JP2006086503A - Method and equipment for efficient perpendicular fluid transfer for cooling exoergic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat exchanger capable of reducing pressure drop between an inlet port and an outlet port. <P>SOLUTION: A heat exchanger and the method of manufacturing the same comprise a contact layer 102 for cooling a heat source. The contact layer is connected with a heat source 99. The contact layer is structured such that fluid can be flown. Further, the heat exchanger comprises a manifold layer 106 connected with the contact layer. The manifold layer is connected with the first group of individualized holes. The manifold layer comprises at least one first port 108 for circulating fluid via the first group. Further, the manifold layer is connected with the second group of individualized holes. The manifold layer comprises at least one second port 109 for circulating fluid via the second group. The holes of the first and second groups are arranged such that the shortest flow path between the first and second ports is realized in order to cool the heat source appropriately. Each of the holes of the first group is desirably arranged at the smallest optimal interval with respect to each of the holes of the second group. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

Related applications

  This patent application is filed Nov. 1, 2002, which is hereby incorporated by reference, and is pending US Provisional Patent Application No. 60 / 423,009, entitled “Flexible Fluid Transport and Microchannel Heat Sink”. US Patent Application No. 60/90, filed January 24, 2003, which is hereby incorporated by reference, and is incorporated herein by reference. (METHODS FOR FLEXIBLE FLUID DELIVERY AND HOTSPOT COOLING BY MICROCHANNEL HEAT SINKS) No. 442,383, entitled “OPTIMIZED PLATE FIN HEAT EXCHANGER FOR CPU COOLING”, filed March 17, 2003, incorporated herein by reference. And pending US Provisional Patent Application No. 60 / 455,729, entitled “Microchannel Heat Exchanger Device with Porous Configuration and Method for Producing the Same” MICROCHANNEL HEAT EXCHANGER APPARATUS WITH POROUS CONFIGURATION AND METHOD OF MANUFACTURING THEREOF), filed on March 16, 2003, incorporated herein by reference, claiming priority under 35 USC 119 (e) And pending US Provisional Patent Application No. 60 / 439,635, entitled “Method and APPARATUS FOR FLEXIBLE FLUID for flexible fluid transport for cooling hot spots required in heat generating devices” DELIVERY FOR COOLING DESIRED HOT SPOTS IN A HEAT PRODUCING DEVICE), filed on October 6, 2003, US patent application Ser. No. 10 / 680,584. METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE And US Provisional Patent Application No. 60 / 442,383, filed Jan. 24, 2003, and incorporated herein by reference, entitled “Plate Fin Heat Optimized for CPU Cooling” "OPTIMIZED PLATE FIN HEAT EXCHANGER FOR CPU COOLING" and pending US Provisional Patent Application No. 60 / 455,729, filed Mar. 17, 2003, incorporated herein by reference. This is a continuation-in-part of “Microchannel Heat Exchanger APPARATUS WITH POROUS CONFIGURATION AND METHOD OF MANUFACTURING THEREOF”.

  The present invention relates generally to a method and apparatus for cooling a heat generating device, and more particularly to the efficiency of cooling a desired hot spot in an electronic device while minimizing the pressure drop in the heat exchanger. The present invention relates to a method and apparatus for vertical fluid delivery.

  Microchannel heat sinks have been used in industry since their appearance in the early 1980s, showing applicability to high heat flux cooling applications. However, existing microchannels use conventional parallel channel arrangements, which are not suitable for cooling exothermic devices where the thermal load varies spatially. Such a heat generating device has a region that generates more heat than other regions. In the present specification, such a hotter region is referred to as a “hot spot”, and a region that generates less heat than the hot spot is referred to as a “warm spot”.

  1A and 1B show a side view and a plan view of a conventional heat exchanger 10, respectively. The heat exchanger 10 is connected to an electronic device 99 such as a microprocessor via a thermal interface material 98. As shown in FIGS. 1A and 1B, fluid typically flows from a single inlet port 12 as indicated by the arrows, flows along parallel microchannels 14 along the bottom surface 11, and flows out of the outlet port 16. The heat exchanger 10 cools the electronic device 99 but the fluid flows uniformly from the inlet port 12 to the outlet port 16. In other words, the fluid flows substantially uniformly along the entire bottom surface 11 of the heat exchanger 10 and no more fluid is supplied to the area of the bottom surface 11 corresponding to the hot spots of the device 99. . Furthermore, the temperature of the liquid flowing from the inlet port 12 generally increases as it flows along the bottom surface 11 of the heat exchanger 10. Thus, the downstream side of the heat source, which is the electronic device 99, i.e., the region near the outlet port 16, is not supplied with cold fluid, and in fact there is a warmer or two-phase fluid heated on the upstream side. Supplied. In this way, the heated fluid transports heat across the entire bottom surface 11 of the heat exchanger 10 and the area of the heat source, which is the electronic device 99, near the outlet port 16, the fluid becomes very hot, The effect of cooling the heat source which is the electronic device 99 is lost. As the temperature rises, the fluid flowing on the bottom surface 11 boils, resulting in a two-phase flow instability where the fluid leaves the region where the most heat is generated. Furthermore, in the heat exchanger 10 having only one inlet port 12 and one outlet, the fluid travels along the long parallel microchannel 14 of the bottom surface 11 over the entire length of the heat exchanger 10. The result is a large pressure drop due to the length of fluid travel. When a large pressure drop occurs in the heat exchanger 10, it is difficult to pump the fluid into the heat exchanger 10, and the operation tends to become unstable.

  FIG. 1C is a side view of a conventional multilevel heat exchanger 20. The fluid flows into the multi-level heat exchanger 20 through the port 22, travels downward through the plurality of jets 28 in the intermediate layer 26, and is discharged from the bottom surface 27 and the discharge port 24. Furthermore, the fluid that moves to the bottom surface 27 along the spout 28 does not flow uniformly. Furthermore, the multi-level heat exchanger 20 shown in FIG. 1C has the same problem as described with respect to the heat exchanger 10 of FIGS. 1A and 1B.

  An object of the present invention is to provide a heat exchanger that can reduce a pressure drop between an inlet port and an outlet port. Furthermore, it is an object of the present invention to provide a microchannel heat exchanger configured to achieve adequate temperature uniformity in the heat source. Furthermore, an object of the present invention is to provide a heat exchanger that realizes appropriate temperature uniformity from the viewpoint of a hot spot of a heat source.

The heat exchanger according to the present invention has a thickness of 0.3 mm to 1.0 mm, is in contact with the heat source, and is connected to the contact layer that cools the heat source by flowing a fluid, and is connected to the contact layer. And a manifold layer having a first set of individualized flow paths for flowing fluid, the first set of individual flow paths being arranged to minimize the pressure drop in the heat exchanger. The manifold layer may comprise a second set of individualized channels that receive fluid from the contact layer. The manifold layer includes a first port that supplies fluid to a first set of individualized flow paths and a second port that removes fluid from the second set of individualized flow paths. Also good. The first set of channels may be configured to provide the shortest channel distance along the contact layer to cool a predetermined region of the heat source to a desired temperature. The first and second sets of flow paths are configured to provide the shortest flow path distance between the first and second ports to cool a predetermined region of the heat source to a desired temperature. May be. The fluid may be in a single phase flow state. At least a portion of the fluid may be in a two-phase flow state. At least a portion of the fluid may transition between a single laminar flow state and a two-phase flow state in the contact layer. The manifold layer includes a circulation level having first and second flow paths therein, the circulation level being coupled to the contact layer and contacting the contact layer via the first and second sets of flow paths. You may comprise so that a fluid may flow independently from a layer. A cylindrical protrusion is connected to each flow path in the first set, and each cylindrical protrusion may extend from the circulation level to a predetermined height. The manifold layer is coupled to the first level and configured to flow fluid between the first set of the first port and the flow path, and the second level of the second port and the flow path. A second level configured to flow fluid between the set of fluids, wherein fluid flowing through the first level in the manifold layer is separated from fluid flowing through the second level. Also good. The first level comprises a first corridor connected to a first port and a first set of flow paths, and the fluid in the first corridor is flowing directly into the first set of flow paths. Also good. The second level comprises a second corridor connected to a second port and a second set of flow paths, and the fluid in the second set of flow paths is flowing directly to the second corridor. Also good. The first set of flow paths is thermally insulated from the second set of flow paths and heat transfer between the first set of flow paths and the second set of flow paths may not be performed. . The first set of channels and the second set of channels may be evenly disposed along at least one dimension. The first set of flow paths and the second set of flow paths may be non-uniformly disposed along at least one dimension. Each flow path of the first set may be disposed at the optimum shortest distance from each other. The first and second sets of flow paths may be arranged to cool at least one contact layer hot spot region in the heat source. At least one of the first flow paths flows through the plurality of first holes, and at least one of the plurality of first holes is substantially at least one of the at least one hole of the second set of flow paths. The first dimension may be substantially equal to the second dimension. At least one of the first flow paths flows through the plurality of first holes, and at least one of the plurality of first holes is substantially at least one of the at least one hole of the second set of flow paths. The first dimension may be different from the second dimension. The contact layer may be formed from a material having a thermal conductivity of at least 100 W / m-K. The contact layer may comprise a coating having a suitable thermal conductivity of at least 10 W / m-K. The contact layer may further include a plurality of pillars configured in a predetermined pattern along the contact layer. At least one of the plurality of pillars may have an area size in a range of (10 μm) ² or more and (100 μm) ² or less. At least one of the plurality of pillars may have a height dimension within a range of 50 μm to 2 mm. At least two of the plurality of pillars may be spaced apart from each other with a spacing dimension in the range of 10 μm to 150 μm. The plurality of pillars may comprise a coating having a suitable thermal conductivity of at least 10 W / m-K. At least one of the plurality of pillars may have at least one varying dimension along a predetermined direction. An appropriate number of pillars may be disposed in a predetermined area along the contact layer. At least a portion of the contact layer may have a roughened surface. The contact layer may comprise a coating having a suitable thermal conductivity of at least 10 W / m-K. The heat exchanger may further comprise a microporous structure disposed along the contact layer. The microporous structure may have a porosity in the range of 50 percent to 80 percent. The average pore size of the microporous structure may be in the range of 10 μm to 200 μm. The microporous structure may have a height dimension within a range of 0.25 mm or more and 2.00 mm or less. The microporous structure may comprise at least one hole having various dimensions along a predetermined direction. A plurality of microchannels arranged in a predetermined configuration may be further provided along the contact layer. At least one of the plurality of microchannels may have an area dimension within a range of (10 μm) ² or more and (100 μm) ² or less. At least one of the plurality of microchannels may have a height dimension in the range of 50 μm to 2 mm. At least two of the plurality of microchannels may be spaced apart from each other with a spacing dimension in the range of 10 μm to 150 μm. At least one of the plurality of microchannels may have a width dimension in the range of 10 μm to 100 μm. The plurality of microchannels may comprise a coating having a thermal conductivity of at least 10 W / m-K. The contact layer may be connected to a heat source. The contact layer may be formed integrally with the heat source. The heat source may be an integrated circuit. The heat exchanger may have an overhanging dimension within a range of 0 mm or more and 15 mm or less.

The heat exchanger according to the present invention is a heat exchanger configured to cool the heat source, has a thickness of 0.3 mm to 1.0 mm, and is configured to contact the heat source and allow fluid to flow. A contact layer and a manifold layer coupled to the contact layer, wherein the manifold layer is configured to flow fluid through the contact layer and is arranged in a plurality of sub- strates arranged to achieve an optimum fluid travel distance between each other. A first level having a generally vertical inlet flow path and a second level having at least one outlet flow path for removing fluid from the contact layer. The first level may comprise at least one first port configured to flow fluid through the inlet flow path. The second level comprises at least one second port configured to flow fluid from at least one outlet flow path, wherein the second level fluid is separated from the fluid by the first level. May flow. The second level has a plurality of substantially vertical outlet channels that remove fluid from the contact layer, and the plurality of inlets and outlet channels are arranged to achieve an optimal fluid travel distance between each other. May be. The manifold layer is connected to the contact layer, extends vertically inside, and has a plurality of first apertures that flow fluid to the contact layer along the inlet channel, and extends vertically inside, and contacts the layer along the outlet channel. A circulation level having a plurality of second apertures for receiving fluid from the fluid. The first level may comprise an inlet fluid corridor that allows fluid to flow horizontally from the first port to the first aperture. The second level may comprise an outlet fluid corridor that causes fluid to flow horizontally from the second aperture to the second port. The first and second apertures may be evenly disposed along at least one dimension. The first and second apertures may be non-uniformly disposed along at least one dimension. The inlet channel and the at least one outlet channel may be sealed together in the manifold layer. The contact layer may be connected to a heat source. The contact layer may be formed integrally with the heat source. The heat source may be an integrated circuit. The first and second apertures may be configured to cool at least one contact layer hot spot region of the heat source. At least one of the first apertures may have an inlet dimension that is substantially equal to at least one outlet dimension of the plurality of second apertures. At least one of the first apertures may have an inlet dimension that is different from at least one outlet dimension of the plurality of second apertures. The contact layer may be formed from a material having a thermal conductivity of at least 100 W / m-K. The contact layer may comprise a coating that provides a suitable thermal conductivity of at least 10 W / m-K. The contact layer may further include a plurality of pillars configured in a predetermined pattern along the contact layer. At least one of the plurality of pillars may have an area size in a range of (10 μm) ² or more and (100 μm) ² or less. At least one of the plurality of pillars may have a height dimension within a range of 50 μm to 2 mm. At least two of the plurality of pillars may be spaced apart from each other with a spacing dimension in the range of 10 μm to 150 μm. The plurality of pillars may comprise a coating having a suitable thermal conductivity of at least 10 W / m-K. At least one of the plurality of pillars may have at least one varying dimension along a predetermined direction. An appropriate number of pillars may be disposed in a predetermined area along the contact layer. At least a portion of the contact layer may have a roughened surface. The contact layer may comprise a coating having a suitable thermal conductivity of at least 10 W / m-K. You may further provide the microporous structure arrange | positioned along the contact layer. The microporous structure may have a height dimension within a range of 0.25 mm or more and 2.00 mm or less. The microporous structure may comprise at least one hole having various dimensions along a predetermined direction. The average pore size of the microporous structure may be in the range of 10 μm to 200 μm. At least one region of the microporous structure may have a porosity of 50% or more and 80% or less. The contact layer may comprise a plurality of microchannels arranged in a suitable pattern. At least one of the plurality of microchannels may have an area dimension within a range of (10 μm) ² or more and (100 μm) ² or less. At least one of the plurality of microchannels may have a height dimension in the range of 50 μm to 2 mm. At least two of the plurality of microchannels may be spaced apart from each other with a spacing dimension in the range of 10 μm to 150 μm. At least one of the plurality of microchannels may have a width dimension in the range of 10 μm to 100 μm. The plurality of microchannels may comprise a coating having a thermal conductivity of at least 10 W / m-K. You may have an overhanging dimension within the range of 0 mm or more and 15 mm or less. The heat exchanger may further include a plurality of cylindrical protrusions extending from the circulation level to an appropriate height and connected to the first aperture.

