DE102005031102A1 - Control method for controlling temperature of heat source, e.g. microprocessor, involves channeling two temperature fluids to and from heat exchange surface, respectively, wherein fluid is channeled to minimize temperature differences along - Google Patents

Abstract

The method involves channeling a first temperature fluid to the heat exchanging surface of a heat exchanger (100), wherein the first temperature fluid undergoes thermal exchange with the heat source along the heat exchanging surface, and channeling a second temperature fluid from the heat exchange surface, wherein fluid is channeled to minimize temperature differences along the heat source. Independent claims are also included for the following: (a) a heat exchanger; and (b) a hermetic closed loop system for controlling temperature of heat source.

Description

Territory of invention

The The invention relates generally to a method and apparatus for cooling a heat-producing Device, and especially a branched or enforced distributor to reduce the pressure drop in a microchannel heat exchanger.

background the invention

since their introduction in the early days 80s of the past century have become micro-channel cooler than very suitable for Applications at high heat flux density proven and used in the industry. existing Have microchannels however, conventional parallel channel arrangements which do not good for cooling calorific A directions are suitable, the spatially varying heat loads exhibit. Such heat-producing Facilities have areas that generate more heat than other areas. These warmer Areas are referred to herein as "hot spots" while the Areas of the heat source which not so much heat generate, here as "hot spots" to be called.

1A shows a prior art heat exchanger 10 that is about a thermal interface material 98 to an electronic device 99 as a microprocessor is coupled. As in 1A As shown, fluid generally flows from a single inlet port 12 along the floor surface 11 between the parallel microchannels 14 as shown by arrows, and passes through the outlet port 16 out. Although the heat exchanger 10 the electrical device 99 cools, the liquid flows in a uniform manner from the inlet port 12 to the outlet connection 16 , In other words, the liquid flows substantially uniformly along the entire bottom surface 11 of the heat exchanger 10 and leads the areas of the floor area 11 , the hot spots of the facility 99 comply, no longer liquid too. Furthermore, the temperature of the flowing liquid generally increases as it moves along the bottom surface 11 the heat exchanger flows. Accordingly, areas of the heat source become 99 , which are downstream or close to the outlet port 16 not supplied with cold liquid, but with liquid which has already been heated upstream. The heated liquid distributes the heat over the entire floor area 11 the heat exchanger and the area of the heat source 99 with liquid close to the outlet port 16 so hot that it can not cool the heat source. In addition, the heat exchanger has 10 only one inlet 12 and an outlet 16 , which forces the liquid along the long parallel microchannels 14 in the floor area 11 over the entire length of the heat exchanger 10 to flow, thereby generating a high pressure drop.

1B shows a side view of a known multi-level heat exchanger 20 , Liquid enters the multi-level heat exchanger 20 through the connection 22 and flows through numerous nozzles 28 in the middle position 26 to the floor area 27 and from the outlet 24 , The along the nozzles 28 flowing liquid can evenly down to the bottom surface 27 flow or not. Although in the heat exchanger 20 entering liquid over the length of the heat exchanger 20 distributed, this design provides the warmer areas of the heat exchanger 20 and the heat source no longer liquid available, which require a greater fluid circulation.

Furthermore, conventional heat exchangers are made of materials having a high thermal resistance in the bottom surface so that the heat exchanger has a coefficient of thermal expansion which is that of the heat source 99 fits. The high thermal resistance of the heat exchanger thus does not allow sufficient heat exchange with the heat source 99 , To take account of the high thermal resistance, larger channel cross-sectional dimensions are chosen so that more heat exchange between the heat exchanger 10 and the heat source 99 he follows. If the dimensions of the channels in the heat exchanger are made smaller and the distance between the channel walls and the hydraulic diameter is reduced, the thermal resistance of the heat exchanger is reduced. However, one problem with using narrow microchannels is the increase in pressure loss along the channels. The increase in pressure loss places extreme demands on a pump which drives the fluid through the heat exchanger. Larger microchannel dimensions also cause a greater pressure drop between the inlet and outlet ports due to the long distance over which one or two-phase liquid must flow. Furthermore, cooking the liquid in a microchannel heat exchanger causes greater pressure loss for a given flow rate due to the mixture of liquid and vapor as well as the vapor phase acceleration of the liquid. Both of these factors increase the pressure loss per unit length. The large pressure loss created within the current microchannel heat exchanger requires larger pumps that can produce higher pressures and therefore are not suitable in a microchannel arrangement.

Is needed a microchannel heat exchanger, which is designed so that a proper uniformity the temperature of the heat source is reached. Furthermore becomes a heat exchanger needed which is designed so that a proper uniformity with regard to hot spots the heat source is reached. In addition, will a heat exchanger needed which has a relatively high thermal conductivity to a adequate heat exchange with the heat source carry out to be able to. Furthermore, a heat exchanger is needed, the is designed so that a small pressure loss between the inlet and outlet ports for the liquid to achieve.

Summary the invention

In one aspect of the invention, a heat exchanger includes a boundary layer for cooling a heat source, wherein the boundary layer is configured to allow liquid to flow therethrough, and wherein the boundary layer has a thickness within a range of about 0.3 mm to about 1.0 mm and a manifold layer for circulating the fluid to and from the interface, the manifold layer having a first set of fingers and a second set of fingers, wherein the first set of fingers are disposed parallel to the second set of fingers in that the pressure drop within the heat exchanger is reduced. The liquid can be in a single-phase state. The liquid can also be in a biphasic state. At least a portion of the liquid in the boundary layer may undergo conversion from a single phase to a two phase state. A particular finger of the first set may be spaced a suitable distance from a particular finger of the second set at an appropriate distance to minimize pressure loss in the heat exchanger. Each of the fingers can have the same length and width dimensions. At least one of the fingers can be dimensioned differently than the other fingers. The fingers may be non-periodically arranged in at least one dimension of the manifold layer. At least one of the fingers may have a varying dimension along the length of the manifold layer. The manifold layer may have more than three and fewer than ten parallel fingers. The fingers of the first and second sets may be alternately arranged along a dimension of the manifold layer. The manifold layer may be configured to cool at least one interface hot spot region. The heat exchanger may also include at least one first port communicating with the first set of fingers, fluid entering the heat exchanger through the at least one first port. The heat exchanger may also include at least one second port communicating with the second set of fingers, liquid exiting the heat exchanger through the at least one second port. The manifold layer may be disposed over the interface with liquid flowing down through the first set of fingers and flowing upward through the second set of fingers. The heat exchanger may also include a first port passage communicating with the first port and the first set of fingers, wherein the first port passage is configured to channel fluid from the first port to the first set of fingers. The heat exchanger may also include a second port passage communicating with the second port and the second set of fingers, the second port passage being configured to channel fluid from the second set of fingers to the second port. The boundary layer may be formed integrally with the heat source. The boundary layer may be coupled to the heat source. The heat exchanger may also include an intermediate layer for channeling liquid to and from one or more predetermined positions in the boundary layer via at least one conduit, the intermediate layer being positioned between the boundary layer and the manifold layer. The intermediate layer may be coupled to the barrier layer and the manifold layer. The intermediate layer may be formed integrally with the barrier layer and the manifold layer. The at least one line may have at least one varying dimension along the intermediate layer. The barrier layer may have a coating disposed thereon, the coating having a suitable thermal conductivity of at least 10 W / mK. The barrier layer may have a thermal conductivity of at least 100 W / mK. The heat exchanger may also include a plurality of columns arranged in a predetermined pattern along the boundary layer. At least one of the plurality of columns may have an area dimension within a range of 10 ² μm and 100 ² μm. At least one of the plurality of columns may have a height dimension within a range of 50μm and 2mm. At least two of the plurality of columns may be spaced from each other by 10 to 150 μm. The plurality of columns may have a coating thereon, the coating having a suitable thermal conductivity of at least 10 W / mK. The boundary layer may have a roughened surface. The barrier layer may have a microporous structure disposed thereon. The porous microstructure may have a porosity of 50 to 80%. The porous microstructure may have an average pore size within a range of 10 to 200 μm sen. The porous microstructure may have a height within a range of 0.25 to 2.00 mm. The heat exchanger may also include a number of microchannels arranged in a predetermined pattern along the boundary layer. At least one of the plurality of microchannels may have an area dimension within a range of 10 ² μm and 100 ² μm. At least one of the microchannels may have a height dimension within the range of 50 μm and 2 mm. At least two of the microchannels may be at a distance of 10 to 150 microns to each other. At least one of the microchannels may have a width within a range of 10 to 100 μm. The microchannels can be coupled to the intermediate layer. The microchannels may be formed integrally with the intermediate layer. The microchannels may be subdivided into segmented rows having at least one groove therebetween, at least one groove being aligned with a corresponding finger. The microchannels may have a coating disposed thereon, the coating having a suitable thermal conductivity of at least 10 W / mK. An overhang dimension can range between 0 and 15 mm.

