . 306 ' which is coupled with this. As stated above, the heat exchanger is 300 . 300 ' coupled to the heat source (not shown) or, alternatively, completely integrated into the heat source (eg embedded in a microprocessor). It is obvious to a person skilled in the art that the intermediate layer 302 . 302 ' is substantially enclosed, and in 12A is exposed for the purpose of exemplifying only. It is preferred that the intermediate layer 302 . 302 ' a variety of columns 303 which extends along the lower surface 301 are arranged. Further, the columns have 303 alternatively, have any shape as with reference to FIGS 10A to 10E described, and / or are radially distributed ribs 303E , Again, the intermediate layer 302 alternatively, any other features as described above (eg, microchannels, roughened surfaces). The intermediate layer 302 as well as the features in the layer 302 preferably have the same thermal conductivity characteristics as described above and will not be described again with reference to the preferred embodiment. Although the interlayer 302 compared to the distribution layer 306 is smaller, it is obvious to a person skilled in the art that the intermediate layer 302 and the distribution layer 306 any other size in comparison with each other and with the heat source 99 can have. The remaining features of the intermediate layer 302 . 302 ' have the same characteristics as the intermediate layers described above and will not be described in detail.

The preferred heat exchanger 300 reduces the pressure drop in the heat exchanger essentially by the use of the discharge channels 322 in the distribution layer 306 , The delivery channels 322 are vertical in the distribution layer 306 arranged and put the intermediate layer 302 vertical fluid available to the pressure drop in the heat exchanger 300 to reduce. As stated above, a pressure drop in the heat exchanger 300 is generated or increased by the flow of fluid along the intermediate layer in the X and Y directions for a substantial period of time and / or a significant distance. The distribution layer 306 reduces the flow in the X and Y directions by placing the fluid vertically on the intermediate layer 302 through the multiple delivery channels 322 is pressed. In other words, several individual fluid jets are directed at the intermediate layer 302 directed from above. The delivery channels 322 are arranged at an optimum distance from each other to allow the fluid to flow minimally in the X and Y directions and vertically upward from the intermediate layer 302 to stream. The force of the individual fluid paths from the optimally arranged channels 322 therefore, naturally causes the fluid in an upwardly directed fluid path away from the interface layer 302 flows. Further, the individual channels maximize 322 the distribution of the fluid flow to the individual channels 322 in the interlayer 302 , whereby the pressure drop in the heat exchanger 302 is reduced while the heat source 99 is effectively cooled. Furthermore, the structure of the preferred heat exchanger allows 300 in that the heat exchanger 300 has a smaller size than other heat exchangers because the fluid does not have to travel a long distance in the lateral X and Y directions to the heat source 99 suitable to cool.

The preferred distribution layer 306 , in the 12A shown comprises two separate levels. The distribution layer 306 includes in particular a level 308 and a level 312 , The level 308 is with the interlayer 302 and the level 312 coupled. Even though 12A shows that the level 312 above the level 308 is arranged, considered a subject man also that the level 308 alternatively above the level 312 is arranged. It is further apparent to one skilled in the art that any number of levels are alternatively provided in accordance with the present invention.

The alternative distribution layer 306 ' , in the 12B shown comprises three separate levels. The distribution layer 306 ' includes in particular a circulation level 304 ' , a level 308 ' and a level 312 ' , The circulation level 304 ' is with the interlayer 302 ' as well as with the level 308 ' coupled. The level 308 ' is with the circulation level 304 ' and the level 312 ' coupled. Although the 12B shows that the level 312 ' above the level 308 ' is arranged, the expert recognizes that the level 308 ' alternatively above the level 312 ' is arranged. It is further apparent to one skilled in the art that any number of levels are alternatively provided in accordance with the present invention.

12C shows a perspective view of the circulation level 304 ' according to the present invention. The circulation level 304 ' includes an upper surface 304A ' and a lower surface 304B ' , As in the 12B and 12C shown includes the circulation level 304 ' several openings 322 ' that run through this. In one embodiment, the outlet openings of the openings 322 ' level with the lower surface 304B ' , Alternatively, the openings extend 322 ' over the lower surface 304B ' to bring the fluid closer to the interlayer 302 ' to lead. Further, the circulation level includes 304 ' several openings 324 ' , by this of the upper surface 304A ' to the lower surface 304B ' extend and project vertically as cylindrical projections in the Z direction a predetermined distance. It is obvious to a person skilled in the art that the openings 322 ' . 324 ' Alternatively, at an angle through the circulation level and do not have to go exactly vertical. As stated above, the intermediate layer is 302 ' ( 12B ) in an embodiment having the lower surface 304B ' of the circulation level 304 ' coupled. Therefore, the fluid enters the intermediate layer 302 ' in that it only through the openings 322 ' flows in the Z direction, and from the inter mediate layer 302 ' characterized in that it only through the openings 324 ' flows in the Z direction. As described below, the fluid entering the intermediate layer 302 ' through the openings 322 ' enters, separated from the fluid, which is from the intermediate layer 302 ' through the openings 324 ' by the circulation level 304 ' exit.

As in 12C shown has a portion of the openings 324 ' prefers cylindrical sections from the upper surface 304A ' in the Z direction from the circulation level 304 ' such that fluid through the openings 324 ' directly to the passage piece 326 ' in the level 312 ' ( 12F and 12G ) flows. Preferably, the cylindrical protrusions are circular, as in FIG 12C but may alternatively have any other shape. Along the interlayer 302 ' However, the fluid flows from each opening 322 ' to adjacent openings 324 ' in lateral and vertical direction. It is preferred that the openings 322 ' and the openings 324 ' are thermally isolated from each other, so that heat from the heated fluid, which from the intermediate layer 302 ' through the distributor layer 306 ' leaking, not to the cooled fluid, to the intermediate layer 302 ' through the distributor layer 306 ' flows, wanders.

12D shows a preferred embodiment of the level 308 according to the present invention. As in 12D shown, covers the level 308 an upper surface 308A and a lower surface 308B , The lower surface is preferred 308B of the level 308 directly with the intermediate layer 302 coupled, as in 12A shown. The level 308 includes a recessed passage piece 320 that has multiple fluid delivery channels 322 comprising, preferably, fluid to the intermediate layer 302 conduct. The recessed passage piece 320 is sealably in contact with the intermediate layer 302 , wherein fluid from the intermediate layer 302 exit to and between the channels 322 in the passage piece 320 flows and through the connection 314 is pouring out. It should be noted that fluid from the intermediate layer 302 exit, not into the delivery channels 322 entry.

