DE102006050256A1 - Cooler i.e. water cooler, for e.g. electronic component i.e. computer, has chambers and nozzles directly arranged in base plate, where medium flows via chambers and nozzles such that heat energy is carried from core and center of cooler - Google Patents

Cooler i.e. water cooler, for e.g. electronic component i.e. computer, has chambers and nozzles directly arranged in base plate, where medium flows via chambers and nozzles such that heat energy is carried from core and center of cooler Download PDF

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Publication number
DE102006050256A1
DE102006050256A1 DE200610050256 DE102006050256A DE102006050256A1 DE 102006050256 A1 DE102006050256 A1 DE 102006050256A1 DE 200610050256 DE200610050256 DE 200610050256 DE 102006050256 A DE102006050256 A DE 102006050256A DE 102006050256 A1 DE102006050256 A1 DE 102006050256A1
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Prior art keywords
radiator
base plate
cooler
nozzles
chambers
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DE200610050256
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German (de)
Inventor
Hans-Helmut Pahls
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Pahls Hans-Helmut Dipl-Ing
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Pahls Hans-Helmut Dipl-Ing
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Priority to DE200610050256 priority Critical patent/DE102006050256A1/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • F28F13/185—Heat-exchange surfaces provided with microstructures or with porous coatings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Human Computer Interaction (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

The cooler has a cover (2) that is fixed with screws on a cooler base plate (1) in inlet and/or outlet ways (100, 200). The base plate has a thread in the ways, where the cover is made of 1-4 millimeters thin plate material. A seal (70) is provided between the cover and the base plate outside the screws. Chambers (10) and nozzles (20) are directly arranged as a cascade-shape in the base plate. A medium flows through the chambers and nozzles such that heat energy to be dissipated is directed and carried from a core and a center of the cooler.

Description

Stand der TechnikState of the art

Der Einsatz von Wasserkühlern an Elektronikbauteilen stellt eine sinnvolle Alternative zur Lüfterkühlung dar.Of the Use of water coolers on electronic components represents a sensible alternative to fan cooling.

Insbesondere am Computermarkt besteht ein steigendes Interesse an Wasserkühlern, denn steigende Computerleistungen erzeugen höhere Wärmemengen und benötigen ebenso steigende Kühlerleistungen. Einfache oder aber auch aufwendig gestaltete Lüfterkühlungen stoßen an ihre Leistungsgrenzen, bzw. erzeugen eine hohe Lärmemission.Especially There is an increasing interest in watercoolers in the computer market, because of rising water prices Computer services generate higher amounts of heat and need as well increasing cooling performance. Simple or complex fan cooling systems reach their performance limits or generate a high noise emission.

Im wesentlichen bestehen heutige Wasserkühler aus einer metallischen gut wärmeleitenden Kühlergrundplatte und einem darauf montierten Kühlerdeckel. Zudem sind Verfahren bekannt, in denen versucht wird durch zusätzlichen Einsatz einer Düsenplatte zwischen Kühlergrundplatte und Kühlerdeckel ( DE 10 2004 018 144 A1 ) die zu einer guten Wärmeableitung notwendigen Strömungsbedingungen zu verbessern.Essentially, today's water coolers consist of a metallic heat-conducting radiator base plate and a radiator cover mounted thereon. In addition, methods are known in which is attempted by additional use of a nozzle plate between the radiator base plate and radiator cap ( DE 10 2004 018 144 A1 ) to improve the flow conditions necessary for good heat dissipation.

Die Kühlergrundplatte wird im Allgemeinen mit der einen Seite am zukühlendem Objekt, z.B. der CPU eines Computers, kontaktiert.The Cooler base is generally associated with one side of the object to be cooled, e.g. the CPU a computer, contacted.