  The electronic device according to the present invention is an electronic device that generates heat, and has an integrated circuit and a thickness of 0.3 mm to 1.0 mm, and is formed integrally with the integrated circuit so that a fluid can flow therethrough. A contact layer configured to cool the heat generated by the electronic device, at least one inlet channel for supplying fluid to the contact layer, and at least one outlet channel for removing fluid from the contact layer, and at least one One inlet flow path and at least one outlet flow path are disposed at an interval that moves the fluid at an optimum shortest distance, and includes a manifold layer that circulates the fluid in the contact layer.

  The circulation system according to the present invention is a circulation system that cools at least one integrated circuit, has a thickness of 0.3 mm to 1.0 mm, is configured to flow a fluid, and contacts the integrated circuit. A contact layer, at least one inlet channel for supplying fluid to the contact layer, and at least one outlet channel for removing fluid from the contact layer, wherein the at least one inlet channel and at least one outlet channel are At least one heat exchanger that is disposed at an interval to move the fluid at an optimum shortest distance and that is coupled to the contact layer and that absorbs heat generated by the integrated circuit; At least one pump connected to one heat exchanger and circulating the fluid through the circulation system, and connected to the pump and the heat exchanger, from the heat exchanger The heated liquid was issued and a heat rejector for cooling.

  Other features and advantages of the present invention will become apparent from the following detailed description of preferred embodiments.

  The heat exchanger generally captures thermal energy generated from the heat source, preferably by passing the fluid through selective areas of the contact layer that are coupled to the heat source. Specifically, the fluid is identified in the contact layer to cool the hot spot and the area around the hot spot to achieve temperature uniformity across the heat source while keeping the pressure drop in the heat exchanger small. Shed in the area. As described in the various embodiments described below, the heat exchanger is selected for the contact layer using a plurality of apertures, channels and / or fingers in the manifold layer and using conduits in the intermediate layer. Fluid is circulated and circulated to and from the hot spot area. Alternatively, heat exchangers are specially placed in place to cool the heat source effectively by allowing fluid to flow directly into and out of the hot spot. You may have the port of.

  Here, a microchannel heat exchanger for cooling the hot spot position of the device will be described, but alternatively, the heat exchanger of the present invention may be used to heat the cold spot position of the device. This will be apparent to those skilled in the art. Furthermore, although the present invention is described as a microchannel heat exchanger, the present invention is not limited to this description and can be used for other applications.

  FIG. 2A shows a schematic of a circulating cooling device 30 comprising a suitable fluidly sealed microchannel heat exchanger 100 that is hermetically sealed in accordance with the present invention. Furthermore, FIG. 2B shows a schematic of a circulating cooling device 30 comprising another flexible fluid transport microchannel heat exchanger 100 having a plurality of fluid ports 108, 109 according to the present invention. Note that the system is not limited to the fluid transport microchannel heat exchanger 100 shown here, and may include other heat exchanger embodiments.

  As shown in FIG. 2A, fluid ports 108, 109 are connected to fluid line 38, which is connected to pump 32 and thermal condenser 36. The pump 32 pumps and circulates fluid in the circulation type cooling device 30. In one embodiment, one fluid port 108 is used to supply fluid to the fluid transport microchannel heat exchanger 100. In addition, one fluid port 109 is used to drain fluid from the fluid transport microchannel heat exchanger 100. In one embodiment, a uniform and constant flow of fluid flows into and out of the fluid transport microchannel heat exchanger 100 via each fluid port 108, 109. . Alternatively, fluids having different flow rates may flow into the fluid transport microchannel heat exchanger 100 and be discharged from the fluid transport microchannel heat exchanger 100 via the fluid ports 108 and 109 at a predetermined time. Good. Alternatively, as shown in FIG. 2B, a single pump may provide fluid to inlet ports, which are a plurality of designated fluid ports 108. Alternatively, multiple pumps (not shown) may provide fluid to their corresponding fluid ports 108, 109. Further alternatively, in this system, a suitable or alternative heat exchange using the dynamic sensing and control module 34 depending on the change in the amount of heat at various hot spots or hot spot locations and the location of the hot spots. The flow rate of fluid entering and exiting the vessel may be dynamically varied and controlled.

  FIG. 3B is an exploded view of a three layer heat exchanger, which is a preferred fluid transport microchannel heat exchanger 100 with a preferred manifold layer according to the present invention. The three-layer heat exchanger, which is a fluid transport microchannel heat exchanger 100 shown as an embodiment in FIG. 3B, comprises a contact layer 102, at least one intermediate layer 104, and at least one manifold layer 106. Alternatively, as described below, the fluid transport microchannel heat exchanger 100 may be a two-layer device that includes a contact layer 102 and a manifold layer 106. As shown in FIGS. 2A and 2B, the fluid transport microchannel heat exchanger 100 includes a heat source that is an electronic device 99, for example, but not limited to, an electronic device such as a microchip or an integrated circuit. A thermal interface material 98 is preferably sandwiched between the coupled heat source, which is the electronic device 99, and the fluid transport microchannel heat exchanger 100. Alternatively, the fluid transport microchannel heat exchanger 100 may be directly coupled to the surface of the heat source, which is the electronic device 99. Alternatively, the fluid transport microchannel heat exchanger 100 is integrally formed with the heat source that is the electronic device 99, that is, the fluid transport microchannel heat exchanger 100 and the heat source that is the electronic device 99 are used as one component. It will be apparent to those skilled in the art that it may be formed. In this case, the contact layer 102 is provided integrally with a heat source that is the electronic device 99 and is formed so as to be included in the same component as the heat source that is the electronic device 99.

  Preferably, the fluid transport microchannel heat exchanger 100 according to the present invention is configured to contact directly or indirectly a heat source, which is a rectangular electronic device 99, as shown. However, it will be apparent to those skilled in the art that the fluid transport microchannel heat exchanger 100 may have any other shape depending on the shape of the heat source that is the electronic device 99. For example, a heat exchanger according to the present invention may be configured to have a semicircular shape, whereby a heat exchanger (not shown) can be configured with a corresponding semicircular heat source (not shown). ) Directly or indirectly. Furthermore, the fluid transport microchannel heat exchanger 100 preferably has dimensions slightly larger than the heat source in the range of 0.5 mm to 5.0 mm.

  FIG. 3A is a plan view of a preferred manifold layer 106 in accordance with the present invention. Specifically, the manifold layer 106 includes four side surfaces in addition to the top surface 130 and the bottom surface 132, as shown in FIG. 3B. However, in FIG. 3A, the upper surface 130 is removed to appropriately represent and explain the function of the manifold layer 106. As shown in FIG. 3A, the manifold layer 106 includes a series of channels or channels 116, 118, 120, 122 and fluid ports 108, 109 formed in these channels. As shown in FIG. 3B, the fingers 118, 120 extend completely through the body of the manifold layer 106 in the Z-direction. Alternatively, as shown in FIG. 3A, the fingers 118, 120 may be formed in part of the manifold layer 106, extend in the Z-direction, and have apertures. Further, the channels 116 and 122 may be formed so as to extend to a part of the manifold layer 106. The remaining region 107 between the inlet and outlet channels corresponding to the channels 116, 122 extends from the top surface 130 to the bottom surface 132 and constitutes the body of the manifold layer 106.

  As shown in FIG. 3A, fluid enters the manifold layer 106 through the inlet port, which is the fluid port 108, flows along the inlet channel corresponding to the channel 116, and is shown in the X and Y directions from the channel 116. Flows into a number of fingers 118 that branch in the direction of, thereby supplying fluid to selected areas of the contact layer 102. The fingers 118 are formed in different predetermined directions and provide fluid to the location of the contact layer 102 corresponding to the hot spot of the heat source and the area in the vicinity thereof. These locations of the contact layer 102 are hereinafter referred to as contact hot spot regions. The fingers are configured to cool the stationary contact layer hot spot area and also to cool the temporally converting contact layer hot spot area. As shown in FIG. 3A, the channels 116, 122 and fingers 118, 120 are disposed in the manifold layer 106 in the X and Y directions. Forming channels 116, 122 and fingers 118, 120 in various directions in this way transports fluid, cools hot spots of heat sources that are electronic devices 99, and / or fluid transport microchannel heat exchangers. The pressure drop within 100 can be minimized. Alternatively, as shown in the specific examples of FIGS. 4 and 5, the channels 116 and 122 and the fingers 118 and 120 may be arranged in the manifold layer 106 at regular intervals to form a predetermined pattern.

  The configuration and dimensions of the fingers 118, 120 are determined according to the hot spot of the heat source, which is the electronic device 99 that needs to be cooled. Manifold layer 106 is configured such that fingers 118 and 120 are located on or near the contact layer hot spot area in contact layer 102 based on the location of the hot spots and the amount of heat generated at or near each hot spot. The Manifold layer 106 allows single-phase fluid and / or two-phase fluid to contact layer 102 without causing a substantial pressure drop in fluid transport microchannel heat exchanger 100 and circulating cooling device 30 (FIG. 2A). Circulate. By transporting the fluid to the contact layer hot spot region, the temperature of the contact layer hot spot region is uniform, as is the region of the heat source adjacent to the contact layer hot spot region.

  The number and size of the channels 116 and fingers 118 are determined based on a number of factors. In one embodiment, the inlet and outlet fingers corresponding to fingers 118, 120 have the same width dimension. Alternatively, the inlet and outlet fingers corresponding to the fingers 118, 120 may have different width dimensions. The width dimension of the fingers 118 and 120 is preferably in the range of 0.25 mm to 0.50 mm. In one embodiment, the inlet and outlet fingers corresponding to fingers 118, 120 have the same length and depth dimensions. Alternatively, the inlet and outlet fingers corresponding to fingers 118, 120 may have different length and depth dimensions. In other embodiments, the inlet and outlet fingers corresponding to the fingers 118, 120 may have various width dimensions along the length of the fingers. The length dimensions of the inlet and outlet fingers corresponding to the fingers 118 and 120 are preferably 0.5 mm or more and within three times the length of the heat source. Further, the fingers 118 and 120 are preferably formed to have a height or depth dimension within a range of 0.25 mm to 0.50 mm. Furthermore, less than 10 or more than 30 fingers per cm are disposed in the manifold layer 106. However, it will be apparent to those skilled in the art that 10-30 fingers per cm may be provided in the manifold layer.

  In the present invention, the fingers 118 and 120 and the channels 116 and 122 may be irregularly formed in order to optimize the cooling efficiency of the hot spot of the heat source. In order to achieve a uniform temperature across the heat source, which is the electronic device 99, the spatial distribution of heat transport to the fluid may be matched to the spatial distribution of heat generation. As the fluid flows through the microchannel along the contact layer, the temperature increases and begins to change to vapor under two-phase conditions. Thus, the fluid expands significantly, resulting in a significantly faster flow rate. The efficiency of heat transport from the contact layer to the fluid usually improves as the fluid flow rate increases. Therefore, by adjusting the dimensions of the cross-sections of the fingers 118, 120 and the channels 116, 122 for inflow and outflow of fluid in the heat exchanger 100, the efficiency of heat transport to the fluid can be adjusted.

  For example, a particular finger may be designed for a heat source that generates higher heat near the inlet. In addition, for areas where liquid and vapor mixing is expected, it may be advantageous to increase the cross-section of fingers 118, 120 and channels 116, 122. Although not shown in the figure, the flow velocity of the fluid can be increased by reducing the cross section of the finger on the inlet side. It is also possible to slow the fluid flow rate by increasing the cross-section of a particular finger or channel on the downstream outlet side. By designing the fingers or channels in this way, the pressure drop is minimized in the heat exchanger in the region where the fluid volume, acceleration and velocity increase due to the liquid-to-vapor change in two-phase flow. And hot spot cooling efficiency can be optimized.

  In addition, fluids at different desired locations within the fluid transport microchannel heat exchanger 100 can be obtained by temporarily widening and subsequently again narrowing the fingers 118, 120 and channels 116, 122 along their length. The flow rate of can be increased. Instead, the heat and transport efficiency is adjusted according to the expected heat dissipation distribution across the heat source, which is the electronic device 99, by changing the finger and channel dimensions from large to small and from small to large many times. Sometimes it is appropriate. Note that the description regarding the change in the dimensions of the fingers and the channel is not limited to this embodiment, and can be similarly applied to other embodiments described later.

  Alternatively, as shown in FIG. 3A, the manifold layer 106 may include one or more apertures 119 in the inlet fingers corresponding to the fingers 118. In the three-layer heat exchanger that is the fluid transport microchannel heat exchanger 100, the fluid flowing along the finger 118 flows into the intermediate layer 104 through the aperture 119. Alternatively, in a two-layer heat exchanger that is a fluid transport microchannel heat exchanger 100, the fluid flowing along the finger 118 flows directly from the aperture 119 into the contact layer 102. Further, as shown in FIG. 3A, the manifold layer 106 includes an aperture 121 in the outlet finger 120. In the fluid transport microchannel heat exchanger 100, the fluid flowing out of the intermediate layer 104 flows into the outlet finger 120 through the aperture 121. Instead, in the two-layer heat exchanger that is the fluid transport microchannel heat exchanger 100, the fluid flowing out from the contact layer 102 flows directly into the outlet finger 120 through the aperture 121.

  In a variation, the inlet and outlet fingers corresponding to fingers 118, 120 are open channels that do not have apertures. The bottom surface 103 of the manifold layer 106 contacts the upper surface of the intermediate layer 104 in the three-layer heat exchanger that is the fluid transport microchannel heat exchanger 100, and contacts the contact layer 102 in the two-layer heat exchanger. In this way, in the three-layer heat exchanger that is the fluid transport microchannel heat exchanger 100, the fluid can freely move between the intermediate layer 104 and the manifold layer 106. Fluid is flowed through the conduit 105 of the intermediate layer 104 to properly enter and exit the appropriate contact layer hot spot area. As will be apparent to those skilled in the art, conduit 105 may be arranged to align directly with the fingers, as described below, or elsewhere in the three-layer system.

  FIG. 3B shows a three-layer heat exchanger, which is a fluid transport microchannel heat exchanger 100 having a manifold layer shown as a modification, but instead, the fluid transport microchannel heat exchanger 100 is a manifold. It may have a two-layer structure consisting of the layer 106 and the contact layer 102, in which case the fluid goes directly between the manifold layer 106 and the contact layer 102 without going through the intermediate layer 104. It will be apparent to those skilled in the art that the manifold layer, intermediate layer, and contact layer configurations shown herein are exemplary and that the actual configuration is not limited to the configurations shown herein.

  As shown in FIG. 3B, the intermediate layer 104 preferably comprises a plurality of conduits 105 extending through the intermediate layer 104 itself. An inflow conduit, which is a conduit 105, allows fluid to flow from the manifold layer 106 to a designated contact layer hot spot area of the contact layer 102. Similarly, the aperture in conduit 105 allows fluid to flow from contact layer 102 to fluid port 109. In this way, the intermediate layer 104 provides fluid transport from the contact layer 102 to the fluid port 109 coupled to the manifold layer 106.