In another aspect of the present invention, a heat exchanger for cooling a heat source comprises a manifold layer having a first set of fingers in a first configuration, wherein each finger of the first set channels fluid at a first temperature, and the manifold layer further comprises a second set of fingers a second configuration, wherein each finger of the second set channels liquid at a second temperature, and the first set and the second set of fingers are arranged parallel to each other, and a boundary layer having a thickness of about 0.3 to 1.0 mm configured to receive liquid at the first temperature at a plurality of first locations, wherein each first location is associated with a corresponding finger of the first set, and the interface layer directs fluid along a plurality of predetermined paths to a plurality of second locations, each second place a entspre associated finger of the second sentence. The liquid can be in a single-phase state. The fluid may be in a biphasic state. At least a portion of the liquid in the boundary layer may undergo conversion between a single-phase and a two-phase state. A particular finger of the first set may be spaced a suitable distance from a particular finger of the second set, the appropriate dimension reducing the pressure drop in the heat exchanger. The heat exchanger may also include at least one first port communicating with the first set of fingers, fluid entering the heat exchanger through at least one first port. The heat exchanger may also include at least one second port communicating with the second set of fingers, fluid exiting the heat exchanger through at least one second port. The manifold layer may be positioned above the boundary layer with liquid flowing down through the first set of fingers and flowing upward through the second set of fingers. The boundary layer may be formed integrally with the heat source. The boundary layer may be coupled to the heat source. The fingers of the first set may be arranged in an alternating arrangement with the fingers of the second set. Each of the fingers can have the same length and width dimensions. At least one of the fingers may have different dimensions than the remaining fingers. The fingers may be non-periodically arranged in at least one direction of the manifold layer. At least one of the fingers may have at least one varying dimension along the length of the manifold layer. The manifold layer may have more than three and fewer than ten parallel fingers. The heat exchanger may also include a first port passage communicating with the first port and the first set of fingers, wherein the first port passage is configured to direct fluid from the first port to the first set of fingers. The heat exchanger may also include a second port passage communicating with the second port and the second set of fingers, the second port passage being configured to channel fluid from the second set of fingers to the second port. The heat exchanger may also include an intermediate layer for channeling liquid to and from one or more predetermined positions in the boundary layer via at least one conduit, the intermediate layer being positioned between the boundary layer and the manifold layer. The conduit may be arranged in a predetermined configuration and channel fluid to one or more interface hot spot areas in the intermediate layer. The conduit may be arranged in a predetermined configuration to channel fluid from one or more interface hot spot areas of the intermediate layer. The intermediate layer may be coupled to the barrier layer and the manifold layer. The intermediate layer may be formed integrally with the barrier layer and the manifold layer. The conduit may have at least one varying dimension in the intermediate layer. The intermediate layer may have a coating disposed thereon, wherein the coating has a suitable thermal conductivity of at least 10 W / mK. The intermediate layer may have a thermal conductivity of at least 10 W / mK. The heat exchanger may also include a plurality of columns arranged in a predetermined pattern along the intermediate layer. At least one of the columns may have a surface dimension in the range of 10 ² microns and 100 ² microns. At least one of the columns may have a height of 50 microns and 2mm. At least two of the plurality of columns may be spaced from each other by 10 to 150 μm. A coating may be disposed on the plurality of columns, the coating having a suitable thermal conductivity of at least 10 W / mK. The boundary layer may have a roughened surface. The barrier layer may have a microporous structure disposed thereon. The porous microstructure may have a porosity within a range of 50 to 80%. The porous microstructure may have an average pore size within the range of 10 to 200 μm. The porous microstructure may have a height within a range of 0.25 to 2 mm. The heat exchanger may also include a plurality of microchannels formed in a predetermined pattern along the boundary layer. At least one of the microchannels may have a surface dimension in the range of 10 ² microns and 100 ² microns. At least one of the microchannels may have a height within the range of 10 μm and 2 mm. At least two of the microchannels may be spaced from one another by 10 to 150 μm. At least one of the microchannels may have a width in the range of 10 to 100 microns. The microchannels can be coupled to the boundary layer. The microchannels may be formed integrally with the boundary layer. The microchannels may be divided into segments along a dimension of the boundary layer, wherein at least one groove is formed between the divided microchannel segments. The microchannels may be continuous along one dimension of the boundary layer. The at least one groove may be aligned with a corresponding finger. A coating may be arranged on the microchannels, the coating having a suitable thermal conductivity of at least 20 W / mK. An overhang dimension can range between 0 and 15 mm.

Other Features and advantages of the present invention will be apparent after review the detailed description of preferred described below embodiments seen.

Short description the drawings

1A shows a side view of a conventional heat exchanger.

1B shows a plan view of a conventional heat exchanger.

1C shows a side view of a previously known multi-level heat exchanger.

2A shows a schematic representation of a closed cooling system with a preferred embodiment of the microchannel heat exchanger according to the invention for a flexible delivery of liquid.

2 B shows a schematic representation of a closed cooling system with an alternative embodiment of the microchannel heat exchanger according to the invention for a flexible delivery of liquid.

3A shows a plan view of an alternative distribution layer of the heat exchanger according to the invention.

3B shows an exploded view of an alternative heat exchanger with the alternative distribution layer according to the present invention.

4 shows a perspective view of the preferred branched distribution layer according to the present invention.

5 shows a plan view of the preferred branched distribution layer with a boundary layer according to the present invention.

6A shows a cross-sectional view of the preferred distribution layer and boundary layer according to the present invention along the lines A - A.

6B shows a cross-sectional view of the preferred branched distribution layer along with boundary layer according to the present invention along the lines B - B.

6C shows a cross-sectional view of the preferred branched distribution layer along with boundary layer according to the present invention along the lines C - C.

7A shows an exploded view of the preferred branched distribution layer and boundary layer according to the present invention.

7B shows a perspective view of an alternative embodiment of the boundary layer according to the present invention.

8A shows a schematic plan view of an alternative distribution layer according to the vorlie ing invention.

8B shows a schematic plan view of the boundary layer according to the present invention.

8C shows a schematic plan view of the boundary layer according to the present invention.

9A shows a schematic representation of the alternative embodiment of the three-level heat exchanger according to the present invention.

9B shows a schematic side view of the alternative embodiment of the two-level heat exchanger according to the present invention.

10 shows a perspective view of the boundary layer with a micro pin row according to the present invention.

11 shows a partially cutaway perspective view of the alternative heat exchanger according to the present invention.

12 shows a schematic side view of the boundary layer of the heat exchanger with a coating material arranged thereon according to the present invention.

13 shows a flowchart of an alternative method of manufacturing the heat exchanger according to the present invention.

14 shows a schematic representation of an alternative embodiment of the present invention with two coupled to a heat source heat exchangers.

detailed Description of the present invention

Generally said the heat exchanger takes thermal Energy generated by a heat source is by adding liquid through selected areas the boundary layer is passed, which preferably to the heat source is coupled. More specifically, the fluid is specific to the areas Boundary layer fed to the hot spots and areas around the hot spots to cool, and in general a uniformity the temperature over the heat source to achieve a small pressure drop within the heat exchanger. As in the various embodiments is explained below, uses the heat exchanger a variety of openings, channels and / or fingers in the manifold layer as well as lines in the Interlayer to liquid to and from selected Hot spot regions to conduct in the boundary layer. Alternatively, the heat exchanger several connections on, which are specially arranged at predetermined locations to liquid directly to the hot spots to deliver and derive from them to effectively cool the heat source.

Even though the microchannel heat exchanger according to the present Invention relating to a flexible liquid delivery for cooling hot spots is described and discussed in one device, it is obvious to one skilled in the art it can be seen that the heat exchangers alternatively for a flexible fluid delivery for heating a cold spot in a facility can be used. Furthermore It should be noted that the present invention also for other applications suitable and not on the ones discussed here Applications limited Although it is preferably described as a microchannel heat exchanger.

2A shows a schematic representation of a closed cooling system 30 which is a preferred microchannel heat exchanger 400 according to the present invention for a flexible liquid delivery. Further shows 2 B a schematic representation of a closed cooling system 30 , which is an alternative microchannel heat exchanger 200 with several connections 108 . 109 for the flexible delivery of liquid according to the present invention.

As in 2A is shown are the fluid connections 108 . 109 on liquid lines or lines 38 coupled to a pump 32 and a thermal capacitor 30 are connected. The pump 32 Pumps and circulates fluid within the self-contained circle 30 , Preference is given to a liquid connection 108 for a supply of liquid to the heat exchanger 100 used. Furthermore, the liquid connection is preferred 109 used to remove liquid from the heat exchanger 100 dissipate. Preferably, a uniform, constant amount of liquid enters the heat exchanger 100 and leaves it via the corresponding fluid connections 108 , 109 , Alternatively, different amounts of liquid at a given time through the inlet and outlet ports 108 . 109 enter and exit. Alternatively, a pump supplies a plurality of predetermined inlet ports 108 with liquid, like this one in 2 B is shown. Alternatively, several pumps (not shown) supply the respective inlet and outlet ports 108 . 109 with liquid. Furthermore, the dynamic locking and control module 34 alternatively, be provided in the system to vary and dynamically control the amount and flow rate of liquid entering and exiting the preferred or alternative heat exchanger in response to varying hot spots or heat changes memegen at hot spots as well as a local change of hot spots.

The preferred embodiment is a three-level heat exchanger 400 which is a boundary layer 402 , at least one intermediate layer 404 and at least one distribution layer 406 having. The preferred distribution layer 402 and the preferred boundary layer 402 are in 7 shown and the intermediate layer 104 is in 3B shown. Alternatively, the heat exchanger 400 as set forth below, be a two-tier apparatus which forms the boundary layer 402 and the distribution layer 406 contains, as in 7 is shown. As in the 2A and 2 B is shown is the heat exchanger 400 to a heat source 99 coupled, such as an electronic part or an electronic device, such as a microchip or an integrated circuit, wherein a thermal boundary material 98 preferably between the heat source 99 and the heat exchanger 100 is arranged. Alternatively, the heat exchanger 400 directly to the surface of the heat source 99 coupled. It will also be apparent to those skilled in the art that the heat exchanger 400 alternatively integrally with the heat source 99 may be formed, wherein the heat exchanger 400 and the heat source 99 are formed as a part. Thus, the boundary layer 102 integral with the heat source 99 and formed integrally with this.

Preferably, the heat exchanger is 400 according to the present invention directly or indirectly with the heat source 99 in contact, which has a rectangular shape, as shown in the drawing figures. However, it will be apparent to those skilled in the art that the heat exchanger 400 may have any other shape, which is the shape of the heat source 99 equivalent. For example, the heat exchanger according to the invention may have a semi-circular outer shape (not shown) and be in direct or indirect contact with a corresponding semicircular shaped heat source (not shown). Furthermore, it is preferred that the heat exchanger 400 in terms of its dimensions, slightly larger than the heat source, namely by 0.5 to 5.0 mm.

3A shows a plan view of the alternative embodiment of the manifold layer 106 according to the present invention. As in 3B is shown has the manifold layer 106 four sides as well as a top 130 and a floor area 132 on. The top 130 is in 3A but omitted to the operation of the distribution layer 107 adequately represent and describe. As in 3A is shown has the manifold layer 106 a number of channels or passages 116 . 118 . 120 . 122 as well as connections 108 . 109 who are trained in it. The finger 118 . 120 extend completely through the body of the manifold layer 106 in Z direction, like this one in 3B is shown. Alternatively, the fingers can 118 and 120 extend partially in the Z direction and have openings, as in 3A is shown. Furthermore, the passages extend 116 and 122 partly through the distributor layer 106 , The remaining areas between the inlet and outlet passages 116 . 120 , with 107 are designated, extending from the top 130 to the floor area 132 and form the body of the manifold layer 106 ,

As in 3A is shown, the liquid passes through the inlet port 108 into the distribution layer 106 and flows along the inlet channel 116 to several fingers 118 which are different from the channel 116 branch out in multiple directions in the X and / or Y direction to selected areas of the boundary layer 102 to supply with liquid. The finger 118 are arranged in different predetermined directions to liquid to sites of the boundary layer 102 which correspond to the areas of the hot spots of the heat source or these adjacent areas. These sites of the boundary layer 102 hereinafter referred to as boundary layer hot spot areas. The fingers are configured to cool both stationary and time varying boundary layer hot spots. As in 3A shown are the channels 116 . 122 and the fingers 118 . 120 in the X and / or Y direction in the manifold layer 106 arranged. Thus, the different directions of the channels allow 116 . 122 and the finger 118 . 120 a delivery of liquid to the hot spots of the heat source 99 to cool and / or the pressure drop within the heat exchanger 100 to minimize. Alternatively, the channels 116 . 122 and the fingers 118 . 120 periodically in the distribution layer 106 arranged and form as in the preferred embodiment, a pattern.

