JP2008111653A - Cooler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cooling method and a cooler for cooling a heat source. <P>SOLUTION: This cooler is provided with a fluid heat exchanger, a pump, a thermoelectric device having a cooling portion and a heating portion, and a heat removing device contacting thermally with at least a portion of the heating portion of the thermoelectric device. The pump is connected to the fluid heat exchanger to make a fluid flow therethrough. The thermoelectric device is cooperated with the heat exchanger in the cooler to enhance the cooling efficiency of a cooling system. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

Related applications

  This patent application is filed on November 1, 2002 and is abandoned US Provisional Patent Application No. 60 / 423,009, entitled “Flexible Fluid Transport and Cooling of Hot Spots with Microchannel Heat Sink ( METHODS FOR FLEXIBLE FLUID DELIVERY AND HOTSPOT COOLING BY MICROCHANNEL HEAT SINKS), US Provisional Patent Application No. 60 / 442,382, filed January 24, 2003, abandoned OPTIMIZED PLATE FIN HEAT EXCHANGER FOR CPU COOLING "and pending US Provisional Patent Application No. 60 / 455,729, filed March 17, 2003, entitled" Porous " MICROCHANNEL HEAT EXCHANGER APPARATUS WITH POROUS CONFIGURATION AND METHOD OF MANUFACTURING THEREOF " Accordingly, pending US Provisional Patent Application No. 60 / 439,635, filed March 16, 2003, claiming priority under 35 USC 119 (e), title of invention “Fever” 2003, which is a continuation-in-part application of "METHOD AND APPARATUS FOR FLEXIBLE FLUID DELIVERY FOR COOLING DESIRED HOT SPOTS IN A HEAT PRODUCING DEVICE" US patent application Ser. No. 10 / 680,584, filed Oct. 6, 2000, entitled “Method and Apparatus for Efficient Vertical Fluid Transport for Cooling Heating Devices (METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE) No. 10/69, filed on Oct. 30, 2003, a continuation-in-part of US patent application , 179, part of continuation application of the title "METHOD AND APPARATUS FOR EFFICIENT VERTICAL FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE" Yes, all of these patent documents are incorporated herein by reference. US Patent Application No. 60 / 439,635, filed Mar. 16, 2003 and pending, entitled "Method for flexible fluid transport for cooling hot spots required in heat generating devices and "METHOD AND APPARATUS FOR FLEXIBLE FLUID DELIVERY FOR COOLING DESIRED HOT SPOTS IN A HEAT PRODUCING DEVICE" is a US provisional patent filed and abandoned on November 1, 2002, all incorporated herein by reference. Application 60 / 423,009, title of invention “METHODS FOR FLEXIBLE FLUID DELIVERY AND HOTSPOT COOLING BY MICROCHANNEL HEAT SINKS”, pending US provisional patent application No. 60 / 442,383, Title of Invention “OPTIMIZED PLATE FIN HEAT EXCHANGE R FOR CPU COOLING) and pending US Provisional Patent Application No. 60 / 455,729, filed Mar. 17, 2003, entitled “Microchannel Heat Exchanger Device with Porous Configuration and Method for Producing the Same” Claims priority under § 119 (e) of the US Patent Act for (MICROCHANNEL HEAT EXCHANGER APPARATUS WITH POROUS CONFIGURATION AND METHOD OF MANUFACTURING THEREOF).

  The present invention relates to a cooling method and a cooling apparatus for cooling a heat generating device, and more particularly, to a cooling method for efficient vertical fluid transport that cools an electronic device by minimizing a pressure drop in a heat exchanger. And a cooling device and an apparatus incorporating one or more thermoelectric devices.

  Microchannel heat sinks have been used in industry since their appearance in the early 1980s, showing applicability to high heat flux cooling applications. However, existing microchannels use conventional parallel channel arrangements, which are not suitable for cooling exothermic devices where the thermal load varies spatially. Such a heat generating device has a region that generates more heat than other regions. In the present specification, such a hotter region is referred to as a “hot spot”, and a region that generates less heat than the hot spot is referred to as a “warm spot”.

  1A and 1B show a side view and a plan view of a conventional heat exchanger 10, respectively. The heat exchanger 10 is connected to an electronic device 99 such as a microprocessor through a thermal interface material (hereinafter referred to as TIM) 98. As shown in FIGS. 1A and 1B, fluid typically flows from a single inlet port 12 as indicated by the arrows, flows along parallel microchannels 14 along the bottom surface 11, and flows out of the outlet port 16. The heat exchanger 10 cools the electronic device 99, but the fluid flows uniformly from the inlet port 12 to the outlet port 16. In other words, the fluid flows substantially uniformly along the entire bottom surface 11 of the heat exchanger 10 and no more fluid is supplied to the area of the bottom surface 11 corresponding to the hot spots of the device 99. . Further, the temperature of the liquid flowing in from the inlet port 12 usually increases as it flows along the bottom surface 11 of the heat exchanger 10. Accordingly, the cold fluid is not supplied to the downstream side of the heat source 99, that is, the region close to the outlet port 16, but actually, the warmer fluid or the two-phase fluid heated upstream is supplied. Thus, the heated fluid transports heat over the entire bottom surface 11 of the heat exchanger 10 and the area of the heat source 99, and in the vicinity of the outlet port 16, the fluid becomes very hot and cools the heat source 99. The effect of doing is lost. As the temperature rises, the liquid flowing on the bottom surface 11 boils, resulting in two-phase flow instabilities in which the fluid leaves the region where the most heat is generated. Furthermore, in the heat exchanger 10 having only one inlet port 12 and one outlet, the fluid travels along the long parallel microchannel 14 of the bottom surface 11 over the entire length of the heat exchanger 10. The result is a large pressure drop due to the length of fluid travel. When a large pressure drop occurs in the heat exchanger 10, it becomes difficult to pump fluid into the heat exchanger 10 and instability increases.

  FIG. 1C is a side view of a conventional multilevel heat exchanger 20. The fluid flows into the multi-level heat exchanger 20 through the port 22, travels downward through the plurality of jets 28 in the intermediate layer 26, and exits from the bottom surface 27 and the outflow port 24. Furthermore, the fluid that moves to the bottom surface 27 along the spout 28 does not flow uniformly. Furthermore, the multi-level heat exchanger 20 shown in FIG. 1C has the same problem as described with respect to the heat exchanger 10 of FIGS. 1A and 1B.

  An object of the present invention is to provide a heat exchanger that can reduce a pressure drop between an inlet port and an outlet port while efficiently cooling a heat source. Furthermore, an object of the present invention is to provide a heat exchanger that realizes appropriate temperature uniformity from the viewpoint of a heat source. Furthermore, an object of the present invention is to provide a heat exchanger that realizes appropriate temperature uniformity from the viewpoint of a hot spot of a heat source.

  As one aspect of the present invention, the present invention provides a cooling device for cooling a heat source. The cooling device includes a fluid heat exchanger, a pump connected to the fluid heat exchanger, and a fluid flowing therein, a cooling portion and a heating portion, and at least a part of the cooling portion is in thermal contact with the fluid heat exchanger. And a thermoelectric device that cools the fluid heat exchanger and a heat remover that is in thermal contact with at least a portion of the heating portion of the thermoelectric device.

  In the present invention, a thermoelectric device, a heat remover, and a fluid heat exchanger can be variously configured. For example, but not limited to these, the following configurations are possible. That is, the thermoelectric device and the fluid heat exchanger may be integrally formed. The thermoelectric device and the fluid heat exchanger may each be formed as a module and connected to each other. The thermoelectric device and the heat remover may be integrally formed. The thermoelectric device and the heat remover may each be formed as a module and connected to each other. The thermoelectric device, the heat remover, and the fluid heat exchanger may be integrally formed.

  Furthermore, the fluid heat exchanger, the heat remover, and the thermoelectric device are assumed to have a plurality of possible configurations. For example, when the cooling device cools the heat source, the fluid heat exchanger is located between the thermoelectric device and the heat source. The thermoelectric device may be disposed between the fluid heat exchanger and the heat remover.

  Furthermore, in the cooling device according to the present invention, the heat exchanger may include a manifold region and a microscale region for fluid transportation. The microscale region may include one of microchannels, micropillars, microlattices, and microporous regions. The pump used in the present invention is preferably an electromechanical pump, but may be any type of pump including, for example, an ion pump. Note that the present invention is not limited to the embodiments having the special configuration described above, and is defined only by the scope of the appended claims.

  Furthermore, the cooling device according to the present invention is a cooling device for cooling an electronic device, and includes a heat exchanger, a pump, a first thermoelectric device, a heat removal device, and a second thermoelectric device. The pump is connected to a fluid heat exchanger, and a fluid is flowed therein. Each thermoelectric device includes a cooling portion and a heating portion. The first thermoelectric device is configured such that at least a portion of the cooling portion is in thermal contact with the fluid heat exchanger, cools the fluid heat exchanger, and at least a portion of the heating portion contacts the heat sink. The second thermoelectric device has a cooling portion and a heating portion, at least a portion of the heating portion is in thermal contact with the fluid heat exchanger, heats the fluid heat exchanger, and at least a portion of the cooling portion is with the electronic device. It is configured to be in thermal contact and cool the electronic device.

  In the present invention, a thermoelectric device, a heat remover, and a fluid heat exchanger can be variously configured. For example, but not limited to these, the following configurations are possible. That is, the first thermoelectric device and the fluid heat exchanger may be integrally formed. The first thermoelectric device and the fluid heat exchanger may each be formed as a module and connected to each other. That is, the second thermoelectric device and the fluid heat exchanger may be integrally formed. The second thermoelectric device and the fluid heat exchanger may each be formed as a module and connected to each other. The first thermoelectric device and the heat remover may be integrally formed. The first thermoelectric device and the heat remover may each be formed as a module and connected to each other. The first thermoelectric device, the second thermoelectric device, the heat remover, and the fluid heat exchanger may be integrally formed.

  In addition, fluid heat exchangers, heat removers, and thermoelectric devices are envisioned in multiple possible configurations, for example, a thermoelectric device is located between a fluid heat exchanger and an electronic device when cooling the electronic device. The fluid heat exchanger may be disposed between the thermoelectric device and the heat remover.

  The heat exchanger may include a manifold region and a microscale region for fluid transport. The microscale region may include one of microchannels, micropillars, microlattices, and microporous regions. The pump used in the present invention is preferably an electromechanical pump, but may be any type of pump including, for example, an ion pump. Note that the present invention is not limited to the embodiments having the special configuration described above, and is defined only by the scope of the appended claims.

  Furthermore, the cooling device according to the present invention includes a fluid heat exchanger, a fluid conduit structure, a pump, a heat remover, and a thermoelectric device. The pump is connected to the fluid conduit structure and flows fluid to itself and the fluid heat exchanger. Both the heat remover and the thermoelectric device are coupled to the fluid conduit structure and are coupled in heat conduction with the fluid flowing through the fluid conduit structure.

  In the present invention, the thermoelectric device, the fluid conduit structure, the heat remover, and the fluid heat exchanger can be variously configured. For example, but not limited to these, the following configurations are possible. The thermoelectric device and the conduit structure may be integrally formed. The thermoelectric device and the conduit structure may each be formed as a module and connected to each other.

  In the cooling device according to the present invention, the heat exchanger may include a manifold region and a microscale region for fluid transportation. The microscale region may include one of microchannels, micropillars, microlattices, and microporous regions. The pump used in the present invention is preferably an electromechanical pump, but may be any type of pump including, for example, an ion pump. Note that the present invention is not limited to the embodiments having the special configuration described above, and is defined only by the scope of the appended claims.

  Furthermore, the present invention provides a microprocessor cooling device for cooling the microprocessor. The microprocessor cooling apparatus includes a fluid heat exchanger, a thermoelectric device, a heat remover, and a pump that causes fluid to flow through the fluid heat exchanger. The fluid heat exchanger can be coupled to the microprocessor in a heat conducting manner, and the thermoelectric device can be coupled to the fluid heat exchanger in a heat conducting manner and can be coupled to the microprocessor in a heat conducting manner. The heat remover is coupled to both the fluid heat exchanger and the thermoelectric device so as to conduct heat.

  In the present invention, a thermoelectric device, a heat remover, and a fluid heat exchanger can be variously configured. For example, but not limited to these, the following configurations are possible. The fluid heat exchanger, the heat remover, and the thermoelectric device may be integrally formed. The fluid heat exchanger, the heat remover, and the thermoelectric device may each be formed as a module and connected to each other.

  In the microprocessor cooling device, the heat exchanger may include a manifold region and a microscale region for fluid transport. The microscale region may include one of microchannels, micropillars, microlattices, and microporous regions. The pump used in the present invention is preferably an electromechanical pump, but may be any type of pump including, for example, an ion pump. Note that the present invention is not limited to the embodiments having the special configuration described above, and is defined only by the scope of the appended claims.

  Other features and advantages of the present invention will become apparent from the following detailed description of the preferred embodiment.

  The heat exchanger generally captures the thermal energy generated from the heat source, preferably by passing the fluid through selective regions of the contact layer that are coupled to the heat source. Specifically, the fluid identifies the contact layer to cool the hot spot and the area around the hot spot so as to achieve temperature uniformity across the heat source while keeping the pressure drop in the heat exchanger small. Shed in the area. As will be described in the various embodiments described below, the heat exchanger selects the contact layer using a plurality of apertures, channels and / or fingers in the manifold layer and using conduits in the intermediate layer. Fluid is circulated and circulated into and out of the hot spot area. Alternatively, heat exchangers are specially placed in place to cool the heat source effectively by allowing fluid to flow directly into and out of the hot spot. You may have the port of.

  Here, a microchannel heat exchanger for cooling the hot spot position of the device will be described, but alternatively, the heat exchanger of the present invention may be used to heat the cold spot position of the device. This will be apparent to those skilled in the art. Here, a microchannel heat exchanger for cooling the hot spot position of the device will be described. However, the present invention may be applied to other application examples and is not limited to the embodiments described herein. it is obvious.

  FIG. 2A shows a schematic of a circulating cooling device 30 comprising a suitable fluidly sealed microchannel heat exchanger 100 that is hermetically sealed in accordance with the present invention. Further, FIG. 2B shows a schematic of a circulating cooling device 30 'comprising another flexible fluid transport microchannel heat exchanger 100 having a plurality of ports 108', 109 'according to the present invention. Note that the system is not limited to the heat exchanger 100 shown here, and may include other heat exchanger embodiments.