  The conduit 105 is disposed in the intermediate layer 104 in a predetermined pattern based on a number of factors. These factors include, but are not limited to, the position of the contact layer hot spot region, the flow rate necessary for appropriately cooling the heat source that is the electronic device 99 in the contact layer hot spot region, and the temperature of the fluid. Etc. The width dimension of other portions is designed to be several mm at the maximum, but the conduit 105 preferably has a width dimension of about several hundred μm. However, the conduit 105 may be formed in other dimensions based at least on the factors described above. It will be apparent to those skilled in the art that each conduit 105 of the intermediate layer 104 has the same shape and / or dimensions, but this condition is not necessary. For example, as with the fingers described above, the conduit may have varying length and / or width dimensions instead of this embodiment. Alternatively, the conduit 105 may have a constant depth or height dimension through the intermediate layer 104. Alternatively, the conduit 105 may have different depth dimensions, for example, a trapezoidal or nozzle-shaped shape in the thickness direction of the intermediate layer 104. The horizontal shape of the conduit 105 is shown as a rectangle in FIG. 2C, but the horizontal shape of the conduit 105 can be any other shape, such as a circle (FIG. 3A), a curved shape, an ellipse, or the like. There may be. Instead of this, the one or more conduits 105 may be formed into a shape corresponding to a part or the whole shape of the upper one or more fingers.

  The intermediate layer 104 is preferably positioned horizontally within the fluid transport microchannel heat exchanger 100 such that the conduit 105 is vertical. Alternatively, the intermediate layer 104 may be arranged in any other direction within the fluid transport microchannel heat exchanger 100, such as, but not limited to, slanting or curving. Alternatively, the conduit 105 may be disposed horizontally, diagonally, curved, or in any other direction within the intermediate layer 104. Further, the intermediate layer 104 preferably extends horizontally along the entire length of the fluid transport microchannel heat exchanger 100, and the intermediate layer 104 completely separates the contact layer 102 from the manifold layer 106, thereby allowing fluid to flow. It may be forced to flow through the conduit 105. Alternatively, a portion of the fluid transport microchannel heat exchanger 100 does not include an intermediate layer 104 between the manifold layer 106 and the contact layer 102, thereby allowing fluid to flow between the manifold layer 106 and the contact layer 102. You may make it go freely. Further alternatively, the intermediate layer 104 may extend vertically between the manifold layer 106 and the contact layer 102 to form an independent, individual intermediate layer region. Alternatively, the intermediate layer 104 may not extend completely from the manifold layer 106 to the contact layer 102.

  FIG. 10A is a perspective view of a preferred embodiment of a contact layer 302 in accordance with the present invention. As shown in FIG. 10A, the contact layer 302 includes a series of pillars 303 extending upward from the bottom surface 301 of the contact layer 302. Further, FIG. 10A shows a microporous structure that is a bottom surface 301 provided on the bottom surface of the contact layer 302. Note that the contact layer 302 may include only the microporous structure that is the bottom surface 301, and may include any other contact layer structure (for example, a microchannel, a pillar, or the like) together with the microporous structure. It is clear.

  The preferred contact layer 302 comprises pillars 303 rather than microchannels for fluid flow from the inlet aperture to the surrounding outlet aperture in the preferred manifold layer 302 '(FIG. 12A). As will be described in more detail later, the fluid travels through the series of inlet apertures to the contact layer 302 and through a series of outlet apertures that are spaced an optimum distance from the inlet aperture. It is discharged from the contact layer 302. In other words, fluid flows from each inlet aperture toward the nearest outlet aperture. Preferably, each inlet aperture is surrounded by an outlet aperture. In this way, the fluid entering the contact layer 302 flows in a direction toward the surrounding outlet aperture. Thus, the contact layer 302 is preferably provided with pillars 303 to transport sufficient heat to the fluid and to minimize the pressure drop of the fluid as it flows from the inlet aperture to the outlet aperture.

  Contact layer 302 preferably comprises a dense array of high and narrow pillars 303 extending perpendicularly from bottom surface 301 and contacting the bottom surface of the manifold layer. Instead of this, the pillar 303 may not be in contact with the bottom surface of the manifold layer. Further, at least one of the pillars 303 may extend at a predetermined angle with respect to the bottom surface 301 of the contact layer 302. Further, the pillars 303 are preferably arranged at equal distances from each other along the contact layer 302, thereby making the heat transport capability of the contact layer 302 constant over the bottom surface 301. Alternatively, the pillars 303 may be arranged at unequal intervals. For example, in the specific example shown in FIG. Has been. The distance between the pillars 303 is determined based on the size of the heat source that is the electronic device 99, the resistance to the fluid, the size and position of the hot spot, the heat flux density from the heat source that is the electronic device 99, and the like. For example, decreasing the density of the pillar 303 decreases the fluid resistance, but decreases the surface area for heat transport from the contact layer 302 to the fluid. Note that the configuration of the pillars 303 arranged at non-uniform intervals is not limited to the embodiment of FIG. 10B, and other configurations are possible depending on the conditions regarding the heat source and the required operation of the circulating cooling device 30 (FIG. 2A). Any configuration is possible.

  Furthermore, the pillar 303 is preferably formed in a cylindrical shape, as shown in FIG. 10A, so that fluid flows from the inlet aperture to the outlet aperture with minimal resistance. However, the pillar 303 has, but is not limited to, a square 303B (FIG. 10B), a diamond shape, an ellipse 303C (FIG. 10C), a hexagon 303D (FIG. 10D), or any other shape. May be. Further, the contact layer 302 may comprise a combination of different shaped pillars along the bottom surface 301.

  For example, as shown in FIG. 10E, the contact layer 302 may include several sets of rectangular fins 303E, and the rectangular fins 303E in each set may be arranged radially with respect to one another. Further, the contact layer 302 may include a plurality of squares 303B disposed between a set of rectangular fins 303E. In one embodiment, an open circular area in a radially configured rectangular fin 303E may be placed under each inlet aperture, and the short fins 303E may help direct fluid to the outlet aperture. . Thus, the radially configured short fins 303E contribute to minimizing the pressure drop in the contact layer 302 while realizing a substantially uniform supply of the cooling fluid. Depending on the size and relative position of the inlet and outlet apertures, the pillar and / or fin configuration can be variously selected, and depending on whether the fluid is a single phase flow or a two phase flow, the contact layer 302 The most suitable configuration can be selected. It will be apparent to those skilled in the art that any of the embodiments described herein and variations thereof can be combined with various pillar 303 configurations.

  Preferably, the fluid transport microchannel heat exchanger 100 according to the present invention has a larger width than the heat source that is the electronic device 99. If the fluid transport microchannel heat exchanger 100 is larger than the heat source that is the electronic device 99, there is an overhang dimension. The overhang dimension is the furthest distance between one outer wall of the heat source that is the electronic device 99 and the fluid channel wall inside the fluid transport microchannel heat exchanger 100, such as, for example, the inner wall of the inlet port 316 (FIG. 12A). Distance. In a preferred embodiment, the overhang dimension is 0-5 mm for single phase flow and 0-15 mm for two phase flow. Furthermore, the thickness dimension of the contact layer 102 of the present invention is preferably 0.3 to 0.7 mm for a single-phase flow and 0.3 to 1.0 mm for a two-phase flow.

  The fluid transport microchannel heat exchanger 100 in the embodiment of the present invention uses a microporous structure that is a bottom surface 301 provided on a contact layer 302. The microporous structure which is the bottom surface 301 has an average pore size within a range of 10 to 200 μm in both a single laminar flow and a two-phase flow. Furthermore, it is desirable that the porosity of the microporous structure 136 be in the range of 50 to 80 percent in both the single laminar flow and the two-phase flow. It is desirable that the height of the microporous structure 136 be in the range of 0.25 to 2.00 mm in both the single-layer flow and the two-phase flow.

In embodiments using pillars and / or microchannels along the contact layer 302, the contact layer 102 according to the present invention has a thickness dimension in the range of 0.3 to 0.7 mm for single phase flow. In the case of a two-phase flow, it has a thickness dimension in the range of 0.3 to 1.0 mm. Furthermore, in the case of single-phase flow, in the case of two-phase flow, each pillar or microchannel has an area in the range of 10μm ² ~100μm ^2. Furthermore, the separation dimension between each pillar and / or is in the range of 10 to 100 μm in both the single-phase flow and the two-phase flow. The width dimension of the microchannel is set to be within a range of 10 to 100 μm in both a single-layer flow and a two-phase flow. The height dimension of the microchannel and / or pillar is in the range of 50 to 800 μm in the case of a single-phase flow, and in the range of 50 μm to 2 mm in the case of a two-phase flow. However, it will be apparent to those skilled in the art that dimensions other than those described above may be used.

  FIG. 3B shows a perspective view of a variation of the contact layer 102 according to the present invention. As shown in FIG. 3B, the contact layer 102 includes a bottom surface 103 and preferably a plurality of microchannel walls 110, and the region between the microchannel walls 110 allows fluid to flow along the fluid flow path. Or distribute. The bottom surface 103 is flat and has a high thermal conductivity that realizes sufficient heat transport from the heat source that is the electronic device 99. Alternatively, the bottom surface 103 may comprise troughs and / or crests designed to collect fluid at a particular location or to retreat fluid from a particular location. The microchannel walls 110 are formed in parallel, as shown in FIG. 3B, so that fluid flows between the microchannel walls 110 along the flow path.

  Alternatively, it will be apparent to those skilled in the art that the microchannel wall 110 may be configured in any other suitable configuration based on the factors described above. For example, as shown in FIG. 8C, the contact layer 102 may have grooves between sections of the microchannel wall 110. Further, the microchannel wall 110 may have dimensions to minimize the pressure drop or pressure differential within the contact layer 102. Also, although not limited to the following, other structures other than the microchannel wall 110 may be used, such as a rough surface, for example, a microporous structure such as sintered metal and silicon foam. it is obvious. However, here, the contact layer 102 in the present invention will be described using the parallel microchannel walls 110 shown in FIG. 3B as an example. Alternatively, the microchannel wall 110 may have a non-parallel configuration.

  Through the microchannel wall 110, the fluid exchanges heat along a selected hot spot location in the contact layer hot spot region and cools the heat source, which is the electronic device 99, at that location. The microchannel wall 110 preferably has a width dimension in the range of 10 to 100 μm and a height dimension in the range of 50 μm to 2 mm, depending on the amount of heat of the heat source that is the electronic device 99. The microchannel wall 110 has a length dimension in the range of 100 μm to several cm, depending on the size of the heat source and the size of the hot spot and the heat flux density from the heat source. Alternatively, any other microchannel wall dimension may be used. The microchannel wall 110 is divided by an interval in the range of 50 to 500 μm according to the amount of heat of the heat source that is the electronic device 99, but this interval may be set to any other value.

  In FIG. 3B, the top surface of the manifold layer 106 is shown cut away to show the channels 116, 122 and fingers 118, 120 in the body of the manifold layer 106. Here, the position of the heat source that is the electronic device 99 that generates high heat is referred to as a hot spot, and the position of the heat source that is the electronic device 99 that generates heat lower than this is referred to as a warm spot. As shown in FIG. 3B, the heat source that is the electronic device 99 has a position A that is a hot spot region and a position B that is a warm spot region. The area of the contact layer 102 that contacts the hot spot and the warm spot is shown as the contact layer hot spot area. That is, as shown in FIG. 3B, the contact layer 102 includes a contact layer hot spot region A on the position A and a contact layer hot spot region B on the position B.

  As shown in FIGS. 3A and 3B, the fluid first flows into the fluid transport microchannel heat exchanger 100, preferably through an inlet port, which is one fluid port. The fluid then preferably flows into the inlet channel corresponding to one channel 116. Alternatively, the fluid transport microchannel heat exchanger 100 may include inlet channels corresponding to two or more channels 116. As shown in FIGS. 3A and 3B, the fluid flowing along the inlet channel corresponding to the channel 116 from the inlet port which is the fluid port 108 first branches to the finger 118A. Further, fluid flowing along the remainder of the inlet channel corresponding to channel 116 is poured into individual fingers, such as finger 118B and finger 118C.

  In the example shown in FIG. 3B, the fluid is supplied to the contact layer hot spot region A by pouring the fluid into the finger 118A. That is, the fluid flows down to the intermediate layer 104 through the fingers 118A. The fluid flows into the contact layer 102 via the inlet conduit 105A disposed under the finger 118A, and exchanges heat with the heat source that is the electronic device 99. As described above, the microchannels of the contact layer 102 may be arranged in any direction. For example, the microchannel 111 in the contact layer region A is disposed in a direction perpendicular to the other microchannel wall 110 of the contact layer 102. Thereby, the fluid from the inlet conduit 105A moves along the microchannel 111 as shown in FIG. 3B, and in other regions of the contact layer 102, the fluid moves in different directions. The heated fluid then flows up to the outlet finger 120A via the outlet conduit 105D.

  Similarly, fluid flows down to the intermediate layer 104 in the Z-direction via fingers 118E and 118F. The fluid then flows down to the contact layer 102 via the inlet conduit 105C in the Z-direction. The heated fluid then flows from the contact layer 102 through the outlet conduit 105D to the outlet fingers 120E, 120F in the Z-direction. The fluid transport microchannel heat exchanger 100 removes the fluid heated in the manifold layer 106 via the outlet fingers 120, which are connected to the outlet channels 122. Through the outlet channel 122, fluid is preferably discharged from the heat exchanger via an outlet port, which is one fluid port 109.

  Also preferably, the inflow and outflow conduits, which are conduits 105, are disposed directly or nearly directly over suitable contact layer hotspot regions to supply fluid directly to the hot spots of the heat source, which is the electronic device 99. Further, in order to minimize the pressure drop, each outlet finger 120 is disposed in the vicinity of the aperture 119 corresponding to a particular contact layer hot spot area. Thus, the fluid flows into the contact layer 102 via the inlet finger 118A and travels the shortest distance from the contact layer 102 to the outlet finger 120A along the bottom surface 103 of the contact layer 102. Obviously, the distance that the fluid travels along the bottom surface 103 properly removes heat from the heat source, which is the electronic device 99, without creating an unnecessary amount of pressure drop. Further, as shown in FIGS. 3A and 3B, in order to reduce the pressure drop of the fluid flowing along the finger 118, the corner portions in the fingers 118, 120 are preferably formed to be curved.

  As will be apparent to those skilled in the art, the configuration of manifold layer 106 shown in FIGS. 3A and 3B is merely exemplary. The configuration of the channels 116 and fingers 118 in the manifold layer 106 is not limited to the following, but includes the location of the contact layer hot spot region, the flow rate of fluid to and from the contact layer hot spot region. It depends on many factors such as the amount of heat generated by the heat source in the contact layer hot spot region. For example, as shown in FIGS. 4-7A and described below, one possible configuration for the manifold layer 106 is to combine parallel inlet and outlet fingers alternately along the width of the manifold layer. You may comprise in such a pattern (interdigitated pattern). However, the channel 116 and the finger 118 may be arranged in any other configuration.