The arrangement as well as the dimensions of the fingers 118 . 120 are in the light of the cooling hot spots of the heat source 99 selected. The locations of the hot spots as well as the amount of heat generated near or at each hot spot are used around the manifold layer 106 to configure so that the fingers 118 . 120 above or adjacent to the boundary layer hot spots of the boundary layer 102 are arranged. The distribution layer 106 preferably allows a single and / or two-phase liquid in the boundary layer 102 to circulate without any significant pressure loss within the heat exchanger 100 and the system 30 ( 2A ) arises. The delivery of liquid to the interface hot spot areas produces a uniform temperature at the interface hot spot areas as well as in areas of the heat source adjacent the boundary layer hot spot areas.

The dimensions as well as the number of channels 116 and fingers 118 depend on a number of factors. In one embodiment, the inlet and outlet fingers 118 . 120 the same width dimensions. Alternatively, the inlet and outlet ports 118 . 120 have different width dimensions. The broad dimensions of the fingers 118 . 120 are preferably within the range of 0.25 to 0.50 mm. In this embodiment, the inlet and outlet fingers 118 . 120 the same length and depth dimensions. Alternatively, the inlet and outlet fingers 118 . 120 have different length and depth dimensions. In another embodiment, the inlet and outlet fingers 118 . 120 along the fingers varying width dimensions. The length dimensions of the inlet and outlet fingers 118 . 120 lie in a range between 0.5 mm to three times the length of the heat source. Continue to have the fingers 118 . 120 a height or depth within a range of 0.25 to 0.50 mm. Furthermore, less than ten or more than thirty fingers per centimeter are in the manifold layer 106 intended. However, it will be apparent to one skilled in the art that a number between ten and thirty fingers per centimeter of the manifold layer is alternatively possible.

Within the present invention is also provided the geometry of the fingers 118 . 120 and the channels 116 . 122 in a non-periodic arrangement to optimize the cooling of the hot spots of the heat source. To get a uniform temperature over the heat source 99 to obtain corresponds to the spatial distribution of heat transfer to the liquid of the spatial distribution of heat generation. When the liquid along the boundary layer through the microchannels 110 As its temperature rises, it begins to transform into steam, creating two-phase conditions. Accordingly, the liquid undergoes substantial expansion, resulting in a significant increase in its velocity. The effectiveness of heat transfer from the boundary layer to the liquid is generally improved with high velocity flow. It is therefore possible to increase the efficiency of heat transfer to the fluid by adjusting the cross-sectional dimensions in the finger 118 . 120 for the supply and discharge of liquid and the channels 116 . 122 in the heat exchanger 100 to improve.

For example, a particular finger may be formed for a heat source at which higher heat generation occurs near the inlet. Furthermore, it may be advantageous to have a larger cross section for the areas of the fingers 118 . 120 and the channels 116 . 122 to provide where a mixture of liquid and vapor is expected. Although not shown, a finger may be configured to begin at the inlet with a region of smaller cross-section to produce a high velocity of the flowing liquid. The particular finger or channel may also be configured to increase in cross-section at a downstream outlet to produce a lower flow rate. The formation of the finger or channel allows the heat exchanger to minimize pressure loss and to optimize the cooling of hot sources in areas where the liquid volume, acceleration and velocity of the liquid change from liquid to vapor to two-phase Flow increase.

Furthermore, the fingers can 118 . 120 and channels 116 . 122 be designed so that they widen in their longitudinal direction and then narrow again to the speed of the liquid at different points of the microchannel heat exchanger 100 to increase. Alternatively, it may be desirable to vary the dimensions of the fingers and channels from large to small and back again several times to increase the efficiency of heat transfer to the expected heat release distribution across the heat source 99 tailor. It should be understood that the foregoing discussion of varying the dimensions of the fingers and channels also applies to other embodiments and is not limited to the above discussed embodiment.

Alternatively contains the distribution layer 106 one or more openings 119 in the inlet fingers 118 , as in 3A is shown. In the three-level heat exchanger 100 the liquid flows along the fingers 118 flows through the openings 119 down to the intermediate layer 104 , Alternatively, the along the fingers 118 flowing liquid in a two-level heat exchanger 100 through openings 119 down directly into the boundary layer 102 stream. Furthermore, the distributor layer contains 106 , as in 3A shown is openings 121 in the outlet fingers 120 , In the three-level heat exchanger 100 the liquid flows from the intermediate layer 104 up through the openings 121 into the outlet fingers 120 , Alternatively, the liquid flows at the two-level heat exchanger 100 from the boundary layer 102 through the openings 121 straight up into the outlet fingers 120 ,

At the in 3A embodiment shown are the inlet and outlet fingers 118 . 120 open channels without openings. The floor area 103 the distributor layer 106 bumps against the top of the interlayer 104 at the three-level heat exchanger 100 or she bumps into the boundary layer 102 in the two-level heat exchanger. Accordingly, flows in the three-level heat exchanger 100 Liquid free to and from the intermediate layer 104 and the distributor layer 106 , The liquid is through lines 105 in the interlayer 104 led to the relevant boundary layer hot spot area. It is for the skilled person recognizable bar, that the lines 105 are aligned directly to the fingers, as described below, or may be located elsewhere in the three-tier system.

3B shows an exploded view of the three-level heat exchanger 100 with another distributor layer according to the invention. Alternatively, the heat exchanger 100 have a two-layered structure, which the distributor layer 106 and the boundary layer 102 contains, with liquid directly between the manifold layer 106 and the boundary layer 102 flows through without an intermediate layer 104 to stream. It will be apparent to those skilled in the art that the formation of the manifold layer, the interlayer and the barrier layer is merely exemplary and not limited to the embodiments shown.

As in 3B is shown, the intermediate layer 104 several lines 105 which extend through the intermediate layer. The inflow lines 105 conduct incoming fluid from the manifold layer 106 at certain predetermined boundary layer hot spots of the boundary layer 102 , Similarly, the openings channel 105 also the liquid flow from the boundary layer 102 to the outlet port (s) 109 , Accordingly, the intermediate layer provides 104 also for a liquid delivery from the boundary layer 102 to the outlet port 109 where the outlet port 108 with the distribution layer 106 communicated.

The wires 105 are in the boundary layer 104 arranged in a predetermined pattern based on a number of factors, including but not limited to the locations of the boundary layer hot spot areas, the required amount of liquid flow in the boundary layer hot spot area for corresponding cooling of the heat source 99 and the temperature of the liquid. The cables have a width of 100μm, whereby other widths up to several millimeters are possible. Furthermore, the conduits have other dimensions, which depend at least on the factors mentioned above. It will be apparent to those skilled in the art that each wire 105 in the interlayer 104 has the same shape and / or dimension, although this is not necessary. For example, the leads, such as the fingers described above, may alternatively have varying length and / or width dimensions. Furthermore, the lines 105 a constant depth or height over the intermediate layer 104 exhibit. Alternatively, the lines 105 have varying depth dimensions over the intermediate layer and, for example, be shaped as a trapezoid or nozzle-shaped. Although the horizontal shape of the wires 105 in 2C Shown at right angles, the lines can be 105 alternatively have any other shape and, for example, circular ( 3A ) may be curved or elliptical. Alternatively, one or more lines 105 be shaped so that they correspond to a part of the fingers described above or all fingers.

The intermediate layer 104 is in the heat exchanger 100 arranged horizontally, with the lines 105 are arranged vertically. Alternatively, the intermediate layer 104 be arranged in any other direction within the heat exchanger, for example diagonally or curved. Alternatively, the lines 105 in the interlayer 104 arranged in horizontal, diagonal, curved or any other direction. Furthermore, the intermediate layer extends 104 horizontally over the entire length of the heat exchanger 100 , wherein the intermediate layer 104 the boundary layer 102 completely from the distributor layer 106 delimits to force the liquid through the lines 105 to be channeled. Alternatively, contains a section of the heat exchanger 100 not the intermediate layer 104 between the distributor layer 106 and the boundary layer 102 wherein the liquid flows freely between these layers. Furthermore, the intermediate layer can 104 alternatively vertically between the distributor layer 106 and the boundary layer 102 extend to form separate distinct intermediate section areas. Alternatively, the intermediate layer extends 104 not completely from the distributor layer 106 to the boundary layer 102 ,

The heat exchanger according to the invention is preferred 100 wider than the heat source 99 , In this case, that the heat exchanger 100 bigger than the heat source 99 is, there is an overhang dimension. The overhang dimension is the furthest distance between an outer wall of the heat source 99 and the inner wall of the liquid passage of the Wärmetau shear 100 as the inner wall of the inlet port 408 ( 4 ). In the preferred embodiment, the overhang dimension for a single phase is in the range between 0 and 5 mm, and for a two-phase liquid in the range between 0 and 15 mm.

10 shows a perspective view of an embodiment of a boundary layer 202 ' according to the present invention. As in 10 is shown has the boundary layer 202 ' a number of columns 203 on which is from a top of the boundary layer 202 ' extend upwards. Further shows 10 a microporous structure 213 that is on top of the boundary layer 202 ' is arranged. It can be seen that the boundary layer 202 ' only the microporous structure 213 may have, as well a combination of the microporous structure with any other interface feature (eg, microchannels, columns, etc.). Furthermore, the boundary layer has 202 ' according to the present invention preferably a thickness of 0.3 to 0.7 mm for a single-phase liquid and 0.3 to 1.0 mm for a two-phase liquid.

In the embodiment of the heat exchanger, which is a microporous structure 213 used that on the boundary layer 202 ' is arranged, has the microporous structure 213 an average pore size of 10 to 200 microns for both a single phase and a two-phase liquid. Furthermore, the microporous structure has 213 a porosity of 50 to 80% for both a single-phase and a two-phase liquid. The height of the microporous structure 213 is in the range of 0.25 to 2.00 mm for both a single-phase and a two-phase liquid.