  As shown in FIG. 2A, the fluid ports 108, 109 are connected to a fluid line 38, which is connected to a pump 32 and a thermal condenser 36. The pump 32 pumps and circulates fluid in the circulation type cooling device 30. In one embodiment, one fluid port 108 is used to supply fluid to the heat exchanger 100. In addition, one fluid port 109 is used to exhaust fluid from the heat exchanger 100. In one embodiment, a uniform, constant flow rate fluid flows into and out of the heat exchanger 100 via each fluid port 108, 109. Alternatively, fluids having different flow rates may be flowed into and discharged from the heat exchanger 100 via the fluid ports 108 and 109 at a predetermined time. Alternatively, as shown in FIG. 2B, a single pump may provide fluid to a plurality of designated inlet ports 108 '. Alternatively, multiple pumps (not shown) may provide fluid to their corresponding inlet port 108 and outlet port 109. Further alternatively, in this system, a suitable or alternative heat exchange using dynamic sensing and control module 34 depending on the change in the amount of heat at various hot spots or hot spot locations and the location of the hot spots. The flow rate of fluid entering and exiting the vessel may be dynamically varied and controlled.

  FIG. 3B is an exploded view of a preferred three-layer heat exchanger 100 with a preferred manifold layer according to the present invention. A three-layer heat exchanger 100 shown as one embodiment in FIG. 3B includes a contact layer 102, at least one intermediate layer 104, and at least one manifold layer 106. Alternatively, the heat exchanger 100 may be a two-layer device that includes a contact layer 102 and a manifold layer 106, as described below. As shown in FIGS. 2A and 2B, the heat exchanger 100 is connected to a heat source 99 which is an electronic device such as, but not limited to, a microchip or an integrated circuit, and exchanges heat with the heat source 99. A thermal interface material 98 is preferably sandwiched between the vessels 100. Alternatively, the heat exchanger 100 may be directly connected to the surface of the heat source 99. Alternatively, it will be apparent to those skilled in the art that, instead of this, the heat exchanger 100 may be formed integrally with the heat source 99, that is, the heat exchanger 100 and the heat source 99 may be formed as one piece. In this case, the contact layer 102 is formed integrally with the heat source 99 and is included in the same component as the heat source 99. In addition, a thermoelectric device 97 is preferably disposed between the thermal interface material 98 and the heat source 99. Details of the thermoelectric device 97 will be described later.

  Preferably, the heat exchanger 100 according to the present invention is configured to directly or indirectly contact a rectangular heat source 99 as shown in the figure. It will be apparent to those skilled in the art that the heat exchanger 100 may have any other shape depending on the shape of the heat source 99. For example, a heat exchanger according to the present invention may be configured to have a semicircular shape, whereby a heat exchanger (not shown) can be configured with a corresponding semicircular heat source (not shown). ) Directly or indirectly. Furthermore, the heat exchanger 100 preferably has a size slightly larger than the heat source in the range of 0.5 millimeters to 5.0 millimeters.

  FIG. 3A is a plan view of a preferred manifold layer 106 according to the present invention. Specifically, the manifold layer 106 includes four side surfaces in addition to the top surface 130 and the bottom surface 132, as shown in FIG. 3B. In FIG. 3A, the upper surface 130 is removed to appropriately represent and explain the function of the manifold layer 106. As shown in FIG. 3A, the manifold layer 106 comprises a series of channels or channels 116, 118, 120, 122 and ports 108, 109 formed in these channels. As shown in FIG. 3B, the fingers 118, 120 extend completely through the body of the manifold layer 106 in the Z direction. Alternatively, as shown in FIG. 3A, the fingers 118 and 120 may be formed in a part of the manifold layer 106, extend in the Z direction, and have an aperture. Further, the flow paths 116 and 122 may be formed so as to extend to a part of the manifold layer 106. The remaining region 107 between the inlet channel 116 and the outlet channel 120 extends from the top surface 130 to the bottom surface 132 and constitutes the body of the manifold layer 106.

  As shown in FIG. 3A, fluid enters the manifold layer 106 via the inlet port 108, flows along the inlet channel 116, and branches off from the inlet channel 116 in several directions, indicated as the X and Y directions. Into the finger 118, thereby supplying fluid to selected areas of the contact layer 102. The fingers 118 are formed in different predetermined directions and provide fluid to the location of the contact layer 102 corresponding to the hot spot of the heat source and the area in the vicinity thereof. These locations of the contact layer 102 are hereinafter referred to as contact hot spot regions. The fingers are configured to cool the stationary contact layer hot spot area and also to cool the temporally converting contact layer hot spot area. As shown in FIG. 3A, the channels 116, 122 and fingers 118, 120 are disposed in the manifold layer 106 in the X and Y directions. By forming channels 116, 122 and fingers 118, 120 in various directions in this manner, fluid is transported, hot spots of heat source 99 are cooled, and / or pressure drop in heat exchanger 100 is minimized. can do. Alternatively, as shown in the specific examples of FIGS. 4 and 5, the channels 116 and 122 and the fingers 118 and 120 may be arranged in the manifold layer 106 at regular intervals to form a predetermined pattern.

  The configuration and dimensions of the fingers 118, 120 are determined according to the hot spot of the heat source 99 that needs to be cooled. Manifold layer 106 is configured such that fingers 118 and 120 are located on or near the contact layer hot spot area in contact layer 102 based on the location of the hot spots and the amount of heat generated at or near each hot spot. The The manifold layer 106 circulates the single-phase fluid and / or the two-phase fluid through the contact layer 102 without causing a substantial pressure drop in the heat exchanger 100 and the circulating cooling device 30 (FIG. 2A). By transporting the fluid to the contact layer hot spot region, the temperature of the contact layer hot spot region is uniform, as is the region of the heat source adjacent to the contact layer hot spot region.

  The number and size of the channels 116 and fingers 118 are determined based on a number of factors. In one embodiment, inlet finger 118 and outlet finger 120 have the same width dimension. Alternatively, the inlet finger 118 and the outlet finger 120 may have different width dimensions. The width dimension of the fingers 118, 120 is preferably in the range of 0.25 millimeters to 0.50 millimeters. In one embodiment, inlet finger 118 and outlet finger 120 have the same length and depth dimensions. Alternatively, the inlet finger 118 and the outlet finger 120 may have different lengths and depth dimensions. In other embodiments, inlet finger 118 and outlet finger 120 may have various width dimensions along the length of the finger. The length dimension of the inlet finger 118 and the outlet finger 120 may be formed within a range of 0.5 millimeters or more and within three times the length dimension of the heat source. Further, the fingers 118, 120 may be formed to have a height or depth dimension in the range of 0.25 millimeters to 0.50 millimeters. Further, less than 10 or more than 30 fingers per centimeter are disposed in the manifold layer 106. However, it will be apparent to those skilled in the art that 10 to 30 fingers may be provided per centimeter in the manifold layer.

  In the present invention, the fingers 118 and 120 and the channels 116 and 122 may be irregularly formed in order to optimize the cooling efficiency of the hot spot of the heat source. In order to achieve a uniform temperature across the heat source 99, the spatial distribution of heat transport to the fluid may be matched to the spatial distribution of heat generation. As the fluid flows through the microchannel 111 along the contact layer, the temperature increases and begins to change to vapor under two-phase conditions. Thus, the fluid expands significantly, resulting in a significantly faster flow rate. The efficiency of heat transport from the contact layer to the fluid usually improves as the fluid flow rate increases. Therefore, by adjusting the dimensions of the cross-sections of the fingers 118, 120 and the channels 116, 122 for inflow and outflow of fluid in the heat exchanger 100, the efficiency of heat transport to the fluid can be adjusted.

  For example, a particular finger may be designed for a heat source that generates higher heat near the inlet. In addition, for areas where liquid and vapor mixing is expected, it may be advantageous to increase the cross-section of fingers 118, 120 and channels 116, 122. Although not shown in the figure, the flow velocity of the fluid can be increased by reducing the cross section of the finger on the inlet side. It is also possible to slow the fluid flow rate by increasing the cross-section of a particular finger or channel on the downstream outlet side. By designing the fingers or channels in this way, the pressure drop is minimized in the heat exchanger in the region where the fluid volume, acceleration and velocity increase due to the liquid to vapor change in two-phase flow. And hot spot cooling efficiency can be optimized.

  In addition, fluid flow rates at different desired locations within the microchannel heat exchanger 100 by temporarily widening the fingers 118, 120 and channels 116, 122 along their length and then again narrowing them. Can speed up. Instead, it is appropriate to adjust the heat transport efficiency according to the expected heat dissipation distribution across the heat source 99 by changing the finger and channel dimensions from large to small and from small to large many times. There can be. Note that the description regarding the change in the dimensions of the fingers and the channel is not limited to this embodiment, and can be similarly applied to other embodiments described later.

  Alternatively, as shown in FIG. 3A, the manifold layer 106 may include one or more apertures 119 in the inlet finger 118. In the three-layer heat exchanger 100, the fluid flowing along the fingers 118 flows into the intermediate layer 104 through the aperture 119. Instead, in the two-layer heat exchanger 100, the fluid flowing along the finger 118 flows directly from the aperture 119 into the contact layer 102. Further, as shown in FIG. 3A, the manifold layer 106 includes an aperture 121 in the outlet finger 120. In the three-layer heat exchanger 100, the fluid flowing out from the intermediate layer 104 flows into the outlet finger 120 through the aperture 121. Instead, in the two-layer heat exchanger 100, the fluid flowing out from the contact layer 102 flows directly into the outlet finger 120 through the aperture 121.

  In a variation, the inlet finger 118 and the outlet finger 120 are open channels that do not have an aperture. The bottom surface 132 of the manifold layer 106 contacts the upper surface of the intermediate layer 104 in the three-layer heat exchanger 100, and contacts the contact layer 102 in the two-layer heat exchanger. In this way, in the three-layer heat exchanger 100, fluid can freely pass between the intermediate layer 104 and the manifold layer 106. Fluid is flowed through the conduit 105 of the intermediate layer 104 to properly enter and exit the appropriate contact layer hot spot area. As will be apparent to those skilled in the art, conduit 105 may be arranged to align directly with the fingers, as described below, or elsewhere in the three-layer system.

  FIG. 3B shows a three-layer heat exchanger 100 having a manifold layer as a modified example. Instead, the heat exchanger 100 has a two-layer structure including a manifold layer 106 and a contact layer 102. In this case, the fluid flows directly between the manifold layer 106 and the contact layer 102 without passing through the intermediate layer 104. It will be apparent to those skilled in the art that the manifold layer, intermediate layer, and contact layer configurations shown herein are exemplary and that the actual configuration is not limited to the configurations shown herein.

  As shown in FIG. 3B, the intermediate layer 104 preferably comprises a plurality of conduits 105 extending through the intermediate layer 104 itself. An inflow conduit 105 circulates fluid from the manifold layer 106 to a designated contact layer hot spot area of the contact layer 102. Similarly, the aperture 105 allows fluid to flow from the contact layer 102 to the outlet port 109. In this manner, the intermediate layer 104 provides fluid transport from the contact layer 102 to an outlet port 109 coupled to the manifold layer 106.

  The conduit 105 is disposed in the intermediate layer 104 in a predetermined pattern based on a number of factors. These factors include, but are not limited to, the position of the contact layer hot spot region, the flow rate necessary to appropriately cool the heat source 99 in the contact layer hot spot region, the temperature of the fluid, and the like. The width dimension of the other portions is designed to be several millimeters at the maximum, but the conduit 105 preferably has a width dimension on the order of several hundred microns. However, the conduit 105 may be formed in other dimensions based at least on the factors described above. It will be apparent to those skilled in the art that each conduit 105 of the intermediate layer 104 has the same shape and / or dimensions, but this condition is not necessary. For example, similar to the fingers described above, the conduit may have varying length and / or width dimensions instead of this embodiment. Alternatively, the conduit 105 may have a constant depth or height dimension through the intermediate layer 104. Alternatively, the conduit 105 may have different depth dimensions, for example, a trapezoidal or nozzle-shaped shape in the thickness direction of the intermediate layer 104. The horizontal shape of the conduit 105 is shown as a rectangle in FIG. 3B, but the horizontal shape of the conduit 105 can be any other shape, such as a circle (FIG. 3A), a curved shape, an ellipse, or the like. There may be. Alternatively, the one or more conduits 105 may be formed into a shape corresponding to the shape of a part or the whole of the upper one or more fingers.

  The intermediate layer 104 is preferably disposed horizontally within the heat exchanger 100 such that the conduit 105 is vertical. Alternatively, the intermediate layer 104 may be arranged in any other direction within the heat exchanger 100, such as, but not limited to, oblique or curved. Alternatively, the conduit 105 may be disposed horizontally, diagonally, curved, or in any other direction within the intermediate layer 104. Further, the intermediate layer 104 preferably extends horizontally along the entire length of the heat exchanger 100, and the intermediate layer 104 completely separates the contact layer 102 from the manifold layer 106, thereby forcing the fluid into the conduit. 105 may be distributed. Alternatively, a portion of the heat exchanger 100 does not include the intermediate layer 104 between the manifold layer 106 and the contact layer 102, thereby allowing fluid to flow freely between the manifold layer 106 and the contact layer 102. You may do it. Further alternatively, the intermediate layer 104 may extend vertically between the manifold layer 106 and the contact layer 102 to form an independent, individual intermediate layer region. Alternatively, the intermediate layer 104 may not extend completely from the manifold layer 106 to the contact layer 102.

  FIG. 10A is a perspective view of a preferred embodiment of a contact layer 302 in accordance with the present invention. As shown in FIG. 10A, the contact layer 302 includes a series of pillars 303 extending upward from the bottom surface 301 of the contact layer 302. Further, FIG. 10A shows a microporous structure 301 provided on the bottom surface of the contact layer 302. It should be noted that the contact layer 302 may include only the microporous structure 301 and may include any other contact layer structure (for example, a microchannel, a pillar, etc.) in addition to the microporous structure. It is. Details regarding the microporous structure will be described later.