  FIG. 4 is a perspective view of another manifold layer 406 of a heat exchanger according to the present invention. The manifold layer 406 of FIG. 4 includes a plurality of parallel fluid fingers 411, 412 that mate or mesh with each other, thereby creating a substantial pressure drop within the heat exchanger 400 and the circulating cooling device 30 (FIG. 2A). Instead, a single phase fluid and / or a two phase fluid can be circulated through the contact layer 402. As shown in FIG. 4, the inlet fingers corresponding to the fluid fingers 411 and the outlet fingers corresponding to the fluid fingers 412 are alternately arranged. However, it will be apparent to those skilled in the art that any number of inlet fingers or outlet fingers may be arranged adjacent to each other, and therefore the present invention is not limited to the alternating configuration shown in FIG. . In addition, the fingers may be arranged alternately such that parallel fingers diverge from other parallel fingers, or parallel fingers are connected to other parallel fingers. Accordingly, more inlet fingers may be provided than outlet fingers, and conversely, more outlet fingers may be provided than inlet fingers.

  The inlet finger corresponding to the fluid finger 411 supplies the fluid flowing into the heat exchanger to the contact layer 402, and the outlet finger corresponding to the fluid finger 412 extracts the fluid discharged from the heat exchanger 400 from the contact layer 402. . The configuration of the manifold layer 406 shown here allows fluid to flow into the contact layer 402, travel a very short distance in the contact layer 402, and then flow into the outlet fingers corresponding to the fluid fingers 412. By substantially reducing the length of fluid travel along the contact layer 402, the pressure drop in the heat exchanger 400 and the circulating cooling device 30 (FIG. 2A) can be substantially reduced.

  As shown in FIGS. 4 and 5, the manifold layer 406 shown as a modified example is connected to the inlet fingers corresponding to the two fluid fingers 411, and includes a flow path 414 for supplying fluid thereto. The manifold layer 406 shown in FIGS. 8 and 9 includes outlet fingers corresponding to the three fluid fingers 412 connected to the flow path 418. The flow path 414 of the manifold layer 406 has a flat bottom surface that allows fluid to flow through the fluid fingers 411, 412. Alternatively, a gentle slope may be provided in the flow path 414 to allow fluid to flow through the selected fluid finger 411. Alternatively, one or more apertures may be provided on the bottom surface of the inlet channel corresponding to the channel 414 in order to cause a part of the fluid to flow down to the contact layer 402. Similarly, manifold layer flow path 418 may have a flat bottom surface that contains fluid and allows fluid to flow to fluid port 408. Alternatively, a gentle slope may be provided in the flow path 418 to allow fluid to flow through the selected fluid port 408. Furthermore, in this specific example, the width of the flow paths 414 and 418 is about 2 mm. However, in other specific examples, any other width dimension may be used.

  The flow paths 414, 418 are connected to fluid ports 408, 409, which are connected to fluid lines 38 (FIG. 2A) of the circulating cooling device 30. The manifold layer 406 includes fluid ports 408 and 409 disposed in the horizontal direction. Alternatively, although not shown in FIGS. 4-7, the manifold layer 406 may include fluid ports 408, 409 configured vertically and / or diagonally, as described below. Instead of this, the manifold layer 406 may not include the flow path 414. In this case, fluid is supplied directly from the fluid port 408 to the fluid finger 411. Further alternatively, the fluid 411 may not include the flow path 418, in which case the fluid in the fluid finger 412 is discharged directly from the heat exchanger 400 via the fluid port 408. Here, the two fluid ports 408 are connected to the flow paths 414, 418, but instead, any other number of ports may be provided.

  The inlet fingers corresponding to the fluid fingers 411 have dimensions to allow fluid to move to the contact layer without creating a large pressure drop along the fluid fingers 411 and the circulating cooling device 30 (FIG. 2A). . The width dimension of the inlet finger corresponding to the fluid finger 411 is, for example, in the range of 0.25 mm or more and 5.00 mm or less. However, any other dimensions may be used. Furthermore, the length dimension of the inlet finger corresponding to the fluid finger 411 is preferably within a range of 0.5 mm or more and within three times the length dimension of the heat source. Alternatively, this length dimension may be any value. Further, as described above, the inlet finger corresponding to the fluid finger 411 extends downward toward the microchannel 410 or at a position slightly higher than the height of the microchannel 410 so that the fluid flows directly into the microchannel 410. Extend. The height dimension of the inlet finger corresponding to the fluid finger 411 is preferably in the range of 0.25 mm or more and 5.00 mm or less. It will be apparent to those skilled in the art that the fluid fingers 411 need not extend downwardly toward the microchannel 410 and may use any height dimension other than those shown here. Also, although the inlet fingers corresponding to the fluid fingers 411 here have the same dimensions, it will be apparent to those skilled in the art that the inlet fingers corresponding to the fluid fingers 411 may have different dimensions. It is. Further, alternatively, the inlet fingers corresponding to the fluid fingers 411 may vary in width, cross-sectional dimensions and / or distance between adjacent fingers. In particular, the fluid finger 411 may include a region having a wider width or deeper depth and a region having a narrower width or shallower depth along the longitudinal direction. By varying the dimensions in this way, more fluid is provided to a given contact layer hot spot region in the contact layer 402 through a wider portion, and the narrow portion provides a warm spot contact layer hot spot region. The flow rate can be limited.

  Further, the outlet fingers corresponding to the fluid fingers 412 have dimensions suitable for moving fluid to the contact layer without creating a large pressure drop along the circulating cooling device 30 (FIG. 2A) and the fluid fingers 412. Have. The outlet finger corresponding to the fluid finger 412 has a width dimension in the range of 0.25 mm or more and 5.00 mm or less, but any other width dimension may be used. Furthermore, the length dimension of the outlet fingers corresponding to the fluid fingers 412 may be formed within a range of 0.5 mm or more and within three times the length dimension of the heat source. Further, the outlet finger corresponding to the fluid finger 412 is lowered down to the height of the microchannel 410 so that after the fluid flows horizontally along the microchannel 410, it easily flows to the outlet finger corresponding to the fluid finger 412. It extends. The width dimension of the outlet finger corresponding to the fluid finger 412 is, for example, in the range of 0.25 mm to 5.00 mm. However, any other dimensions may be used. Also, although the outlet fingers corresponding to the fluid fingers 412 have the same dimensions here, it will be apparent to those skilled in the art that the outlet fingers corresponding to the fluid fingers 412 may have different dimensions. It is. Further alternatively, the outlet fingers corresponding to the fluid fingers 412 may have irregular shapes that vary in width, cross-sectional dimensions, and / or distance between adjacent fingers.

  As shown in FIGS. 4 and 5, the inlet and outlet fingers corresponding to the fluid fingers 411 and 412 are respectively segmented and separated from each other, so that the fluid in these flow paths does not mix. Specifically, as shown in FIG. 4, outlet fingers corresponding to two fluid fingers 412 are provided on the outer edge side of the manifold layer 406, and outlet fingers corresponding to one fluid finger 412 are provided on the manifold layer 406. It is provided in the center. Further, the two inlet fluid fingers 411 are provided adjacent to both sides of the outlet finger corresponding to the central fluid finger 412. With this particular configuration, fluid entering the contact layer 402 travels a short distance within the contact layer 402 before flowing out of the contact layer 402 via an outlet finger corresponding to the fluid finger 412. However, it will be apparent to those skilled in the art that the inlet and outlet channels may be arranged in any other suitable configuration, and thus are not limited to the configurations shown and described herein. The number of inlet and outlet fingers corresponding to the fluid fingers 411, 412 in the manifold layer 406 is preferably greater than 3 and desirably less than 10 per cm in the manifold layer 406. In addition, it is obvious to those skilled in the art that the number of the inlet channels and the outlet channels is not limited to the configuration shown and described here, and may be any other number.

  The manifold layer 406 is connected to an intermediate layer (not shown), and the intermediate layer (not shown) is connected to the contact layer 402, thereby forming a three-layer heat exchanger that is the heat exchanger 400. . This intermediate layer has been described in connection with the embodiment shown in FIG. 3B. Alternatively, as shown in FIG. 7A, the manifold layer 406 may be connected to the contact layer 402 and disposed on the contact layer 402 to form a two-layer heat exchanger that is the heat exchanger 400. . A cross section of a suitable manifold layer 406 coupled to the contact layer 402 of the two-layer heat exchanger is shown in FIGS. 6A-6C. Specifically, FIG. 6A is a cross-sectional view of heat exchanger 400 taken along line AA in FIG. 6B is a cross-sectional view of the heat exchanger 400 along line BB in FIG. 5, and FIG. 6 is a cross-sectional view of the heat exchanger 400 along line CC in FIG. As described above, the inlet and outlet fingers corresponding to the fluid fingers 411, 412 extend from the top surface of the manifold layer 406 to the bottom surface. When the manifold layer 406 and the contact layer 402 are coupled together, the inlet and outlet fingers corresponding to the fluid fingers 411, 412 have a height that is the same as or slightly higher than the height of the microchannel 410 of the contact layer 402. With this configuration, the fluid from the inlet finger corresponding to the fluid finger 411 easily flows out of the inlet finger corresponding to the fluid finger 411 via the microchannel 410. Further, this configuration allows fluid flowing through the microchannel 410 to easily flow up to the outlet fingers corresponding to the fluid fingers 412 after flowing through the microchannel 410.

  Although not shown in the figure, as an alternative, the intermediate layer 104 (FIG. 3B) may be disposed between the manifold layer 406 and the contact layer 402. The intermediate layer 104 (FIG. 3B) allows fluid to flow to designated contact layer hot spot areas in the contact layer 402. Further, the intermediate layer 104 (FIG. 3B) can be used to provide a uniform flow of fluid to the contact layer 402. In addition, the intermediate layer 104 can be used to provide fluid to the contact layer hot spot region of the contact layer 402, properly cool the hot spot, and make the temperature in the heat source that is the electronic device 99 uniform. The inlet and outlet fingers corresponding to the fluid fingers 411, 412 are not necessarily required, but are disposed on or near the hot spot of the heat source, which is the electronic device 99, in order to properly cool the hot spot.

  FIG. 7A is an exploded view of another manifold layer 406 with another contact layer 102 in accordance with the present invention. Contact layer 102 includes a continuous configuration of microchannel walls 110, as shown in FIG. 3B. In this configuration, generally speaking, as with the preferred manifold layer 106 shown in FIG. 3B, fluid flows into the manifold layer 406 via the fluid port 408 and travels through the flow path 414 to the fluid fingers 411. Head. The fluid flows into the opening of the inlet finger corresponding to the fluid finger 411 and flows along the length of the fluid finger 411 in the X-direction, as indicated by the arrows. Furthermore, the fluid flows down in the Z-direction to a contact layer 402 provided below the manifold layer 406. As shown in FIG. 7A, in the contact layer 402, the fluid flows along the bottom surface in the X and Y directions of the contact layer 402, and exchanges heat with the heat source that is the electronic device 99. The heated fluid flows upward in the Z-direction through the outlet fingers corresponding to the fluid fingers 412 and out of the contact layer 402, and the outlet fingers corresponding to the fluid fingers 412 move along the X-direction, A heated fluid is caused to flow through the flow path 418 of the manifold layer 406. The fluid then flows along the flow path 418 and is discharged from the heat exchanger by flowing out of the port 409.

  As shown in FIG. 7A, the contact layer comprises a series of grooves 416 disposed between a set of microchannels 410 that allow fluid to flow into and out of fluids 411, 412. Flows out. Specifically, the groove 416A is located directly below the inlet finger corresponding to the fluid finger 411 of the other manifold layer 406 so that fluid entering the contact layer 402 is routed through the inlet finger corresponding to the fluid finger 411. It flows directly into the microchannel adjacent to the groove 416A. In this way, the groove 416A causes the fluid to flow directly from the inlet finger corresponding to the fluid finger 411 to a specific designated flow path, as shown in FIG. Similarly, the contact layer 402 has a groove 416 </ b> B provided immediately below the outlet finger corresponding to the fluid finger 412 in the Z direction. Thus, fluid that flows horizontally along the microchannel 410 toward the outlet channel flows horizontally to the groove 416B and perpendicularly to the outlet finger corresponding to the fluid finger 412 above the groove 416B.

  FIG. 6A is a cross-sectional view of a heat exchanger 400 that includes a manifold layer 406 and a contact layer 402. Specifically, FIG. 6A shows an inlet finger corresponding to the fluid finger 411 intercombined with an outlet finger corresponding to the fluid finger 412 so that fluid flows to the inlet finger corresponding to the fluid finger 411. Down and up to the outlet finger corresponding to the fluid finger 412. In addition, as shown in FIG. 6A, the fluid flows horizontally through the microchannel 410 disposed between the inlet and outlet channels and separated by the grooves 416A, 416B. Alternatively, the microchannel walls may be continuous without being separated by the microchannel (FIG. 3B). As shown in FIG. 6A, the inlet and / or outlet fingers corresponding to the fluid fingers 411, 412 have a curved surface 420 at the end near the groove 416. This curved surface 420 causes fluid to flow down the fluid finger 411 toward the microchannel 410 adjacent to the fluid finger 411. In this manner, the fluid entering the contact layer 102 flows more easily toward the microchannel 410 than flowing directly into the groove 416A. Similarly, the outlet finger curved surface 420 corresponding to the fluid finger 412 directs fluid from the microchannel 410 to the outer fluid finger 412.

  In a variation, as shown in FIG. 7B, the contact layer 402 ′ may include an inlet finger corresponding to the fluid finger 411 and an outlet finger corresponding to the fluid finger 412 as described above with respect to the manifold layer 406 (FIGS. 8 and 9). Is provided. In a variation, fluid is supplied directly from the fluid port 408 'to the contact layer 402'. The fluid flows along the flow path 414 'toward the inlet finger corresponding to the fluid finger 411'. The fluid then traverses the set of microchannels 410 ', exchanges heat with a heat source (not shown), and flows into the outlet fingers corresponding to the fluid fingers 412'. The fluid then flows into the flow path 418 'along the outlet fingers corresponding to the fluid fingers 412' and is discharged from the contact layer 402 'via the port 409'. The fluid ports 408 ', 409' may be formed in the configured 'contact layer 402' or may be formed in the manifold layer 406 (FIG. 7A).

  Note that although the heat exchanger according to the present invention is shown here to operate in all horizontal directions, it will be apparent to those skilled in the art that this heat exchanger may operate in the vertical direction. . When operating in the vertical direction, the heat exchanger is configured such that each inlet channel is located above an adjacent outlet channel. Thus, fluid enters the contact layer via the inlet channel and naturally flows into the outlet channel. Obviously, any other configuration of the manifold layer and contact layer may be used to operate the heat exchanger in the vertical direction.

  8A to 8C are plan views of other embodiments of the heat exchanger according to the present invention. Specifically, FIG. 8A is a plan view of another manifold layer 206 in accordance with the present invention. 8B and 8C are plan views of the intermediate layer 204 and the contact layer 202, respectively. Further, FIG. 9A shows a three-layer heat exchanger using another manifold layer 206, and FIG. 9B shows a two-layer heat exchanger using another manifold layer 206.