In the embodiment, which columns and / or microchannels along the boundary layer 202 ' used, has the boundary layer 202 ' According to the present invention, a thickness in the range of 0.3 to 0.7 mm for a single-phase liquid and 0.3 to 1.0 mm for a two-phase liquid. Furthermore, the area occupied by at least one column or microchannel is between 10 ² μm and 100 ² μm for both a single-phase and a two-phase liquid. Furthermore, the distance between at least two columns and / or microchannels in the range of 10 to 150 microns for both a single-phase and a two-phase liquid state. The width of the microchannels is in the range of 10 to 100 microns for both a single-phase and a two-phase state of the liquid. The height of the microchannels and / or columns is in the range of 50 to 800 μm for a single-phase liquid state and between 50 μm and 2 mm for a two-phase liquid state. It will be apparent to those skilled in the art that other alternative dimensions are possible.

3B shows a perspective view of the boundary layer 102 according to the present invention. As in 3B is shown has the boundary layer 102 a floor area 103 and a variety of microchannel walls 110 on, with the area between the microchannel walls 110 the liquid is channeled along a liquid flow path. The floor area 103 is even and has a high thermal conductivity to ensure adequate heat transfer from the heat source 99 to enable. Alternatively, the floor area indicates 103 Troughs and / or elevations to collect or return liquid from a specific location. The microchannel walls 110 are arranged in parallel, as in 3B with liquid preferably between the microchannel walls 110 flows along a liquid path. Alternatively, the microchannel walls 110 a non-parallel configuration.

It will be apparent to those skilled in the art that the microchannel walls 110 alternatively, may be configured in any other suitable configuration, depending on the factors discussed above. For example, the boundary layer 102 alternatively grooves between the sections of the microchannel walls 110 on, like this one in 8C is shown. Furthermore, the microchannel walls have 110 Dimensions which the pressure drop or the pressure difference within the boundary layer 102 minimize. It can also be seen that in addition to microchannel walls 110 any other features are suitable, including columns ( 10 ), roughened surfaces or a microporous structure such as a sintered metal or a silicate foam ( 10 ). However, an example as in 3B shown training with parallel microchannel walls 110 used to the boundary layer 102 to describe according to the present invention.

The microchannel walls 110 allow the fluid thermal exchange along the selected hot spots of the interface hot spot area to the heat source 99 to cool at this point. The microchannel walls 110 have a width of 10 to 100 microns and a height in the range of 50 μ to 2 mm, depending on the power of the heat source 99 , The microchannels 110 have a length between 100 microns and several centimeters, depending on the dimensions of the heat source, as well as the size of the hot spots and the heat flow density of the hot spot. Alternatively, any other dimensions are possible for the microchannel walls. The microchannel walls 110 are at a mutual distance of 50 to 500 microns, depending on the power of the heat source 99 although a different distance is possible.

Referring again to 3B It should be noted that the top of the manifold layer 106 is cut away to the channels 116 . 122 and the fingers 118 . 120 within the body of the distribution layer 106 to be able to show. The places of the heat source 99 , which produce more heat, are hereby referred to as hot spots, while the locations of the heat source 99 , which produce less heat, hereby referred to as hot spots. As in 3B is shown, the heat source shown 99 a hot spot area at point A and a hot spot area at point B. The areas of the boundary layer 102 which adjoin the hot and hot spots are accordingly referred to as boundary layer hot spot areas. As in 3B is shown has the boundary layer 102 a boundary layer hot spot area A, which lies above the point A posi tion, and a boundary layer hot spot area B, which is positioned above the point B.

As in the 3A and 3B is shown, the liquid first passes through the inlet port 108 in the heat exchanger 100 one. The liquid then flows preferably to a laßkanal A 116 , Alternatively, the heat exchanger 100 more than one inlet channel 116 on. As in the 3A and 3B is shown, liquid branches from the inlet port 108 along the inlet channel 116 flows, first to the finger 118D , Furthermore, liquid flows, which flows through the remainder of the inlet channel 116 continues, to individual fingers 118B and 118C .etc.

In 3B the boundary layer hot spot region A is supplied with liquid by adding liquid to the finger 118A flows, taking fluid through the finger 118A down to the intermediate layer 104 flows. The liquid then flows through the under the finger 118A positioned inlet pipe 105a to the boundary layer 102 wherein the liquid undergoes heat exchange with the heat source 99 is subjected. The liquid flows as in 3B shown along the microchannels 110 although the liquid in any other direction along the boundary layer 102 can flow. The heated liquid then flows upwardly through the conduit 105B to the outlet finger 120A , Similarly, fluid flows in the Z direction through fingers 118E and 118F to the intermediate layer 104 downward. The liquid then flows through the inlet conduit 105C in the Z direction down to the boundary layer 102 , The heated liquid then flows upwardly in the Z direction from the boundary layer 102 through the outlet pipe 105D to the outlet fingers 120E and 120F , The heat exchanger 100 removes the heated liquid in the manifold layer 106 over the outlet fingers 120 , wherein the outlet fingers 120 with the outlet channel 122 communicate. The outlet channel 122 allows the liquid through an outlet port 109 exit from the heat exchanger.

In one embodiment, the inflow and outflow lines 105 positioned directly or nearly directly above the respective boundary layer hot spot areas to the hot spots of the heat source 99 to apply liquid directly. Furthermore, each outlet finger 120 configured to be closest to a respective inlet finger 119 for a particular boundary layer hot spot area to minimize the intervening pressure drop. Accordingly, liquid passes through the inlet finger 118A into the boundary layer 102 and flows over the smallest possible distance along the floor surface 103 the boundary layer 102 before they reach the boundary layer 102 to the outlet finger 120A leaves. It can be seen that the distance over which the liquid travels along the bottom surface 103 flows from the heat source 99 generated heat removed in a suitable manner, without generating an unnecessarily high pressure loss. Furthermore, the corners are the fingers 118 . 120 curved to the pressure drop along the fingers 118 to reduce flowing liquid, like this in the 3A and 3B is shown.

It will be apparent to those skilled in the art that in the 3A and 3B shown configuration of the distribution layer 106 is only an example. The configuration of the channels 116 and the finger 118 in the distribution layer 106 These depend on a number of factors including the locations of the interface hot spot areas, the amount of liquid flowing to and from the interface hot spot areas, as well as the amount of heat generated by the heat source in the boundary layer hot spot areas. For example, the preferred configuration of the manifold layer 106 an interlaced pattern of parallel inlet and outlet fingers disposed along the width of the manifold layer, such as that in Figs 4 to 7A shown and explained below. Nonetheless, any other configuration of channels is 116 and the finger 118 possible.

4 shows a perspective view of the preferred distribution layer 406 according to the heat exchanger according to the invention. The distribution layer 406 in 4 preferably has a number of interleaved parallel liquid fingers 411 . 412 on, which allow a single-phase and / or a two-phase liquid, through the boundary layer 402 to flow without being within the heat exchanger 400 and the system 30 ( 2A ) a significant pressure drop occurs. As in 8th are shown are the inlet fingers 411 alternating with the outlet fingers 412 arranged. However, it will be apparent to those skilled in the art that a certain number of inlet or outlet fingers may be disposed adjacent to each other, and that the construction is therefore not limited to the alternate arrangement, as in 4 is shown. Furthermore, the fingers are alternatively formed so that a parallel finger is branched from another parallel finger or connected to another parallel finger. Accordingly, it is possible to have considerably more inlet fingers than outlet fingers, and vice versa.

The inlet fingers or passages 411 supply the liquid entering the heat exchangers to the boundary layer 402 , and the exhaust fingers 412 remove the liquid from the boundary layer 402 , which then from the heat exchanger 400 exit. The preferred configuration the distributor layer 406 allows the liquid to enter the boundary layer 402 to enter, and over a very short distance in the boundary layer 402 to pour before entering the outlet passage 412 entry. The substantial decrease in the length over which the liquid along the boundary layer 402 flows, sets the pressure drop in the heat exchanger 400 and the system 30 ( 2A ) substantially down.

As in the 4 - 5 shows the preferred distribution layer 406 a passage 414 on, which with two inlet passages 411 communicates and supplies them with fluid. As in the 8th - 9 is shown has the manifold layer 406 three outlet passages 412 on which with the passage 418 communicate. The passages are preferred 414 in the distribution layer 406 a flat bottom surface, which the liquid to the fingers 411 . 412 channeled. Alternatively, the passage 414 slightly inclined, causing the liquid when channeling to selected fluid passages 411 supported. Alternatively, the inlet passage 414 one or more openings in its bottom surface, which allow a portion of the liquid, down to the boundary layer 402 to stream. Similarly, the passage has 418 in the distribution layer a flat bottom, which receives the liquid and the connection 408 channeled. Alternatively, the passage has 418 a slight tilt, which channeling the liquid to selected outlet ports 408 supported. Continue to have the passages 414 . 418 a width of about 2 mm, although any other width is alternatively possible.

The passages 414 . 418 communicate with the connections 408 . 409 , where the connections to liquid lines 38 in the system 30 ( 2A ) are connected. The distribution layer 406 preferably has horizontally arranged liquid connections 408 . 409 on. Alternatively, the manifold layer comprises 406 vertically and / or diagonally arranged fluid connections 408 . 409 as discussed below, although in the 4 - 7 not shown. Alternatively, the manifold layer 406 no passage 414 on. Accordingly, the liquid becomes the fingers 411 from the terminals 408 fed directly. If the distribution layer 411 alternatively no passages 418 the liquid flows in the fingers 412 directly through the connections 408 from the heat exchanger 400 , Even if two connections 408 are shown with the passages 414 . 418 It will be understood that any other number of terminals may alternatively be used.

The intake passages 411 preferably have dimensions that allow the liquid to flow to the boundary layer without passing along the passages 411 and the system 30 ( 2A ) to produce a high pressure drop. The intake passages 411 preferably have a width in the range of 0.25 - 5.00 mm, although any other width dimensions are alternatively possible. Furthermore, the inlet passages 411 preferably has a length in the range of 0.5 mm to three times the length of the heat source. Alternatively, other lengths are possible. As stated above, the inlet passages extend 411 continue down to the height or slightly above the height of the microchannels 410 so that the liquid goes directly to the microchannels 110 is channeled. The intake passages 411 preferably have a height in the range of 0.25 - 5.00 mm. It will be apparent to one skilled in the art that the passages 411 not down to the microchannels 410 extend, and that, alternatively, any other height is possible. It will be apparent to those skilled in the art that the inlet passages 411 have different dimensions, although they are shown with the same dimensions. Furthermore, the inlet passages 411 alternatively have varying widths, cross-sectional dimensions and / or distances to adjacent fingers. In particular, the passage 411 Have areas of greater width or depth as well as sections of lesser widths and depths along their length. The varied dimensions enable more liquid to reach predetermined interface hot spot areas in the boundary layer 402 is provided by further formed sections while the flow to the hot spot areas is reduced by narrower sections.