  As will be described in more detail later, the fluid travels through the series of inlet apertures to the contact layer 302 and through a series of outlet apertures that are spaced an optimum distance from the inlet aperture. It is discharged from the contact layer 302. In other words, fluid flows from each inlet aperture toward the nearest outlet aperture. Preferably, each inlet aperture is surrounded by an outlet aperture. In this way, the fluid entering the contact layer 302 flows towards the surrounding outlet aperture. Thus, the contact layer 302 is preferably provided with pillars 303 to transport sufficient heat to the fluid and to minimize the pressure drop of the fluid as it flows from the inlet aperture to the outlet aperture.

  Contact layer 302 preferably comprises a dense array of high and narrow pillars 303 extending perpendicularly from bottom surface 301 and contacting the bottom surface of the manifold layer. Instead of this, the pillar 303 may not be in contact with the bottom surface of the manifold layer. Further, at least one of the pillars 303 may extend at a predetermined angle with respect to the bottom surface 301 of the contact layer 302. Further, the pillars 303 are preferably arranged at equal distances from each other along the contact layer 302, thereby making the heat transport capability of the contact layer 302 constant over the bottom surface 301. Alternatively, the pillars 303 may be arranged at non-uniform intervals. For example, in the specific example shown in FIG. 10B, the central pillar 303 of the contact layer 302 is arranged at a wider interval than the peripheral pillar 303. Has been. The distance between the pillars 303 is determined based on the size of the heat source 99, resistance to the fluid, the size and position of the hot spot, the heat flux density from the heat source 99, and the like. For example, decreasing the density of the pillar 303 decreases the fluid resistance, but decreases the surface area for heat transport from the contact layer 302 to the fluid. Note that the configuration of the pillars 303 arranged at non-uniform intervals is not limited to the embodiment of FIG. 10B, and other configurations are possible depending on the conditions relating to the heat source and the required operation of the circulating cooling device 30 (FIG. 2A). Any configuration may be used.

  Furthermore, the pillar 303 is preferably formed in a cylindrical shape, as shown in FIG. 10A, so that fluid flows from the inlet aperture to the outlet aperture with minimal resistance. However, the pillar 303 has, but is not limited to, a square 303B (FIG. 10B), a diamond shape, an ellipse 303C (FIG. 10C), a hexagon 303D (FIG. 10D), or any other shape. May be. Further, the contact layer 302 may comprise a combination of different shaped pillars along the bottom surface 301.

  For example, as shown in FIG. 10E, the contact layer 302 may include several sets of rectangular fins 303E, and the rectangular fins 303E in each set may be arranged radially with respect to each other. Further, the contact layer 302 may include a plurality of pillars 303B disposed between a set of rectangular fins 303E. In one embodiment, an open circular area within a radially configured rectangular fin 303E may be placed under each inlet aperture to help guide fluid to the outlet aperture. Thus, the radially configured fins 303E contribute to minimizing the pressure drop while realizing a substantially uniform supply of the cooling fluid in the contact layer 302. Depending on the size and relative position of the inlet and outlet apertures, the pillar and / or fin configuration can be variously selected, and depending on whether the fluid is single-phase or two-phase flow, the contact layer 302 The most suitable configuration can be selected. It will be apparent to those skilled in the art that any of the embodiments described herein and variations thereof can be combined with various pin 303 configurations.

  The heat exchanger 100 according to the present invention preferably has a larger width than the heat source 99. If the heat exchanger 100 is larger than the heat source 99, there is an overhang dimension. The overhang dimension is the farthest distance between one outer wall of the heat source 99 and the fluid channel wall inside the heat exchanger 100, such as, for example, the inner wall of the inlet port 316 (FIG. 12A). In a preferred embodiment, the overhang dimension is 0-5 millimeters for single phase flow and 0-15 millimeters for two phase flow. Furthermore, the thickness dimension of the contact layer 102 of the present invention is preferably 0.3 to 0.7 millimeters for single phase flow and 0.3 to 1.0 millimeters for two phase flow. .

  The heat exchanger 100 in the embodiment of the present invention uses a microporous structure 301 provided on the contact layer 302. The microporous structure 301 has an average pore size in the range of 10 to 200 microns for both single laminar and two phase flows. Furthermore, it is desirable that the porosity of the microporous structure 301 be in the range of 50 to 80 percent in both the single-layer flow and the two-phase flow. The height of the microporous structure 301 is preferably in the range of 0.25 to 2.00 millimeters for both single-layer flow and two-phase flow.

In embodiments using pillars and / or microchannels along the contact layer 302, the contact layer 102 according to the present invention has a thickness dimension in the range of 0.3 to 0.7 millimeters for single phase flow. And has a thickness dimension in the range of 0.3 to 1.0 millimeters for a two-phase flow. Furthermore, for both single-phase and two-phase flows, at least one pillar has an area in the range of (10 microns) ² to (100 microns) ² . Furthermore, the separation dimension between at least two of the pillars and / or microchannels is in the range of 10 to 150 microns for both single-phase flow and two-phase flow. The width dimension of the microchannel is set in the range of 10 to 100 microns for both the single-phase flow and the two-phase flow. The height dimension of the microchannels and / or pillars is in the range of 50 to 800 microns for single phase flow and in the range of 50 microns to 2 millimeters for two phase flow. It will be apparent to those skilled in the art that dimensions other than those described above may be used.

  FIG. 3B shows a perspective view of a variation of the contact layer 102 according to the present invention. As shown in FIG. 3B, the contact layer 102 includes a bottom surface 103 and preferably a plurality of microchannel walls 110, and the region between the microchannel walls 110 allows fluid to flow along the fluid flow path. Or distribute. The bottom surface 103 is flat and has a high thermal conductivity that realizes sufficient heat transport from the heat source 99. Alternatively, the bottom surface 103 may comprise troughs and / or crests designed to collect fluid at a particular location or to retreat fluid from a particular location. The microchannel walls 110 are formed in parallel, as shown in FIG. 3B, so that fluid flows between the microchannel walls 110 along the flow path.

  Alternatively, it will be apparent to those skilled in the art that the microchannel wall 110 may be configured in any other suitable configuration based on the factors described above. For example, as shown in FIG. 8C, the contact layer 202 may have grooves between sections of the microchannel wall 210. Further, the microchannel wall 110 may have dimensions to minimize the pressure drop or pressure differential within the contact layer 102. Also, although not limited to the following, other structures other than the microchannel wall 110 may be used, such as rough surfaces, for example, microporous structures such as sintered metal and silicon foam. it is obvious. Here, by way of example, the contact layer 102 in the present invention will be described using the parallel microchannel walls 110 shown in FIG. 3B. Alternatively, the microchannel wall 110 may have a non-parallel configuration.

  Through the microchannel wall 110, the fluid exchanges heat along the selected hot spot location in the contact layer hot spot region and cools the heat source 99 at that location. The microchannel wall 110 preferably has a height dimension in the range of 100 microns to 1 millimeter and a width dimension in the range of 50 microns to 2 millimeters, depending on the amount of heat of the heat source 99. The microchannel wall 110 has a length dimension in the range of 100 microns to several centimeters, depending on the size of the heat source and the size of the hot spot and the heat flux density from the heat source. Alternatively, any other microchannel wall dimension may be used. The microchannel walls 110 are separated by an interval in the range of 50 to 500 microns depending on the amount of heat of the heat source 99, but this interval may be set to any other value.

  In FIG. 3B, the top surface of the manifold layer 106 is shown cut away to show the channels 116, 122 and fingers 118, 120 in the body of the manifold layer 106. Here, the position of the heat source 99 that generates high heat is defined as a hot spot, and the position of the heat source 99 that generates lower heat is defined as a warm spot. As shown in FIG. 3B, the heat source 99 has a position A that is a hot spot area and a position B that is a warm spot area. The area of the contact layer 102 that contacts the hot spot and the warm spot is shown as the contact layer hot spot area. That is, as shown in FIG. 3B, the contact layer 102 includes a contact layer hot spot region A on the position A and a contact layer hot spot region B on the position B.

  As shown in FIGS. 3A and 3B, the fluid first flows into the heat exchanger 100, preferably via one inlet port 108. The fluid then preferably flows into one inlet channel 116. Alternatively, the heat exchanger 100 may include two or more inlet channels 116. As shown in FIGS. 3A and 3B, the fluid flowing from the inlet port 108 along the inlet channel 116 first branches to the finger 118A. Further, fluid flowing along the remainder of the inlet channel 116 is poured into individual fingers, such as fingers 118B and fingers 118C.

  In the example shown in FIG. 3B, the fluid is supplied to the contact layer hot spot region A by pouring the fluid into the finger 118A. That is, the fluid flows down to the intermediate layer 104 through the fingers 118A. The fluid flows into the contact layer 102 via the inlet conduit 105A disposed under the finger 118A and exchanges heat with the heat source 99. As described above, the microchannels of the contact layer 102 may be arranged in any direction. For example, the microchannel 111 in the contact layer hot spot region A is disposed in a direction orthogonal to the other microchannel wall 110 of the contact layer 102. Thereby, the fluid from the conduit 105A moves along the microchannel 111 as shown in FIG. 3B, and in other regions of the contact layer 102, the fluid moves in different directions. The heated fluid then flows up to the outlet finger 120A via the outlet conduit 105D.

  Similarly, fluid flows down in the Z direction to the intermediate layer 104 via fingers 118E and 118F. The fluid then flows down to the contact layer 102 in the Z direction via the inlet conduit 105C. Then, the heated fluid flows in the Z direction from the contact layer 102 to the outlet fingers 120E and 120F via the outlet conduit 105D. The heat exchanger 100 removes the fluid heated in the manifold layer 106 via the outlet fingers 120, which are connected to the outlet channels 122. Through the outlet channel 122, fluid is preferably exhausted from the heat exchanger via one outlet port 109.

  Also, in one embodiment, the inflow and outflow conduits 105 are disposed directly or nearly directly over a suitable contact layer hotspot area to supply fluid directly to the hot spot of the heat source 99. Further, to minimize the pressure drop, each outlet finger 120 is disposed in the vicinity of each inlet finger 118 corresponding to a particular contact layer hot spot area. Thus, the fluid flows into the contact layer 102 via the inlet finger 118A and travels the shortest distance from the contact layer 102 to the outlet finger 120A along the bottom surface 103 of the contact layer 102. It is clear that the distance that the fluid travels along the bottom surface 103 properly removes heat from the heat source 99 without causing an unnecessary amount of pressure drop. Further, as shown in FIGS. 3A and 3B, in order to reduce the pressure drop of the fluid flowing along the finger 118, the corner portions in the fingers 118, 120 are preferably formed to be curved.

  As will be apparent to those skilled in the art, the configuration of manifold layer 106 shown in FIGS. 3A and 3B is merely exemplary. The configuration of the channels 116 and fingers 118 in the manifold layer 106 is not limited to the following, but includes the location of the contact layer hot spot region, the flow rate of fluid to and from the contact layer hot spot region. It depends on many factors such as the amount of heat generated by the heat source in the contact layer hot spot region. For example, as shown in FIGS. 4-7A and described below, one possible configuration for the manifold layer 106 is to combine parallel inlet and outlet fingers alternately along the width of the manifold layer. You may comprise in such a pattern (interdigitated pattern). The channel 116 and the finger 118 may be arranged in any other configuration.

  FIG. 4 is a perspective view of another manifold layer 406 of a heat exchanger according to the present invention. The manifold layer 406 of FIG. 4 includes a plurality of parallel fluid fingers 411, 412 that mate or mesh with each other, thereby creating a substantial pressure drop within the heat exchanger 400 and the circulating cooling device 30 (FIG. 2A). Instead, a single phase fluid and / or a two phase fluid can be circulated through the contact layer 402. As shown in FIG. 4, the inlet fingers 411 and the outlet fingers 412 are alternately arranged. However, it will be apparent to those skilled in the art that any number of inlet fingers or outlet fingers may be arranged adjacent to each other, and therefore the present invention is not limited to the alternating configuration shown in FIG. . In addition, the fingers may be arranged alternately such that parallel fingers diverge from other parallel fingers, or parallel fingers are connected to other parallel fingers. Accordingly, more inlet fingers may be provided than outlet fingers, and conversely, more outlet fingers may be provided than inlet fingers.

  The channel or inlet finger 411 supplies the fluid flowing into the heat exchanger to the contact layer 402, and the channel or outlet finger 412 takes out the fluid discharged from the heat exchanger 400 from the contact layer 402. With the configuration of the manifold layer 406 shown here, the fluid can flow into the contact layer 402, travel a very short distance in the contact layer 402, and then flow into the outlet channel 412. By substantially reducing the length of fluid travel along the contact layer 402, the pressure drop in the heat exchanger 400 and the circulating cooling device 30 (FIG. 2A) can be substantially reduced.

  As shown in FIGS. 4 and 5, the manifold layer 406 shown as a modified example is connected to two inlet channels 411 and includes a channel 414 for supplying fluid thereto. The manifold layer 406 shown in FIGS. 4 and 5 includes three outlet channels 412 connected to the channel 418. The flow path 414 of the manifold layer 406 has a flat bottom surface that allows fluid to flow through the fingers 411, 412. Alternatively, a gentle slope may be provided in the channel 414 in order to allow fluid to flow through the selected fluid channel 411. Alternatively, one or more apertures may be provided on the bottom surface of the inlet channel 414 in order to allow a part of the fluid to flow down to the contact layer 402. Similarly, manifold layer flow path 418 may have a flat bottom surface that contains fluid and allows fluid to flow to port 409. Alternatively, a gentle slope may be provided in the flow path 418 to allow fluid to flow through the selected outlet port 409. Furthermore, in this specific example, the width of the flow paths 414, 418 is about 2 millimeters. However, in other specific examples, any other width dimension may be used.

  The flow paths 414, 418 are connected to ports 408, 409, which are connected to fluid lines 38 (FIG. 2A) of the circulating cooling device 30. The manifold layer 406 includes fluid ports 408 and 409 disposed in the horizontal direction. Alternatively, although not shown in FIGS. 4-7, the manifold layer 406 may include fluid ports 408, 409 configured vertically and / or diagonally, as described below. Instead of this, the manifold layer 406 may not include the flow path 414. In this case, fluid is supplied directly from the port 408 to the finger 411. Further, alternatively, the manifold layer 406 may not include the flow path 418, in which case the fluid in the finger 412 is discharged directly from the heat exchanger 400 via the port 408. Here, the two ports 408 are connected to the flow paths 414 and 418, but instead, any other number of ports may be provided.