  As shown in FIGS. 8A and 9A, the manifold layer 206 includes a plurality of fluid ports 208 configured horizontally and vertically. Alternatively, the fluid port 208 may be disposed at an angle with respect to the manifold layer 206 or in any other direction. The fluid port 208 is disposed at a selected location within the manifold layer 206 to effectively provide fluid to a predetermined contact layer hot spot area of the heat exchanger 200. Multiple fluid ports 208 have the important advantage of being able to provide fluid directly from the fluid port to a particular contact layer hot spot area without causing a large pressure drop in the heat exchanger 200. Further, the fluid port 208 is disposed in the manifold layer 206 so that the fluid in the contact layer hot spot region can travel the shortest distance distance to the fluid port 208 so that the fluid is directed to the fluid port 208. Achieve temperature uniformity while maintaining minimal pressure drop between corresponding inlet and outlet ports. Further, the use of the manifold layer 206 can stabilize the two-phase flow in the heat exchanger 200 while providing an evenly uniform flow across the contact layer 202. In place of this, two or more manifold layers 206 are provided in the heat exchanger 200, and one manifold layer 206 circulates fluid to and from the heat exchanger 200, and the other manifold layer (see FIG. (Not shown) may control the rate of fluid circulation to the heat exchanger 200. Alternatively, all of the plurality of manifold layers 206 may circulate fluid to a corresponding selected contact layer hot spot area in the contact layer 202.

  The manifold layer 206 shown as a variation has a lateral dimension corresponding to the dimension of the contact layer 202. Furthermore, the manifold layer 206 has the same dimensions as the heat source that is the electronic device 99. Alternatively, the manifold layer 206 may be larger than the heat source that is the electronic device 99. The vertical dimension of the manifold layer 206 is preferably in the range of 0.1 to 10 mm. Further, the size of the aperture in the manifold layer 206 connected to the fluid port 208 may be in the range between 1 mm to the full width or full length of the heat source that is the electronic device 99.

  FIG. 11 is a perspective view of the heat exchanger 200 having another manifold layer 206 according to the present invention with a part cut away. As shown in FIG. 11, the heat exchanger 200 is divided into individual regions based on the amount of heat generated along the body of the heat source that is the electronic device 99. These regions are separated by the vertical intermediate layer 204 and / or the microchannel wall structure 210 of the contact layer 202. However, as will be apparent to those skilled in the art, the configuration of the present invention is not limited to the assembly shown in FIG. 11, which is shown for illustrative purposes only. The heat exchanger 200 is connected to one or more pumps, with one pump connected to the inlet port 208A and the other pump connected to the outlet port 208B.

  As shown in FIG. 3, the heat source that is the electronic device 99 has a hot spot at position A and a warm spot at position B, and the hot spot at position A generates higher heat than the warm spot at position B. . It is obvious that the heat source that is the electronic device 99 may have two or more hot spots and warm spots at any time and at any position. In this specific example, the position A is a hot spot, and from the position A, more heat is transported to the contact layer 202 on the position A (shown as the contact layer hot spot area A in FIG. 11). Thus, the heat exchanger 200 provides more fluid and / or a higher flow rate fluid to the contact layer hot spot region A in order to properly cool position A. In this specific example, the contact layer hot spot region B is shown larger than the contact layer hot spot region A, but the contact layer hot spot regions A and B in the heat exchanger 200 and all other contact layer hot spots are shown. It will be appreciated that the spot area may have any size and / or may have any relative configuration.

  Alternatively, as shown in FIG. 11, fluid enters the heat exchanger via inlet port 208A and flows into the contact layer hot spot region A by flowing along the intermediate layer 204 to the inflow conduit 205A. Also good. Next, the fluid flows down the inflow conduit 205 </ b> A in the Z-direction and reaches the contact layer hot spot region A of the contact layer 202. The fluid flows between the microchannels 210 </ b> A so that heat from location A is transported to the fluid by heat conduction through the contact layer 202. The heated fluid flows along the contact layer 202 in the contact layer hot spot area A toward the outlet port 209A and is discharged from the heat exchanger 200. It will be apparent to those skilled in the art that an inlet port corresponding to any number of fluid ports 208 and an outlet port corresponding to fluid ports 209 may be used for a particular contact layer hot spot region or set of contact layer hot spot regions. It is. Further, the outlet port 209A is disposed near the contact layer 202A, but instead the outlet port 209A is not limited to the following, for example, any other location such as the outlet port 209B. You may provide in arrangement | positioning perpendicular | vertical to.

  In the specific example shown in FIG. 11, the heat source that is the electronic device 99 has a warm spot at the position B that generates heat lower than the position A of the heat source that is the electronic device 99. The fluid that flows in through the outlet port 208B is supplied to the contact layer hot spot region B by flowing into the outflow conduit 205B along the intermediate layer 204B. Next, the fluid flows down the outflow conduit 205 </ b> B in the Z− direction and reaches the contact layer hot spot region B of the contact layer 202. The fluid flows between the microchannels 210A in the X and Y directions, so that heat from location B is transported to the fluid by heat conduction through the contact layer 202. The heated fluid flows up the outlet port 209B in the Z direction along the entire contact layer 202B in the contact layer hot spot region B via the outlet conduit 205B of the intermediate layer 204 and is discharged from the heat exchanger 200. The

  Instead, as shown in FIG. 9A, the heat exchanger 200 may include a vapor permeable membrane 214 disposed on the contact layer 202. The vapor permeable membrane 214 is in sealing contact with the inner wall of the heat exchanger 200. The vapor permeable membrane 214 has several small apertures, and vapor generated along the contact layer 202 flows into the outlet port 209 via the apertures. Further, the vapor permeable membrane 214 is configured to have hydrophobicity, whereby the vapor permeable membrane 214 prevents the liquid flowing along the contact layer 202 from passing through the aperture. For other details of the vapor permeable membrane 114, see also co-pending US patent application Ser. No. 10 / 366,128, filed Feb. 12, 2003, entitled “Vapor-permeable microchannel heat. "VAPOR ESCAPE MICROCHANNEL HEAT EXCHANGER", which is incorporated herein by reference.

  FIG. 12A is an exploded view of a preferred heat exchanger 300 in accordance with the present invention. FIG. 12B is an exploded view of another heat exchanger 300 'according to the present invention. As shown in FIGS. 12A and 12B, the heat exchanger 300, 300 'includes contact layers 302, 302' and manifold layers 306, 306 'connected thereto. As described above, the heat exchangers 300 and 300 ′ may be connected to a heat source (not shown) or may be configured integrally with the heat source (eg, may be incorporated in a microprocessor). ). Although the contact layers 302 and 302 ′ are not substantially exposed to the outside, it is obvious to those skilled in the art that FIG. 12A shows the contact layers 302 and 302 ′ exposed for explanation. . Preferably, the contact layers 302, 302 ′ include a plurality of pillars 303 disposed along the bottom surface 301. Furthermore, the pillar 303 may have any shape as described with reference to FIGS. 10A to 10E, and / or may be provided with the short fins 303 </ b> E configured radially. Further, the contact layer 302 may have any of the other features described above (eg, microchannels, rough surfaces, etc.). Contact layer 302 and the structure within contact layer 302 preferably have the same thermal conductivity characteristics, as described above with respect to the preferred embodiments, and the same description will not be repeated here. In the example shown here, the contact layer 302 has a smaller dimension than the manifold layer 306, but the dimensions of the contact layer 302 and the manifold layer 306 are relative to each other and to the heat source that is the electronic device 99. It will be apparent to those skilled in the art that any other relationship may be present. The contact layers 302, 302 'have the same characteristics as the contact layers described above, and the same description will not be repeated here.

  In many cases, the preferred heat exchanger 300 uses delivery channels 322 in the manifold layer 306 to minimize pressure drop within the heat exchanger. The transport channel 322 is disposed vertically within the manifold layer 306 and supplies fluid vertically to the contact layer 302 to reduce the pressure drop across the heat exchanger 300. As described above, a pressure drop occurs or rises in the heat exchanger 300 as the fluid flows in the X and Y directions along the contact layer for a significant amount of time and / or distance. Manifold layer 306 minimizes flow in the X and Y directions by lengthening the fluid perpendicular to contact layer 302 by several transport channels 322. In other words, the fluid is directly sprayed onto the contact layer 302 from above. The transport channels 322 are arranged at an optimum distance from each other, thereby minimizing fluid flow in the X and Y directions, with much flowing perpendicular to the contact layer 302. Thus, fluid flows in an upward direction away from the contact layer 302 due to the forces of the individual flow paths from the optimally positioned transport channel 322. Furthermore, the individual transport channels 322 divide the flow rate into several transport channels 322 to the maximum within the contact layer 302, thereby effectively cooling the heat source, which is the electronic device 99, while the heat exchanger 300. The pressure drop at can be reduced. Furthermore, in the preferred heat exchanger 300 configuration, the distance for the fluid to move in the X direction and the Y direction, which are horizontal directions, can be shortened in order to properly cool the heat source that is the electronic device 99. It can be made smaller than other heat exchangers.

  The preferred manifold layer 306 shown in FIG. 12A has two independent levels. Specifically, the manifold layer 306 has a level 308 and a level 312. Level 308 is coupled to contact layer 302 and level 312. In FIG. 12A, level 312 is disposed above level 308, but it will be apparent to those skilled in the art that level 308 may be disposed above level 312. It will also be apparent to those skilled in the art that any number of levels may be provided based on the present invention.

The manifold layer 306 ′ shown as a variation in FIG. 12B has three independent levels. Specifically, the manifold layer 306 ′ has a circulation level 304 ′, a level 308 ′, and a level 312 ′. Circulation level 304 ′ is coupled to contact layer 302 ′ and level 308 ′. Level 308 ′ is coupled to circulation level 304 ′ and level 312 ′. In FIG. 12B, level 312 ′ is disposed above level 308 ′, but it will be apparent to those skilled in the art that level 308 ′ may be disposed above level 312 ′. It will also be apparent to those skilled in the art that any number of levels may be provided based on the present invention.
FIG. 12C is a perspective view of the circulation level 304 ′ according to the present invention. The circulation level 304 ′ has a top surface 304A ′ and a bottom surface 304B ′. Also, as shown in FIGS. 12B and 12C, several apertures 322 ′ are opened in the circulation level 304 ′. In one embodiment, the opening of the aperture 322 ′ is provided in the same plane as the bottom surface 304B ′. Alternatively, the aperture 322 ′ may protrude beyond the bottom surface 304B ′ and supply fluid to the contact layer 302 ′ from a closer location. Furthermore, the circulation level 304 ′ may have several apertures 324 ′ that penetrate perpendicularly from the top surface 304A ′ to the bottom surface 304B ′, the aperture 324 ′ projecting a predetermined distance in the Z-direction. Also good. Alternatively, it will be apparent to those skilled in the art that the apertures 322 ', 324' may extend at a predetermined angle at the circulation level and need not be completely vertical. As described above, in one embodiment, the contact layer 302 ′ (FIG. 12B) is coupled to the bottom surface 304B ′ of the circulation level 304 ′. In this way, the fluid flows into the contact layer 302 ′ via the aperture 322 ′ in the Z-direction and is discharged from the contact layer 302 ′ via only the aperture 324 ′ in the Z-direction. As will be described below, the fluid entering the contact layer 302 ′ via the aperture 322 ′ is separated from the fluid exiting the contact layer 302 ′ via the aperture 324 ′ at the circulation level 304 ′.

  As shown in FIG. 12C, a portion of the aperture 324 ′ preferably includes a cylindrical member extending in the Z-direction from the upper surface 304A ′ of the circulation level 304 ′, so that the fluid is allowed to pass through the aperture 324 ′. To the level 312 ′ corridor 326 ′ (FIGS. 12F and 12G). The cross section of the cylindrical protrusion is preferably circular as shown in FIG. 12C, but this shape may be any shape. Note that fluid flows in a horizontal and vertical direction from each aperture 322 'along the contact layer 302' to the adjacent aperture 324 '. Aperture 322 ′ and aperture 324 ′ are preferably thermally isolated from each other so that heat from the heated fluid exhausted from contact layer 302 ′ through manifold layer 306 ′ can be removed from manifold layer 306 ′. Does not propagate to the cooled fluid that pours into the contact layer 302 ′ via.

  FIG. 12D shows a preferred embodiment of level 308 according to the present invention. As shown in FIG. 12D, the level 308 has a top surface 308A and a bottom surface 308B. Preferably, the bottom surface 308B of level 308 is directly coupled to the contact layer 302 as shown in FIG. 12A. Level 308 includes a recessed corridor 320 that preferably includes several transport channels 322 that supply fluid to the contact layer 302. The recessed corridor 320 is in sealing contact with the contact layer 302, and the fluid discharged from the contact layer 302 flows around and between the transport channels 322 in the corridor 320 and exits via the port 314. To be discharged. Note that the fluid discharged from the contact layer 302 does not flow into the transport channel 322.

  FIG. 12E is a perspective view of the back side of level 308 'according to the present invention. Level 308 'has a top surface 308A' and a bottom surface 308B ', and the bottom surface 308B' of level 308 'is directly coupled to circulation level 304' (FIG. 12C). The level 308 'preferably includes a port 314', a corridor 320 'and a plurality of apertures 322', 324 'on the bottom 308B' side. It will be apparent to those skilled in the art that any number of ports and corridors may be provided at level 308 '. The apertures 322 ', 324' shown in FIG. 12E are configured to face the circulation level 304 '. Specifically, as shown in FIG. 12E, the aperture 322 ′ causes fluid flowing into the collider 320 ′ to flow to the contact layer 302 ′, and the aperture 324 ′ causes fluid from the contact layer 302 ′ to flow to level 312 ′. . The aperture 324 'extends through the corridor 320' at the level 308 '. The apertures 324 'are individually separated so that the fluid flowing through the aperture 324' does not contact or mix with the fluid flowing through the cylinder associated with the aperture 324 '. Also, separating each aperture 324 'can ensure that the fluid flowing through each aperture 324' flows along the flow path provided by the aperture 324 '. The aperture 324 'is preferably configured vertically. This allows fluid to flow vertically in most of the manifold layer 306 '. In particular, if an aperture 322 'is provided between the contact layer and the level, it is clear that a similar approach can be applied to the aperture 322'.

  In this embodiment, each aperture or hole 322 'has the same size, but each aperture 322' may have a different or varying diameter along the length. For example, the diameter of the aperture 322 'close to the port 314 may be reduced to limit the flow rate therethrough. Reducing the aperture 322 'facilitates fluid flow away from the port 314 and below the aperture 322'. By changing the diameter of the aperture 322 ′ in this way, the fluid can be supplied to the contact layer 302 more uniformly. It will be apparent to those skilled in the art that the diameter of the aperture 322 'may be varied to effectively cool a known contact layer hot spot area in the contact layer 302. The above description is also applicable to the aperture 324 ', and it will be apparent to those skilled in the art that the size of the aperture 324' may be varied or changed to make the fluid flowing out of the contact layer 302 constant.

  In the preferred embodiment, port 314 provides fluid to level 308 and contact layer 302. The port 314 shown in FIG. 12D preferably extends from the top surface 308A to the corrider 320 through a portion of the level 308 body. Alternatively, the port 314 may be connected to the corridor 320 from the side or bottom surface of the level 308. Preferably, port 314 is coupled to port 315 at level 312 (FIGS. 12A, 12B). The port 314 is sealed as shown in FIG. 12C or connected to a corridor 320 formed as a depression as shown in FIG. 12D. The corrider 320 preferably serves to flow fluid from the contact layer 302 to the port 314. Alternatively, the corrider 320 allows fluid to flow from the port 314 to the contact layer 302.