Furthermore, the outlet passages 412 Preferably, dimensions that allow the liquid to flow to the boundary layer without a large pressure drop along the passage 412 as well as the system 30 ( 2A ) to create. The outlet passages 412 preferably have a width in the range of 0.25 - 5.00 mm, although any other width is alternatively possible. Furthermore, the outlet passages 412 preferably has a length in the range of 0.5 mm and three times the length of the heat source. Furthermore, the outlet passages extend 412 down to the height of the microchannels 410 so that the liquid flows slightly upwards into the outlet passages 412 after flowing horizontally through the microchannels 410 has flowed. The intake passages 411 preferably have a height in the range of 0.25 - 5.00 mm, although any other height is alternatively possible. It will be apparent to those skilled in the art that the outlet passages 412 have the same dimensions, although it is alternatively possible that the outlet passages 412 have different dimensions. It should again be noted that the outlet passages 412 alternatively may have varying widths, cross-sectional dimensions and / or distances to adjacent fingers.

The inlet and outlet passages 411 . 412 are preferably divided into segments and differ from each other, as this in the 4 and 5 is shown, wherein liquid does not mix between the passages. As in 8th In particular, two outlet passages are shown along the outer edges of the manifold layer 406 arranged and an outlet passage 412 is in the middle of the distribution layer 406 arranged. Furthermore, there are two intake passages 411 on adjacent sides of the middle outlet passage 412 arranged. This particular design causes that in the boundary layer 402 entering liquid over a short distance in the boundary layer 402 flows before leaving the boundary layer 402 through the outlet passage 412 flows. However, it will be apparent to those skilled in the art that the inlet and outlet passages can be arranged in any other configuration, and that their arrangement and design is therefore not limited to the shown and be described embodiment. The number of inlet and outlet fingers 411 . 412 is more than three within the distribution layer 406 but less than ten per centimeter across the manifold layer 406 , It will also be apparent to those skilled in the art that any other number of inlet and outlet passages may be used and that their number is therefore not limited to the number shown and described in the present disclosure.

The distributor layer is preferred 406 coupled to the intermediate layer (not shown), wherein the intermediate layer (not shown) to the boundary layer 402 is coupled to a three-level heat exchanger 400 to build. With regard to the interlayer referred to here, reference is made to the above with reference to FIGS 3B explained embodiment referenced. The distribution layer 406 can alternatively to the boundary layer 402 coupled and above the boundary layer 402 be arranged to a two-level heat exchanger 400 to form, as in 7A is shown. The 6A - 6C show schematic cross-sectional views of the preferred distribution layer 406 , which at the two-level heat exchanger to the boundary layer 402 is coupled. Specially shows 6A the cross section of the heat exchanger 400 along the line A - A in 5 , Further shows 6B the cross section of the heat exchanger 400 along the line B - B and 6C shows the cross section of the heat exchanger 400 along the line C - C in 5 , As stated above, the inlet and outlet passages extend 411 . 412 from the top to the bottom surface of the manifold layer 406 , If the distribution layer 406 and the boundary layer 402 coupled to each other, are the inlet and outlet passages 411 . 412 at or slightly above the height of the microchannels 410 in the boundary layer 402 , This formation causes the liquid from the inlet passages 411 easily through the microchannels 410 flows. Furthermore, this design causes the liquid flowing through the microchannels to flow easily through the outlet passages 412 flows upwards after passing through the microchannels 410 flowed.

In the preferred embodiment, the intermediate layer 104 ( 3B ) between the manifold layer 406 and the boundary layer 402 arranged, although this is not shown in the drawing figures. The intermediate layer 104 ( 3B ) channels the liquid flow to predetermined boundary layer hot spots of the boundary layer 402 , Furthermore, the intermediate layer 104 ( 3B ) is preferably used to produce a uniform liquid flow into the boundary layer 402 entry. Also, the intermediate layer is preferably used to form boundary layer hot spots in the boundary layer 402 To supply liquid to adequately cool the hot spots and a uniform temperature of the heat source 99 to create. Although the inlet and outlet passages 411 . 412 preferably near or above the hot spots of the heat source 99 are arranged to adequately cool the hot spots, this is not essential.

7A shows an exploded view of another distribution layer 406 with an alternative boundary layer 102 according to the present invention. Preferably, the boundary layer 102 continuous or continuous arrangements of microchannel walls 110 on, like in 3B is shown. During general operation, liquid will appear, similar to the preferred distributor layer 106 according to 3B is shown in the distribution layer 406 at a fluid connection 408 and flows through the passage 414 in the direction of the liquid fingers or passages 411 , The liquid passes through the opening of the inlet fingers 411 and preferably flows in the X direction over the length of the fingers 411 as shown by arrows. Furthermore, the liquid flows in the Z direction down to the boundary layer 402 , which are below the distributor layer 406 is positioned. As in 7A shown crosses the liquid in the boundary layer 402 the bottom surface in the X and Y direction of the boundary layer 402 and performs a heat exchange with the heat source 99 by. The heated liquid exits the boundary layer 402 preferably by upward flow in the Z direction via the outlet fingers 412 from, with the Auslaßfinger 412 the heated liquid for passage 418 in the distribution layer 406 Channel in the X direction. The liquid then flows along the passage 418 and leaves the heat exchanger by flowing out of the port 409 ,

In the 7A shown boundary layer contains a number of ribs or grooves 416 between sets of microchannels 410 are arranged and the liquid when channeling to and from the passages 411 . 412 support. The grooves 416A are directly below the intake passage 411 the alternative distribution layer 406 arranged, with the liquid, which in the boundary layer 402 over the intake passage 411 enters, directly to the groove 416A channeled adjacent microchannels. The grooves 416A thus allow the liquid to flow directly into specifically provided flow paths from the inlet passages 411 to be channeled, like this one in 5 is shown. Similarly, the boundary layer contains 402 groove 416B which are directly below the outlet passages 412 are arranged in the Z direction. Liquid flowing horizontally along the microchannels 410 flows in the direction of the outlet passages, therefore becomes horizontal to the grooves 416A and vertical to the outlet passage 412 over the grooves 416B channeled.

6A shows the cross section of a heat exchanger 400 with a distribution layer 406 and a boundary layer 402 , In particular shows 6A the intake passage 411 that with the outlet passages 412 is intertwined, with the liquid passing through the inlet passages 411 down and through the outlet passages 412 flows upwards. Further shows 6A Make sure the liquid is horizontal through the microchannel walls 410 which flows between the inlet and outlet passages and through the microchannels 410 are separated. Alternatively, the microchannel walls are continuous ( 3B ) and not separated by grooves. As in 6A is shown, have the inlet and / or outlet passages 411 . 412 preferably at their ends near the grooves 116 a curved surface 420 , The curved surface 420 directs the passage 411 downflowing liquid to the microchannels 410 which are adjacent to the passage 411 are arranged. So that gets into the boundary layer 102 Incoming fluid easier directly to the microchannels 410 piped as if directly to the groove 416A flows. Similarly, the curved surface supports 420 in the outlet passages 412 the management of the liquid from the microchannels 410 to the outer passage 412 ,

In an alternative embodiment, which in 7B is shown has the boundary layer 402 ' the intake passages 411 ' and outlet passages 412 ' on, the above with reference to the distribution layer 406 ( 8th - 9 ) have been discussed. In the alternative embodiment, the liquid from the port 408 ' directly to the boundary layer 402 ' guided. The liquid flows along the passage 414 ' to the intake passage 411 ' , The liquid then flows across the microchannels 410 ' and undergoes heat exchange with the heat source (not shown) and flows to the outlet passages 412 ' , The liquid then flows along the outlet passages 412 ' to the passage 418 ' , where the liquid is the boundary layer 402 ' over the connection 409 ' leaves. The connections 408 ' . 409 ' are in the boundary layer 402 ' formed and alternatively in the distribution layer 406 ( 7A ).

Even though all heat exchangers according to the present Invention are shown with horizontal operation, it is for one One skilled in the art recognizes that the inventive heat exchanger alternatively can work in a vertical position. When in vertical Position is worked, the heat exchangers are alternatively designed so that every intake passage is arranged above an adjacent outlet passage. Accordingly, occurs Liquid in the boundary layer through the inlet passages and is on natural Way to an outlet passage channeled. It is also it can be seen that every other Configuration of the distribution layer and the boundary layer alternatively for one vertical operation of the heat exchanger can be used.

The 8A - 8C show plan views of another embodiment of the heat exchanger according to the present invention. 8A shows a plan view of a differently formed distribution layer 206 according to the present invention. The 8B and 8C show a plan view of an intermediate layer 204 and a boundary layer 202 , Further shows 9A a three-level heat exchanger, which the differently formed distribution layer 206 used while 9B shows a two-level heat exchanger, which is the differently formed distribution layer 206 used.

As in the 8A and 9A is shown has the manifold layer 206 a plurality of horizontally and vertically disposed fluid ports 208 on. Alternatively, the fluid connections 208 diagonally or in any other direction with respect to the manifold layer 206 be arranged. The fluid connections 208 are at selected points of the distribution layer 206 placed to effectively liquid at predetermined boundary layer hot spots of the heat exchanger 200 to deliver. The multiple fluid connections 208 provide a significant advantage because liquid can be delivered directly from a liquid port to a particular boundary layer hot spot area without the pressure drop in the heat exchanger 200 in a significant way to enlarge. Furthermore, the fluid connections 208 also in the distribution layer 206 positioned to allow liquid in the boundary layer hot spots, with the least distance to the outlet port 208 to flow so that the liquid maintains a uniform temperature, while a minimal pressure loss between the inlet and outlet ports 208 is obtained. Furthermore, the used distribution layer supports 206 a stabilization of a two-phase flow inside the heat exchanger 200 because they are for a uniformly distributed, uniform flow across the boundary layer 202 provides. It should be noted that alternatively more than one distribution layer 206 in the heat exchanger 200 can be arranged, wherein a distribution layer 206 the liquid in and out of the heat exchanger 200 and another manifold layer (not shown) controls the rate of fluid circulation to the heat exchanger 200 controls. Alternatively, all of the multiple distribution layers 206 Liquid to selected corresponding boundary layer hot spot areas in the boundary layer 202 conduct.