12E shows a perspective view of the underside of an alternative embodiment of the level 308 ' according to the present invention. The level 308 ' includes an upper surface 308A ' and a lower surface 308B ' , reducing the lower surface of the level 308B ' directly with the circulation level 304 ' ( 12C ) is coupled. The level 308 ' preferably comprises a connection 314 ' , a passage piece 320 ' and a variety of openings 322 ' . 324 ' in the lower surface 308B ' , It is obvious to a professional that the level 308 ' may comprise any number of terminals and passages. The openings 322 ' . 324 ' in 12E are designed to match the circulation level 304 ' are facing. As in particular in 12E shown, direct the openings 322 ' Fluid entering the passageway 320 ' enters, so that it enters the interlayer 302 ' flows, whereas the openings 324 ' Fluid from the interlayer 302 ' so direct it to the level 312 ' flows. The openings 324 ' completely through the passage piece 320 ' in the level 308 ' , The openings 324 ' are isolated and separated so that fluid passing through the openings 324 ' flows, does not come into contact with the fluid that flows through the cylinder, with the openings 324 ' are connected or mixed with this. The openings 324 ' are also isolated to ensure that the fluid passing through each of the openings 324 ' enters, along the fluid path that flows through the opening 324 ' is provided. The openings 324 ' are preferably designed vertically. Therefore, the fluid becomes vertical through a substantial portion of the manifold layer 306 ' channeled. It is obvious that the same for the openings 322 ' is true, especially in the case that the level between the intermediate layer and the level is arranged.

Although the openings or holes 322 are shown with the same size, the openings can 322 have different or varying diameters along a length. For example, the holes can 322 closer to the connection 314 have a smaller diameter to limit fluid flow therethrough. The smaller holes 322 Therefore force the fluid through the openings 322 to flow down, the farther from the port 314 are. This change in the diameters in the holes 322 allows a more uniform distribution of the fluid in the intermediate layer 302 , It is obvious to a person skilled in the art that the diameters of the holes 322 Alternatively, be varied to a cooling in known, hot areas in the heat source corresponding intermediate layer areas in the intermediate layer 302 to effect. It is obvious to a person skilled in the art that the above description applies to the openings 324 ' applicable, the dimensions of the openings 324 ' vary or are different, to provide a uniform outflow from the interlayer 302 to effect.

In the preferred embodiment, the port 314 Fluid to the level 308 and the intermediate layer 302 to disposal. The connection 314 in 12D is preferably from the upper surface 308A through a section of the body of the level 308 to the passage piece 320 , The connection 314 runs alternatively to the passage piece 320 from the side or bottom of the level 308 , It is preferred that the terminal 314 with the connection 315 in the level 312 ( 12A to 12B ) is coupled. The connection 314 leads to the passage piece 320 which is enclosed, as in 12C shown or deepened, as in 12D shown. The passage piece 320 preferably serves to supply fluid to the port 314 from the intermediate layer 302 to channel. The passage piece 320 Alternatively, it channels fluid from the port 314 to the intermediate layer 302 ,

As in the 12F and 12G shown is the connection 315 in the level 312 preferably at the terminal 314 aligned and connected with this. With reference to the 12A Fluid preferably passes through the port 316 in the heat exchanger 300 and flows through the passage piece 328 down to the delivery channels 322 in the level 308 and finally to the interlayer 302 , With reference to the 12B alternatively, fluid preferably passes through the port 315 ' in the heat exchanger 300 ' and flows through the connection 314 ' in the level 308 ' and finally to the interlayer 302 ' , The connection 315 in 12F is preferably from the upper surface 312A through the body of the level 312 , Alternatively, the connection runs 315 from one side of the level 312 , Alternatively, the level includes 312 not the connection 315 , whereby the fluid through the port 314 ( 12D and 12E ) in the heat exchanger 300 entry. Further, the level includes 312 a connection 316 which prefers the fluid to the passage piece 328 ' kana lisiert. It will be apparent to one skilled in the art that the level has any number of terminals and passages. The passage piece 328 preferably channels fluid to the delivery channels 322 and possibly to the intermediate layer 302 ,

12G shows a perspective view of a bottom of an alternative embodiment of the level 312 ' according to the present invention. The level 312 ' is preferred with the level 308 ' in 12E coupled. As in 12F shown, covers the level 312 ' a recessed passageway area 328 ' in the body, along the bottom surface 312B ' is exposed. The recessed passage piece 328 ' is in connection with the connection 316 ' , whereby the fluid directly from the recessed passage piece 328 ' to the connection 316 ' flows. The recessed passage piece 328 ' is above the upper surface 308A ' of the level 308 ' arranged to allow the fluid, unhindered by the openings 324 ' to the passage piece 328 ' to flow upwards. The circumference of the recessed passage piece 320 ' and the lower surface 312B ' is against the upper surface 308A ' of the level 312 ' sealed so that all the fluid from the openings 324 ' to the connection 316 ' through the passage piece 328 ' flows. Each of the openings 330 ' in the lower surface 312B ' is at a corresponding opening 321 ' in the level 308 ' ( 12E ) and communicates therewith, thereby opening 330 ' at the same height as the upper surface 308A ' of the level 308 ' ( 12E ) are arranged. Alternatively, have the openings 330 a diameter slightly larger than the diameter of the corresponding opening 324 ' is, making the openings 324 ' through the openings 330 ' in the passage piece 328 ' run.

12H shows a cross-sectional view of the preferred heat exchanger in 12A along the line HH according to the present invention. As in 12H shown is the intermediate layer 302 with the heat source 99 coupled. As stated above, the heat exchanger is 300 alternatively integral with the heat source 99 formed as a component. The intermediate layer 302 is with the bottom surface 308B of the level 308 coupled. Further, the level 312 preferred with the level 308 coupled, creating the upper surface 308A of the level 308 against the lower surface 312B of the level 312 is sealed. The circumference of the passage piece 320 of the level 308 is in connection with the intermediate layer 302 , There is also the passage piece 328 in the level 312 in connection with the openings 322 in the level 308 , The lower surface 312B of the level 312 is against the upper surface 308A of the level 308 sealed, so that the fluid is not between the levels 308 . 312 penetrates.

12I shows a cross-sectional view of the alternative heat exchanger in 12B along the line II according to the present invention. As in 12I shown is the intermediate layer 302 ' with a heat source 99 ' coupled. The intermediate layer 302 ' is with the bottom surface 304B ' of the circulation level 304 ' coupled. Further, the circulation level 304 ' with the level 308 ' coupled, creating the upper surface 304A ' of the circulation level 304 ' against the lower surface 308B ' of the level 308 ' is sealed. Further, the level 312 ' preferred with the level 308 ' coupled, creating the upper surface 308A ' of the level 308 ' against the lower surface 312B ' of the level 312 ' is sealed. The circumference of the passage piece 320 ' of the level 308 ' is in connection with the openings in the upper surface 304A ' of the circulation level 304 ' so that fluid does not penetrate between the two levels. Further, the circumference of the passage piece 328 ' in the level 312 ' in conjunction with the openings in the upper surface 308A ' of the circulation level 308 ' so that fluid does not penetrate between the two levels.