  As shown in FIGS. 12F and 12G, the level 312 port 315 is preferably aligned with and connected to the port 314. As shown in FIG. 12A, fluid preferably flows into heat exchanger 300 via inlet port 316 and flows down to level 308 transport channel 322 and ultimately to contact layer 302 via corridor 328. . Alternatively, as shown in FIG. 12B, fluid preferably enters heat exchanger 300 'via port 315' and flows to contact layer 302 'via port 314' at level 308 '. The port 315 shown in FIG. 12F preferably extends from the top surface 312A to the level 312 body. Alternatively, port 315 may extend from the side of level 312. Alternatively, level 312 may not have a port 315, in which case fluid enters heat exchanger 300 via port 314 (FIGS. 12D and 12E). In addition, level 312 includes an inlet port 316, which preferably allows fluid to flow through corridor 328 '. It will be apparent to those skilled in the art that this level may include any number of ports and corridors. The corridor 328 preferably allows fluid to flow from the transport channel 322 to the contact layer 302 eventually.

  FIG. 12G is a rear perspective view of a variation of level 312 'according to the present invention. Level 312 'is preferably coupled to level 308' shown in FIG. 12E. As shown in FIG. 12F, the level 312 'includes a recessed corridor 328' exposed in the body along the bottom surface 312B '. Recessed corridor 328 'is connected to inlet port 316', and fluid travels directly from recessed corridor 328 'to inlet port 316'. A recessed corridor 328 'is disposed on the top surface 308A' of the level 308 'so that fluid can freely move from the aperture 324' to the collider 328 '. The periphery of the recessed corridor 320 'and the bottom surface 312B' is sealed against the top surface 308A 'of the level 312' so that all of the fluid from the aperture 324 'is routed through the corridor 328' to the inlet port 316 '. Inflow. Each aperture 330 ′ of the bottom surface 312B ′ is aligned and connected to the aperture 321 ′ of the level 308 ′ (FIG. 12E), and the aperture 330 ′ is provided in the same plane as the top surface 308A ′ (FIG. 12E) of the level 308 ′. . Alternatively, the aperture 330 'may have a diameter that is slightly larger than the diameter of the corresponding aperture 324' so that the aperture 324 'extends through the aperture 330' to the collider 328 '.

  FIG. 12H shows a cross-section at line HH of the preferred heat exchanger of FIG. 12A in accordance with the present invention. As shown in FIG. 12H, the contact layer 302 is coupled to a heat source that is an electronic device 99. As described above, the heat exchanger 300 may be integrally formed with a heat source that is the electronic device 99 as one component. Contact layer 302 is coupled to bottom surface 308B of level 308. Further, the level 312 is preferably coupled to the level 308 and the top surface 308A of the level 308 is sealed against the bottom surface 312B of the level 312. The periphery of the level 308 corridor 320 is connected to the contact layer 302. Further, level 312 corridor 328 is coupled to level 308 transport channel 322. The bottom surface 312B of level 312 is sealed against the top surface 308A of level 308 so that fluid does not leak between the two levels 308,312.

  FIG. 12I shows a cross-section at line II of the variation of the heat exchanger shown in FIG. 12B according to the present invention, as shown in FIG. It is connected. The contact layer 302 'is connected to the bottom surface 304B' of the circulation level 304 '. The circulation level 304 is also coupled to the level 308 ', and the upper surface 304A' of the circulation level 304 'is sealed against the bottom surface 308B' of the level 308 '. Further, level 312 'is preferably coupled to level 308', with the top surface 308A 'of level 308' sealed against the bottom surface 312B 'of level 312'. The perimeter of the level 308 'corridor 320' is connected to the upper surface 304A 'aperture of the circulation level 304' so that fluid does not leak between the two levels 308 ', 304'. Further, the perimeter of the level 312 'corridor 328' is connected to the top surface 308A 'aperture of the level 308' so that fluid does not leak between the two levels 312 ', 308.

  In a preferred operation, the cooled fluid enters the heat exchanger 300 via the level 312 'inlet port 316, as shown by the arrows in FIGS. 12A and 12H. The cooled fluid flows from the inlet port 316 down to the corridor 328 and is poured into the contact layer 302 via the transport channel 322. The cooled fluid in the corridor 320 does not come into contact with or mix with the heated fluid discharged from the heat exchanger 300. The fluid that enters the contact layer 302 exchanges heat with the heat source that is the electronic device 99 and absorbs heat generated from the heat source that is the electronic device 99. The configuration of the transport channel 322 effectively cools the heat source, which is the electronic device 99, and in the contact layer 302, the fluid travels the shortest distance in the X and Y directions, minimizing the pressure drop in the heat exchanger 300. To be optimized. The heated fluid flows from the contact layer 302 to the corridor 320 at level 308 in the Z-direction. The heated fluid exiting the manifold layer 306 does not come into contact with or mix with the cooled fluid flowing into the manifold layer 306. The heated fluid flows into the corridor 320 and is discharged from the heat exchanger 300 through the ports 314 and 315. It will be apparent to those skilled in the art that fluid may flow in a direction opposite to that shown in FIGS. 12A and 12H without departing from the scope of the present invention.

  In operation in the variation, the cooled fluid enters the heat exchanger 300 'via the inlet port 316' at level 312 'as shown by the arrows in FIGS. 12B and 12I. The cooled fluid flows down from port 315 'to port 314' at level 308 '. The fluid then flows into the corridor 320 'and flows down to the contact layer 302' via the circulation level 304 'aperture 322'. However, the cooled fluid of the corridor 320 'does not come into contact with or mix with the heated fluid discharged from the heat exchanger 300'. The fluid entering the contact layer 302 ′ exchanges heat with the heat source that is the electronic device 99 and absorbs heat generated from the heat source that is the electronic device 99. As will be described later, the configuration of the apertures 322 ′ and 324 ′ effectively cools the heat source, which is the electronic device 99, and allows fluid along the contact layer 302 ′ from each aperture 322 ′ to the adjacent aperture 324 ′. Optimized to travel the shortest distance and minimize the pressure drop during this time. Optimized to do. The heated fluid flows up from the contact layer 302 'in the Z direction via level 308' and reaches the level 312 'corridor 328' via several apertures 324 '. As the heated fluid flows up the aperture 324 ', it does not come into contact with or mix with the cooled fluid flowing into the manifold layer 306'. The heated fluid enters the level 312 'corridor 328' and exits the heat exchanger 300 'via the inlet port 316'. It will be apparent to those skilled in the art that fluid may flow in a direction opposite to that shown in FIGS. 12B and 12I without departing from the scope of the present invention.

  In the preferred manifold layer 306, the transport channel 322 is configured to minimize the distance that the fluid flows through the contact layer 302 while properly cooling the heat source, which is the electronic device 99. In the manifold layer 306 'shown as a variation, the aperture 322' and the aperture 324 'are configured to minimize the distance that fluid flows through the contact layer 302'. Specifically, the apertures 322 ′ and 324 ′ provide a substantially vertical flow path, and the length of the flow path in the heat exchanger 300 ′ is minimized in the horizontal and X and Y directions. The As a result, the heat exchangers 300 and 300 ′ appropriately cool the heat source as the electronic device 99 and greatly reduce the distance through which the fluid flows. Therefore, the heat exchangers 300 and 300 ′ and the circulation type cooling device 30 , 30 '(FIGS. 2A-2B) can be greatly reduced.

  Specific configurations and cross-sectional dimensions of the aperture 322 and / or the aperture 324 are not limited to the following, but include various conditions such as flow conditions, temperature, the amount of heat generated from the heat source that is the electronic device 99, the flow rate of the fluid, and the like. It is determined based on various factors. Hereinafter, the apertures 322 and 324 will be described. However, this description may be applied to only one of the aperture 322 and the aperture 324.

  The apertures 322 and 324 are disposed at an optimum distance from each other so as to properly cool the heat source, which is the electronic device 99, to a desired temperature and to minimize the pressure drop. In the preferred embodiment of the configuration and optimal distance of the apertures 322 and / or apertures 324, the flow paths through the apertures 322, 324 and often the contact layer 302 are separated by changing the size and position of the individual apertures. Can be optimized. In addition, the aperture configuration in the preferred embodiment can optimize the total flow rate of fluid entering the contact layer and the area cooled by the fluid flowing through each aperture 322.

  In one embodiment, the apertures 322, 324 may be configured in an alternating configuration, ie, a checkered pattern, in the manifold layer 306, as shown in FIGS. Apertures 322 and 324 are spaced apart by the shortest distance that each fluid needs to move in a checkered pattern. However, the apertures 322 and 324 need to be separated from each other by a sufficient distance to supply the coolant to the contact layer 302 for a sufficient time. As shown in FIGS. 13 and 14, one or more apertures 322 are associated to travel the shortest distance along the contact layer 302 before fluid entering the contact layer 302 is drained from the contact layer 302. It is preferable that the number of apertures 324 be adjacent to each other and vice versa. For this reason, as shown in FIGS. 13 and 14, the apertures 322, 324 may be arranged radially around each other so that the fluid travels the shortest distance from all apertures 322 to the nearest aperture 324. . For example, as shown in FIG. 13, fluid that enters the contact layer 302 via one particular aperture 322 will experience minimal resistance by the adjacent aperture 324. Further, the cross sections of the apertures 322 and 324 are preferably circular, but the cross section may have any other shape.

  Further, as described above, the aperture 324 shown in the above-described figure protrudes from the circulation level 304 or the levels 308 and 312 as a cylindrical member, but the aperture can be seen from any level of the manifold layer 306. It does not have to protrude. In addition, the manifold layer 306 preferably has a surface that is rounded in the vicinity of the region where the fluid changes direction, thereby enhancing the effect of reducing the pressure drop in the heat exchanger 300.

  The dimensions of the apertures 322, 324 and the optimal distance configuration depend on the temperature at which the fluid is exposed along the contact layer 302. In addition, the cross-sectional dimensions of the flow paths in the apertures 322 and 324 need to be large enough to reduce the pressure drop in the heat exchanger 300. When the fluid is only in a single phase flow along the contact layer 302, each aperture 322 is preferably surrounded by a plurality of adjacent apertures 324 in a symmetric hexagonal configuration, as shown in FIG. It is. Furthermore, in the case of a single phase flow, it is desirable that the number of apertures at the circulation level 304 is substantially equal. Further, in the case of single phase flow, the apertures 322, 324 preferably have the same diameter. However, it will be apparent to those skilled in the art that the configuration and ratio of the apertures 322 and 324 are not limited to the above-described embodiments.

  When the fluid is in a two-phase flow along the contact layer 302, it is desirable that the apertures 322, 324 have an asymmetric configuration to accommodate the acceleration of the two-phase flow. However, the apertures 322 and 324 may be symmetrically configured even in the case of a two-phase flow. For example, at the circulation level 304, the apertures 322 and 324 may be arranged symmetrically so that the opening of the aperture 324 is larger than the opening of the aperture 322. Alternatively, for a two-phase flow, at the circulation level 304, the number of apertures 324 may be greater than the aperture 322 at the circulation level 304 using the hexagonal symmetrical configuration shown in FIG.

  The apertures 322 and 324 at the circulation level 304 may be alternately arranged to cool the hot spot of the heat source that is the electronic device 99. That is, for example, at the circulation level 304, the two apertures 322 are alternately arranged adjacent to each other, and both the apertures 322 are configured to be located on the contact layer hot spot region or in the vicinity of the contact layer hot spot region. Also good. It goes without saying that a suitable number of apertures 324 are placed adjacent to both apertures 322 to reduce the pressure drop across the contact layer 302. Thus, the two apertures 322 provide a cold fluid to the contact layer hot spot area and cool the contact layer hot spot area to a uniform and substantially equal temperature as described above.

  As mentioned above, the preferred heat exchanger 300 has significant advantages over other heat exchangers. In the preferred heat exchanger 300 configuration, the use of a vertical flow path reduces the pressure drop, so a relatively low performance pump can be used. Furthermore, the inlet and flow paths along the contact layer 302 can be individually optimized with a suitable heat exchanger 300 configuration. In addition, the individual levels allow for customizable designs to optimize heat transport homogeneity, pressure drop reduction, and individual component dimensions. Also, the preferred heat exchanger 300 configuration can reduce the pressure drop in a system where the fluid is in a two-phase flow state, and thus this configuration is used in both single-phase and two-phase flow systems. be able to. Furthermore, as will be described below, suitable heat exchangers can accommodate many different manufacturing methods and can adjust the component geometry to compensate for tolerances.

  Hereinafter, a method for manufacturing and assembling the individual layers of the fluid transport microchannel heat exchanger 100 and the fluid transport microchannel heat exchanger 100 will be described. In the following, for the sake of brevity, preferred and alternative heat exchangers according to the present invention will be described using the fluid transport microchannel heat exchanger 100 of FIG. 3B and its individual layers. Also, in the following, assembly / manufacturing details will be described in connection with the present invention, including details of one fluid inlet port and one fluid outlet port as shown in FIGS. 1A-1C. It will be apparent to those skilled in the art that the present invention applies equally well to two- and three-layer heat exchangers using and to conventional heat exchangers.

  The contact layer preferably has a coefficient of thermal expansion (hereinafter referred to as CTE) that is equal to or close to a heat source that is the electronic device 99. Thereby, the contact layer preferably expands and contracts similarly according to expansion and contraction of the heat source which is the electronic device 99. Alternatively, the material of the contact layer 302 may have a CTE different from the CTE of the material of the heat source that is the electronic device 99. The contact layer 302 made from a material such as silicon has a CTE corresponding to the CTE of the heat source that is the electronic device 99 and sufficient heat to properly transport heat from the heat source that is the electronic device 99 to the fluid. It has conductivity. However, instead of this, the contact layer 302 may be formed using another material having a CTE that matches the CTE of the heat source that is the electronic device 99.

  The contact layer 302 has a high thermal conductivity that provides sufficient heat conduction between the heat source that is the electronic device 99 and the fluid that flows along the contact layer 302 so that the heat source that is the electronic device 99 does not overheat. It is preferable. The contact layer 302 is preferably formed from a material having a high thermal conductivity of about 100 W / m-K. However, the thermal conductivity of the contact layer 302 may be 100 W / m-K or higher and is not limited to this value, as will be apparent to those skilled in the art.

  In order to achieve a suitable high thermal conductivity, the contact layer 102 is preferably formed from a semiconductor substrate such as silicon. Alternatively, the contact layer may be, but is not limited to, single crystal dielectric material, metal, aluminum, nickel copper, Kovar ™, graphite, diamond, composites thereof and any suitable It may be made from any other material including alloys. Other materials for the contact layer 302 include patterned or molded organic mesh.

  As shown in FIG. 15, the contact layer 302 is coated with a coating material layer 112 to protect the material of the contact layer 302 and improve the heat exchange properties of the contact layer 302. Specifically, the coating material layer 112 provides chemical protection that prevents chemical interaction between the fluid and the contact layer 302. For example, the contact layer 302 made of aluminum is scraped by the fluid that contacts it, and the contact layer 302 may degrade over time. Here, by electroplating the surface of the contact layer 302 with a coating material layer 112 of about 25 μm nickel thin film, any chemical potential reaction is prevented without significantly changing the thermal properties of the contact layer 302. can do. Obviously, any other coating material having an appropriate layer thickness may be used depending on the material of the contact layer 302.