The alternative distribution layer 206 has lateral dimensions that are pretty much accurate to the dimensions of the boundary layer 202 fit. Furthermore, the distributor layer has 206 the same dimensions as the heat source 99 , Alternatively, the distribution layer 206 bigger than the heat source 99 be. The vertical dimensions of the manifold layer 206 are within the range of 0.1 and 10 mm. Furthermore, the openings in the distributor layer 206 which the fluid connections 208 dimensionally in the range between 1 mm and the entire width or length of the heat source 99 be.

11 shows a broken perspective view of a three-level heat exchanger 200 with the other distribution layer according to the present invention. As in 11 is shown is the heat exchanger 200 divided into separate areas, depending on the amount of along the body of the heat source 99 generated heat. The subdivided areas are through the vertical interlayer 204 and / or micro-channel walls 210 in the boundary layer 202 separated from each other. However, it will be apparent to those skilled in the art that the in 11 shown arrangement is not limited to this configuration, but that this is shown only by way of example.

As in 3 shown has the heat source 99 a hot spot at the point A and a hot spot at the point B, wherein the hot spot at the point A generates more heat than the hot spot at the point B. It can be seen that the heat source 99 may have more than one hot spot and more than one hot spot at any one time. Since in the example the point A is a hot spot and at the point A more heat is applied to the boundary layer 202 is transmitted above the point A (in 11 referred to as boundary layer hot spot area A) becomes the boundary layer hot spot area A in the heat exchanger 200 more liquid and / or liquid with higher flow velocity provided to the point A of the heat exchanger 200 to cool adequately. Although the boundary layer hot spot area B is shown to be greater than the boundary layer hot spot area A, it can be seen that the boundary layer hot spot areas A and B as well as any other boundary layer hot spot areas of the heat exchanger 200 relative to each other may have any size and / or configuration.

Alternatively, as in 11 can be shown, the over the fluid connections 208A liquid entering the heat exchanger to the boundary layer hot spot area A by flowing along the intermediate layer 204 to the inflow lines 205A be directed. The liquid then flows down through the inlet conduits 205A in the Z direction in the boundary layer hot spot area A of the boundary layer 202 , The liquid flows between the microchannels 210A , wherein heat from the point A to the liquid by conduction through the boundary layer 202 passes. The heated liquid flows along the boundary layer 202 in the boundary layer hot spot area A toward the outlet port 209A where the liquid from the heat exchanger 200 exit. It will be apparent to those skilled in the art that any number of inlet ports 208 and outlet connections 209 can be used for a particular boundary layer hot spot area or multiple such areas. Although the outlet port 209A near the boundary layer 202A is shown, the outlet port 209A alternatively be positioned vertically at any other location, optionally also at the distributor layer 209B ,

Similarly, in the case of 11 Example shown, the heat source 99 a hot spot in the area B, which is less heat than at the point A of the heat source 99 generated. Through the connection 208B incoming liquid becomes the boundary layer hot spot area B by flowing along the intermediate layer 204B to the inflow lines 205B directed. The liquid then flows through the inflow lines 205B down in the Z direction in the boundary layer hot spot area B of the boundary layer 202 , The liquid flows between the microchannels 210 in the X and Y directions, wherein heat generated by the heat source at the point B is transferred to the liquid. The heated liquid flows along the entire boundary layer 202B in the boundary layer warming area B up to the outlet ports 209B in the Z direction via the discharge lines 205B in the interlayer 204 , wherein the liquid from the heat exchanger 200 exit.

Alternatively, the heat exchanger 200 , as in 9A is shown, a vapor permeable membrane 214 that are above the boundary layer 202 is positioned. The vapor permeable membrane 214 is in sealing contact with the inner sidewalls of the heat exchanger 200 , The membrane has numerous small openings that steam it along the boundary layer 202 has been generated, thereby, to the outlet port 209 to get. The membrane 214 is also hydrophobic, to prevent it from passing along the boundary layer 202 flowing liquid through the openings of the membrane 214 reached. Further details of the vapor permeable membrane 214 are disclosed in U.S. Patent Application No. 10 / 366,128 filed February 12, 2003, entitled "Vapor Escape Microchannel Heat Exchanger", which is hereby incorporated by reference.

Of the Microchannel heat exchanger according to the present The invention may alternatively have other configurations which are not described above. For example, the heat exchanger have a manifold layer, the pressure drop within of the heat exchanger by means of separately sealed inlet and outlet openings minimized, which lead to the boundary layer. The liquid flows directly through inlet openings to the boundary layer and is subject to heat exchange in the boundary layer. The liquid then exits the boundary layer by passing directly through outlet ports flows, the adjacent to the inlet openings are arranged. This porous Configuration of the distribution layer minimizes the distance over which the liquid between the intake and outlet ports must flow, and maximize the division of the liquid flow between the various openings, which lead to the boundary layer.

Details about how the heat exchanger 100 and the individual layers in the heat exchanger 100 are discussed below. The following discussion refers to the preferred and alternative heat exchangers according to the present invention, wherein the heat exchanger 100 in 3B and individual layers will be referred to for simplicity. It will also be apparent to one of ordinary skill in the art, that even though the manufacturing details relating to the present invention are described, the manufacturing details are alternatively applicable to conventional heat exchangers as well as two- and three-level heat exchangers employing a liquid inlet port and a liquid outlet port. like in the 1A - 1C is shown.

The boundary layer preferably has 102 a thermal expansion coefficient which is similar or equal to that of the heat source 99 is. Accordingly, the boundary layer expands 102 preferably according to the heat source 99 out and pulls according to the heat source 99 together. Alternatively, the material of the boundary layer 102 have a thermal expansion coefficient different from that of the material of the heat source. A boundary layer made of a material such as silicon 102 has a thermal expansion coefficient to that of the heat source 99 Fits, and has sufficient thermal conductivity to adequately heat from the heat source 99 to transfer to the liquid. Alternatively, however, other materials may be used for the boundary layer 102 be used, whose thermal expansion coefficient match that of the heat source.

The boundary layer 102 in the heat exchanger 100 preferably has a high thermal conductivity to a sufficient heat conduction between the heat source 99 and along the boundary layer 102 allow flowing liquid, so that the heat source 99 not overheated. The boundary layer 102 is preferably made of a material having a high thermal conductivity of 100 W / mK. However, it will be apparent to one skilled in the art that the boundary layer 102 may also have a thermal conductivity of more or less than 100 W / mK and is not limited thereto.

In order to obtain the preferred thermal conductivity, the barrier layer is preferably made of a semiconductor substrate such as silicon. Alternatively, the barrier layer may be made of other materials such as single crystalline dielectric materials, metals, aluminum, nickel and copper, kovar, graphite, diamond, composites or any suitable alloys. An alternative material for the boundary layer 102 is a patterned or cast organic grid material.

As in 12 is shown, it is preferred that the boundary layer 102 with a coating 112 is coated to the material of the boundary layer 102 protect as well as the thermal exchange properties of the boundary layer 102 to improve. The coating 112 creates a chemical protection, the specific chemical reaction between the liquid and the boundary layer 102 eliminated. For example, a barrier layer made of aluminum 102 be attacked by the liquid coming into contact with it, the boundary layer 102 would be destroyed over time. The coating 112 a thin nickel layer of about 25 microns is therefore preferred by electroplating over the surface of the boundary layer 102 applied to prevent any possible chemical reactions without the thermal properties of the boundary layer 102 to change significantly. It will be appreciated that any other coating material having a suitable coating thickness may be provided, depending on the material or materials of the boundary layer 102 ,

Furthermore, the coating material 112 on the boundary layer 102 applied to improve the thermal conductivity of the boundary layer, and a sufficient heat exchange with the heat source 99 to be able to perform as in 12 is shown. For example, a boundary layer 102 on a metallic basis with a plastic coating thermally with a layer of a nickel coating 112 to be improved on the plastic. The nickel layer has a thickness of at least 25 μm, depending on the dimensions of the boundary layer 102 and the heat source 99 , It will be appreciated that any other coating material having a suitable coating thickness may be provided, depending on the material or materials of the boundary layer 102 , The coating material 112 is alternatively used on a material which already has high thermal conductivity characteristics, so that the coating material further improves the thermal conductivity of the material. The coating material 112 is preferred both on the floor surface 103 as well as the microchannel walls 110 the boundary layer 102 applied, as in 12 is shown. Alternatively, the coating material 112 either on the floor surface 103 or the micro-channel walls 110 be applied. The coating material 112 preferably consists of a metal such as nickel or aluminum, but is not limited thereto. Rather, the coating material 112 alternatively, consist of any other high conductivity material.

The boundary layer 102 is preferably formed by an etching process using a copper material coated with a thin nickel layer around the barrier layer 102 to protect. Alternatively, the boundary layer 102 made of aluminum, a silicon substrate, plastic or other suitable material. A barrier layer made of a material with poor thermal conductivity 102 may also be coated with a suitable coating material to increase the thermal conductivity of the boundary layer 102 to improve. One method of electrically forming the barrier layer is to apply a particle layer of chromium or other suitable material over the bottom surface 103 the boundary layer 102 and applying a suitable electrical voltage to the particle layer. The electrical connection forms a layer of a thermally conductive coating material 112 on the boundary layer 102 , The electrical molding process leads to coating dimensions in the range of 10 - 100 microns. The boundary layer 102 is formed by an electric molding process such as a patterned electroplating. Furthermore, the boundary layer may alternatively be prepared by photochemical or chemical milling, either alone or in combination with an electrical forming process. For producing features in the boundary layer 102 For example, conventional lithographic equipment may be used for chemical milling. Furthermore, the aspect ratios and tolerances can be improved by using laser assisted chemical milling processes.

The micro-channel walls 110 are preferably made of silicon. The micro-channel walls 110 may alternatively be made of other materials, such as patterned glass, polymer, or a cast polymer grid. Although it is useful if the micro-channel walls 110 made of the same material as the floor surface 103 the boundary layer 102 can exist, the micro-channel walls 110 alternatively made of a different material than the rest of the boundary layer 102 ,

Preferably, the micro-channel walls 110 a thermal conductivity of at least 10 W / mK. Alternatively, the micro-channel walls 110 have a thermal conductivity of more than 10 W / mK. It will be apparent to those skilled in the art that the microchannel walls 110 alternatively may have a thermal conductivity of at least 20 W / mK, wherein coating material 112 on the micro-channel walls 110 is applied as in 12 shown is the thermal conductivity of the walls 110 to improve. For micro-channel walls 110 consisting of materials which already have a good thermal conductivity, the coating has 112 a thickness of at least 25 microns, which is the surface area of the microchannel walls 110 also protects. For micro-channel walls 110 made of a material with poor thermal conductivity possesses the coating 112 a thermal conductivity of at least 50 W / mK and is more than 25 microns thick. It will be apparent to those skilled in the art that other types of coating materials as well as other thickness dimensions are possible.