  The inlet channel 411 has dimensions to allow fluid to move to the contact layer without causing a large pressure drop along the channel 411 and the circulating cooling device 30 (FIG. 2A). The width dimension of the inlet channel 411 is, for example, in the range of 0.25 millimeters to 5.00 millimeters. However, any other dimensions may be used. Furthermore, the length of the inlet channel 411 may be formed within a range of 0.5 mm or more and within three times the length of the heat source. Alternatively, this length dimension may be any value. Further, as described above, the inlet flow path 411 extends downwardly toward the microchannel 410 or at a position slightly higher than the height of the microchannel 410 so that the fluid flows directly into the microchannel 410. The height dimension of the inlet channel 411 is preferably in the range of 0.25 mm or more and 5.00 mm or less. It will be apparent to those skilled in the art that the flow path 411 does not have to extend downward toward the microchannel 410, and any height dimension other than those shown here may be used. Moreover, although the inlet channel 411 has the same dimension here, it is clear to those skilled in the art that the inlet channel 411 may have a different dimension. Further, alternatively, the inlet channel 411 may vary in width, cross-sectional dimensions, and / or distance between adjacent fingers. In particular, the channel 411 may include a region having a wider width or deeper depth and a region having a narrower width or shallower depth along the longitudinal direction. By varying the dimensions in this way, more fluid is provided to a given contact layer hot spot region in the contact layer 402 through a wider portion, and the narrow portion provides a warm spot contact layer hot spot region. The flow rate can be limited.

  Further, the outlet channel 412 has dimensions suitable for moving fluid to the contact layer without causing a large pressure drop along the circulating cooling device 30 (FIG. 2A) and the channel 412. The outlet channel 412 has a width dimension in the range of 0.25 millimeters to 5.00 millimeters, but any other width dimension may be used. Furthermore, the length of the outlet channel 412 may be formed within a range of 0.5 mm or more and within three times the length of the heat source. Further, as described above, the outlet flow path 412 extends downwardly toward the microchannel 410 or at a position slightly higher than the height of the microchannel 410 so that fluid flows directly into the microchannel 410. The height dimension of the inlet channel 411 is preferably in the range of 0.25 mm or more and 5.00 mm or less. Also, here, the outlet channels 412 have the same dimensions, but it will be apparent to those skilled in the art that the outlet channels 412 may have different dimensions. Further, alternatively, the inlet channel 411 may vary in width, cross-sectional dimensions, and / or distance between adjacent fingers.

  As shown in FIGS. 4 and 5, the inlet channel 411 and the outlet channel 412 are segmented and separated from each other, so that the fluids in these channels do not mix. Specifically, as shown in FIG. 4, the two outlet channels 412 are provided on the outer edge side of the manifold layer 406, and the one outlet channel 412 is provided in the center of the manifold layer 406. Further, the two inlet channels 411 are provided adjacent to both sides of the central outlet channel 412. With this particular configuration, fluid entering the contact layer 402 travels a short distance within the contact layer 402 before flowing out of the contact layer 402 via the outlet channel 412. However, it will be apparent to those skilled in the art that the inlet and outlet channels may be arranged in any other suitable configuration, and thus are not limited to the configurations shown and described herein. The number of inlet fingers 411 and outlet fingers 412 in the manifold layer 406 is desirably greater than three and desirably less than ten per centimeter in the manifold layer 406. Further, it is apparent to those skilled in the art that the number of the inlet channels and the outlet channels is not limited to the configuration shown and described here, and may be any other number.

  The manifold layer 406 is connected to an intermediate layer (not shown), and the intermediate layer (not shown) is connected to the contact layer 402, thereby forming a three-layer heat exchanger 400. This intermediate layer has been described in connection with the embodiment shown in FIG. 3B. Alternatively, as shown in FIG. 7A, the manifold layer 406 may be connected to the contact layer 402 and disposed on the contact layer 402 to form a two-layer heat exchanger 400. A cross section of a suitable manifold layer 406 coupled to the contact layer 402 of the two-layer heat exchanger is shown in FIGS. 6A-6C. Specifically, FIG. 6A is a cross-sectional view of heat exchanger 400 taken along line AA in FIG. 6B is a cross-sectional view of the heat exchanger 400 along line BB in FIG. 5, and FIG. 6C is a cross-sectional view of the heat exchanger 400 along line CC in FIG. As described above, the inlet channel 411 and the outlet channel 412 extend from the upper surface of the manifold layer 406 to the bottom surface. When the manifold layer 406 and the contact layer 402 are connected to each other, the inlet channel 411 and the outlet channel 412 have the same height as the microchannel 410 of the contact layer 402 or a slightly higher height. With this configuration, the fluid from the inlet channel 411 easily flows out of the inlet channel 411 through the microchannel 410. Further, according to this configuration, the fluid flowing through the microchannel 410 easily flows up to the outlet channel 412 after flowing through the microchannel 410.

  Although not shown in the figure, as an alternative, the intermediate layer 104 (FIG. 3B) may be disposed between the manifold layer 406 and the contact layer 402. The intermediate layer 104 (FIG. 3B) allows fluid to flow to designated contact layer hot spot areas in the contact layer 402. Further, the intermediate layer 104 (FIG. 3B) can be used to provide a uniform flow of fluid to the contact layer 402. In addition, the intermediate layer 104 can be used to provide fluid to the contact layer hot spot region of the contact layer 402 to properly cool the hot spot and to equalize the temperature in the heat source 99. The inlet channel 411 and the outlet channel 412 are not necessarily required, but are disposed on or near the hot spot of the heat source 99 in order to properly cool the hot spot.

  FIG. 7A is an exploded view of another manifold layer 406 with another contact layer 102 in accordance with the present invention. Contact layer 102 includes a continuous configuration of microchannel walls 110, as shown in FIG. 3B. In this configuration, generally speaking, fluid, like the manifold layer 106 shown in FIG. 3B, flows into the manifold layer 406 via the fluid port 408, travels through the flow path 414, and is a fluid finger or flow path 411. Head for. The fluid flows into the opening of the inlet finger 411 and flows along the length of the finger 411 in the X-direction, as indicated by the arrow. Further, the fluid flows down in the Z direction to a contact layer 402 provided below the manifold layer 406. As shown in FIG. 7A, in the contact layer 402, the fluid flows along the bottom surface of the contact layer 402 in the X and Y directions and exchanges heat with the heat source 99. The heated fluid flowed upward in the Z direction through the outlet finger 412 and out of the contact layer 402, and the outlet finger 412 was heated in the flow path 418 of the manifold layer 406 along the X-direction. Flow fluid. The fluid then flows along the flow path 418 and is discharged from the heat exchanger by flowing out of the port 409.

  As shown in FIG. 7A, the contact layer comprises a series of grooves 416 disposed between a set of microchannels 410 that allow fluid to flow into and into the channels 411, 412. Flows out of 412. Specifically, the groove 416A is located directly below the inlet flow path 411 of the other manifold layer 406, so that the fluid entering the contact layer 402 passes through the inlet flow path 411 to the microchannel adjacent to the groove 416A. Direct inflow. In this manner, the groove 416A allows the fluid to flow directly from the inlet channel 411 to a specific designated channel, as shown in FIG. 7A. Similarly, the contact layer 402 has a groove 416B provided immediately below the outlet channel 412 in the Z direction. Thereby, the fluid that flows horizontally along the microchannel 410 toward the outlet channel flows horizontally in the groove 416B and vertically flows in the outlet channel 412 above the groove 416B.

  FIG. 6A is a cross-sectional view of a heat exchanger 400 that includes a manifold layer 406 and a contact layer 402. Specifically, FIG. 6A shows an inlet channel 411 combined with the outlet channel 412, whereby fluid flows down to the inlet channel 411 and flows up to the outlet channel 412. In addition, as shown in FIG. 6A, the fluid flows horizontally through the microchannel 410 disposed between the inlet and outlet channels and separated by grooves 416A, 416B. Alternatively, the microchannel walls may be continuous without being separated by the grooves (FIG. 3B). As shown in FIG. 6A, both or one of the inlet channel 411 and the outlet channel 412 has a curved surface 420 at the end near the groove 416. Due to the curved surface 420, the fluid flows down the channel 411 toward the microchannel 410 adjacent to the channel 411. In this manner, the fluid entering the contact layer 102 flows more easily toward the microchannel 410 than flowing directly into the groove 416A. Similarly, the curved surface 420 of the outlet channel 412 directs fluid from the microchannel 410 to the outer channel 412. Similarly, the curved surface 420 of the outlet channel 412 directs fluid from the microchannel 410 to the outer channel 412.

  In a variation, as shown in FIG. 7B, the contact layer 402 'includes an inlet channel 411 and an outlet channel 412 as described above with respect to the manifold layer 406 (FIGS. 4 and 5). In a variation, fluid is supplied directly from the fluid port 408 'to the contact layer 402'. The fluid flows along the flow path 414 'toward the inlet flow path 411'. The fluid then traverses the set of microchannels 410 ', exchanges heat with a heat source (not shown), and flows into the outlet channel 412'. The fluid then flows along the outlet channel 412 'to the channel 418' and is discharged from the contact layer 402 'via the fluid port 409'. The fluid ports 408 ', 409' may be formed in the configured contact layer 402 'or may be formed in the manifold layer 406 (FIG. 7A).

  Note that although the heat exchanger according to the present invention is shown here to operate in all horizontal directions, it will be apparent to those skilled in the art that this heat exchanger may operate in the vertical direction. . When operating in the vertical direction, the heat exchanger is configured such that each inlet channel is located above an adjacent outlet channel. Thus, fluid enters the contact layer via the inlet channel and naturally flows into the outlet channel. Obviously, any other configuration of the manifold layer and contact layer may be used to operate the heat exchanger in the vertical direction.

  8A to 8C are plan views of other embodiments of the heat exchanger according to the present invention. Specifically, FIG. 8A is a plan view of another manifold layer 206 in accordance with the present invention. 8B and 8C are plan views of the intermediate layer 204 and the contact layer 202, respectively. Further, FIG. 9A shows a three-layer heat exchanger using another manifold layer 206, and FIG. 9B shows a two-layer heat exchanger using another manifold layer 206.

  As shown in FIGS. 8A and 9A, the manifold layer 206 includes a plurality of fluid ports 208 configured horizontally and vertically. Alternatively, the fluid port 208 may be disposed at an angle with respect to the manifold layer 206 or in any other direction. The fluid port 208 is disposed at a selected location within the manifold layer 206 to effectively provide fluid to a predetermined contact layer hot spot area of the heat exchanger 200. Multiple fluid ports 208 have the important advantage of being able to provide fluid directly from the fluid ports to a particular contact layer hot spot area without causing a large pressure drop in the heat exchanger 200. Further, the fluid port 208 is disposed in the manifold layer 206 so that the fluid in the contact layer hot spot region can travel the shortest distance to the exhaust port 208 so that the fluid can flow into the inlet and outlet ports 208. Achieve temperature uniformity while maintaining a minimum pressure drop between. Further, the use of the manifold layer 206 can stabilize the two-phase flow in the heat exchanger 200 while providing an even and uniform flow across the contact layer 202. Instead, two or more manifold layers 206 are provided in the heat exchanger 200, and one manifold layer 206 allows fluid to flow to and from the heat exchanger 200, and the other manifold layer (see FIG. (Not shown) may control the rate of fluid circulation to the heat exchanger 200. Alternatively, all of the plurality of manifold layers 206 may circulate fluid to a corresponding selected contact layer hot spot area in the contact layer 202.

  The manifold layer 206 shown as a modification has a lateral dimension corresponding to the dimension of the contact layer 202. Further, the manifold layer 206 has the same dimensions as the heat source 99. Alternatively, the manifold layer 206 may be larger than the heat source 99. The vertical dimension of the manifold layer 206 may be in the range of 0.1 to 10 millimeters. Further, the size of the aperture in the manifold layer 206 that is coupled to the fluid port 208 may be in the range between 1 millimeter and the full width or length of the heat source 99.

  FIG. 11 is a perspective view with a portion cut away of a three-layer heat exchanger 200 having another manifold layer 206 according to the present invention. As shown in FIG. 11, the heat exchanger 200 is divided into individual regions based on the amount of heat generated along the body of the heat source 99. These regions are separated by the vertical intermediate layer 204 and / or the microchannel wall structure 210 of the contact layer 203. However, as will be apparent to those skilled in the art, the configuration of the present invention is not limited to the assembly shown in FIG. 11, which is shown for illustrative purposes only. The heat exchanger 200 is connected to one or more pumps, one pump is connected to the inlet 208A and the other pump is connected to the inlet 208B.

  As shown in FIG. 3B, the heat source 99 has a hot spot at position A and a warm spot at position B, and the hot spot at position A generates higher heat than the warm spot at position B. It is obvious that the heat source 99 may have two or more hot spots and warm spots at any time and at any position. In this specific example, the position A is a hot spot, and from the position A, more heat is transported to the contact layer 102 on the position A (shown as the contact layer hot spot area A in FIG. 11). Thus, the heat exchanger 200 provides more fluid and / or a higher flow rate fluid to the contact layer hot spot region A in order to properly cool position A. In this specific example, the contact layer hot spot region B is shown larger than the contact layer hot spot region A, but the contact layer hot spot regions A and B in the heat exchanger 200 and all other contact layer hot spots are shown. It will be appreciated that the spot area may have any size and / or may have any relative configuration.

  Alternatively, as shown in FIG. 11, fluid enters the heat exchanger via fluid port 208A and flows into the contact layer hot spot region A by flowing along the intermediate layer 204 to the inflow conduit 205A. Also good. Next, the fluid flows down the inflow conduit 205 </ b> A in the Z direction and reaches the contact layer hot spot region A of the contact layer 203. The fluid flows between the microchannels 210 </ b> A so that heat from location A is transported to the fluid by heat conduction through the contact layer 203. The heated fluid flows along the contact layer 203 in the contact layer hot spot region A toward the outlet port 209 </ b> A and is discharged from the heat exchanger 200. It will be apparent to those skilled in the art that any number of inlet ports 208 and outlet ports 209 may be used for a particular contact layer hot spot region or set of contact layer hot spot regions. Further, the outlet port 209A is disposed near the contact layer 203A, but alternatively, the outlet port 209A is not limited to the following, for example, any other location such as the manifold layer 206. You may arrange | position perpendicular | vertical to.