Die andere Seite bildet mit dem Kühlerdeckel einen Hohlraum und wird von einem Kühlmedium durchströmt. Die Wärme wird von der Unterseite der Kühlergrundplatte aufgenommen und über das Kühlmedium abgeleitet. Aufgrund der geringen Durchflussleistungen, der bequemen Montagemöglichkeit und des geringen Arbeitsdruckes werden zumeist Pneumatiksteckanschlüsse (nachfolgend Durchflussverschraubung genannt) zum verbinden des Kühlers mit den Leitungen gewählt.The other side forms with the radiator cap one Cavity and is traversed by a cooling medium. The Heat is from the bottom of the radiator base plate taken and over the cooling medium derived. Due to the low flow rates, the convenient Mounting option and the low working pressure are usually pneumatic connectors (hereafter Flow connection) for connecting the radiator with chosen the lines.

Einige grundlegende Kriterien zum Erreichen eines guten Wirkungsgrades sind: Eine möglichst große vom Kühlmedium umspülte Oberfläche, eine günstige Strömungssituation, insbesondere an der Oberfläche des Kühlers, und die Auswahl eines gut wärmeleitenden Materials.Some basic criteria for achieving good efficiency are: the largest possible of the cooling medium lapped Surface, a cheap one Flow situation, especially on the surface the radiator, and the selection of a good heat-conducting Material.

Zum Erreichen eines guten Wirkungsgrades werden zudem Kühleroberflächen z.B. frästechnisch mit einer feinen Struktur versehen. Diese Strukturen werden auch Mikrostrukturen genannt. Es werden auch Düsensysteme verwendet, die sich im Deckel oder in einer zusätzlichen Platte zwischen Kühlerdeckel und Kühlergrundplatte ( DE 10 2004 018 144 A1 ) befinden.To achieve good efficiency, radiator surfaces are, for example, provided with a fine structure by milling. These structures are also called microstructures. It also nozzle systems are used, which in the lid or in an additional plate between the radiator cap and radiator base plate ( DE 10 2004 018 144 A1 ) are located.

Beim ( DE 10 2004 018 144 A1 ) befinden sich die Düsen in einer zusätzlichen Platte zwischen Kühlerdeckel und Kühlergrundplatte. Das Kühlmedium soll turbulent in den Kühlerinnenraum einfließen. Die Kühlergrundplatte ist mit einer Mikrostruktur zum Vergrößern der Gesamtoberfläche versehen.At the ( DE 10 2004 018 144 A1 ) are the nozzles in an additional plate between the radiator cap and radiator base plate. The cooling medium should flow turbulently into the interior of the cooler. The radiator base plate is provided with a microstructure to increase the overall surface area.

Bei marktüblichen Kühlern zeigt sich, das die vom Kühlmedium umspülte projizierte Oberfläche relativ klein im Verhältnis zur Kühlergröße ist. Das Kühlmedium ( DE 10 2004 018 144 A1 ) strömt über zusätzliche oder im Deckel angebrachte Düsen auf die Kühlergrundplatte, fließt aber unsymmetrisch und nicht ausgerichtet durchs Kühlerinnere. Dadurch ist nicht auszuschließen, das Bereiche des Kühlers vom Kühlmedium nicht bzw. unregelmäßig angeströmt werden. Eine eindeutige homogene effektive Wärmeabfuhr wird somit nicht erreicht.In commercially available coolers, it turns out that the projected from the cooling medium projected surface is relatively small in relation to the radiator size. The cooling medium ( DE 10 2004 018 144 A1 ) flows through additional or in the lid mounted nozzles on the radiator base plate, but flows asymmetrically and not aligned through the cooler interior. As a result, it can not be ruled out that areas of the cooler will not be flown through or irregularly from the cooling medium. A clear homogeneous effective heat dissipation is thus not achieved.

Die zusätzliche Platte stellt zudem einen zusätzlichen Material-, Kosten-, und Gewichtsfaktor dar.The additional Plate also provides an additional Material, cost, and weight factor.

Aufgabenstellungtask

Die Aufgabe der vorliegenden Erfindung besteht darin:
eine symmetrische, ausgerichtete und damit definierbare Strömungssituation zu ermöglichen und damit für eine gleichmäßige effektive Wärmeabfuhr zu sorgen.The object of the present invention is:
to allow a symmetrical, aligned and thus definable flow situation and thus to ensure a uniform effective heat dissipation.