Around the micro-channel walls 110 so that they have an adequate thermal conductivity of at least 10 W / mK, the walls become 110 electrically with coating material 112 ( 12 ), such as nickel or other metal as stated above. Around the micro-channel walls 110 so that they have an adequate thermal conductivity of at least 50 W / mK, the walls become 110 electroplated with copper on a thin metal film particle layer. Alternatively, the micro-channel walls 110 not coated with a coating material. It is understood that the thermal conductivity characteristics of the microchannel walls 110 and the coating 112 also those of the columns 203 ( 10 ) and any other coating disposed thereon, if indicated.

The micro-channel walls 110 are preferably formed by hot-stamping techniques to achieve a high ratio of the channel walls 110 along the floor surface 103 the boundary layer 102 to achieve. The micro-channel walls 110 are alternatively formed of silicon structures that are placed on a glass surface, where they are etched in the desired configuration. The micro-channel walls 110 Alternatively, they can be made by standard lithographic techniques, stamping or any other methods. The microchannel walls 110 are alternatively separate from the boundary layer 102 are produced and attached to the boundary layer 102 glued by anodic welding or by gluing with an epoxy resin. Alternatively, the microchannels 110 by conventional electric forming techniques such as electroplating to the boundary layer 102 be coupled.

There are a large number of processes necessary for the preparation of the intermediate layer 104 can be used. The intermediate layer is preferably made of silicon. It will be apparent to those skilled in the art that any other material may be envisioned, such as glass, laser patterned glass, polymers, metals, plastic, cast organic materials, or any composites thereof. The intermediate layer is preferred 104 formed by using plasma etching techniques. Alternatively, the intermediate layer 104 be formed by using a chemical etching technique. Other methods include machining, etching, extruding and / or forging a metal into the desired configuration. The intermediate layer 104 may alternatively be molded by injecting a plastic into the desired configuration. Alternatively, the intermediate layer 104 be brought into the desired configuration by laser drilling a glass plate.

The distribution layer 106 can be made by a variety of methods. The distributor layer is preferred 106 produced by an injection molding process using plastic, metal, a polymer compound or other material, each layer being of the same material. Alternatively, as discussed above, each layer may be made of a different material. The distribution layer 106 may alternatively be made by a metal cutting or corrosive technique. It will be apparent to those skilled in the art that the distribution layer 106 can be produced by using any suitable method.

For coupling the intermediate layer 104 to the boundary layer 102 and the distribution layer 106 for the purpose of forming the heat exchanger 100 a variety of methods can be used. The boundary layer 102 , the intermediate layer 104 and the distribution layer 106 are preferably coupled together by an anodic process, by gluing or by eutectic bonding. The intermediate layer 104 may alternatively be integral with the characteristics of the manifold layer 106 and the boundary layer 102 be formed. The intermediate layer 104 can pass through a chemical process to the boundary layer 102 be coupled. The boundary layer 104 Alternatively, it can be made by hot embossing or gentle lithographic techniques using a wire spark erosion process or a silicon part to form the interlayer 104 to shape. The intermediate layer 104 is then alternatively electroplated with metal or other suitable material to increase the thermal conductivity of the interlayer 104 to improve, if necessary.

Alternatively, the intermediate layer 104 along with the production of micro-channel walls 110 in the boundary layer 102 be produced by an injection molding process. Alternatively, the intermediate layer 104 along with the production of micro-channel walls 110 be prepared by another suitable method. Other methods of manufacturing the heat exchanger include, for example, soldering, fusion welding, electic welding, intermetallic welding, and any other suitable technique, depending on the types of materials used in each layer.

Another alternative method of manufacturing the heat exchanger according to the present invention is disclosed in U.S.P. 13 described. As with reference to 13 has been carried out, an alternative method for producing the heat exchanger comprises the formation of a hard mask, which, like the boundary layer (step 500 ) consists of a silicon substrate. The hard mask is made of silicon dioxide or, alternatively, spin-on glass. When the hard mask is formed, the number of subchannels in the hard mask is formed, with the subchannels forming the fluid paths between the microchannel walls 110 form (step 502 ). The subchannels are formed by any suitable method, for example by high frequency embossing, chemical milling, soft lithography or xenon difluoride etching. In this case, sufficient space between each sub-channel must be ensured so that adjacent subchannels are not interconnected. Thereafter, the glass is then applied to the surface of the hard mask by any conventional method to form the intermediate layer and the Form distribution layer (step 504 ). Subsequently, the intermediate layer and the manifold layer are cured by an aftertreatment process (step 506 ). Once the intermediate layer and the manifold layer are fully formed and cured, one or more fluid ports are formed in the cured layer (step 508 ). The fluid ports are etched into the manifold layer or alternatively drilled. Although here are specific methods for making the boundary layer 102 , the intermediate layer 104 and the distribution layer 106 have been discussed, are other known methods for producing the heat exchanger 100 alternatively possible.

14 shows an alternative embodiment of the heat exchanger according to the present invention. As in 6 is shown are two heat exchangers 200 . 200 ' to a heat source 99 coupled. The heat source 99 as an electronic component or an electronic device is connected to an electronic circuit or a circuit board 96 coupled and arranged upright, with each side of the heat source 99 is accessible. A heat exchanger according to the present invention is on one side of the heat source 99 coupled, with both heat exchangers 200 . 200 ' for maximum cooling of the heat source 99 to care. Alternatively, the heat source may be horizontally coupled to the circuit board, with more than one heat exchanger on top of the heat source 99 is arranged (not shown), and wherein each heat exchanger electrically to the heat source 99 is coupled. Further details of this embodiment are disclosed in U.S. Patent Application No. 10 / 072,137 filed February 7, 2002, entitled "Power Conditioning Module", which is hereby incorporated by reference.

As in 14 is shown is the heat exchanger 200 with two layers to the left side of the heat source 99 coupled, and the heat exchanger 200 ' with three layers to the right side of the heat source 99 , It will be apparent to those skilled in the art that the preferred or alternative embodiment of the heat exchangers to the sides of the heat source 99 is coupled. It will also be apparent to those skilled in the art that the alternative embodiments of the heat exchanger 200 ' alternatively to the sides of the heat source 99 can be coupled. In the 14 shown alternative embodiment allows a more precise hot spot cooling of the heat source 99 by applying liquid for cooling hot spots along the thickness of the heat source 99 available. Accordingly, the embodiment according to 14 adequate cooling of hot spots in the center of the heat source 99 by heat exchange on both sides of the heat source 99 , It will be apparent to those skilled in the art that the in 14 shown embodiment in the cooling system 30 according to the 2A - 2 B can be used, although other closed cooling systems are possible.

As stated above, the heat source can 99 be designed so that the locations of one or more hot spots due to different tasks, that of the heat source 99 to change. To the heat source 99 To adequately cool the system 30 alternatively a locking and control module 34 ( 2A - 2 B ), which determines the amount of liquid and / or the speed in the heat exchanger 100 incoming fluid changes dynamically in response to a change in hot spots.

As in 14 shown are one or more sensors 124 at each boundary layer hot spot area in the heat exchanger 200 arranged and / or at any potential hot spot of the heat source 99 , Alternatively, a plurality of heat sources may be arranged evenly between the heat source and the heat exchanger and / or in the heat exchanger itself. The control module 38 ( 2A - 2 B ) is also connected to one or more valves in the closed circuit 30 coupled and controls the flow of liquid to the heat exchanger 100 , The at least one valve is arranged in the liquid lines, but it may alternatively be arranged elsewhere. The sensors 124 are to the control module 34 coupled, the control module 34 is preferably arranged upstream of the heat exchanger, as in 2 is shown. Alternatively, the control module 34 be arranged in any other place in the closed system.

The sensors 124 put the control module 34 Information about, for example, the velocity of the liquid flowing into the boundary layer hot spot area, the temperature of the boundary layer 102 in the boundary layer hot spot area and / or the heat source and the liquid temperature. For example, in the arrangement according to the schematic 14 in the boundary layer 124 arranged sensors the control module 34 the information is available that the temperature in a certain boundary layer hot spot area of the heat exchanger 200 rises while the temperature in a particular boundary layer hot spot area of the heat exchanger 200 ' sinks. In response, the control module causes 34 in that to the heat exchanger 200 led amount of liquid is increased, and that to the heat exchanger 200 ' flowing amount of liquid reduced. Alternatively, the control module 34 the amount of liquid flowing to one or more boundary layer hot spots in one or more heat exchangers in response to that from the sensors 118 he change information. Although the sensors 118 in 14 with two heat exchangers 200 . 200 ' are shown, it can be seen that the sensors 118 Alternatively, it can only be coupled to a heat exchanger.

The The present invention is above based on specific embodiments been described to the understanding to enable the construction and operation of the invention or simplify. This reference to specific embodiments and its details are intended to limit the scope of the claims, however restrict in any way. It is for Those skilled in the art will readily appreciate that modifications are for illustration chosen embodiments possible are without departing from the spirit and the scope of protection to leave the invention.