  In the specific example shown in FIG. 11, the heat source 99 has a warm spot at the position B that generates heat lower than the position A of the heat source 99. The fluid that flows in through the port 208B is supplied to the contact layer hot spot region B by flowing into the inflow conduit 205B along the intermediate layer 204B. Next, the fluid flows down the inflow conduit 205 </ b> B in the Z direction and reaches the contact layer hot spot region B of the contact layer 203. The fluid flows between the microchannels 210A in the X and Y directions so that heat from location B is transported to the fluid by heat conduction through the contact layer 203. The heated fluid flows up the discharge port 209B in the Z direction along the entire contact layer 203B in the contact layer hot spot region B via the outlet conduit 205B of the intermediate layer 204, and is discharged from the heat exchanger 200. The

  Instead, as shown in FIG. 9A, the heat exchanger 200 may include a vapor permeable film 214 disposed on the contact layer 203. The vapor permeable membrane 214 is in sealing contact with the inner wall of the heat exchanger 200. The vapor permeable membrane 214 has several small apertures, and the vapor generated along the contact layer 202 flows into the fluid port 208 through this aperture. Further, the vapor permeable membrane 214 is configured to have hydrophobicity, whereby the vapor permeable membrane 214 prevents the liquid flowing along the contact layer 202 from passing through the aperture. For other details of the vapor permeable membrane 214, see co-pending US patent application Ser. No. 10 / 366,128, filed Feb. 12, 2003, entitled “Vapor-permeable microchannel heat. "VAPOR ESCAPE MICROCHANNEL HEAT EXCHANGER", which is incorporated herein by reference.

  FIG. 12A is an exploded view of a preferred heat exchanger 300 in accordance with the present invention. FIG. 12B is an exploded view of another heat exchanger 300 'according to the present invention. As shown in FIGS. 12A and 12B, the heat exchanger 300, 300 'includes contact layers 302, 302' and manifold layers 306, 306 'connected thereto. As described above, the heat exchangers 300 and 300 ′ may be connected to a heat source (not shown) or may be configured integrally with the heat source (eg, may be incorporated in a microprocessor). ). Although the contact layers 302 and 302 ′ are not substantially exposed to the outside, it is obvious to those skilled in the art that FIG. 12A shows the contact layers 302 and 302 ′ exposed for explanation. . In one embodiment, the contact layers 302, 302 'comprise a plurality of pillars 303 disposed along a bottom surface 301 (not shown). Furthermore, the pillar 303 may have any shape as described with reference to FIGS. 10A to 10E and / or may be provided with fins 303E configured in a radial manner. Further, the contact layer 302 may have any of the other features described above (eg, microchannels, rough surfaces, etc.). Contact layer 302 and the structure within contact layer 302 preferably have the same thermal conductivity characteristics, as described above with respect to the preferred embodiment. In the illustrated example, the contact layer 302 has a smaller dimension than the manifold layer 306, but the dimensions of the contact layer 302 and the manifold layer 306 are in any other relationship with respect to each other and the heat source 99. It will be apparent to those skilled in the art that The contact layers 302, 302 'have the same characteristics as the contact layers described above, and the same description will not be repeated here.

  Often, the heat exchanger 300 uses the delivery channels 322 of the manifold layer 306 to minimize pressure drop within the heat exchanger. The transport channel 322 is disposed vertically within the manifold layer 306 and supplies fluid vertically to the contact layer 302 to reduce the pressure drop across the heat exchanger 300. As described above, a pressure drop occurs or rises in the heat exchanger 300 as the fluid flows in the X and Y directions along the contact layer for a significant amount of time and / or distance. Manifold layer 306 minimizes flow in the X and Y directions by flowing fluid perpendicular to contact layer 302 through several transport channels 322. In other words, the fluid is individually sprayed directly onto the contact layer 302 from above. The transport channels 322 are arranged at an optimum distance from each other, thereby minimizing fluid flow in the X and Y directions, with much flowing perpendicular to the contact layer 302. Thus, fluid flows in an upward direction away from the contact layer 302 due to the forces of the individual flow paths from the optimally positioned channel 322. Further, the individual channels 322 divide the flow rate into several channels 322 to the maximum within the contact layer 302, thereby reducing the pressure drop in the heat exchanger 300 while effectively cooling the heat source 99. be able to. Further, in the configuration of the heat exchanger 300, in order to cool the heat source 99 appropriately, the distance that the fluid moves in the X direction and the Y direction, which are horizontal directions, can be shortened. It can be made smaller.

  The preferred manifold layer 306 shown in FIG. 12A has two independent levels. Specifically, the manifold layer 306 has a level 308 and a level 312. Level 308 is coupled to contact layer 302 and level 312. In FIG. 12A, level 312 is disposed above level 308, but it will be apparent to those skilled in the art that level 308 may be disposed above level 312. It will also be apparent to those skilled in the art that any number of levels may be provided based on the present invention.

  The manifold layer 306 'shown as a variation in FIG. 12B has three independent levels. Specifically, the manifold layer 306 'has a circulation level 304', a level 308 ', and a level 312'. Circulation level 304 'is coupled to contact layer 302' and level 308 '. Level 308 'is coupled to circulation level 304' and level 312 '. In FIG. 12B, level 312 'is disposed above level 308', but it will be apparent to those skilled in the art that level 308 'may be disposed above level 312'. It will also be apparent to those skilled in the art that any number of levels may be provided based on the present invention.

  FIG. 12C is a perspective view of a circulation level 304 'according to the present invention. The circulation level 304 'has a top surface 304A' and a bottom surface 304B '. Also, as shown in FIGS. 12B and 12C, several apertures 322 'are opened in the circulation level 304'. In one embodiment, the opening of the aperture 322 'is provided in the same plane as the bottom surface 304B'. Alternatively, the aperture 322 'may protrude beyond the bottom surface 304B' and supply fluid to the contact layer 302 'from closer. Further, the circulation level 304 ′ may have several apertures 324 ′ penetrating perpendicularly from the top surface 304A ′ to the bottom surface 304B ′, and the aperture 324 ′ may protrude a predetermined distance in the Z direction. Good. Alternatively, it will be apparent to those skilled in the art that the apertures 322 ', 324' may extend at a predetermined angle at the circulation level and need not be completely vertical. As described above, in one embodiment, the contact layer 302 '(FIG. 12B) is coupled to the bottom surface 304B' of the circulation level 304 '. In this way, the fluid flows into the contact layer 302 'via the aperture 322' in the Z direction and is discharged from the contact layer 302 'via only the aperture 324' in the Z direction. As described below, the fluid entering the contact layer 302 'via the aperture 322' is separated from the fluid exiting the contact layer 302 'via the circulation level 304' aperture 324 '.

  As shown in FIG. 12C, a portion of the aperture 324 ′ has a cylindrical member extending in the Z direction from the top surface 304A ′ of the circulation level 304 ′, so that fluid can be passed through the aperture 324 ′. It flows directly to level 312 ′ corridor 328 ′ (FIGS. 12F and 12G). In the specific example shown in FIG. 12C, the cylindrical protrusion has a circular cross section, but this shape may be any shape. It should be noted that fluid flows in the horizontal and vertical directions from each aperture 322 'along the contact layer 302' to the adjacent aperture 324 '. In one embodiment, the apertures 322 ′ and 324 ′ are thermally isolated from each other so that heat from the heated fluid that is exhausted from the contact layer 302 ′ via the manifold layer 306 ′ is It does not propagate to the cooled fluid that pours into the contact layer 302 'through the manifold layer 306'.

  FIG. 12D shows another embodiment of level 308 according to the present invention. As shown in FIG. 12D, the level 308 has a top surface 308A and a bottom surface 308B. The bottom surface 308B of level 308 is directly coupled to the contact layer 302 as shown in FIG. 12A. Level 308 includes a recessed corridor 320 that includes several fluid transport channels 322 that supply fluid to the contact layer 302. The recessed corrider 320 is in sealing contact with the contact layer 302, and the fluid discharged from the contact layer 302 flows around and between the channels 322 in the collider 320 and is discharged out through the port 314. Is done. Note that the fluid discharged from the contact layer 302 does not flow into the transport channel 322.

  FIG. 12E is a perspective view of the back side of level 308 'according to the present invention. Level 308 'has a top surface 308A' and a bottom surface 308B ', and the bottom surface 308B' of level 308 'is directly coupled to circulation level 304' (FIG. 12C). The level 308 'preferably includes a port 314', a corridor 320 'and a plurality of apertures 322', 324 'on the bottom 308B' side. It will be apparent to those skilled in the art that any number of ports and corridors may be provided at level 308 '. The apertures 322 ', 324' shown in FIG. 12E are configured to face the circulation level 304 '. Specifically, as shown in FIG. 12E, the aperture 322 ′ causes fluid flowing into the collider 320 ′ to flow to the contact layer 302 ′, and the aperture 324 ′ causes fluid from the contact layer 302 ′ to flow to level 312 ′. . The aperture 324 'extends through the corridor 320' at the level 308 '. The apertures 324 'are individually separated so that the fluid flowing through the aperture 324' does not contact or mix with the fluid flowing through the cylinder associated with the aperture 324 '. Also, separating each aperture 324 'can ensure that the fluid flowing through each aperture 324' flows along the flow path provided by the aperture 324 '. In one embodiment, the aperture 324 'is configured vertically. This allows fluid to flow vertically in most of the manifold layer 306 '. In particular, if an aperture 322 'is provided between the contact layer and the level, it is clear that a similar approach can be applied to the aperture 322'.

  In this example, each hole or aperture 322 has the same size, but each aperture 322 may have a different or varying diameter along the length. For example, the diameter of the aperture 322 close to the port 314 may be reduced to limit the flow rate passing therethrough. Reducing the aperture 322 facilitates fluid flow away from the port 314 and below the aperture 322. By changing the diameter of the aperture 322 in this way, the fluid can be supplied to the contact layer 302 more uniformly. It will be apparent to those skilled in the art that the diameter of the aperture 322 may be varied to effectively cool a known contact layer hot spot area in the contact layer 302. It will be apparent to those skilled in the art that the above description can also be applied to the aperture 324 ', and that the size of the aperture 324' can be varied or varied to make the fluid flowing out of the contact layer 302 constant.

  In one embodiment, port 314 provides fluid to level 308 and contact layer 302. The port 314 shown in FIG. 12D extends from the top surface 308A to the corridor 320 through a portion of the level 308 body. Alternatively, the port 314 may be connected to the corridor 320 from the side or bottom surface of the level 308. Preferably, port 314 is coupled to port 315 at level 312 (FIGS. 12A, 12B). The port 314 is sealed as shown in FIG. 12C or connected to a corridor 320 formed as a depression as shown in FIG. 12D. The corrider 320 preferably serves to flow fluid from the contact layer 302 to the port 314. Alternatively, the corrider 320 allows fluid to flow from the port 314 to the contact layer 302.

  As shown in FIGS. 12F and 12G, the level 312 port 315 is aligned with and connected to the port 314. As shown in FIG. 12A, fluid flows into heat exchanger 300 via port 316 and flows down to transport channel 322 at level 308 and finally to contact layer 302 via corridor 328. Alternatively, as shown in FIG. 12B, fluid flows into heat exchanger 300 'via port 315' and flows to contact layer 302 'via port 314' at level 308 '. Port 315 shown in FIG. 12F extends from top surface 312A to the body of level 312. Alternatively, port 315 may extend from the side of level 312. Alternatively, level 312 may not have port 315, in which case fluid enters heat exchanger 300 via port 314 (FIGS. 12D and 12E). Further, level 312 includes a port 316, which preferably allows fluid to flow through corridor 328 '. It will be apparent to those skilled in the art that this level may include any number of ports and corridors. The corridor 328 causes fluid to flow from the transport channel 322 to the contact layer 302 eventually.

  FIG. 12G is a rear perspective view of a variation of level 312 'according to the present invention. Level 312 'is linked to level 308' shown in FIG. 12E. As shown in FIG. 12F, the level 312 'includes a recessed corridor 328' exposed in the body along the bottom surface 312B '. Recessed corridor 328 'is connected to port 316' and fluid travels directly from recessed corridor 328 'to port 316'. A recessed corridor 328 'is disposed on the upper surface 308A' of the level 308 'so that fluid can freely move from the aperture 324' to the collider 328 '. The periphery of the recessed corridor 328 'and the bottom surface 312B' is sealed to the top surface 308A 'of the level 312' so that all of the fluid from the aperture 324 'flows into the port 316' via the corridor 328 '. To do. Each aperture 330 ′ of the bottom surface 312B ′ is aligned and connected to the aperture 321 ′ of the level 308 ′ (FIG. 12E), and the aperture 330 ′ is provided in the same plane as the top surface 308A ′ (FIG. 12E) of the level 308 ′. . Alternatively, the aperture 330 'may have a diameter that is slightly larger than the diameter of the corresponding aperture 324' so that the aperture 324 'extends through the aperture 330' to the collider 328 '.

  FIG. 12H shows a cross-section at line HH of the heat exchanger of FIG. 12A according to the present invention. As shown in FIG. 12H, the contact layer 302 is coupled to a heat source 99. As described above, the heat exchanger 300 may be integrally formed with the heat source 99 as one component. Contact layer 302 is coupled to bottom surface 308B of level 308. In addition, level 312 is coupled to level 308 and the top surface 308A of level 308 is sealed against the bottom surface 312B of level 312. The periphery of the level 308 corridor 320 is connected to the contact layer 302. Further, the level 312 corridor 328 is coupled to the level 308 aperture 322. The bottom surface 312B of level 312 is sealed against the top surface 308A of level 308 so that fluid does not leak between the two levels 308,312.

  FIG. 12I shows a cross section along line II of a variation of the heat exchanger shown in FIG. 12B according to the present invention. As shown in FIG. 12I, the contact layer 302 'is coupled to a heat source 99'. The contact layer 302 'is connected to the bottom surface 304B' of the circulation level 304 '. Also, the circulation level 304 'is coupled to the level 308', and the upper surface 304A 'of the circulation level 304' is sealed against the bottom surface 308B 'of the level 308'. In addition, level 312 'is coupled to level 308', and top surface 308A 'of level 308' is sealed against bottom surface 312B 'of level 312'. The perimeter of the level 308 'corridor 320' is connected to the upper surface 304A 'aperture of the circulation level 304' so that fluid does not leak between the two levels 308 ', 304'. Further, the perimeter of the level 312 'corridor 328' is connected to the upper surface 308A 'aperture of the circulation level 308' so that fluid does not leak between the two levels 312 ', 308'.