In the preferred operation, as with the arrows in the 12A and 12H shown, cooled fluid enters the heat exchanger 300 through the connection 316 in the level 312 ' one. The cooled fluid flows down through the port 316 to the passage piece 328 and flows through the delivery channels 322 down to the intermediate layer 302 , The cooled fluid in the passage 320 does not mix with any heated fluid coming out of the heat exchanger 300 exit, and does not come in contact with this. The fluid that enters the interlayer 302 enters, undergoes a thermal exchange with and absorbs the heat that is in the heat source 99 is produced. The openings 322 are optimally arranged so that the fluid has the smallest distance in the X and Y directions in the intermediate layer 302 flows to the pressure drop in the heat exchanger 300 minimize while the heat source 99 is effectively cooled. The heated fluid then flows upwardly in the Z direction from the intermediate layer 302 to the passage piece 320 in the level 308 , The heated fluid coming out of the manifold layer 306 does not mix with any cooled fluid entering the manifold layer 306 enters, and does not come into contact with this. When entering the passage piece 320 the heated fluid flows to the ports 314 and 315 and exits the heat exchanger 300 out. It is obvious to a person skilled in the art that the fluid alternatively flows opposite to the path which enters the 12A and 12H is shown without departing from the scope of the present invention.

In the alternative operation, as indicated by the arrows in FIGS 12B and 12I shown, cooled fluid enters the heat exchanger 300 ' through the connection 316 ' in the level 312 ' one. The cooled fluid flows down through the port 315 ' to the connection 314 ' in the level 308 ' , The fluid then flows into the passage 320 ' and flows down to the intermediate layer 302 ' through the openings 322 ' in the circulation level 304 ' , However, the cooled fluid comes in the passage 320 ' not in contact with any heated fluid coming from the heat exchanger 300 ' exit, and does not mix with this. The fluid that enters the interlayer 302 ' enters, undergoes a thermal exchange with and absorbs the heat in the heat source 99 is produced. As described below, the openings are 322 ' and openings 324 ' arranged so that the fluid is the optimum closest distance along the intermediate layer 302 ' from every opening 322 ' to an adjacent opening 324 ' flows to reduce the pressure drop between them while the heat source 99 is effectively cooled. The heated fluid then flows upwardly in the Z direction from the intermediate layer 302 ' through the level 308 ' through different openings 324 ' to the passage piece 328 ' in the level 312 ' , The heated fluid does not mix with any cooled fluid entering the manifold layer 306 ' enters while passing through the openings 324 ' moves up, and does not come in contact with this. When entering the passage piece 328 ' in the level 312 ' the heated fluid flows to the port 316 ' and exits the heat exchanger 300 ' out. It will be obvious to a person skilled in the art that the fluid alternatively has an opposite path to that in the 12B and 12I flows without departing from the scope of the present invention.

In the preferred distribution layer 306 are the openings 322 arranged so that the path length that the fluid in the intermediate layer 302 flows, is minimized while the heat source 99 is suitably cooled. In the alternative distribution layer 306 ' are the openings 322 ' and the openings 324 ' arranged so that the path length that the fluid in the intermediate layer 302 ' flows, is minimized while the heat source 99 is suitably cooled. The openings 322 ' . 324 ' In particular, they provide substantially vertical fluid paths so that the flow in the X and Y directions (lateral direction) in the heat exchanger 300 ' is minimized. In this way, the heat exchanger reduces 300 . 300 ' significantly the path length that the fluid must flow to the heat source 99 suitable to cool, which in turn significantly reduces the pressure drop in the heat exchanger 300 . 300 ' and the control loop 30 . 30 ' ( 2A to 2 B ) is produced.

The exact arrangement and cross-sectional sizes of the openings 322 and / or openings 324 depend on a number of factors, including, but not limited to, flow conditions, temperature, heat, that of the heat source 99 is generated, and fluid flow rate. It is noted that, although the following description refers to the openings 322 and 324 It is obvious that the description applies equally to the openings 322 or the openings 324 can be applied.

The openings 322 . 324 have an optimal distance between them, whereby the pressure drop is reduced when the heat source 99 suitably cooled to a desired temperature. The arrangement and the optimal distance of the openings 322 and / or the openings 324 allow in the preferred embodiment also an independent optimization of the openings 322 . 324 and the fluid paths (generally) through the intermediate layer 302 by changing the dimensions and positions of the individual openings. In addition, the arrangement of the apertures in the preferred embodiment also significantly increases the pitch of the total stream entering the interface layer as well as the size of the area which is cooled by the fluid passing through each aperture 322 entry.

In one embodiment, the openings 322 . 324 in an alternating arrangement or in a "checkerboard" pattern in the manifold layer 306 arranged as in the 13 and 14 shown. Each of the openings 322 . 324 is spaced by the minimum path length that the fluid must flow in the "checkerboard" pattern 322 . 324 a sufficient path length to be separated from each other to the cooling liquid of the intermediate layer 302 for a sufficient period of time. As in the 13 and 14 it is preferred that one or more of the openings 322 is arranged adjacent to a corresponding number of openings or vice versa / are, so that the fluid, which in the intermediate layer 302 enters, the smallest path along the intermediate layer 302 must flow before leaving the interlayer 302 exit. As shown in the figures, it is therefore preferred that the openings 322 . 324 Radially arranged around each other to the fluid when flowing the smallest path length of any opening 322 to the nearest openings 324 to support. Such as in 13 shown, the Fuid flows into the intermediate layer 302 through a specific opening 322 enters, the path of least resistance to an adjacent opening 324 , Furthermore, the openings have 322 . 324 prefers a circular shape, although the openings may have any other shape.

As stated above, although the openings 324 shown in the figures, from the circulation level 304 or the level 308 . 312 alternatively, as a cylindrical member, the openings do not protrude from any of the levels in the manifold layer 306 out. It is further preferred that the distribution layer 306 rounded surfaces around the areas in which the fluid changes direction to reduce the pressure drop in the heat exchanger 300 to support.