  The contact layer 302 is preferably formed by etching a copper material coated with a nickel thin film to protect the contact layer 302. Alternatively, the contact layer 302 may be formed from aluminum, a silicon substrate, plastic or any other suitable material. Further, the contact layer 302 formed of a material having low thermal conductivity may be coated with an appropriate coating material in order to improve the thermal conductivity of the contact layer 302. One technique for electroforming the contact layer is to apply a seed layer of chromium or other suitable material along the bottom surface of the contact layer 302 and apply an appropriate voltage electrical connection to the seed layer. By this electrical connection, a layer of the thermally conductive coating material layer 112 is formed on the contact layer 302. Also, various structures in the range of 10 to 100 μm can be formed by electroforming. The contact layer 302 can be formed by electrocasting such as patterned electroplating. Further alternatively, the contact layer may be formed by photochemical etching or chemical cutting alone or in combination with electroforming. The structure in the contact layer 302 may be machined using a standard lithographic set for chemical cutting. Further, by using a laser-assisted chemical cutting process, the aspect ratio can be changed and the tolerance accuracy can be increased.

  The pillar 303 described above can be manufactured by various methods. However, the pillar 303 needs to be formed so as to have high thermal conductivity. Preferably, the pillar 303 is formed of a material having very high thermal conductivity such as copper. However, it will be apparent to those skilled in the art that other materials, such as silicon, may be used here. The pillar 303 can be formed by various methods including, but not limited to, electroforming, electric discharge machining wire method, stamping, MIM, and machining. Furthermore, the contact layer 302 may be formed in a desired configuration by cutting using a saw and / or a milling machine. In the case of the contact layer 302 made of silicon, the pillar 303 is formed by, for example, plasma etching, sawing, lithographic patterning, various wet etching, etc. according to the aspect ratio corresponding to the necessary pillar 303 in the contact layer 302. It can be formed by various methods. The radially-configured rectangular fins 303E (FIG. 10E) can be formed using lithographic patterning, and plasma etching or electroplating can be employed within the mold defined by the lithograph.

  In a variation, the microchannel wall 110 used in the contact layer 302 is formed from silicon. Alternatively, the microchannel wall 110 may be formed of any other material including, but not limited to, patterned glass, polymer, and molded polymer mesh. The microchannel wall 110 is formed of the same material as the material of the bottom surface 103 of the contact layer 102, but instead, the microchannel wall 110 is formed of a material different from the material of other parts of the contact layer 102. May be.

  In a variation, the microchannel wall 110 has a thermal conductivity characteristic of at least 10 W / m-K. Alternatively, the microchannel wall 110 may have a thermal conductivity characteristic greater than 10 W / m-K. As will be apparent to those skilled in the art, the microchannel wall 110 may alternatively have a thermal conductivity characteristic of less than 10 W / m-K, in which case, as shown in FIG. In order to improve the thermal conductivity of the wall 110, a coating material layer 112 may be applied to the microchannel wall 110. In addition, a coating material layer 112 having a thickness of at least 25 μm that protects the surface of the microchannel wall 110 may be applied to the microchannel wall 110 that is already formed of a material having high thermal conductivity. For the microchannel wall 110 formed from a low-rate material, a coating material layer 112 having a thermal conductivity of at least 50 W / m-K and a thickness of 25 μm or more may be applied. It will be apparent to those skilled in the art that other types and thicknesses of coating materials may be used.

  In order to form a microchannel wall 110 having a suitable thermal conductivity of at least 10 W / m-K, the microchannel wall 110 may be formed by, for example, a coating material layer 112 (FIG. 15) of nickel or other metal as described above. Electroformed. Also, to form a microchannel wall 110 having a suitable thermal conductivity of at least 50 W / m-K, the microchannel wall 110 is formed by electroplating copper on a thin film metal film seed layer. . Alternatively, the microchannel wall 110 may not be coated with a coating material. Note that the thermal conductivity characteristics of the microchannel wall 110 and the coating material layer 112 may be applied to the pillar 303 (FIG. 10A) if appropriate, and any appropriate coating may be applied to the pillar 303.

  The microchannel wall 110 is formed by a thermal embossing method, thereby realizing a high aspect ratio of the microchannel wall 110 along the bottom surface 103 of the contact layer 102. Alternatively, the microchannel wall 110 may be formed as a silicon structure deposited on the glass surface, which is etched to the desired configuration on the glass. Alternatively, the microchannel wall 110 may be formed by standard lithographic methods, stamping or casting methods, or any other suitable technique. The microchannel wall 110 may be formed separately from the contact layer 102 and connected to the contact layer 102 by anodic bonding or epoxy resin bonding. Alternatively, the microchannel wall 110 may be coupled to the contact layer 102 by conventional electroforming techniques such as electroplating.

  The intermediate layer 104 can be formed using various methods. The intermediate layer is preferably formed of silicon. The intermediate layer may also be any other material including, but not limited to, glass or laser patterned glass, polymer, metal, glass, plastic, molded organic material, or composites thereof. It will be apparent to those skilled in the art that suitable materials may be used. Alternatively, the intermediate layer 104 may be formed using a plasma etching technique. Alternatively, the intermediate layer 104 may be formed using a chemical etching method. As another method, the metal may be formed into a desired configuration by machining, etching, extrusion, and / or forging. Alternatively, the intermediate layer 104 may be formed in a desired configuration by injection molding of a plastic mesh. Alternatively, the intermediate layer 104 may be formed in a desired configuration by laser drilling on a glass plate.

  The manifold layer 306 can be created by various techniques. A suitable manifold layer 306 may be formed entirely in one piece. Alternatively, as shown in FIG. 12, a plurality of independent parts may be formed and then connected to form a suitable manifold layer 306. Manifold layer 306 is formed by an injection molding process using plastic, metal, polymer composite or any other suitable material, wherein each layer is preferably formed from the same material. Alternatively, as described above, each layer may be formed from different materials. The manifold layer 306 may be formed using a metal processing technique such as machining or etching. Those skilled in the art will appreciate that the manifold layer 306 may be formed by any other suitable technique.

  The intermediate layer 104 is coupled to the contact layer 102 and the manifold layer 106 in various ways, thereby forming the fluid transport microchannel heat exchanger 100. The contact layer 102, the intermediate layer 104, and the manifold layer 106 are connected to each other by anodic bonding, an adhesive, or a eutectic bonding method. Alternatively, the intermediate layer 104 may be integrally formed in the structure of the manifold layer 106 and the contact layer 102. The intermediate layer 104 may be coupled to the contact layer 102 by a chemical bonding process. Alternatively, the intermediate layer 104 may be formed by thermal embossing or soft lithography techniques, where the intermediate layer 104 may be stamped using a wire electrical discharge machine EDM or a silicon master. Further, if necessary, the intermediate layer 104 may be electroplated with a metal or other suitable material to improve the thermal conductivity of the intermediate layer 104.

  Alternatively, the intermediate layer 104 may be formed simultaneously with the creation of the microchannel wall 110 in the contact layer 102 by injection molding. Alternatively, the intermediate layer 104 may be formed with the creation of the microchannel wall 110 by any other suitable technique. Other techniques for forming the heat exchanger include, but are not limited to, soldering, fusion, eutectic bonding, intermetallic bonding, and the type of material used in each layer. Any other suitable technique may be used.

  FIG. 16 shows another method for manufacturing a heat exchanger according to the present invention. As shown in FIG. 16, the other manufacturing method of this heat exchanger has a process (step 500) of manufacturing a hard mask formed from a silicon substrate as a contact layer. The hard mask is formed from silicon oxide or spin-on glass. Once the hard mask is formed, a plurality of under-channels are formed in the hard mask. These underchannels form a flow path between the microchannel walls 110 (step 502). The under channel may be formed by any suitable method such as, but not limited to, HF etching technology, chemical cutting, soft lithography, xenon difluoride etching, and the like. Furthermore, it is necessary to provide a sufficient space between the under channels so that adjacent under channels are not bridged with each other. Next, using some known technique, spin-on glass is provided on the upper surface of the hard mask to form an intermediate and a manifold layer (step 504). Subsequently, the intermediate layer and the manifold layer are strengthened by a curing method (step 506). After the intermediate layer and the manifold layer are fully formed and reinforced, one or more fluid ports are formed in the reinforced layer (step 508). The fluid port is formed by etching or drilling the manifold layer. While specific techniques for creating the contact layer 102, intermediate layer 104, and manifold layer 106 have been described above, the fluid transport microchannel heat exchanger 100 may be manufactured using other techniques known in the art. Good.

  A modification of the heat exchanger according to the present invention is shown in FIG. In the modification shown in FIG. 17, two heat exchangers 200 and 200 ′ are connected to a heat source that is one electronic device 99. Specifically, a heat source that is an electronic device 99 such as an electronic device is connected to the circuit board 96 and arranged vertically, and both surfaces of the heat source that is the electronic device 99 are necessarily exposed to the outside. The heat exchangers 200 and 200 ′ according to the present invention are respectively connected to the exposed surface of the heat source that is the electronic device 99, and the heat exchangers 200 and 200 ′ allow the cooling efficiency of the heat source that is the electronic device 99 to be improved. Maximized. Alternatively, if the heat source is connected horizontally to the circuit board, two or more heat exchangers (not shown) are stacked on the heat source, which is the electronic device 99, and each heat exchanger is connected to the electronic device 99. The heat source may be electrically connected. Additional details regarding this embodiment can be found in co-pending US patent application Ser. No. 10 / 072,137 filed Feb. 7, 2002, entitled “POWER CONDITIONING MODULE”. Which is hereby incorporated by reference.

  In the example shown in FIG. 17, the heat exchanger 200 having two layers is connected to the left side of the heat source that is the electronic device 99, and the heat exchanger 200 ′ having three layers is on the right side of the heat source that is the electronic device 99. It is connected. It will be apparent to those skilled in the art that a suitable or alternative heat exchanger may be coupled to any face of the heat source that is the electronic device 99. Further, as a modification, it is obvious to those skilled in the art that another heat exchanger 200 ′ may be connected to the side surface of the heat source that is the electronic device 99. In the modification shown in FIG. By supplying the fluid to cool the hot spots that exist along the thickness of the heat source, the hot spots of the heat source that is the electronic device 99 can be cooled more accurately. That is, in the embodiment shown in FIG. 17, by performing heat exchange on both surfaces of the heat source that is the electronic device 99, the hot spot can be appropriately cooled at the center of the heat source that is the electronic device 99. In addition, in embodiment shown in FIG. 17, although the circulation type cooling device 30 of FIG. 2A and 2B is used, it is clear to those skilled in the art that other circulation systems may be used.

  As described above, the heat source that is the electronic device 99 may change the position of one or more hot spots due to different tasks that need to be performed in the heat source that is the electronic device 99. In order to properly cool the heat source, which is the electronic device 99, the circulating cooling device 30 (FIGS. 2A and 2B) is configured to change the fluid entering the fluid transport microchannel heat exchanger 100 in response to a change in the position of the hot spot. A sensing and control module 34 is provided that dynamically changes the flow rate and / or flow rate.

  Specifically, as shown in FIG. 17, one or more sensors 124 are disposed in each contact layer hot spot region in the heat exchanger 200 and / or in each potential hot spot location of the heat source that is the electronic device 99. To do. Alternatively, a plurality of sensors may be equally arranged between the heat source and the heat exchanger and / or in the heat exchanger itself. The control module 34 (FIGS. 2A and 2B) may also be coupled to one or more valves in the circulating cooling device 30 that controls the flow of fluid to the fluid transport microchannel heat exchanger 100. In this embodiment, these one or more valves are disposed in the fluid line, but may alternatively be disposed in any other location. The plurality of sensors 124 are coupled to the control module 34, which is preferably disposed on the upstream side of the fluid transport microchannel heat exchanger 100, as shown in FIG. Alternatively, the control module 34 may be arranged at any other position in the circulation type cooling device 30.

  The sensor 124 is not limited to the following, for example, the flow rate of the fluid flowing through the contact layer hot spot region, the temperature of the hot spot region of the heat source that is the contact layer 102 and / or the electronic device 99, the temperature of the fluid, and the like. Is provided to the control module 34. For example, in the embodiment shown in FIG. 17, the sensor 124 disposed on the contact layer has a higher temperature in a specific contact layer hot spot area of the heat exchanger 200, and the specific contact layer of the heat exchanger 200 ′. Information indicating that the temperature of the hot spot area is low is provided to the control module 34. In response, the control module 34 increases the flow rate of fluid to the heat exchanger 200 and decreases the flow rate of fluid to the heat exchanger 200 '. Instead, the control module 34 changes the flow rate of the fluid to one or more contact layer hot spot areas in the one or more heat exchangers in response to information received from the sensor that is the finger 118. Also good. In the specific example shown in FIG. 14, the sensor as the finger 118 is connected to the two heat exchangers 200 and 200 ′. Instead, the sensor as the finger 118 is connected to only one heat exchanger. Obviously it may be.

  The invention has been described in terms of specific embodiments, including various details, in order to provide a clear explanation of the structure and operating principles of the invention. Such reference herein to specific embodiments and details thereof is not intended to limit the scope of the claims appended hereto. It will be apparent to those skilled in the art that the exemplary selected embodiments can be modified without departing from the spirit and scope of the present invention.

It is a side view of the conventional heat exchanger. It is a top view of the conventional heat exchanger. It is a side view of the conventional multilevel heat exchanger. 1 is a schematic diagram of a circulating cooling device incorporating a preferred embodiment of a flexible fluid transport microchannel heat exchanger according to the present invention. FIG. FIG. 6 is a schematic diagram of a circulating cooling device incorporating a variation of a flexible fluid transport microchannel heat exchanger according to the present invention. It is a top view of the modification of the manifold layer of the heat exchanger based on this invention. FIG. 3B is an exploded view of a heat exchanger with a manifold layer variation according to the present invention. 1 is a perspective view of manifold layers that are assembled together according to the present invention. FIG. 1 is a plan view of a contact layer and manifold layers that are assembled together according to the present invention. FIG. 1 is a cross-sectional view along line AA of a contact layer and a manifold layer mating with each other according to the present invention. FIG. FIG. 4 is a cross-sectional view along line B-B of the contact layer and the manifold layers mated together according to the present invention. FIG. 6 is a cross-sectional view along line CC of the contact layer and the manifold layers mated together according to the present invention. FIG. 3 is an exploded view of a contact layer and a manifold layer mating with each other according to the present invention. It is a perspective view of the modification of the contact layer based on this invention. It is a top view of the modification of the manifold layer based on this invention. 1 is a plan view of a contact layer according to the present invention. FIG. 1 is a plan view of a contact layer according to the present invention. FIG. It is a side view of the modification of the three-layer type heat exchanger based on this invention. It is a side view of the modification of the two-layer type heat exchanger based on this invention. 1 is a perspective view of a contact layer having a micro pin array according to the present invention. FIG. 1 is a perspective view of a contact layer having a micro pin array according to the present invention. FIG. 1 is a perspective view of a contact layer having a micro pin array according to the present invention. FIG. 1 is a perspective view of a contact layer having a micro pin array according to the present invention. FIG. 1 is a perspective view of a contact layer having a micro pin array according to the present invention. FIG. It is a partially notched perspective view of the modification of the heat exchanger based on this invention. 1 is an exploded view of a preferred heat exchanger according to the present invention. FIG. It is an exploded view of the modification of the heat exchanger based on this invention. It is a perspective view of the modification of the circulation level based on this invention. It is a perspective view from the bottom face side of the suitable inlet level based on this invention. It is a perspective view from the bottom face side of the modification of the inlet level based on this invention. It is the perspective view from the bottom face side of the suitable outlet level based on this invention. It is a perspective view from the bottom face side of the modification of the outlet level based on this invention. 1 is a cross-sectional view of a preferred heat exchanger according to the present invention. It is sectional drawing of the modification of the heat exchanger based on this invention. Figure 2 is a top view of the circulation level with a preferred configuration of inlet and outlet apertures according to the present invention for single phase flow flow. Figure 2 is a top view of the circulation level with a preferred configuration of inlet and outlet apertures according to the present invention for two-phase flow. 1 is a side view of a contact layer of a heat exchanger according to the present invention to which a coating material is applied. FIG. It is a flowchart which shows the manufacture procedure of the heat exchanger based on this invention. It is a figure which shows other embodiment of this invention which connects two heat exchangers to a heat source.