  In actual operation, the cooled fluid enters the heat exchanger 300 via level 312 port 316, as indicated by the arrows in FIGS. 12A and 12H. The cooled fluid flows from port 316 down to corridor 328 and is poured into contact layer 302 via transport channel 322. The cooled fluid in the corridor 320 does not come into contact with or mix with the heated fluid discharged from the heat exchanger 300. The fluid entering the contact layer 302 exchanges heat with the heat source 99 and absorbs heat generated from the heat source 99. The configuration of the aperture 322 is optimized to effectively cool the heat source 99 and to move the fluid the shortest distance in the X and Y directions in the contact layer 302 to minimize the pressure drop in the heat exchanger 300. Is done. The heated fluid flows from the contact layer 302 to the corridor 320 at level 308 in the Z direction. The heated fluid that exits the manifold layer 306 does not come into contact with or mix with the cooled fluid that flows into the manifold layer 306. The heated fluid flows into the corridor 320 and is discharged from the heat exchanger 300 through the ports 314 and 315. It will be apparent to those skilled in the art that fluid may flow in a direction opposite to that shown in FIGS. 12A and 12H without departing from the scope of the present invention.

  In operation in the variation, as shown by the arrows in FIGS. 12B and 12I, the cooled fluid enters the heat exchanger 300 'via the port 315' at level 312 '. The cooled fluid flows from port 315 'down to level 308' port 314 '. The fluid then flows into the corridor 320 'and down to the contact layer 302' via the circulation level 304 'aperture 322'. However, the cooled fluid of the corridor 320 'does not come into contact with or mix with the heated fluid discharged from the heat exchanger 300'. The fluid entering the contact layer 302 ′ exchanges heat with the heat source 99 and absorbs heat generated from the heat source 99. As will be described later, the configuration of the apertures 322 ′ and 324 ′ effectively cools the heat source 99 and allows the fluid along the contact layer 302 ′ to have the shortest distance from each aperture 322 ′ to the adjacent aperture 324 ′. Optimized to move and minimize pressure drop during this time. The heated fluid flows in the Z direction from the contact layer 302 'via level 308' and reaches the level 312 'corridor 328' via several apertures 324 '. As the heated fluid flows up the aperture 324 ', it does not come into contact with or mix with the cooled fluid entering the manifold layer 306'. The heated fluid enters the level 312 'corridor 328' and exits the heat exchanger 300 'via the port 316'. It will be apparent to those skilled in the art that fluid may flow in a direction opposite to that shown in FIGS. 12B and 12I without departing from the scope of the present invention.

  In the manifold layer 306, the aperture 322 is configured to minimize the distance that the fluid flows through the contact layer 302 while properly cooling the heat source 99. In the manifold layer 306 'shown as a variation, the aperture 322' and the aperture 324 'are configured to minimize the distance that fluid flows through the contact layer 302'. Specifically, the apertures 322 ′ and 324 ′ provide a substantially vertical flow path, and the length of the flow path in the heat exchanger 300 ′ is minimized in the horizontal and X directions. The As a result, the heat exchangers 300 and 300 ′ appropriately cool the heat source 99 and greatly reduce the distance through which the fluid flows. Therefore, the heat exchangers 300 and 300 ′ and the circulating cooling devices 30 and 30 ′ ( The pressure drop within (calculating for 2A-2B) can be greatly reduced. The particular configuration and cross-sectional dimensions of aperture 322 and / or aperture 324 are not limited to the following, but are based on various factors such as, for example, flow conditions, temperature, amount of heat generated from heat source 99, fluid flow rate, and the like. Determined. Hereinafter, the apertures 322 and 324 will be described, but this description may be applied to only one of the aperture 322 and the aperture 324.

  Apertures 322 and 324 are disposed at an optimum distance from each other to properly cool the heat source 99 to a desired temperature and to minimize pressure drop. In the embodiment of aperture 322 and / or aperture 324 configuration and optimal distance, the flow through the apertures 322, 324 and often the contact layer 302 can be separated by changing the size and position of the individual apertures. Can be optimized. Furthermore, the aperture configuration in one embodiment can optimize the total flow rate of fluid entering the contact layer and the area cooled by the fluid flowing through each aperture 322.

  In one embodiment, the apertures 322, 324 may be configured in an alternating configuration, i.e., a checkered pattern, in the manifold layer 306, as shown in FIGS. Apertures 322 and 324 are spaced apart by the shortest distance that each fluid needs to move in a checkered pattern. However, the apertures 322 and 324 need to be separated from each other by a sufficient distance to supply the coolant to the contact layer 302 for a sufficient time. As shown in FIGS. 13 and 14, one or more apertures 322 are associated to travel the shortest distance along the contact layer 302 before the fluid entering the contact layer 302 is drained from the contact layer 302. A configuration may be adopted in which the apertures 324 are adjacent to each other and vice versa. Thus, as shown in FIGS. 13 and 14, the apertures 322, 324 are arranged radially around each other and fluid travels the shortest distance from all apertures 322 to the closest aperture 324. For example, as shown in FIG. 13, fluid that enters the contact layer 302 via one particular aperture 322 will experience minimal resistance by the adjacent aperture 324. Further, the cross sections of the apertures 322 and 324 are preferably circular, but the cross section may have any other shape.

  Further, as described above, the aperture 324 shown in the above-described figure protrudes from the circulation level 304 or the levels 308 and 312 as a cylindrical member, but the aperture can be seen from any level of the manifold layer 306. It does not have to protrude. The manifold layer 306 may also have a rounded surface near the area where the fluid changes direction, thereby enhancing the effect of reducing the pressure drop in the heat exchanger 300.

  The dimensions of the apertures 322, 324 and the optimal distance configuration depend on the temperature at which the fluid is exposed along the contact layer 302. In addition, the cross-sectional dimensions of the flow paths in the apertures 322 and 324 need to be large enough to reduce the pressure drop in the heat exchanger 300. When the fluid is only in a single-phase flow along the contact layer 302, each aperture 322 is surrounded by a plurality of adjacent apertures 324 in a symmetric hexagonal configuration, as shown in FIG. Furthermore, in the case of a single phase flow, the number of apertures at the circulation level 304 is substantially equal. Further, for single phase flow, the apertures 322, 324 preferably have the same diameter. However, it will be apparent to those skilled in the art that the configurations and ratios of the apertures 322 and 324 are not limited to the above-described embodiments.

  When the fluid is in a two-phase flow along the contact layer 302, the apertures 322, 324 are in an asymmetric configuration to accommodate the acceleration of the two-phase flow. However, the apertures 322 and 324 may be symmetrically configured even in the case of a two-phase flow. For example, at the circulation level 304, the apertures 322 and 324 may be arranged symmetrically so that the opening of the aperture 324 is larger than the opening of the aperture 322. Alternatively, for a two-phase flow, the number of apertures 324 may be greater than the number of apertures 322 at the circulation level 304 using the hexagonal symmetrical configuration shown in FIG.

  The hot spots of the heat source 99 may be cooled by alternately arranging the apertures 322 and 324 at the circulation level 304. That is, for example, at the circulation level 304, the two apertures 322 are alternately arranged adjacent to each other, and both the apertures 322 are configured to be positioned on the contact layer hot spot region or in the vicinity of the contact layer hot spot region. Also good. It goes without saying that a suitable number of apertures 324 are placed adjacent to both apertures 322 to reduce the pressure drop across the contact layer 302. Thus, the two apertures 322 provide a cold fluid to the contact layer hot spot area and cool the contact layer hot spot area to a uniform and substantially equal temperature as described above.

  As described above, the heat exchanger 300 has significant advantages over other heat exchangers. In the heat exchanger 300, since the pressure drop is reduced because the vertical flow path is used, a pump having a relatively low performance can be used. Furthermore, the configuration of the heat exchanger 300 allows the inlet and flow path to be individually optimized along the contact layer 302. Furthermore, the individual levels allow for customizable designs to optimize heat transport homogeneity, reduced pressure drop, and individual component dimensions. Also, the configuration of the heat exchanger 300 can reduce the pressure drop in a system where the fluid is in a two-phase flow state, and therefore this configuration can be used in either a single-phase flow system or a two-phase flow system. it can. Furthermore, as described below, the heat exchanger accommodates many different manufacturing methods and can adjust the component geometry to compensate for tolerances.

  FIG. 18 is a perspective view of a heat exchanger 600 according to an embodiment of the present invention. As shown in FIG. 18, the heat exchanger 600 includes a bottom manifold layer 604, a contact layer 602, and a top manifold layer 606. The top manifold layer 606 is connected to the bottom manifold layer 604, and the contact layer 602 is disposed between the upper and lower manifold layers 604, 606. As shown in FIGS. 18 and 19, the top manifold layer 606 preferably includes two apertures 608, 609 that extend through the top manifold layer 606. Specifically, preferably, the inlet aperture 608 flows a cooled fluid through the heat exchanger 600, and the outlet aperture 609 receives a warmed or hot fluid from the heat exchanger 600. 18 and FIG. 19 show one inlet aperture 608 and outlet aperture 609, respectively, the number of inlet apertures 608 and outlet apertures 609 may be any number. Further, here, the inlet aperture 608 and the outlet aperture 609 are configured vertically, but instead, in the top manifold layer 606, the apertures 608, 609 may be provided horizontally and / or obliquely. . In addition, the top manifold layer 606 includes a plurality of outlet fluid channels 610 connected to an outlet chamber 612 and an outlet aperture 609. In FIG. 19, the fluid channels 610 are shown as being configured linearly and parallel to each other, but instead the fluid channels 610 may be configured in any pattern and have any shape. You may do it.

  The bottom manifold layer 604 includes a top surface 614 that corresponds to the bottom surface 615 (FIG. 19) of the top manifold layer 606. The bottom manifold layer 604 includes a recessed area 616 that bites into the body of the bottom manifold layer 604 from the top surface 614. The recessed area 616 has a suitable depth for receiving the contact layer 602, which is flush with the top surface 614 when coupled to the bottom manifold layer 604, as shown in FIG. As shown in FIG. 18, the recessed region 616 includes a protruding surface 620 having a plurality of fluid channels 618, the protruding surface 620 and the fluid channel 618 being configured parallel to each other. The protruding surface 620 protrudes from the bottom surface of the recessed region 616 by an appropriate distance so that the bottom surface of the contact layer 602 contacts the protruding surface 620. The bottom manifold layer 604 and the protruding surface 620 are formed of a material having a high thermal conductivity so that heat generated by the heat source 99 is transported directly to the contact layer 602 via the protruding surface 620. Further, the fluid in the recessed area 616 absorbs heat in the recessed area 616 that flows along the fluid channel 618 through the protruding surface 620, where the fluid is exchanged for heat exchange in the recessed area 616. The temperature rises.

  Thus, higher temperature fluid flows from the fluid channel 618 to the contact layer 602. Contact layer 602 flows fluid from recessed area 616 of bottom manifold layer 604 to fluid channel 610 (FIG. 19) of top manifold layer 606. Contact layer 602 is also in contact with a thermally conductive protruding surface 620 in bottom manifold layer 604. The contact layer 602 provides a heat exchange environment and the fluid can properly absorb heat from the heat source 99. For this reason, the contact layer 602 preferably has a microporous structure, so that the contact layer 602 has a high surface-volume ratio, as described above. Alternatively, the contact layer 602 may comprise microchannels (not shown), pillars (not shown), or any combination thereof.

  In the specific examples shown in FIGS. 18 to 20, the fluid enters and exits the heat exchanger 600 through the top manifold layer 606, but the fluid may enter and exit through the bottom manifold layer 604, Or it may enter and exit through a combination of upper and lower manifold layers 604, 606. For example, in a variation, fluid enters the heat exchanger 600 from the bottom bottom manifold layer 604 and is exhausted from the heat exchanger 600 through the aperture 609 in the top manifold layer 606.

  Hereinafter, the operation | movement of the suitable heat exchanger 600 is demonstrated using FIGS. 18-20. The cooled fluid enters heat exchanger 600 via inlet port 608. As described above, the bottom surface 615 of the top manifold layer 606 contacts and engages the top surface 614 of the bottom manifold layer 604. Accordingly, fluid flows directly from the top manifold layer 606 to the recessed region 616 of the bottom manifold layer 604 in the Z direction. When the fluid reaches the recessed area 616, it moves in the X direction along the recessed area 616 toward the fluid groove 618 disposed in the protruding surface 620 for heat exchange. As shown in FIG. 20, the contact layer 602 is arranged to contact the protruding surface 620 that performs heat exchange, and heat is transported from the protruding surface 620 that performs heat exchange to the contact layer 602. As described above, the protruding surface 620 and bottom manifold layer 604 itself that perform heat exchange have adequate thermal conductivity, which provides sufficient heat transfer from the heat source 99 to the contact layer 602. Accordingly, heat from the heat source 99 is transported to the contact layer 602, and the cooled fluid flows through the fluid grooves 618 and performs heat exchange at the protruding surface 620 that performs heated heat exchange. The fluid moves from the fluid groove 618 to the contact layer 602 in the Z direction, and the fluid performs further heat exchange with the contact layer 602. As described above, the contact layer 602 preferably has a microporous structure that increases the surface-volume ratio, thereby absorbing fluid and heat from the bottom manifold layer 604, so that the fluid is removed from the heat source 99. Heat can be removed sufficiently. The heated fluid flows along fluid channel 610 to outlet chamber 612 and is exhausted from heat exchanger 600 via outlet port 609.

  Hereinafter, a method for manufacturing and assembling the heat exchanger 100 and the individual layers of the heat exchanger 100 will be described. In the following, for the sake of brevity, preferred and alternative heat exchangers according to the present invention will be described using the heat exchanger 100 of FIG. 3B and its individual layers. Also, in the following, assembly / manufacturing details will be described in connection with the present invention, including details of one fluid inlet port and one fluid outlet port as shown in FIGS. 1A-1C. It will be apparent to those skilled in the art that the present invention applies equally well to two- and three-layer heat exchangers using and to conventional heat exchangers.