Dieses wird durch Patenanspruch 1:
(Eine Zulaufmöglichkeit (100) befindet sich mittig, während die Ablaufmöglichkeiten (200) symmetrisch um die Zulaufmöglichkeit angeordnet sind.)This is by patent claim 1:
(An inflow possibility ( 100 ) is in the middle, while the run options ( 200 ) are arranged symmetrically around the inflow possibility.)

Des weiteren aus Patentanspruch 1:
(Direkt in der Kühlergrundplatte (1) sind eine oder mehrere Kammern (10) und Düsen (20) kaskadenförmig angeordnet, durch die das Medium zwangsweise fließt, und damit die abzuführende Wärmeenergie ausgerichtet aus dem Kern und Zentrum des Kühlers mitführen muss.)Furthermore from claim 1:
(Directly in the cooler base plate ( 1 ) are one or more chambers ( 10 ) and nozzles ( 20 ) arranged in a cascade, through which the medium forcibly flows, and thus must carry the heat energy to be dissipated aligned from the core and center of the radiator.)

Eine große projizierte und damit zusammenhängend tatsächliche umspülte große Oberfläche zu erreichen.A size projected and related actual lapped size surface to reach.

Dieses wird erfüllt durch Patenanspruch 1
(Der Kühlerdeckel (2) wird mit den Anschlussverschraubungen (400, 500) auf der Kühlergrundplatte (1) in den Zu- bzw. Ablaufmöglichkeiten fixiert.) Die Dichtung (70) zwischen Deckel und Grundplatte befindet sich außerhalb der Verschraubungen (400, 500).This is fulfilled by patent claim 1
(The radiator cap ( 2 ) is connected to the screwed connections ( 400 . 500 ) on the radiator base plate ( 1 ) in the inflow and outflow possibilities.) The seal ( 70 ) between cover and base plate is located outside the screw connections ( 400 . 500 ).

Denn die Fläche unterhalb der äußeren durchflussfähigen Anschlussverschraubungen wird im Gegensatz zu der Fläche unterhalb üblicher Schraubverbindungen, voll vom Kühlmedium umspült. Durch diese Maßnahme wird die projizierte Fläche im Vergleich zu üblichen Kühlern wesentlich erhöht.Because the surface underneath the outer flow-through connection screw connections is, in contrast to the surface beneath conventional screw connections, completely surrounded by the cooling medium. By this measure, the projected Flä significantly increased compared to conventional coolers.

Einen sicheren, effektiven und raumsparenden Kühler mit wenig Material und relativ geringen Arbeitsaufwand zu erstellen.a safe, effective and space-saving radiator with little material and to create relatively little work.

Dieses wird durch Patentanspruch 1 erreicht.
(Der Kühlerdeckel (2) wird mit den Anschlussverschraubungen (400, 500) auf der Kühlergrundplatte (1) fixiert. Der Kühlerdeckel (2) wird aus einem 1-4 mm dünnen Plattenmaterial erstellt.)This is achieved by claim 1.
(The radiator cap ( 2 ) is connected to the screwed connections ( 400 . 500 ) on the radiator base plate ( 1 ) fixed. The radiator cap ( 2 ) is made from a 1-4 mm thin plate material.)

Zusätzliche Bauteile wie z.B. zusätzliche Düsenplatten, benötigen auf jeder Seite eine weitere Dichtung und sind ein weiterer Kostenfaktor.additional Components such as e.g. additional Nozzle plates need on each side another seal and are another cost factor.

Jede weitere Dichtung stellt zudem einen Unsicherheits- und Kostenfaktor dar.each Another seal also poses an uncertainty and cost factor represents.

Bei bekannte Kühlern, z.B. ausgeführt nach DE 10 2004 018 144 A1 , sind die Gewinde für die Anschlussverschraubungen im Deckel angebracht.In known coolers, for example, executed after DE 10 2004 018 144 A1 , the threads for the fittings are mounted in the lid.