The arrangement in an optimal path length as well as the dimensions of the openings 322 . 324 depend on the temperature value of the fluid along the intermediate layer 302 is exposed. It is also important that the cross-sectional dimensions for the fluid paths in the openings 322 . 324 are large enough to reduce the pressure drop in the heat exchanger 300 to reduce. In the case where the fluid is solely a single-phase flow along the intermediate layer 302 is any opening 322 preferably of several adjacent openings 324 surrounded in a symmetrical hexagonal arrangement, as in 13 shown. In a single-phase flow, it is further preferred that the number of openings be substantially that in the circulation level 304 equivalent. In a single-phase flow, the openings have 322 . 324 furthermore, preferably the same diameter. It will be apparent to one skilled in the art that other arrangements as well as any ratio of openings 322 . 324 alternatively can be considered.

In the case that the fluid is a two-phase flow along the intermediate layer 302 are non-symmetrical arrangements of the openings 322 . 324 preferred to allow acceleration of the biphasic fluid. However, symmetrical arrangements of the openings also become 322 . 324 considered for a two-phase flow. For example, the openings 322 . 324 symmetrical in the circulation level 304 be arranged, with the openings 324 larger outlet openings than the openings 322 exhibit. Alternatively, the hexagonal symmetric arrangement used in 13 is shown in the circulation level 304 used for a two-phase flow, with more openings 324 as openings 322 in the circulation level 304 available.

It should be noted that the openings 322 . 324 may alternatively be arranged in the circulation level to hot areas in the heat source 99 to cool. Therefore, for example, two openings 322 alternatively directly next to each other in the circulation level 304 arranged, whereby both openings 322 are arranged near or above an intermediate layer region corresponding to a hot region in the heat source. It is obvious that the appropriate number of openings 324 adjacent to both openings 322 is arranged to reduce the pressure drop in the intermediate layer 302 to reduce. Thus, the two openings lead 322 the cooling liquid is supplied to the interlayer region corresponding to a hot region in the heat source so as to bring the intermediate layer region corresponding to a hot region in the heat source, described above, to a uniform, substantially the same temperature.

As stated above, the preferred heat exchanger 300 considerable advantages over other heat exchangers. The arrangement of the preferred heat exchanger 300 is alternatively used with a low power pump because of the reduction in pressure drop achieved by the vertical fluid paths. Further allowed the arrangement of the preferred heat exchanger 300 independent optimization of the inlet and fluid paths along the intermediate layer 302 , Furthermore, the separate levels allow for customization to optimize the uniformity of heat transfer, the reduction in pressure drop and the dimensions of the individual components therein. The arrangement of the preferred heat exchanger 300 further reduces the pressure drop in control circuits in which the fluid is subject to a two-phase flow, and can therefore be used in single-phase as well as in two-phase control circuits. As described below, the preferred heat exchanger allows many different manufacturing processes and allows adjustment of the component geometry for tolerance purposes.

Details about how the heat exchanger 100 as well as the individual layers in the heat exchanger 100 are manufactured and manufactured, are described below. The following description refers to the preferred and alternative heat exchangers of the present invention, although to the heat exchanger 100 in 3B and the individual layers are expressly referred to herein for the sake of simplicity. It will also be apparent to those skilled in the art that, although the manufacturing / manufacturing details are described with reference to the present invention, the details of manufacture and manufacture alternatively also apply to conventional heat exchangers as well as two- and three-layer heat exchangers including one Fluid inlet port and use a fluid port, as in the 1A to 1C shown, find application.

Preferably, the intermediate layer has a thermal expansion coefficient which is approximately equal to or identical to that of the heat source 99 is. The intermediate layer therefore preferably expands correspondingly with the heat source 99 out and pulls together with this. Alternatively, the material has the intermediate layer 302 a thermal expansion coefficient which is different from the coefficient of thermal expansion of the material of the heat source. An intermediate layer 302 , which consists of a material such as silicon, has a coefficient of thermal expansion, that of the heat source 99 corresponds to, and has sufficient thermal conductivity to suitably heat from the heat source 99 to transfer to the fluid. However, alternatively, other materials will be in the intermediate layer 302 used, which have coefficients of thermal expansion, that of the heat source 99 correspond.

The intermediate layer preferably has a high thermal conductivity to allow sufficient conduction between the heat source 99 and the fluid flowing along the intermediate layer 302 flows, takes place, so that the heat source 99 not overheated. The intermediate layer is preferably made of a material having a high thermal conductivity of 100 W / mK. It is obvious to a person skilled in the art that the intermediate layer 302 may have a thermal conductivity of more or less than 100 W / mK and is not limited to this value.

In order to achieve the preferred high thermal conductivity, the intermediate layer is preferably made of a semiconductor substrate, such as silicon. Alternatively, the interlayer is made of any other material, including, but not limited to, single crystalline dielectric materials, metals, aluminum, nickel and copper, kovar, graphite, diamond, composites and any suitable alloys. An old native material of the intermediate layer 302 is a patterned or cast organic grid.

As in 15 It is preferred that the intermediate layer be coated with a coating layer 112 is coated to protect the material of the intermediate layer as well as to improve the thermal exchange properties of the intermediate layer. The coating 112 In particular, it provides chemical protection that allows certain chemical interactions between the fluid and the interlayer 302 eliminated. For example, it becomes an intermediate layer 302 made of aluminum, etched by the fluid coming into contact with it, whereby the intermediate layer 102 would be eroded over time. The coating 112 from a thin nickel layer, about 25 microns, is therefore on the surface of the intermediate layer 302 galvanized to chemically prevent any possible reactions without significantly affecting the thermal properties of the interlayer 302 to change. It is obvious that any other coating material with the appropriate layer thickness is considered, depending on the material (s) in the intermediate layer 302 ,

The intermediate layer 302 is formed by an etching process using a copper material coated with a thin layer of nickel around the intermediate layer 302 to protect. Alternatively, the intermediate layer 302 made of aluminum, silicon substrate, plastic or any other suitable material. The intermediate layer 302 made of materials having a low thermal conductivity is also coated with a suitable coating material to improve the thermal conductivity of the intermediate layer 302 to improve. A process for electroforming the Zwi A layer of chromium or a suitable other material along the lower surface of the intermediate layer 302 and to provide an electrical connection of suitable voltage to the seed layer. The electrical connection thereby forms a layer of the thermally conductive coating material 112 on top of the intermediate layer 302 , The electroforming process also forms Merkmal dimensions in the range of 10 to 100 microns. The intermediate layer 302 is formed by a electroforming process, such as pattern electroplating. Furthermore, the intermediate layer is alternatively processed by photochemical etching or chemical removal, alone or in combination with the electroforming process. Conventional chemical ablation lithography assemblies are used to provide features in the interlayer 302 to edit. Furthermore, aspect ratios and tolerances can be improved by using a laser assisted chemical removal process.