  The contact layer preferably has a coefficient of thermal expansion (hereinafter referred to as CTE) equal to or close to that of the heat source 99. Thereby, the contact layer preferably expands and contracts similarly according to the expansion and contraction of the heat source 99. Alternatively, the material of the contact layer 302 may have a CTE that is different from the CTE of the material of the heat source 99. The contact layer 302 made from a material such as silicon has a CTE corresponding to the CTE of the heat source 99 and has sufficient thermal conductivity to properly transport heat from the heat source 99 to the fluid. However, instead of this, the contact layer 302 may be formed using another material having a CTE corresponding to the CTE of the heat source 99.

  The contact layer 302 preferably has a high thermal conductivity that provides sufficient heat conduction between the heat source 99 and the fluid flowing along the contact layer 302 so that the heat source 99 does not overheat. The contact layer 302 is preferably formed from a material having a high thermal conductivity of about 100 W / m-K. However, the thermal conductivity of the contact layer 302 may be 100 W / m-K or higher and is not limited to this value, as will be apparent to those skilled in the art.

  In order to achieve a suitable high thermal conductivity, the contact layer 102 is preferably formed from a semiconductor substrate such as silicon. Alternatively, the contact layer may be, but is not limited to, single crystal dielectric material, metal, aluminum, nickel copper, Kovar ™, graphite, diamond, composites thereof and any suitable It may be made from any other material including alloys. Other materials for the contact layer 302 include patterned or molded organic mesh.

  As shown in FIG. 15, the contact layer 102 is preferably coated with a coating material layer 112 to protect the material of the contact layer 102 and improve the heat exchange properties of the contact layer 102. Specifically, the coating material layer 112 provides chemical protection that prevents chemical interaction between the fluid and the contact layer 102. For example, the contact layer 102 formed from aluminum is scraped by the fluid that contacts it, and the contact layer 102 may deteriorate over time. Here, by electroplating the surface of the contact layer 102 with a coating material layer 112 of about 25 micron nickel thin film, any potential chemical reaction can be achieved without significantly changing the thermal properties of the contact layer 102. Can be prevented. Obviously, any other coating material having an appropriate layer thickness may be used depending on the material of the contact layer 102.

  The contact layer 102 is preferably formed by etching a copper material coated with a nickel thin film to protect the contact layer 102. Alternatively, the contact layer 102 may be formed from aluminum, silicon substrate, plastic or any other suitable material. In addition, the contact layer 102 formed of a material having low thermal conductivity may be coated with an appropriate coating material in order to improve the thermal conductivity of the contact layer 102. One approach to electroforming the contact layer is to apply a seed layer of chromium or other suitable material along the bottom surface of the contact layer 102 and apply an appropriate voltage electrical connection to the seed layer. By this electrical connection, a layer of a thermally conductive coating material layer 112 is formed on the contact layer 102. Various structures in the range of 10 to 100 microns can be formed by electroforming. The contact layer 102 can be formed by electrocasting such as patterned electroplating. Further alternatively, the contact layer may be formed by photochemical etching or chemical cutting alone or in combination with electroforming. The structure in the contact layer 102 may be machined using a standard lithographic set for chemical cutting. Further, by using a laser-assisted chemical cutting process, the aspect ratio can be changed and the tolerance accuracy can be increased.

  The pillar 303 described above can be manufactured by various methods. However, the pillar 303 needs to be formed so as to have high thermal conductivity. Preferably, the pillar 303 is formed of a material having very high thermal conductivity such as copper. However, it will be apparent to those skilled in the art that other materials, such as silicon, may be used here. The pillar 303 can be formed by various methods including, but not limited to, electroforming, electric discharge machining wire method, stamping, MIM, and machining. Furthermore, the contact layer 302 may be formed in a desired configuration by cutting using a saw and / or a milling machine. In the case of the contact layer 302 made of silicon, the pillar 303 is formed by various methods such as plasma etching, sawing, patterning by lithograph, various wet etching, etc. according to the required aspect ratio of the pillar 303 in the contact layer 302. can do. The radially-configured rectangular fins 303E (FIG. 10E) can be formed using lithographic patterning, and plasma etching or electroplating can be employed within the mold defined by the lithograph.

  In a variation, the microchannel wall 110 used in the contact layer 102 is formed from silicon. Alternatively, the microchannel wall 110 may be formed of any other material including, but not limited to, patterned glass, polymer, and molded polymer mesh. The microchannel wall 110 is formed from the same material as that of the bottom surface 103 of the contact layer 102, but instead, the microchannel wall 110 is formed from a material different from the material of other parts of the contact layer 102. May be.

  In a variation, the microchannel wall 110 has a thermal conductivity characteristic of at least 10 W / m-K. Alternatively, the microchannel wall 110 may have a thermal conductivity characteristic greater than 10 W / m-K. As will be apparent to those skilled in the art, the microchannel wall 110 may alternatively have a thermal conductivity characteristic of less than 10 W / m-K, in which case, as shown in FIG. In order to improve the thermal conductivity of the wall 110, a coating material layer 112 may be applied to the microchannel wall 110. Alternatively, a coating material layer 112 having a thickness of at least 25 microns that protects the surface of the microchannel wall 110 may be applied to the microchannel wall 110 that is already formed from a material having high thermal conductivity. For the microchannel wall 110 formed from a material with low thermal conductivity, a coating material layer 112 having a thermal conductivity of at least 50 W / m-K and a thickness of 25 microns or more may be applied. It will be apparent to those skilled in the art that other types and thicknesses of coating materials may be used.

  In order to form a microchannel wall 110 having a suitable thermal conductivity of at least 10 W / m-K, the microchannel wall 110 may be formed by, for example, a coating material layer 112 (FIG. 15) of nickel or other metal as described above. Electroformed. Also, to form a microchannel wall 110 having a suitable thermal conductivity of at least 50 W / m-K, the microchannel wall 110 is formed by electroplating copper on a thin film metal film seed layer. . Alternatively, the microchannel wall 110 may not be coated with a coating material.

  The microchannel wall 110 is formed by a thermal embossing method, thereby realizing a high aspect ratio of the microchannel wall 110 along the bottom surface 103 of the contact layer 102. Alternatively, the microchannel wall 110 may be formed as a silicon structure deposited on the glass surface, which is etched to the desired configuration on the glass. Alternatively, the microchannel wall 110 may be formed by standard lithographic methods, stamping or casting methods, or any other suitable technique. The microchannel wall 110 may be formed separately from the contact layer 102 and connected to the contact layer 102 by anodic bonding or epoxy resin bonding. Alternatively, the microchannel wall 110 may be connected to the contact layer 102 by conventional electroforming techniques such as electroplating.

  The intermediate layer 104 can be formed using various methods. The intermediate layer 104 is preferably made of silicon. The intermediate layer 104 may also include, but is not limited to, glass or laser patterned glass, polymer, metal, glass, plastic, molded organic materials, or other composites including these composites. It will be apparent to those skilled in the art that any suitable material may be used. Alternatively, the intermediate layer 104 may be formed using a plasma etching technique. Alternatively, the intermediate layer 104 may be formed using a chemical etching method. As another method, the metal may be formed into a desired configuration by machining, etching, extrusion, and / or forging. Alternatively, the intermediate layer 104 may be formed in a desired configuration by injection molding of a plastic mesh. Alternatively, the intermediate layer 104 may be formed in a desired configuration by laser drilling on a glass plate.

  The manifold layer 106 can be created by various techniques. A suitable manifold layer 306 may be formed entirely in one piece. Alternatively, as shown in FIG. 12, a plurality of independent parts may be formed and then connected to form a manifold layer 306. Manifold layer 306 is formed by an injection molding process using plastic, metal, polymer composite or any other suitable material, wherein each layer is preferably formed from the same material. Alternatively, as described above, each layer may be formed from different materials. The manifold layer 306 may be formed using a metal processing technique such as machining or etching. Those skilled in the art will appreciate that the manifold layer 306 may be formed by any other suitable technique.

  The intermediate layer 104 is connected to the contact layer 102 and the manifold layer 106 in various ways, thereby forming the heat exchanger 100. The contact layer 102, the intermediate layer 104, and the manifold layer 106 are connected to each other by anodic bonding, an adhesive, or a eutectic bonding method. Alternatively, the intermediate layer 104 may be integrally formed in the structure of the manifold layer 106 and the contact layer 102. The intermediate layer 104 may be coupled to the contact layer 102 by a chemical bonding process. Alternatively, the intermediate layer 104 may be formed by thermal embossing or soft lithography techniques, where the intermediate layer 104 may be stamped using a wire electrical discharge machine EDM or a silicon master. Further, if necessary, the intermediate layer 104 may be electroplated with a metal or other suitable material to improve the thermal conductivity of the intermediate layer 104.

  Alternatively, the intermediate layer 104 may be formed simultaneously with the creation of the microchannel wall 110 in the contact layer 102 by injection molding. Alternatively, the intermediate layer 104 may be formed with the creation of the microchannel wall 110 by any other suitable technique. Other techniques for forming the heat exchanger include, but are not limited to, soldering, fusion, eutectic bonding, intermetallic bonding, and the type of material used in each layer. Any other suitable technique may be used.

  FIG. 16 shows another manufacturing method of the heat exchanger according to the present invention. As shown in FIG. 16, another manufacturing method of this heat exchanger includes a step (step 500) of manufacturing a hard mask formed from a silicon substrate as a contact layer. The hard mask is formed from silicon oxide or spin-on glass. Once the hard mask is formed, a plurality of under-channels are formed in the hard mask. These underchannels form a flow path between the microchannel walls 110 (step 502). The under channel may be formed by any suitable method such as, but not limited to, HF etching technology, chemical cutting, soft lithography, xenon difluoride etching, and the like. Furthermore, it is necessary to provide a sufficient space between the under channels so that adjacent under channels are not bridged with each other. Next, using some known technique, spin-on glass is provided on the upper surface of the hard mask to form an intermediate and a manifold layer (step 504). Subsequently, the intermediate layer and the manifold layer are cured by a curing method (step 506). After the intermediate layer and manifold layer are completely formed and cured, one or more fluid ports are formed in the cured layer (step 508). The fluid port is formed by etching or drilling the manifold layer. While specific techniques for creating the contact layer 102, intermediate layer 104, and manifold layer 106 have been described above, the heat exchanger 100 may be manufactured using other techniques known in the art.

  FIG. 17 shows a modification of the heat exchanger according to another embodiment of the present invention. In the embodiment shown in FIG. 17, two heat exchangers 200 and 200 ′ are connected to one heat source 99. Specifically, the heat source 99 such as an electronic device is connected to the circuit board 96 and arranged vertically, and both surfaces of the heat source 99 are necessarily exposed to the outside. The heat exchangers 200 and 200 'according to the present invention are respectively connected to the exposed surface of the heat source 99, and the heat exchangers 200 and 200' maximize the cooling efficiency of the heat source 99. Alternatively, if the heat source is horizontally connected to the circuit board, two or more heat exchangers (not shown) are stacked on the heat source 99 and each heat exchanger is electrically connected to the heat source 99. May be. Additional details regarding this embodiment can be found in co-pending US patent application Ser. No. 10 / 072,137 filed Feb. 7, 2002, entitled “POWER CONDITIONING MODULE”. Which is incorporated herein by reference.

  In the specific example shown in FIG. 17, the heat exchanger 200 having three layers is connected to the left side of the heat source 99, and the heat exchanger 200 ′ having two layers is connected to the right side of the heat source 99. It will be apparent to those skilled in the art that a suitable or alternative heat exchanger may be connected to any face of the heat source 99. Further, it will be apparent to those skilled in the art that other heat exchangers 200 ′ may be connected to the side surface of the heat source 99 as a modification. In the modification shown in FIG. 17, the hot spot of the heat source 99 can be cooled more accurately by supplying the fluid so as to cool the hot spot existing along the thickness of the heat source 99. That is, in the embodiment shown in FIG. 17, the hot spot can be appropriately cooled at the center of the heat source 99 by performing heat exchange on both sides of the heat source 99. In addition, in embodiment shown in FIG. 17, although the circulation type cooling device 30 of FIG. 2A and 2B is used, it is clear to those skilled in the art that other circulation systems may be used.

  As described above, the heat source 99 may change the position of one or more hot spots due to different tasks that need to be performed at the heat source 99. In order to properly cool the heat source 99, the circulating cooling device 30 (FIGS. 2A and 2B) dynamically adjusts the flow rate and / or flow rate of the fluid entering the heat exchanger 100 in response to changes in the position of the hot spot. A sensing and control module 34 is provided.

  Specifically, as shown in FIG. 17, one or more sensors are disposed on the contact layer 124 in each contact layer hot spot region in the heat exchanger 200 and / or in each potential hot spot location of the heat source 99. To do. Alternatively, multiple sensors may be equally disposed between the heat source and the heat exchanger and / or within the heat exchanger itself. Also, the control module 34 (FIGS. 2A and 2B) may be coupled to one or more valves in the circulating cooling device 30 that controls the flow of fluid to the heat exchanger 100. In this embodiment, the one or more valves are disposed in the fluid line, but may alternatively be disposed in any other location. The plurality of sensors disposed on the contact layer 124 is coupled to a control module 34, which is preferably disposed on the upstream side of the heat exchanger 100, as shown in FIG. Alternatively, the control module 34 may be disposed at any other position in the circulation type cooling device 30.

  Sensors disposed on contact layer 124 include, but are not limited to, for example, the flow rate of fluid flowing through the contact layer hot spot region, the temperature of the contact layer 102 and / or the hot spot region of heat source 99, Information such as the temperature of the fluid is provided to the control module 34. For example, in the embodiment shown in FIG. 17, the sensor disposed on the contact layer 124 has a higher temperature in a specific contact layer hot spot area of the heat exchanger 200 and the specific contact layer of the heat exchanger 200 ′. Information indicating that the temperature of the hot spot area is low is provided to the control module 34. In response, the control module 34 increases the flow rate of fluid to the heat exchanger 200 and decreases the flow rate of fluid to the heat exchanger 200 '. Alternatively, the control module 34 is responsive to information received from sensors disposed on the contact layer 124 for fluid flow to one or more contact layer hot spot regions in the one or more heat exchangers. The flow rate may be changed. In the specific example shown in FIG. 17, the sensor disposed on the contact layer 124 is connected to the two heat exchangers 200 and 200 ′, but instead, the sensor disposed on the contact layer 124. Obviously, it may be connected to only one heat exchanger.