Claims (93)

heat exchangers With a. a boundary layer for cooling a heat source, wherein the boundary layer is formed so as to be separated from a liquid to flow through is, and has a thickness of about 0.3 mm to about 1.0 mm; and b. a distribution layer for passing liquid to and from the boundary layer, wherein the distributor layer comprises a first set of fingers and a has parallel to this arranged second set of fingers, which are arranged so that they the pressure drop within the heat exchanger to reduce. heat exchangers according to claim 1, wherein the liquid is in a single-phase State is. heat exchangers according to claim 1, wherein the liquid is in a biphasic State is. heat exchangers according to claim 1, wherein at least a part of the liquid in the boundary layer of a conversion from a single-phase to a two-phase Condition is subject. heat exchangers according to claim 1, wherein a certain finger of the first set with a suitable distance to a particular finger of the second Set is arranged to reduce the pressure drop in the heat exchanger to minimize. heat exchangers according to claim 1, wherein all fingers have the same length and width dimensions. heat exchangers according to claim 1, wherein at least one of the fingers is different than the remaining Finger is dimensioned. heat exchangers according to claim 1, wherein the fingers in the distributor layer in at least a dimension non-periodically arranged. heat exchangers according to claim 1, wherein at least one finger extends along the length of the Distributor layer has at least one varying dimension. heat exchangers according to claim 1, wherein the distributor layer has more than three and has less than 10 parallel fingers. heat exchangers according to claim 1, wherein the fingers of the first set and the second Set alternately along a dimension of the distribution layer are arranged. heat exchangers according to claim 1, wherein the distributor layer for cooling configured at least one boundary layer hot spot area is. heat exchangers according to claim 1, wherein provided at least a first terminal is that communicates with the first set of fingers, wherein the liquid enters the heat exchanger through the at least one first connection. heat exchangers according to claim 13, wherein at least one second connection is provided is that communicates with the second set of fingers, wherein the liquid exits through the at least second connection from the heat exchanger. heat exchangers according to claim 1, wherein the distributor layer is arranged above the boundary layer is, being the liquid flows down through the first set of fingers and through the second set from fingers upwards flows. heat exchangers The device of claim 13, wherein a first port passage communicates with the first port and the first port first set of fingers communicates, being the first connection passage the liquid from the first port to the first set of fingers channeled. heat exchanger according to claim 16, wherein a second connection passage with the second connection and the second set of fingers communicates, the second connection passage the liquid from the second set of fingers to the second port. heat exchangers according to claim 1, wherein the boundary layer is integral with the heat source is trained. heat exchangers according to claim 1, wherein the boundary layer to the heat source is coupled. heat exchangers according to claim 1, with an intermediate layer for channeling liquid to and from one or more predetermined locations of the boundary layer over at least a conduit, wherein the intermediate layer between the boundary layer and the distributor layer is arranged. heat exchangers according to claim 20, wherein the intermediate layer to the boundary layer and the distribution layer is coupled. heat exchangers according to claim 20, wherein the intermediate layer is integral with the boundary layer and the distributor layer is formed. heat exchangers according to claim 20, wherein the at least one conduit is along the Intermediate layer has at least one varying dimension. heat exchangers according to claim 1, wherein on the boundary layer a coating with a suitable thermal conductivity of at least 10 W / m-K is arranged. heat exchangers according to claim 1, wherein the boundary layer has a thermal conductivity of at least 100 W / m-K. heat exchangers according to claim 1, wherein a number of columns are present, which in a predetermined pattern along the boundary layer are arranged. A heat exchanger according to claim 26, wherein at least one of the columns has a surface dimension in a range of 10 ² μm and 100 ² μm. heat exchangers according to claim 26, wherein at least one of the columns has a height in the range of 50 microns and 2 mm having. heat exchangers according to claim 26, wherein at least two columns are separated from each other by a distance in the range of 10 to 150 μm are separated. heat exchangers according to claim 26, in which a coating is arranged on the columns which has a suitable thermal conductivity of at least 10 W / m-K having. heat exchangers according to claim 1, wherein the boundary layer is roughened surface having. heat exchangers according to claim 1, wherein on the boundary layer a microporous structure is trained. heat exchangers according to claim 32, wherein the porous Microstructure a porosity within a range of 50 to 80%. heat exchangers according to claim 32, wherein the porous Microstructure an average pore size within a range from 10 to 200 microns. heat exchangers according to claim 32, wherein the porous Microstructure a height within the range of 0.25 to 2.00 mm. heat exchangers according to claim 1, wherein there are a number of microchannels which is arranged in a predetermined pattern along the boundary layer are. Heat exchanger according to claim 36, wherein at least one of the microchannels has a surface dimension in the range of 10 ² microns and 100 ² microns. heat exchangers according to claim 36, wherein at least one of the microchannels a Height in Range of 50 microns and 2 mm. heat exchangers according to claim 36, wherein at least two of the microchannels in one mutual distance of 10 to 150 microns stand. heat exchangers according to claim 36, wherein at least one of the microchannels a Width in the range of 10 to 100 microns having. heat exchangers according to claim 36, wherein the plurality of microchannels are coupled to the boundary layer are. heat exchangers according to claim 36, wherein the plurality of microchannels are integral with the boundary layer are formed. heat exchangers The device of claim 36, wherein the plurality of microchannels are in segmented rows at least one groove arranged therebetween are divided, wherein the at least one groove aligned to a corresponding finger is. heat exchangers according to claim 36, wherein on the plurality of microchannels Coating is present which has a suitable thermal conductivity of at least 10 W / m-K. heat exchangers according to claim 1, wherein an overhang dimension 0 to 15 mm. Heat exchanger for cooling a heat source with a. a manifold layer having a first set of fingers in a first configuration, each finger of the first set channeling fluid at a first temperature and a second set of fingers of a second configuration, each finger of the second set channeling fluid at a second temperature; and wherein the first set of fingers is disposed parallel to the second set of fingers; and b. a boundary layer of a thickness of about 0.3 to 1.0 mm for receiving liquid at a first temperature at a plurality of first locations, each first location associated with a corresponding finger of the first set, the boundary layer fluid along a plurality of predetermined paths to a plurality of second locations Directs passages, and wherein every second digit is assigned to a corresponding finger of the second set. heat exchangers according to claim 46, wherein the liquid is in a single-phase State is. heat exchangers according to claim 46, wherein the liquid is in a biphasic State is. heat exchangers according to claim 46, wherein at least a part of the liquid in the boundary layer of a conversion from a single-phase state in a biphasic state. heat exchangers according to claim 46, wherein a particular finger of the first set with a suitable distance to a particular finger of the second Set is arranged to reduce the pressure drop in the heat exchanger to minimize. heat exchangers according to claim 46, wherein provided at least a first terminal is that communicates with the first set of fingers, wherein the liquid enters the heat exchanger through the at least one first connection. heat exchangers according to claim 51, in which at least one second connection is provided is that communicates with the second set of fingers, wherein the liquid exits through the at least second connection from the heat exchanger. heat exchangers according to claim 46, wherein the distribution layer is disposed over the boundary layer is, being the liquid flows down through the first set of fingers and through the second set from fingers upwards flows. heat exchangers according to claim 46, wherein the boundary layer is integral with the heat source is trained. heat exchangers according to claim 46, wherein the boundary layer to the heat source is coupled. heat exchangers according to claim 46, wherein the fingers of the first set are alternating Arrangement are positioned with the fingers of the second set. heat exchangers according to claim 46, wherein each finger has the same length and Has width dimensions. heat exchangers according to claim 46, in which at least one finger has a different dimension than the remaining Finger has. heat exchangers according to claim 46, wherein the fingers are in at least one dimension the distributor layer are arranged non-periodically. heat exchangers according to claim 46, wherein at least one of the fingers is along a Length of the distributor layer has at least one varying dimension. heat exchangers according to claim 46, wherein the distributor layer has more than three and has less than ten parallel fingers. heat exchangers according to claim 52, wherein a first port passage is present with the first connection and the first set of fingers communicates with the first port passage liquid from the first port to the first set of fingers channeled. heat exchangers according to claim 62, wherein a second connection passage is present, which with the second connection and the second set of fingers communicates with the second port passage liquid from the second set of fingers to the second port. heat exchangers according to claim 46 with an intermediate layer for channeling liquid to and from one or more predetermined locations of the boundary layer over at least a conduit, wherein the intermediate layer between the boundary layer and the distributor layer is arranged. heat exchangers according to claim 64, wherein the conduit is in a predetermined configuration is arranged to liquid to one or more hot spots areas to channel the boundary layer. A heat exchanger according to claim 64, wherein the conduit is arranged in a predetermined configuration to remove liquid from one or more boundary layer hot spots in the boundary channel. heat exchangers according to claim 64, wherein the intermediate layer to the boundary layer and the distribution layer is coupled. heat exchangers according to claim 64, wherein the intermediate layer is integral with the boundary layer and the distributor layer is formed. heat exchangers according to claim 64, wherein the conduit is along the intermediate layer has at least one varying dimension. heat exchangers according to claim 46, wherein on the boundary layer a coating with a suitable thermal conductivity of at least 10 W / m-K is arranged. heat exchangers according to claim 46, wherein the boundary layer has a thermal conductivity of at least 100 W / m-K. heat exchangers according to claim 46, wherein a number of columns are present, which in a predetermined pattern along the boundary layer are arranged. A heat exchanger according to claim 72, wherein at least one of the columns has a surface dimension in the range of 10 ² μm to 100 ² μm. heat exchangers according to claim 72, wherein at least one of the columns has a height in the range between 50 microns and 2 mm having. heat exchangers according to claim 72, wherein at least two of the columns at a distance of 10 to 150 μm to each other stand. heat exchangers according to claim 72, wherein disposed on the columns a coating which has a suitable thermal conductivity of at least 10 W / m-K having. heat exchangers according to claim 46, wherein the boundary layer is roughened surface having. heat exchangers according to claim 46, wherein on the boundary layer a microporous structure is arranged. heat exchangers according to claim 78, wherein the porous Microstructure a porosity from 50 to 80%. heat exchangers according to claim 78, wherein the porous Microstructure has an average pore size of 10 to 200 microns. heat exchangers according to claim 78, wherein the porous Microstructure a height from 0.25 to 2.00 mm. heat exchangers according to claim 46, wherein there are a number of microchannels which is arranged in a predetermined pattern along the boundary layer are. Heat exchanger according to claim 82, wherein at least one of the microchannels has a surface dimension in the range of 10 ² to 100 ² microns. heat exchangers according to claim 82, wherein at least one of the microchannels a Height in Range of 50 microns and 2 mm. heat exchangers according to claim 82, wherein at least two of the microchannels in one Distance from 10 to 150 μm to stand by each other. heat exchangers according to claim 82, wherein at least one of the microchannels a Width from 10 to 100 μm having. heat exchangers according to claim 82, wherein the microchannels are coupled to the boundary layer are. heat exchangers according to claim 82, wherein the microchannels are integral with the boundary layer are formed. heat exchangers according to claim 82, wherein the microchannels are along one dimension the boundary layer are divided into segments, between each one at least one groove is arranged. heat exchangers according to claim 82, wherein the microchannels are along one dimension the boundary layer run continuously. heat exchangers according to claim 89, wherein at least one groove to a corresponding finger is aligned. heat exchangers according to claim 82, wherein formed on the microchannels a coating which has a suitable thermal conductivity of at least 10 W / m-K having. heat exchangers according to claim 46, wherein an overhang dimension 0 to 15 mm.