The columns 303 described above can be prepared by a variety of methods. However, it should be noted that the columns 303 are made so that they have a high thermal conductivity. It is preferred that the columns 303 are made of a material with a very high conductivity, such as copper. However, other materials, such as silicon, are also contemplated by one of ordinary skill in the art. The columns 303 can be made by various means including, but not limited to, electroforming, EDM wire fabrication, embossing, MIM, and machining. Further, saws that cut across the surface and / or milling tools may have the desired arrangement in the intermediate layer 302 produce. In an intermediate layer 302 that consists of silicon, would be the pillars 303 of processes such as plasma etching, sawing, lithographic patterning, and various wet etch processes, depending on the desired aspect ratio of the columns 303 in the interlayer 302 , The radially arranged, rectangular ribs 303E ( 10E ) can be prepared by lithographic patterning using plasma etching or electroplating in the lithographically generated molds.

In the alternative embodiment, the microchannel walls are 110 that in the interlayer 102 used, made of silicon. The microchannel walls 110 are alternatively made of any other materials, including, but not limited to, patterned glass, polymers and a cast polymer grid. Although the micro-channel walls 110 made of the same material as the lower surface 103 the intermediate layer 102 are the microchannel walls 110 alternatively from a different material as that of the remaining intermediate layer 102 produced.

In the alternative embodiment, the microchannel walls 110 thermal conductivity characteristics of at least 10 W / mK. Alternatively, the microchannel walls 110 thermal conductivity characteristics of more than 10 W / mK on. It is obvious to a person skilled in the art that the microchannel walls 110 alternatively have thermal conductivity characteristics of less than 10 W / mK, wherein a coating material 112 on the microchannel walls 110 is provided as in 15 shown the thermal conductivity of the wall features 110 to increase. For microchannel walls 110 consisting of materials that already have a good thermal conductivity, has the proposed coating 112 a thickness of at least 25 microns, further the surface of the microchannel walls 110 protects. For microchannel walls 110 that are made of a material with poor thermal conductivity characteristics, has the coating 112 has a thermal conductivity of at least 50 W / mK and is more than 25 μm thick. It will be apparent to one skilled in the art that other types of coating materials as well as thickness dimensions are contemplated.

Around the microchannel walls 110 be designed so that they have a suitable thermal conductivity of at least 10 W / mK, the walls 110 together with the coating material 112 ( 15 ) is formed by a electroforming process, wherein the coating material is, for example, nickel or another metal, as described above. Around the microchannel walls 110 be designed so that they have a suitable thermal conductivity of at least 50 W / mK, the walls 110 galvanized with copper on a seed layer of a thin metal film. Alternatively, the microchannel walls 110 not coated with the coating material. It is understood that the thermal conductivity characteristics of the microchannel walls 110 and the coating 112 If necessary, also on the columns 303 ( 10A ) and any suitable coating provided thereon.

The microchannel walls 110 are formed by a hot embossing technique to a high aspect ratio of the channel walls 110 along the bottom surface 103 the intermediate layer 102 to reach. The microchannel wall features 110 are alternatively fabricated as silicon structures deposited on a glass surface, with the features etched on the glass in the desired configuration. The microchannel walls 110 are alternatively by conventional lithographic techniques, embossing or the aforementioned methods or any other suitable method. The microchannel walls 110 are alternatively separated from the intermediate layer 102 formed and with the intermediate layer 102 connected by an anodic or epoxy compound. Alternatively, the microchannel features 110 with the intermediate layer 102 by conventional electroforming techniques, such as electroplating.

There are a number of methods that can be used to create the intermediate layer 104 manufacture. The intermediate layer consists of silicon. It will be apparent to those skilled in the art that any other suitable material is contemplated, including, but not limited to, glass, laser-patterned glass, polymers, metals, glass, plastic, cast organic materials or any compositions thereof. Alternatively, the intermediate layer 104 produced using plasma etching techniques. Alternatively, the intermediate layer 104 produced using a chemical etching technique. Other alternative methods include machining, etching, extruding, and / or forging a metal into the desired shape. The intermediate layer 104 is alternatively prepared by injection molding a plastic grid in the desired shape. Alternatively, the intermediate layer becomes 104 formed by a glass plate is brought by laser cutting in the desired shape.

The distribution layer 306 can be made by a number of methods. The preferred distribution layer 306 is made as a single element. Alternatively, the preferred distribution layer is 306 from separate components, which in 12 shown, which are then coupled together. The distribution layer 306 can be made in an injection molding process using plastic, metal, polymer compounds or any other suitable material, each layer being of the same material. Alternatively, as described above, each layer is made of a different material. The distribution layer 306 is alternatively produced by a chip technique or a metal etching technique. It is obvious to a person skilled in the art that the distributor layer 306 can be prepared by using any suitable method.

The intermediate layer 104 is with the interlayer 102 and the distribution layer 106 coupled to the heat exchanger 100 to form a variety of methods can be used for this purpose. The intermediate layer 102 , the intermediate layer 104 and the distribution layer 106 are coupled together by an anodic, adhesive or eutectic bonding technique. The intermediate layer 104 is alternatively in features of the manifold layer 106 and the intermediate layer 102 integrated. The intermediate layer 104 is with the interlayer 102 coupled by a chemical bonding method. The intermediate layer 104 alternatively, is prepared by a hot stamping process or a soft lithography technique using wire spark erosion or a silicon stamp to form the intermediate layer 104 to shape. The intermediate layer 104 is then alternatively plated with a metal or other suitable material to increase the thermal conductivity of the intermediate layer, if necessary.

Alternatively, the intermediate layer becomes 104 together with the production of the microchannel walls 110 in the interlayer 102 produced by an injection molding process. Alternatively, the intermediate layer becomes 104 in the production of the microchannel walls 110 formed by any other suitable method. Other methods of forming the heat exchanger include, but are not limited to, soldering, fusing, eutectic, intermetallic, and any other suitable technique, depending on the types of materials used in each layer.