Um diese Gewinde sicher aufnehmen zu können, sind diese handelsüblichen Bauteile aus einem ca. 10 mm starken Material.Around To be able to safely pick up these threads, these are commercially available Components made of approx. 10 mm thick material.

Die Erfindung soll nachstehend anhand der Zeichnungen:The The invention will be described below with reference to the drawings:

1, Seitenansicht im Schnitt, mit Darstellung der möglichen Strömungsverläufe 1 , Side view in section, showing the possible flow patterns

2, Seitenansicht im Schnitt, mit Darstellung der möglichen Anschlussverschraubungen 2 , Side view in section, showing the possible connection screw connections

3, Draufsicht, auf eine Grundplatte 3 , Top view, on a base plate

Claims (11)

Kühler für elektrische, elektronische und andere technische Bauteile Die Kühlergrundplatte wird mit der einen Seite (300) am zu kühlenden Bauteil positioniert. Die andere Seite wird symmetrisch von einem Kühlmedium umströmt. Eine Zulaufmöglichkeit (100) befindet sich mittig, während die Ablaufmöglichkeiten (200) symmetrisch um die Zulaufmöglichkeit angeordnet sind. Der Kühlerdeckel (2) wird mit den Anschlussverschraubungen (400, 500) auf der Kühlergrundplatte (1) in den Zu- bzw. Ablaufmöglichkeiten fixiert. Die Kühlergrundplatte (1) verfügt hierfür über Gewinde in den Zu- bzw. Ablaufmöglichkeiten (100, 200). Der Kühlerdeckel (2) wird aus einem 1-4 mm dünnen Plattenmaterial erstellt. Die Dichtung (70) zwischen Deckel und Grundplatte befindet sich außerhalb der Verschraubungen (400, 500). Direkt in der Kühlergrundplatte (1) sind eine oder mehrere Kammern (10) und Düsen (20) kaskadenförmig angeordnet, durch die das Medium zwangsweise fließt, und damit die abzuführende Wärmeenergie ausgerichtet aus dem Kern und Zentrum des Kühlers mitführen muss.Radiator for electrical, electronic and other technical components The radiator base plate is fitted with one side ( 300 ) positioned on the component to be cooled. The other side is symmetrically flowed around by a cooling medium. An inflow option ( 100 ) is in the middle, while the run options ( 200 ) are arranged symmetrically about the inflow possibility. The radiator cap ( 2 ) is connected to the screwed connections ( 400 . 500 ) on the radiator base plate ( 1 ) in the inflow and outflow options. The radiator base plate ( 1 ) has threads in the inlet and outlet options ( 100 . 200 ). The radiator cap ( 2 ) is made of a 1-4 mm thin plate material. The seal ( 70 ) between cover and base plate is located outside the screw connections ( 400 . 500 ). Directly in the radiator base plate ( 1 ) are one or more chambers ( 10 ) and nozzles ( 20 ) arranged in a cascade through which the medium forcibly flows, and thus the heat energy to be dissipated aligned with the core and center of the radiator must carry. Kühler nach Anspruch 1, dadurch gekennzeichnet das die Zu- und Ablaufrichtung (66, 77) frei gewählt werden kann.Cooler according to claim 1, characterized in that the inlet and outlet direction ( 66 . 77 ) can be chosen freely. Kühler nach Anspruch 1, dadurch gekennzeichnet das die Anzahl der Zu- und Abläufe beliebig ist.cooler according to claim 1, characterized in that the number of Zu- and procedures is arbitrary. Kühler nach Anspruch 1, dadurch gekennzeichnet das die je nachgewählter Strömungsrichtung als Zu- bzw. Ablauf zu bezeichnende mittige Anschlusssituation, außermittig positioniert wird.cooler according to claim 1, characterized in that depending on the selected flow direction as inlet and outlet to be designated central connection situation, eccentrically is positioned. Kühler nach Anspruch 1, dadurch gekennzeichnet das der Kühlerdeckel (2) nicht bzw. nicht ausschließlich mit den Durchflussverschraubungen an den Gewinden der Kühlergrundplatte (1) fixiert wird. Einsetzbar sind alle technisch üblichen kraft- oder formschlüssige