  In a variant, the heat exchanger 100 according to the invention is connected to a thermoelectric device 97 and the thermoelectric device 97 is connected to a heat source 99 as shown in FIG. 2A. The thermoelectric device 97 has the same dimensions as the heat source 99 and is connected to a power source 96 that drives the thermoelectric device 97. The thermoelectric device 97 can act to suppress the bonding temperature under the hottest surface of the heat exchanger 100 or can be used to reduce the temperature difference across the heat source 99. Alternatively, the thermoelectric device 97 may be utilized to cool one or more hot spots of the heat source 99. In one embodiment, the thermoelectric device 97 may be integrally formed in the heat exchanger 100 as part of the contact layer 102. As another embodiment, the thermoelectric device 97 may be integrally formed in the microprocessor or heat source 99. It will be apparent to those skilled in the art that any known thermoelectric device may be used as the thermoelectric device 97 as long as it is appropriately used with the heat source 99 and the heat exchanger 100. It will also be apparent to those skilled in the art that thermoelectric device 97 may be used with any of the heat exchangers disclosed and described herein.

  FIG. 21 illustrates a system for cooling a heat generating device 740 according to the present invention. The system includes a pump (not shown) that circulates fluid through the fluid heat exchanger 730. The fluid heat exchanger 730 is in thermal contact with the heat generating device 740. Further, the thermoelectric device 720 is in thermal contact with the fluid heat exchanger 730 and in thermal contact with the heat remover 710.

  Thermoelectric device 720 has a cooling portion and a heating portion. The thermoelectric device 720 converts electrical energy supplied from a power source (not shown) into a temperature difference between the heating portion and the cooling portion. This temperature difference seeks to maintain a balance, i.e., in order to maintain the temperature difference, it is necessary to dissipate the heat absorbed in the cooling part and compensate for the heat generated from the heating part. Due to electrical and thermodynamic mechanisms within the thermoelectric device, the heat absorbed by the cooling part is transferred to the heating part and this reverse heat transfer is caused. In the system 700, the heating part is connected to the heat remover 710 so as to be able to conduct heat, and the cooling part is connected to the fluid heat exchanger 730 so as to be able to conduct heat.

  In operation, heat is generated within the heat generating device 740. At least a part of the heat generated in the heat generating device 740 is radiated to the fluid heat exchanger 730. The fluid flowing to the fluid heat exchanger 730 absorbs part of the heat from the fluid heat exchanger 730. The remaining heat is conducted to the cooled portion of thermoelectric device 720. A portion of the heat conducted to the cooling portion is transferred by the thermoelectric device 720 to the heating portion. The other part of the heat conducted to the cooling part is dissipated by other principles. Since the heating part and the heat removal device 710 are in thermal contact, the heat from the heating part flows into the heat removal device 710 and is radiated to the surrounding air.

  FIG. 22 illustrates a system 701 according to the present invention that includes a fluid heat exchanger 730, a fluid conduit structure 760 coupled to the fluid heat exchanger 730, a fluid conduit structure 760 coupled to a fluid Is connected to the fluid conduit structure 760, and a fluid remover 710 is connected to the fluid conduit structure 760 and conducts heat to the fluid. Further, the system includes a thermoelectric device 720 that is coupled to the fluid conduit structure 760 and is in heat conductive contact with the fluid flowing therein.

  System 701 preferably operates to cool a heat generating device 740 that is communicatively coupled to fluid heat exchanger 730. Heat generated in the heat generating device is conducted to the fluid heat exchanger 730 and from there to the fluid flowing through the conduit structure 760. The fluid flowing through the fluid conduit structure 760 is in heat conductive contact with the cooled portion of the thermoelectric device 720. As described above, heat is transported from the cooled portion of thermoelectric device 720 to the heated portion of thermoelectric device 720.

  In system 701, some of the heat is conducted from the fluid in fluid conduit structure 760 to the cooled portion of thermoelectric device 760. Heat is transferred from the cooling part to the heating part and further dissipated from the heating part to the surrounding air by heat dissipation and convection.

  Heat conduction and heat dissipation mainly depend on the temperature difference. For this reason, the efficiency of cooling devices that rely on heat transport, such as heat removers and heat exchangers, mainly depends on how well the temperature difference between the object responsible for cooling and the device to be cooled can be maintained. To do. In an embodiment of the present invention, a sufficient temperature difference is maintained using a thermoelectric device in order to achieve efficient cooling.

  The invention has been described in terms of specific embodiments, including various details, in order to provide a clear explanation of the structure and operating principles of the invention. Such reference herein to specific embodiments and details thereof is not intended to limit the scope of the claims appended hereto. It will be apparent to those skilled in the art that the exemplary selected embodiments can be modified without departing from the spirit and scope of the present invention.

It is a side view of the conventional heat exchanger. It is a top view of the conventional heat exchanger. It is a side view of the conventional multilevel heat exchanger. 1 is a schematic diagram of a circulating cooling device incorporating a preferred embodiment of a flexible fluid transport microchannel heat exchanger according to the present invention. FIG. FIG. 6 is a schematic diagram of a circulating cooling device incorporating a variation of a flexible fluid transport microchannel heat exchanger according to the present invention. It is a top view of the modification of the manifold layer of the heat exchanger based on this invention. FIG. 3B is an exploded view of a heat exchanger with a manifold layer variation according to the present invention. 1 is a perspective view of manifold layers that are assembled together according to the present invention. FIG. 1 is a plan view of a contact layer and manifold layers that are assembled together according to the present invention. FIG. 1 is a cross-sectional view along line AA of a contact layer and a manifold layer mating with each other according to the present invention. FIG. FIG. 5 is a cross-sectional view along line BB of the contact layer and the manifold layers mating with each other according to the present invention. FIG. 6 is a cross-sectional view along line CC of the contact layer and the manifold layers mated together according to the present invention. FIG. 3 is an exploded view of a contact layer and a manifold layer mating with each other according to the present invention. It is a perspective view of the modification of the contact layer based on this invention. It is a top view of the modification of the manifold layer based on this invention. 1 is a plan view of a contact layer according to the present invention. FIG. 1 is a plan view of a contact layer according to the present invention. FIG. It is a side view of the modification of the three-layer type heat exchanger based on this invention. It is a side view of the modification of the two-layer type heat exchanger based on this invention. 1 is a perspective view of a contact layer having a micro pin array according to the present invention. FIG. 1 is a perspective view of a contact layer having a micro pin array according to the present invention. FIG. 1 is a perspective view of a contact layer having a micro pin array according to the present invention. FIG. 1 is a perspective view of a contact layer having a micro pin array according to the present invention. FIG. 1 is a perspective view of a contact layer having a micro pin array according to the present invention. FIG. It is a partially notched perspective view of the modification of the heat exchanger based on this invention. It is an exploded view of the heat exchanger based on this invention. It is an exploded view of the modification of the heat exchanger based on this invention. It is a perspective view of the modification of the circulation level based on this invention. It is a perspective view from the bottom face side of the inlet level based on this invention. It is a perspective view from the bottom face side of the modification of the inlet level based on this invention. It is a perspective view from the bottom face side of the outlet level based on this invention. It is a perspective view from the bottom face side of the modification of the outlet level based on this invention. It is sectional drawing of the heat exchanger based on this invention. It is sectional drawing of the modification of the heat exchanger based on this invention. Figure 2 is a top view of the circulation level with a preferred configuration of inlet and outlet apertures according to the present invention for single phase flow flow. Figure 2 is a top view of the circulation level with a preferred configuration of inlet and outlet apertures according to the present invention for two-phase flow. 1 is a side view of a contact layer of a heat exchanger according to the present invention to which a coating material is applied. FIG. It is a flowchart which shows the manufacture procedure of the heat exchanger based on this invention. It is a figure which shows other embodiment of this invention which connects two heat exchangers to a heat source. It is an exploded view of the heat exchanger based on this invention. It is an exploded view of the heat exchanger based on this invention. It is sectional drawing of the heat exchanger based on this invention. FIG. 2 shows a system according to the invention for cooling an electrical device. It is a figure which shows the cooling device based on this invention.

Claims (37)

In a cooling device for cooling a heat source,
a. A fluid heat exchanger;
b. A pump connected to the fluid heat exchanger and having a fluid flow therein;
c. A thermoelectric device having a cooling portion and a heating portion, wherein at least a portion of the cooling portion is in thermal contact with the fluid heat exchanger and cools the fluid heat exchanger;
d. A cooling device comprising: a heat remover that is in thermal contact with at least a part of a heating portion of the thermoelectric device.   The cooling device according to claim 1, wherein the thermoelectric device and the fluid heat exchanger are integrally formed.   The cooling device according to claim 1, wherein the thermoelectric device and the fluid heat exchanger are each formed as a module and connected to each other.   The cooling apparatus according to claim 1, wherein the heat exchanger includes a manifold region and a microscale region for fluid transportation.   The cooling device according to claim 4, wherein the microscale region includes one of a microchannel, a micropillar, a microlattice, and a microporous region.   The cooling apparatus according to claim 1, wherein the thermoelectric device and the heat removal device are integrally formed.   The cooling apparatus according to claim 1, wherein the thermoelectric device and the heat removal device are each formed as a module and connected to each other.   The cooling device according to claim 1, wherein the thermoelectric device, the heat removal device, and the fluid heat exchanger are integrally formed.   The cooling device according to claim 1, wherein the pump is one of an ion pump and an electromechanical pump.   2. The cooling device according to claim 1, wherein the thermoelectric device is disposed such that a fluid heat exchanger is positioned between the thermoelectric device and the heat source when the cooling device cools the heat source. .   The cooling apparatus according to claim 1, wherein the thermoelectric device is disposed between the fluid heat exchanger and the heat remover. In a cooling device for cooling an electronic device,
a. A fluid heat exchanger;
b. A pump connected to the fluid heat exchanger and having a fluid flow therein;
c. A first thermoelectric device having a cooling portion and a heating portion, wherein at least a portion of the cooling portion is in thermal contact with the fluid heat exchanger and cools the fluid heat exchanger;
d. A heat remover in thermal contact with at least a portion of the heated portion of the thermoelectric device;
e. A cooling portion and a heating portion, wherein at least a portion of the heating portion is in thermal contact with the fluid heat exchanger to heat the fluid heat exchanger, and at least a portion of the cooling portion is in thermal contact with the electronic device. And a second thermoelectric device that cools the electronic apparatus.   The cooling apparatus according to claim 12, wherein the first thermoelectric device and the fluid heat exchanger are integrally formed.   The cooling apparatus according to claim 12, wherein the first thermoelectric device and the fluid heat exchanger are each formed as a module and connected to each other.   The cooling apparatus according to claim 12, wherein the second thermoelectric device and the fluid heat exchanger are integrally formed.   The cooling apparatus according to claim 12, wherein the second thermoelectric device and the fluid heat exchanger are each formed as a module and connected to each other.   The cooling apparatus according to claim 12, wherein the first thermoelectric device and the heat removal device are integrally formed.   The cooling apparatus according to claim 12, wherein the first thermoelectric device and the heat removal device are each formed as a module and connected to each other.   The cooling device according to claim 12, wherein the heat exchanger includes a manifold region and a microscale region for fluid transportation.   The cooling device according to claim 19, wherein the microscale region includes one of a microchannel, a micropillar, a microlattice, and a microporous region.   The cooling device according to claim 12, wherein the first thermoelectric device, the second thermoelectric device, the heat removal device, and the fluid heat exchanger are integrally formed.   The cooling device according to claim 12, wherein the pump is any one of an ion pump and an electromechanical pump.   13. The cooling apparatus according to claim 12, wherein the thermoelectric device is disposed between the fluid heat exchanger and the electronic device when the electronic device is cooled.   The cooling device according to claim 12, wherein the fluid heat exchanger is disposed between the thermoelectric device and the heat remover. In a cooling device for cooling an electronic device,
a. A fluid heat exchanger;
b. A fluid conduit structure coupled to the fluid heat exchanger;
c. A pump connected to the fluid conduit structure for flowing fluid to itself and the fluid heat exchanger;
d. A heat remover coupled to the fluid conduit structure and coupled to the flowed fluid to conduct heat;
e. A cooling device comprising: a thermoelectric device connected to the fluid conduit structure and connected to the flowing fluid so as to conduct heat.   The cooling device according to claim 25, wherein the thermoelectric device and the conduit structure are integrally formed.   The cooling device according to claim 25, wherein the thermoelectric device and the conduit structure are each formed as a module and connected to each other.   26. The cooling device of claim 25, wherein the heat exchanger includes a manifold region and a microscale region for fluid transportation.   29. The cooling device of claim 28, wherein the microscale region includes one of a microchannel, a micropillar, a microlattice, and a microporous region.   The cooling device according to claim 25, wherein the pump is one of an ion pump and an electromechanical pump.   26. The cooling device according to claim 25, wherein the thermoelectric device is connected to the heat removal structure so as to be capable of conducting heat.   26. The cooling device according to claim 25, wherein the thermoelectric device is connected to a heat exchanger so as to conduct heat. a. A fluid heat exchanger connectable to the microprocessor in a heat conductive manner;
b. A thermoelectric device coupled to the fluid heat exchanger in a heat conducting manner and connectable to the microprocessor in a heat conducting manner;
c. A heat remover coupled to both the fluid heat exchanger and the thermoelectric device so as to conduct heat;
d. A microprocessor cooling apparatus comprising: a pump for flowing a fluid through the fluid heat exchanger.   34. The microprocessor cooling apparatus according to claim 33, wherein the fluid heat exchanger, the heat remover, and the thermoelectric device are integrally formed.   34. The microprocessor cooling apparatus according to claim 33, wherein the fluid heat exchanger, the heat remover, and the thermoelectric device are each formed as a module and connected to each other.   34. The microprocessor cooling apparatus of claim 33, wherein the heat exchanger includes a manifold region and a microscale region for fluid transport.   37. The microprocessor cooling apparatus of claim 36, wherein the microscale region includes one of a microchannel, a micropillar, a microlattice, and a microporous region.

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