Another alternative method of making the heat exchanger of the present invention is disclosed in U.S. Pat 16 described. As with respect to 16 described, an alternative method for producing the heat exchanger comprises the production of a hard mask, which is formed of a silicon substrate as an intermediate layer (step 500 ). The hard mask consists of a silicon dioxide or alternatively a spin-on-glass. Once the hard mask has been formed, a plurality of subchannels are formed in the hard mask, with the subchannels forming the fluid paths between the microchannel walls 110 (Step 502 ) form. The subchannels are formed by any suitable method, including, but not limited to, RF etching techniques, chemical removal, soft lithography and xenon difluoride etching. Furthermore, sufficient space must be ensured between each subchannel so that no bridge is formed between adjacent subchannels. Thereafter, the spin-on glass is applied to the upper surface of the hard mask by any conventional method to form the intermediate layer and the manifold layer (step 504 ) to build. Then, the intermediate layer and the manifold layer are cured by a curing process (step 506 ) hardened. Once the intermediate layer and the manifold layer are fully formed and cured, a fluid port or multiple fluid ports in the hardened layer (step 508 ) educated. The fluid ports are formed by etching or alternatively by drilling in the manifold layer. Although certain procedures for Production of the intermediate layer 102 , the intermediate layer 104 and the distribution layer 106 are described in this document, other known methods known in the art to heat exchangers 100 Alternatively, consider.

17 shows an alternative embodiment of the heat exchanger of the present invention. As in 6 shown are two heat exchangers 200 . 200 ' with a heat source 99 coupled. In particular, the heat source 99 , such as an electronic device, with a circuit board 96 coupled and arranged upright, eliminating each side of the heat source 99 possibly uncovered. A heat exchanger of the present invention is with an exposed side of the heat source 99 coupled, both heat exchangers 200 . 200 ' a maximum cooling of the heat source 99 enable. Alternatively, the heat source 99 Coupled horizontally with the board, leaving more than one heat exchanger on top of the heat source 99 (not shown), each heat exchanger electrically connected to the heat source 99 is coupled. Further details regarding this embodiment are described in co-pending U.S. Patent Application Serial No. 10 / 072,137, filed February 7, 2002, entitled "Power Conditioning Module", which is incorporated herein by reference is included in this document, shown and described.

As in 17 shown is the heat exchanger 200 with two layers to the left side of the heat source 99 coupled, and the heat exchanger 200 ' with three layers is to the right side of the heat source 99 coupled. It is obvious to a person skilled in the art that the heat exchangers are at the sides of the heat source 99 are coupled. It is also obvious to a person skilled in the art that the alternative embodiments of the heat exchanger 200 ' alternatively to the sides of the heat source 99 are coupled. The alternative embodiment, which is in 17 shown, allows a more accurate cooling of the hot area of the heat source 99 by supplying fluid to cool the hot areas along the thickness of the heat source 99 available. In this way, the embodiment allows in 17 suitable cooling of hot areas in the middle of the heat source 99 by putting heat from both sides of the heat source 99 is exchanged. It is obvious to a person skilled in the art that the in 17 shown embodiment with the cooling control loop 30 in 2A to 2 B is used, although other closed loop control is considered.

As stated above, the heat source 99 alternatively, characteristics in which the positions of a hot area or a plurality of hot areas change due to different tasks from the heat source 99 to be executed. To the heat source 99 suitable to cool, includes the control loop 30 alternatively a measuring and control module 34 ( 2A to 2 B ), which determines the flow rate and / or the flow rate of the fluid entering the heat exchanger 100 occurs, dynamically changing in response to a change in the position of the hot areas.

As in 17 In particular, one or more sensors are shown 124 in each heat exchanger in each hot area in the heat source corresponding interlayer area 200 and / or alternatively in the heat source 99 arranged at every possible position of a hot area. Alternatively, a plurality of heat sources are arranged uniformly between the heat source and the heat exchanger and / or in the heat exchanger itself. The control module 38 ( 2A to 2 B ) is also provided with one or more valves in the control loop 30 coupled to the fluid flow to the heat exchanger 100 controls. The one or more valves are disposed in the fluid lines, but alternatively located at a different location. The variety of sensors 124 is with the control module 34 coupled, wherein the control module 34 preferably upstream of the heat exchanger 100 is arranged as in 2 shown. Alternatively, the control module 34 anywhere else in the closed loop 30 arranged.

The sensors 124 put the control module 34 Information is provided, including, but not limited to, the flow rate of the fluid flowing in the interlayer region corresponding to a hot region in the heat source, the temperature of the interlayer 102 in the intermediate layer region corresponding to a hot region in the heat source and / or the heat source 99 and the temperature of the fluid. With reference to the schematic representation in FIG 17 put the sensors on the intermediate layer 124 are arranged, the control module 34 For example, the information that the temperature in a certain, corresponding to a hot area in the heat source interlayer region in the heat exchanger 200 rises, whereas the temperature in a certain, corresponding to a hot area in the heat source intermediate layer area in the heat exchanger 200 ' decreases. In response, the control module increases 34 the flow rate to the heat exchanger 200 and reduces the flow rate to the heat exchanger 200 ' is made available. In an alternative embodiment, the control module changes 34 alternatively, the flow rate to one or more, a hot area in the heat source corresponding interlayer region (s) in one or more heat exchanger (s) in response to the information provided by the sensors 118 receives. Although the sensors 118 in 17 in connection with two heat exchangers 200 . 200 ' are shown, it is obvious that the sensors 118 alternatively coupled with only one heat exchanger.

The The present invention has been related to certain embodiments described, which include details in order to understand the principles to allow the construction and operation of the invention. Such reference in this document to certain embodiments and details thereof are not intended to limit the scope of the claims, attached to this font are. It is for Professionals obvious that changes in the embodiment, the for the representation chosen was, can be made without departing from the scope of the invention.

Claims (88)