Verbindungsmöglichkeiten, insbesondere, Schraubverbindungen, Klebeverbindungen, Klemmverbindungen, Löt-Schweißverbindungen. Die Position der Verbindungselemente ist beliebig. Bei technischer Machbarkeit sind Kühlerdeckel und Kühlergrundplatte aus einem Stück erstellt.Radiator according to claim 1, characterized in that the radiator cap ( 2 ) not or not exclusively with the flow screw connections on the threads of the radiator base plate ( 1 ) is fixed. It is possible to use all technically usual non-positive or positive connection possibilities, in particular, screw connections, adhesive connections, clamping connections, soldered welded connections. The position of the connecting elements is arbitrary. With technical feasibility, the radiator cap and radiator base plate are made in one piece. Kühler nach Anspruch 1, dadurch gekennzeichnet das der Kühlerdeckel (2) aus einem beliebigen Material in einer beliebigen Form, in einer beliebigen Materialstärke erstellt wird.Radiator according to claim 1, characterized in that the radiator cap ( 2 ) of any material in any shape, in any material thickness is created. Kühler nach Anspruch 1, dadurch gekennzeichnet das Mikrostrukturen zur weiteren Oberflächenvergrößerung angebracht sind. Insbesondere durch materialabhebende oder zuführende Bearbeitung erstellte Bahnen, Vertiefungen, Erhöhungen oder Kanäle.cooler according to claim 1, characterized in that the microstructures for further surface enlargement attached are. In particular by material-removing or feeding processing created paths, depressions, elevations or channels. Kühler nach Anspruch 1, dadurch gekennzeichnet das die Kammern und Düsen jede Lage im Raum annehmen können, senkrecht, schräg oder waagerecht zur Kühlergrundplatte (1). Ihre Anzahl, Anordnung und Reihenfolge ist beliebigCooler according to claim 1, characterized in that the chambers and nozzles can assume any position in space, perpendicularly, obliquely or horizontally to the radiator base plate ( 1 ). Their number, arrangement and order is arbitrary Kühler nach Anspruch 1, dadurch gekennzeichnet das die Dichtung jede Lage zu den äußeren Verschraubungen annehmen kann. Also innerhalb, außerhalb, oder innerhalb und außerhalb.cooler according to claim 1, characterized in that the seal each layer to the outer fittings can accept. So inside, outside, or within and outside. Kühler nach Anspruch 1, dadurch gekennzeichnet, das er aus beliebig vielen Komponenten bestehen kann.cooler according to claim 1, characterized in that it consists of any number Components can exist. Kühler nach Anspruch 1, dadurch gekennzeichnet, das die Zu- und Ablaufmöglichkeiten in beliebiger Anzahl beliebig angeordnet sind, das die Art der Fixierung zwischen Kühlerdeckel und Kühlergrundplatte beliebig ist, das die Kühlergrundplatte eine beliebige Form annimmt, das der Kühlerdeckel eine beliebige Form annimmt, das beliebig viele oder beliebig wenige Kammern und Düsen vorhanden sind.Cooler according to claim 1, characterized gekenn shows that the inlet and outlet options are arbitrarily arranged in any number that the type of fixation between the radiator cap and radiator base plate is arbitrary, the radiator base plate assumes any shape that the radiator cap takes any shape, any number or any number of chambers and nozzles are present.
DE200610050256 2006-10-23 2006-10-23 Cooler i.e. water cooler, for e.g. electronic component i.e. computer, has chambers and nozzles directly arranged in base plate, where medium flows via chambers and nozzles such that heat energy is carried from core and center of cooler Withdrawn DE102006050256A1 (en)

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DE200610050256 DE102006050256A1 (en) 2006-10-23 2006-10-23 Cooler i.e. water cooler, for e.g. electronic component i.e. computer, has chambers and nozzles directly arranged in base plate, where medium flows via chambers and nozzles such that heat energy is carried from core and center of cooler