Claims (88)

a. A contact layer having a thickness of 0.3 mm to 1.0 mm, in contact with a heat source, wherein a fluid is flowed to cool the heat source;
b. A manifold layer coupled to the contact layer and having a first set of individualized channels for flowing fluid through the contact layer;
A heat exchanger in which the first set of individual channels are arranged to minimize pressure drop in the heat exchanger.   The heat exchanger of claim 1, wherein the manifold layer comprises a second set of individualized channels for receiving fluid from the contact layer.   The manifold layer includes a first port for supplying fluid to the first set of individualized channels and a second port for removing fluid from the second set of individualized channels. The heat exchanger according to claim 2, further comprising:   The first set of flow paths is configured to provide the shortest flow path distance along the contact layer to cool a predetermined region of the heat source to a desired temperature. The heat exchanger according to claim 1.   The first and second sets of flow paths provide a shortest flow path distance between the first and second ports to cool a predetermined region of the heat source to a desired temperature. The heat exchanger according to claim 3, wherein the heat exchanger is configured.   The heat exchanger according to claim 1, wherein the fluid is in a single-phase flow state.   The heat exchanger according to claim 1, wherein at least a part of the fluid is in a two-phase flow state.   The heat exchanger according to claim 1, wherein at least a part of the fluid transitions between a single laminar flow state and a two-phase flow state in the contact layer.   The manifold layer includes a circulation level having the first and second flow paths therein, and the circulation level is connected to the contact layer, and the first and second sets of the flow paths are used to 3. The heat exchanger according to claim 2, wherein the heat exchanger is configured to flow a fluid independently to and from the contact layer.   The cylindrical projection is connected to each flow path in the first set, and each cylindrical projection extends from the circulation level to a predetermined height. Heat exchanger. The manifold layer is
a. A first level configured to flow fluid between the first port and the first set of flow paths;
b. A second level coupled to the first level and configured to flow fluid between the second port and the second set of flow paths;
4. A heat exchanger according to claim 3, wherein the fluid flowing through the first level in the manifold layer is separated from the fluid flowing through the second level.   The first level includes a first corridor connected to the first port and the first set of flow paths, and the fluid in the first corridor is the first set of flow paths. The heat exchanger according to claim 11, wherein the heat exchanger flows directly into the heat exchanger.   The second level includes a second corridor connected to the second port and the second set of flow paths, and the fluid in the second set of flow paths is the second corridor. The heat exchanger according to claim 11, wherein the heat exchanger flows directly into the heat exchanger.   The first set of flow paths is thermally insulated from the second set of flow paths, and heat transport is performed between the first set of flow paths and the second set of flow paths. The heat exchanger according to claim 2, wherein there is no heat exchanger.   The heat exchanger according to claim 2, wherein the first set of flow paths and the second set of flow paths are evenly arranged along at least one dimension.   The heat exchanger according to claim 2, wherein the first set of flow paths and the second set of flow paths are non-uniformly arranged along at least one dimension.   2. The heat exchanger according to claim 1, wherein the flow paths of the first set are disposed at an optimum shortest distance from each other.   The heat exchanger according to claim 2, wherein the first set and the second set of flow paths are arranged to cool at least one contact layer hot spot region in the heat source.   At least one of the first flow paths flows through a plurality of first holes, and at least one of the plurality of first holes is substantially at least one of the second set of flow paths. 3. A heat exchanger according to claim 2 having a first dimension substantially equal to the second dimension of the two holes.   At least one of the first flow paths flows through a plurality of first holes, and at least one of the plurality of first holes is substantially at least one of the second set of flow paths. 3. A heat exchanger according to claim 2, having a first dimension different from the second dimension of the two holes.   The heat exchanger according to claim 1, wherein the contact layer is made of a material having a thermal conductivity of at least 100 W / m-K.   The heat exchanger according to claim 1, wherein the contact layer comprises a coating having a suitable thermal conductivity of at least 10 W / m-K.   The heat exchanger according to claim 1, wherein the contact layer further includes a plurality of pillars configured in a predetermined pattern along the contact layer. It said plurality of at least one of the pillars, (10 [mu] m) ² or (100 [mu] m) The heat exchanger of claim 23, wherein the having an area dimension in the range of ² or less.   24. The heat exchanger according to claim 23, wherein at least one of the plurality of pillars has a height dimension in a range of 50 [mu] m to 2 mm.   24. The heat exchanger according to claim 23, wherein the at least two pillars are spaced apart from each other with a spacing dimension in a range of 10 μm to 150 μm.   24. The heat exchanger of claim 23, wherein the plurality of pillars comprise a coating having a suitable thermal conductivity of at least 10 W / m-K.   24. The heat exchanger of claim 23, wherein at least one of the plurality of pillars has at least one changing dimension along a predetermined direction.   The heat exchanger according to claim 23, wherein an appropriate number of the pillars are disposed in a predetermined region along the contact layer.   The heat exchanger according to claim 1, wherein at least a part of the contact layer has a roughened surface.   24. A heat exchanger according to claim 23, wherein the contact layer comprises a coating having a suitable thermal conductivity of at least 10 W / m-K.   The heat exchanger according to claim 1, further comprising a microporous structure disposed along the contact layer.   The heat exchanger according to claim 32, wherein the microporous structure has a porosity in the range of 50 percent to 80 percent.   The heat exchanger according to claim 32, wherein an average pore size of the microporous structure is in a range of 10 µm to 200 µm.   The heat exchanger according to claim 32, wherein the microporous structure has a height dimension in a range of 0.25 mm to 2.00 mm.   The heat exchanger according to claim 32, wherein the microporous structure includes at least one hole having various dimensions along a predetermined direction.   The heat exchanger according to claim 1, further comprising a plurality of microchannels arranged in a predetermined configuration along the contact layer. It said plurality of at least one of the microchannels, (10 [mu] m) ² or (100 [mu] m) The heat exchanger of claim 37 characterized by having an area dimension in the range of ² or less.   38. The heat exchanger according to claim 37, wherein at least one of the plurality of microchannels has a height dimension in a range of 50 [mu] m to 2 mm.   38. The heat exchanger according to claim 37, wherein the at least two of the plurality of microchannels are spaced apart from each other with a spacing dimension in the range of 10 μm to 150 μm.   38. The heat exchanger according to claim 37, wherein at least one of the plurality of microchannels has a width dimension in a range of 10 [mu] m to 100 [mu] m.   38. The heat exchanger of claim 37, wherein the plurality of microchannels comprises a coating having a thermal conductivity of at least 10 W / m-K.   The heat exchanger according to claim 1, wherein the contact layer is connected to a heat source.   The heat exchanger according to claim 1, wherein the contact layer is formed integrally with the heat source.   The heat exchanger according to claim 1, wherein the heat source is an integrated circuit.   The heat exchanger according to claim 1, wherein the heat exchanger has an overhanging dimension within a range of 0 mm or more and 15 mm or less. In a heat exchanger configured to cool a heat source,
a. A contact layer having a thickness of 0.3 mm to 1.0 mm, configured to contact a heat source and flow fluid;
b. A manifold layer coupled to the contact layer,
The manifold layer is
1. A first level having a plurality of substantially vertical inlet channels configured to flow fluid through the contact layer and arranged to achieve an optimal fluid travel distance between each other;
2. And a second level having at least one outlet channel for removing fluid from the contact layer.   48. The heat exchanger of claim 47, wherein the first level comprises at least one first port configured to flow fluid through the inlet flow path.   The second level comprises at least one second port configured to flow fluid from the at least one outlet flow path, the second level fluid fluidizing the first level. The heat exchanger according to claim 48, wherein the heat exchanger flows separately.   The second level has a plurality of substantially vertical outlet channels that remove fluid from the contact layer, and the plurality of inlets and outlet channels provide an optimal fluid travel distance between each other. The heat exchanger according to claim 49, wherein the heat exchanger is arranged as follows.   The manifold layer is connected to the contact layer, extends vertically inside, a plurality of first apertures for flowing fluid along the inlet flow path to the contact layer, and extends vertically inside the outlet flow path. 51. The heat exchanger of claim 50, comprising a circulation level having a plurality of second apertures along which a fluid is received from the contact layer.   52. The heat exchanger of claim 51, wherein the first level comprises an inlet fluid corridor that allows fluid to flow horizontally from the first port to the first aperture.   53. The heat exchanger of claim 52, wherein the second level comprises an outlet fluid corridor that allows fluid to flow horizontally from the second aperture to the second port.   52. The heat exchanger of claim 51, wherein the first and second apertures are evenly disposed along at least one dimension.   52. A heat exchanger according to claim 51, wherein the first and second apertures are non-uniformly disposed along at least one dimension.   48. The heat exchanger of claim 47, wherein the inlet channel and at least one outlet channel are sealed together in the manifold layer.   The heat exchanger according to claim 47, wherein the contact layer is connected to a heat source.   The heat exchanger according to claim 47, wherein the contact layer is formed integrally with the heat source.   48. The heat exchanger of claim 47, wherein the heat source is an integrated circuit.   52. The heat exchanger of claim 51, wherein the first and second apertures are configured to cool at least one contact layer hot spot region of the heat source.   52. The heat exchanger of claim 51, wherein at least one of the first apertures has an inlet dimension that is substantially equal to at least one outlet dimension of the plurality of second apertures.   52. The heat exchanger of claim 51, wherein at least one of the first apertures has an inlet dimension that is different from at least one outlet dimension of the plurality of second apertures.   48. The heat exchanger according to claim 47, wherein the contact layer is made of a material having a thermal conductivity of at least 100 W / m-K.   48. The heat exchanger of claim 47, wherein the contact layer comprises a coating that provides a suitable thermal conductivity of at least 10 W / m-K.   48. The heat exchanger according to claim 47, wherein the contact layer further includes a plurality of pillars configured in a predetermined pattern along the contact layer. It said plurality of at least one of the pillar, (10 [mu] m) ² or (100 [mu] m) The heat exchanger of claim 65 characterized by having an area dimension in the range of ² or less.   66. The heat exchanger according to claim 65, wherein at least one of the plurality of pillars has a height dimension in a range of 50 μm to 2 mm.   66. The heat exchanger according to claim 65, wherein the at least two of the plurality of pillars are spaced apart from each other with a spacing dimension within a range of 10 μm to 150 μm.   66. The heat exchanger of claim 65, wherein the plurality of pillars comprise a coating having a suitable thermal conductivity of at least 10 W / m-K.   66. The heat exchanger of claim 65, wherein at least one of the plurality of pillars has at least one varying dimension along a predetermined direction.   66. The heat exchanger according to claim 65, wherein an appropriate number of the pillars are disposed in a predetermined area along the contact layer.   48. The heat exchanger of claim 47, wherein at least a portion of the contact layer has a roughened surface.   66. The heat exchanger of claim 65, wherein the contact layer comprises a coating having a suitable thermal conductivity of at least 10 W / m-K.   48. The heat exchanger of claim 47, further comprising a microporous structure disposed along the contact layer.   The heat exchanger according to claim 74, wherein the microporous structure has a height dimension within a range of 0.25 mm or more and 2.00 mm or less.   75. A heat exchanger according to claim 74, wherein the microporous structure comprises at least one hole having various dimensions along a predetermined direction.   The heat exchanger according to claim 74, wherein an average pore size of the microporous structure is in a range of 10 µm to 200 µm.   75. The heat exchanger according to claim 74, wherein at least one region of the microporous structure has a porosity of 50% or more and 80% or less.   48. The heat exchanger of claim 47, wherein the contact layer comprises a plurality of microchannels arranged in a suitable pattern. It said plurality of at least one of the microchannels, (10 [mu] m) ² or (100 [mu] m) The heat exchanger of claim 79, wherein the having an area dimension in the range of ² or less.   80. The heat exchanger according to claim 79, wherein at least one of the plurality of microchannels has a height dimension within a range of 50 μm to 2 mm.   80. The heat exchanger according to claim 79, wherein the at least two of the plurality of microchannels are spaced apart from each other with a spacing dimension in a range of 10 μm to 150 μm.   80. The heat exchanger according to claim 79, wherein at least one of the plurality of microchannels has a width dimension in a range of 10 μm to 100 μm.   80. The heat exchanger of claim 79, wherein the plurality of microchannels comprises a coating having a thermal conductivity of at least 10 W / m-K.   The heat exchanger according to claim 47, wherein the heat exchanger has an overhanging dimension in a range of 0 mm or more and 15 mm or less.   52. The heat exchanger of claim 51, further comprising a plurality of cylindrical protrusions extending from the circulation level to an appropriate height and connected to the first aperture. In electronic devices that generate heat,
a. An integrated circuit;
b. A contact layer having a thickness of 0.3 mm to 1.0 mm, integrally formed with the integrated circuit, configured to flow a fluid, and for cooling the heat generated by the electronic device;
c. At least one inlet channel for supplying fluid to the contact layer and at least one outlet channel for removing fluid from the contact layer, wherein the at least one inlet channel and at least one outlet channel are fluids And a manifold layer that circulates fluid through the contact layer. In a circulation system for cooling at least one integrated circuit,
a.
A contact layer having a thickness of 1.0.3 mm to 1.0 mm, configured to allow fluid flow, and contacting the integrated circuit;
2. At least one inlet channel for supplying fluid to the contact layer and at least one outlet channel for removing fluid from the contact layer, wherein the at least one inlet channel and at least one outlet channel are fluids Are arranged at intervals such that they are moved at an optimum shortest distance, and include a manifold layer connected to the contact layer,
At least one heat exchanger that absorbs heat generated by the integrated circuit;
b. At least one pump coupled to the at least one heat exchanger and circulating fluid to the circulation system;
c. A circulation system comprising: a heat removal device that is connected to the pump and the heat exchanger and cools the heated liquid discharged from the heat exchanger.

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