heat exchangers With: a. an intermediate layer in contact with the heat source is and is designed to pass fluid to the heat source to cool, wherein the intermediate layer has a thickness of about 0.3 to about 1 mm; and b. a distribution layer coupled to the intermediate layer , wherein the manifold layer further comprises a first group of singulated ones Having fluid paths to channel fluid to the interface, wherein the individual fluid paths are arranged in the first group, to a pressure drop in the heat exchanger to minimize. heat exchangers according to claim 1, characterized in that the distributor layer further a second group of isolated fluid paths to fluid from the intermediate layer to channel. heat exchangers according to claim 2, characterized in that the distributor layer further a first connection, to direct fluid to the first group of singulated fluid paths, and a second port, to divert fluid from the second group of isolated Fluid paths is channeled has. heat exchangers according to claim 1, characterized in that the first arrangement of fluid paths is arranged to have a minimum fluid path length along the intermediate layer to provide a predetermined area of the heat source to a desired Temperature to cool. heat exchangers according to claim 3, characterized in that the first and second group the fluid paths are arranged to have a minimum fluid path length between to provide the first and second ports, by a predetermined range of the heat source to a desired temperature to cool. heat exchangers according to claim 1, characterized in that the fluid in a single-phase flow state located. heat exchangers according to claim 1, characterized in that at least one part of the fluid is in a two-phase flow state. heat exchangers according to claim 1, characterized in that at least a part of the fluid a change between one and two-phase flow conditions in the heat exchanger subject. heat exchangers according to claim 2, characterized in that the distributor layer further has a circulation level through which the first and second Fluid paths run, the circulation level with the intermediate layer is coupled and designed to be separable fluid to and from the Intermediate layer through the first and second group of fluid paths to channel. heat exchangers according to claim 9, characterized in that each fluid path in the first group a cylindrical projection in conjunction therewith, wherein each cylindrical projection from the circulation level by one predetermined height protrudes. heat exchangers according to claim 3, characterized in that the distributor layer further comprising: a. a first level configured to fluid between the first Connection and to channel the first group of fluid paths; b. a second one Level that is coupled to the first level and is designed fluid between the second port and the second group of Channeling fluid paths, wherein in the distributor layer fluid, which is channeled through the first level, is kept separate from the fluid that is channeled through the second level. heat exchangers according to claim 11, characterized in that the first level further first passage piece comprises that in connection with the first terminal and the first group of Fluid paths, wherein fluid in the first passage piece directly flows to the first group of fluid paths. Heat exchanger according to claim 11, characterized characterized in that the second level further comprises a second passageway in communication with the second port and the second group of fluid paths, the fluid in the second group flowing directly to the second passageway. heat exchangers according to claim 2, characterized in that the first group of fluid paths is thermally isolated from the second group of fluid paths a heat transfer to avoid between them. heat exchangers according to claim 2, characterized in that the first and second group of Fluid paths in a uniform Way are arranged along at least one dimension. heat exchangers according to claim 2, characterized in that the first and second group of Fluid paths in a non-uniform manner along at least a dimension are arranged. heat exchangers according to claim 1, characterized in that the fluid paths in the first Arrangement with each other have a closest optimal distance. heat exchangers according to claim 2, characterized in that the first and second arrangement of Fluid paths are arranged to at least one area in the heat source corresponding hot Cool interlayer area. heat exchangers according to claim 2, characterized in that at least one of the first fluid paths flows through a plurality of first openings, wherein at least one of the first openings the plurality has a first dimension, which is substantially a second dimension of at least one opening in the second group corresponds to fluid paths. heat exchangers according to claim 2, characterized in that at least one of the first fluid paths flows through a plurality of first openings, wherein at least one of the first openings the plurality has a first dimension extending from a second Dimension of at least one second opening in the second arrangement different from fluid paths. heat exchangers according to claim 1, characterized in that the intermediate layer of a material with a thermal conductivity of at least 100 W / mK. heat exchangers according to claim 1, characterized in that on the intermediate layer a coating is formed, wherein the coating has a suitable thermal conductivity of at least 10 W / mK. heat exchangers according to claim 1, characterized in that the intermediate layer further a variety of columns having, in a predetermined pattern along the intermediate layer are arranged. A heat exchanger according to claim 23, characterized in that at least one of said plurality of columns has an area dimension within the range of and including (10 μm) ² to (100 μm) ² . heat exchangers according to claim 23, characterized in that at least one of the plurality of columns a height within the range of and including 50 μm to 2 mm. heat exchangers according to claim 23, characterized in that at least two of the plurality of columns a mutual distance within the range of and including 10 up to 150 μm exhibit. heat exchangers according to claim 23, characterized in that on the plurality of columns Coating is formed, wherein the coating is a suitable thermal conductivity of at least 10 W / mK. heat exchangers according to claim 23, characterized in that at least one of the plurality of columns at least one varying dimension along a predetermined one Direction. heat exchangers according to claim 23, characterized in that a suitable number of columns in arranged a predetermined area along the intermediate layer is. heat exchangers according to claim 1, characterized in that at least one section the intermediate layer has a roughened surface. heat exchangers according to claim 23, characterized in that a coating on the Variety of columns is formed, wherein the coating has a suitable thermal conductivity of at least 10 W / mK. heat exchangers according to claim 1, further comprising a porous microstructure along the intermediate layer is arranged. Heat exchanger according to claim 32, characterized in that the porous microstructure is a Having porosity within the range of and including 50 to 80%. heat exchangers according to claim 32, characterized in that the porous microstructure has an average Pore size within of the range of and including 10 to 200 μm having. heat exchangers according to claim 32, characterized in that the porous microstructure has a height within of the range of and including 0.25 up to 2.00 mm. heat exchangers according to claim 32, characterized in that the porous microstructure at least has a pore having a varying dimension along a having predetermined direction. heat exchangers according to claim 1, further comprising a plurality of microchannels, wherein these in a predetermined configuration along the intermediate layer are arranged. A heat exchanger according to claim 37, characterized in that at least one of the plurality of microchannels has an areal dimension within the range of and including (10 μm) ² to (100 μm) ² . heat exchangers according to claim 37, characterized in that at least one of the Variety of microchannels a height within the range of and including 50 μm to 2 mm. heat exchangers according to claim 37, characterized in that at least two of the plurality of microchannels a mutual distance within the range of and including 10 up to 150 μm exhibit. heat exchangers according to claim 37, characterized in that at least one of the Variety of microchannels a width within the range of and including 10 up to 100 μm having. heat exchangers according to claim 37, characterized in that a coating on the Variety of microchannels is formed, wherein the coating has a suitable thermal conductivity of at least 10 W / mK. heat exchangers according to claim 1, characterized in that the intermediate layer with the heat source is coupled. heat exchangers according to claim 1, characterized in that the intermediate layer integral with the heat source is formed. heat exchangers according to claim 1, characterized in that the heat source is an integrated Circuit is. heat exchangers according to claim 1, characterized in that an overhang dimension within of the range of and including 0 to 15 mm. Heat exchanger, which is designed to be a heat source to cool, full: a. an intermediate layer that is in contact with a heat source