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2372290A3 (en) * 2010-03-29 2014-02-26 Hamilton Sundstrand Space Systems International, Inc. Compact two side cold plate support assembly with threaded inserts
CN107546351A (en) * 2016-04-11 2018-01-05 比亚迪股份有限公司 First daughter backplane
CN111977415A (en) * 2020-06-29 2020-11-24 贵州科虎企业管理集团有限公司 Be applied to chemical industry's reaction raw materials's conveying equipment
WO2022198537A1 (en) * 2021-03-25 2022-09-29 Huawei Technologies Co., Ltd. Jet impingement cooling device and method of manufacturing the same

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AT5588U1 (en) * 2001-07-19 2002-08-26 Manfred Berger Zern At Kuehlsy SLIDING LAYER COOL
DE202005003832U1 (en) * 2004-03-26 2005-05-12 Ebm-Papst St. Georgen Gmbh & Co. Kg heat absorber
DE10393423T5 (en) * 2002-11-01 2005-10-06 Cooligy, Inc., Mountain View Method and apparatus for flexible fluid supply for cooling of desired hot spots in a heat-generating device
DE102004018144A1 (en) * 2004-04-08 2005-11-10 Alphacool Gmbh Cooler for e.g. graphics card, has discharge channels that are formed in nozzle plate and fluidly connected with discharge pipe connection for conduction of cooling medium e.g. water, on base plate
DE10393618T5 (en) * 2002-11-01 2005-11-17 Cooligy, Inc., Mountain View Method and apparatus for achieving temperature uniformity and for cooling overheat points in a heat generating device
DE10393588T5 (en) * 2002-11-01 2006-02-23 Cooligy, Inc., Mountain View Optimal propagation system, apparatus and method for liquid cooled, microscale heat exchange
DE102005028902A1 (en) * 2004-06-29 2006-03-02 Cooligy, Inc., Mountain View Heat exchanger for cooling heat source e.g. integrated circuit, has interface layer, and manifold layer with first set of individualized fluid paths positioned to minimize pressure drop within heat exchanger

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AT5588U1 (en) * 2001-07-19 2002-08-26 Manfred Berger Zern At Kuehlsy SLIDING LAYER COOL
DE10393423T5 (en) * 2002-11-01 2005-10-06 Cooligy, Inc., Mountain View Method and apparatus for flexible fluid supply for cooling of desired hot spots in a heat-generating device
DE10393618T5 (en) * 2002-11-01 2005-11-17 Cooligy, Inc., Mountain View Method and apparatus for achieving temperature uniformity and for cooling overheat points in a heat generating device
DE10393588T5 (en) * 2002-11-01 2006-02-23 Cooligy, Inc., Mountain View Optimal propagation system, apparatus and method for liquid cooled, microscale heat exchange
DE202005003832U1 (en) * 2004-03-26 2005-05-12 Ebm-Papst St. Georgen Gmbh & Co. Kg heat absorber
DE102004018144A1 (en) * 2004-04-08 2005-11-10 Alphacool Gmbh Cooler for e.g. graphics card, has discharge channels that are formed in nozzle plate and fluidly connected with discharge pipe connection for conduction of cooling medium e.g. water, on base plate
DE102005028902A1 (en) * 2004-06-29 2006-03-02 Cooligy, Inc., Mountain View Heat exchanger for cooling heat source e.g. integrated circuit, has interface layer, and manifold layer with first set of individualized fluid paths positioned to minimize pressure drop within heat exchanger

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2372290A3 (en) * 2010-03-29 2014-02-26 Hamilton Sundstrand Space Systems International, Inc. Compact two side cold plate support assembly with threaded inserts
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CN107546351A (en) * 2016-04-11 2018-01-05 比亚迪股份有限公司 First daughter backplane
CN107546351B (en) * 2016-04-11 2020-10-23 比亚迪股份有限公司 First sub-base plate
CN111977415A (en) * 2020-06-29 2020-11-24 贵州科虎企业管理集团有限公司 Be applied to chemical industry's reaction raw materials's conveying equipment
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