is and is adapted to pass fluid, wherein the intermediate layer has a thickness in a range of about 0.3 to about 1.0 mm; and b. a distribution layer coupled to the intermediate layer , wherein the distributor layer further comprises: i. a first Level with a variety of substantially vertical Inlet paths, to deliver fluid to the intermediate layer, wherein the inlet paths so are arranged that they have an optimal, mutual fluid path distance; and ii. a second level with at least one outlet path to remove fluid from the intermediate layer to lead. heat exchangers according to claim 47, characterized in that the first level further comprises at least has a first terminal, which is designed to channel fluid to the inlet paths. heat exchangers according to claim 48, characterized in that the second level further has at least one second terminal which is designed to channel fluid from the at least one outlet path, wherein the fluid in the second level is separate from the fluid in the first one Level is flowing. heat exchangers according to claim 49, characterized in that the second level further a plurality of substantially vertical outlet paths to direct fluid from the intermediate layer, wherein the Variety of intake and outlet paths in an optimal mutual distance between the fluid paths are arranged. heat exchangers according to claim 50, characterized in that the distributor layer further has a circulation level coupled to the intermediate layer is and has a plurality of first openings that are vertical therethrough to supply fluid along the inlet paths channel the intermediate layer, and a plurality of second openings, which run vertically through this to allow fluid along the at least an outlet path of to channel the intermediate layer. heat exchangers according to claim 51, characterized in that in the first level further a passage piece for a inlet fluid is provided to fluid from the first port to the first openings to channel horizontally. heat exchangers according to claim 52, characterized in that the second level is further a passage piece for outlet fluid, to fluid from the second openings horizontal to the second port to channel. heat exchangers according to claim 51, characterized in that the first and second passages are individually, on uniform Way are arranged along at least one dimension. heat exchangers according to claim 51, characterized in that the first and second fluid passages are individually, on non-uniform Way are arranged along at least one dimension. heat exchangers according to claim 47, characterized in that the inlet paths and the at least one outlet path sealed in the distribution layer separately from each other. heat exchangers according to claim 47, characterized in that the intermediate layer with the heat source is coupled. heat exchangers according to claim 47, characterized in that the intermediate layer is integral with the heat source is formed. heat exchangers according to claim 47, characterized in that the heat source is an integrated Circuit is. heat exchangers according to claim 51, characterized in that the first and second openings are arranged to at least one an area in the heat source corresponding hot interlayer region to cool. heat exchangers according to claim 51, characterized in that at least one of the first openings an inlet dimension having substantially an outlet dimension of at least one second opening the variety corresponds. heat exchangers according to claim 51, characterized in that at least one of the first openings an inlet dimension which extends from an outlet dimension of at least one second opening different from the multitude. heat exchangers according to claim 47, characterized in that the intermediate layer of a material with a thermal conductivity of at least 100 W / mK. heat exchangers according to claim 47, characterized in that on the intermediate layer a coating is provided, wherein the coating is a suitable thermal conductivity of at least 10 W / mK. heat exchangers according to claim 47, characterized in that the intermediate layer further a variety of columns has, which are arranged on this in a suitable pattern. A heat exchanger according to claim 65, characterized in that at least one of said plurality of columns has an area dimension within the range of and including (10 μm) ² to (100 μm) ² . heat exchangers according to claim 65, characterized in that at least one of the plurality of columns a height within the range of and including 50 μm to 2 mm. heat exchangers according to claim 65, characterized in that at least two of the plurality of columns a mutual distance within the range of and including 10 up to 150 μm exhibit. heat exchangers according to claim 65, characterized in that on the plurality of columns Coating is formed, wherein the coating is a suitable thermal conductivity of at least 10 W / mK. heat exchangers according to claim 65, characterized in that at least one of the plurality of columns at least one variable Has dimension along a predetermined direction. heat exchangers according to claim 65, characterized in that a suitable number of columns in arranged a predetermined area along the intermediate layer is. heat exchangers according to claim 47, characterized in that at least one section the intermediate layer has a roughened surface. heat exchangers according to claim 65, characterized in that on the plurality of columns Coating is formed, wherein the coating is a suitable thermal conductivity of at least 10 W / mK. A heat exchanger according to claim 47, further comprising a porous microstructure arranged along the intermediate layer. heat exchangers according to claim 74, wherein the porous Microstructure a height within the range of and including 0.25 to 2.00 mm. heat exchangers according to claim 74, characterized in that the porous microstructure is at least a pore with a changeable Has dimension along a predetermined direction. heat exchangers according to claim 74, characterized in that a mean pore size in the porous microstructure within the range of and including 10 μm to 200 μm. heat exchangers according to claim 74, characterized in that the porous microstructure within a porosity of the range of and including 50 to 80%. heat exchangers according to claim 47, characterized in that the intermediate layer further a variety of microchannels which are arranged thereon in a suitable pattern. A heat exchanger according to claim 79, characterized in that at least one of the plurality of microchannels has a surface area within the range of and including (10 μm) ² to (100 μm) ² . heat exchangers according to claim 79, characterized in that at least one of the Variety of microchannels a height within the range of and including 50 μm to 2 mm. heat exchangers according to claim 79, characterized in that at least two of the plurality of microchannels a mutual distance within the range of and including 10 up to 150 μm exhibit. heat exchangers according to claim 79, characterized in that at least one of the Variety of microchannels a width within the range of and including 10 up to 100 μm having. heat exchangers according to claim 79, characterized in that on the plurality of microchannels a Coating is formed, wherein the coating is a suitable thermal conductivity of at least 10 W / mK. heat exchangers according to claim 47, characterized in that an overhang dimension within of the range of and including 0 to 15 mm is provided. heat exchangers according to claim 51, further comprising a plurality of cylindrical projections the appropriate height protrude from the circulation level, with each projection in Connection with the first openings stands. Electronic device that produces heat with: a. an integrated circuit; b. an interlayer, um Dissipate heat that the produced electronic device, wherein the intermediate layer has a thickness in a range of about 0.3 to about 1.0 mm, the intermediate layer is integrally formed with the integrated circuit is and is adapted to pass fluid; and c. one Distribution layer to circulate fluid in the intermediate layer, wherein the manifold layer has at least one inlet fluid path, to direct fluid to the intermediate layer, and at least one Auslaßfluidpfad, to conduct fluid from the intermediate layer, wherein the at least one inlet fluid path and the at least one outlet fluid path are arranged to an optimal mutual minimum fluid path distance provide. Closed loop for cooling at least one integrated Circuit with: a. at least one heat exchanger for absorbing of heat, which produces the integrated circuit, the heat exchanger further comprises: i. an intermediate layer that is in contact with the integrated circuit is and is adapted to pass fluid, wherein the intermediate layer has a thickness in the range of about 0.3 to about 1.0 mm; and ii. a distribution layer coupled to the intermediate layer, wherein the manifold layer has at least one inlet fluid path, to direct fluid to the intermediate layer, and at least one Auslaßfluidpfad, to conduct fluid from the intermediate layer, wherein the at least one inlet fluid path and the at least one outlet fluid path are arranged to an optimal, mutual, minimum fluid path distance provide; at least one pump to move fluid through Circuit circulate, the pump with the at least one heat exchangers is coupled; and c. at least one device for heat removal, with the pump and the heat exchanger is coupled to from the heat exchanger directed, warmed up liquid to cool.