CN101248327A - Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems - Google Patents
Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems Download PDFInfo
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- CN101248327A CN101248327A CNA200680007455XA CN200680007455A CN101248327A CN 101248327 A CN101248327 A CN 101248327A CN A200680007455X A CNA200680007455X A CN A200680007455XA CN 200680007455 A CN200680007455 A CN 200680007455A CN 101248327 A CN101248327 A CN 101248327A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
- F28F7/02—Blocks traversed by passages for heat-exchange media
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
- F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
- F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels
Abstract
An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
Description
Technical field
The present invention relates to a kind of field of heat exchanger.More especially, the present invention relates to a kind ofly make the method for high surface to volume ratio material structures and relate to described structure is attached in the heat exchanger device of microscopic structureization of liquid-cooling system so that effectively heat absorption by a plurality of layers.
Background technology
Effectively the heat conduction needs working fluid to contact so that absorb heat from cooling device with the thermally coupled surf zone as far as possible in liquid-cooling system.Reliable and the effectively manufacturing so extremely important for the effective micro heat exchanger of exploitation of high surface to volume ratio material (HSVRM) structure.Use micro-silicon passage is a kind of heat collection device structure in the early stage liquid-cooling system that proposes of assignee of the present invention.For example, with reference to the U.S. Patent Application Serial Number 10/643684 in the together examination of submitting on August 18th, 2003 that is entitled as " APPARATUS AND METHOD OF FORMING CHANNELS IN AHEAT-EXCHANGING DEVICE ".
High aspect ratio passage is made by the anisotropic etching of silicon, has been found that this method is widely used among little processing and the MEMS.But silicon is with respect to many other materials, particularly have low heat conductivity with respect to the true metal.Though have the method by higher conductive of material manufacturing and design micro heat exchanger in the prior art, these methods are used the expensive manufacturing technology or the labyrinth of appointment, and do not have clear and definite economically viable manufacture method.
For example, the United States Patent (USP) NO.6415860 that authorizes people such as K.W.Kelly is described in the minitype channel that all LIGA form in the cross flow one micro heat exchanger.The method of describing in the Kelley patent that is hereby expressly incorporated by reference is used LIGA, the little processing of the known high aspect ratio of a kind of prior art (HARM).LIGA is the rapid technology of multistep, and it comprises the miniature molded of photoetching, plating and formation HSVRM structure, but owing to uses extraneous material and need synchrotron radiation and the cost height.
The method of authorizing the United States Patent (USP) NO.5274920 of J.A.Matthews is described and is a kind ofly made the technology of miniature interchanger by a plurality of plates and recessed area level are forced together.This method forms the microstructure that comprises a plurality of microcosmic strias.Though intactly described the structure of each plate, the Matthews patent that is hereby expressly incorporated by reference does not have to describe the economic and upgradeable method that is used to make this plate.
The United States Patent (USP) NO.6014312 that authorizes people such as J.Schulz-Harder describes a kind of by comprising one group of fin that layer is constructed of opening separately.This layer is stacked one by one, forms stream.The described patent that is hereby expressly incorporated by reference is described polygon ring structure opening, but does not describe the method for making this layer.
Summary of the invention
The heat exchanger for example coolant of fluid that circulates, this material absorb heat and hot generation source are left in the heat carrying from heat generation source, the heat of cooling produces the source thus.Therefore heat exchanger can be used for cooling off multiple thermal source, for example any source of semiconductor devices, battery, motor, processing cavity locular wall and generation heat.
According to the present invention, put forward the method that a kind of manufacturing comprises the heat exchanger of microstructure.In one embodiment, thus this method comprises that using material removal process to form a plurality of Window layer passes the step that a plurality of heat conduction layers form a plurality of miniature openings; And a plurality of Window layer are linked together so that form the step of synthetic microstructure.
In a preferred embodiment of the invention, heat conduction layer comprises copper, and is linked together by brazing technology by a plurality of Window layer that heat conduction layer forms.Brazing is preferably in vacuum or for example carries out in stove in the reducing atmosphere of forming gas or pure hydrogen.Preferably brazing realizes by the brazing material that comprises silver.Use silver, stove preferably is heated to about 850 ℃, and under this temperature, silver is diffused in the copper, forms Cu-Ag-metal complex alloys, and this alloy melting provides outstanding heat and mechanical cohesive bond thus.
Owing to be formed on the microcosmic length ratio of the opening in the heat conduction layer, carefully control brazing technology, make brazing material not exclusively or the part occlusion of openings.Preferably, before brazing, silver is plated on the heat conduction layer, for the heat conduction layer of about 150 micron thickness, silver-colored thickness about 0.25 and about 2 microns between change.The method of making heat exchanger is aimed at opening before preferably also being included in a plurality of Window layer being linked together in each layer of a plurality of Window layer step.The synthetic microstructure that this aligning guarantees to come from the combination of a plurality of heat conduction layers has desirable characteristics.For example, if form the minitype channel structure, aim at and guarantee that its aspect ratio depends primarily on the quantity of the heat conduction layer that bonds together.
The present invention considers the kinds of processes that is used to form Window layer, comprises technology of removing based on material and the technology that deposits based on material.Illustrative processes includes but is not limited to laser lead plug, Laser Processing, wet etching, LIGA, photoetching, ion beam milling, chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering sedimentation, hydatogenesis, molecular beam epitaxial growth, electroless and electrolytic coating.Though wherein many is HARM technology, the present invention does not need HARM technology.
Preferably, the microcosmic opening forms by wet etching process.Preferred wet etching process is the isotropism wet etching process.Heat conduction layer comprises in the preferred embodiment of copper therein, and the technology that forms the microcosmic opening can be to connect mask chemical etching (also being known as photochemistry processing or PCM), perforation mask electron chemistry etching (also being known as the little processing of electroetching or electrochemistry) or some other suitable wet etching process.
Comprise micro grid detection, a plurality of minitype channel or some other high surface to volume ratio material structure by the synthetic microstructure that a plurality of heat conduction layers are joined together to form.In the present invention, the microcosmic opening of each layer formation of microstructure by passing a plurality of heat conduction layers constitutes, and preferably uses first side that is included in each heat conduction layer to form first micro-pattern and forms second micro-pattern in second side of each heat conduction layer.In this way, the first and second micro-pattern complementations are so that form continuous minitype channel in heat conduction layer.As selection, first and second micro-patterns are designed to form overlapping micro grid detection in heat conduction layer.
A plurality of heat conduction layers preferably have about 50 and about 250 microns between thickness.In addition, be formed on microcosmic opening in the heat conduction layer preferably have about 50 and about 300 microns between size.
In another aspect of this invention, provide a kind of method of making micro heat exchanger, this heat exchanger comprises heat conduction, high surface to volume ratio material (HSVRM) structure.This method comprises the steps: to provide lid structure, the connection of being made by first material to be made and be configured to distribute the manifold structure of cooling fluid, use material removal process to pass a plurality of heat conduction layers that comprise heat conducting material and form a plurality of microcosmic openings so that form a plurality of Window layer from the lid structure by second material.This method also comprises a plurality of Window layer is linked together, so that form the synthetic HSVRM structure comprise heat conducting material, the specific microcosmic hatch frame that wherein is formed in each layer of a plurality of heat conduction layers is designed to form synthetic HSVRM structure when heat conduction layer links together.This method also comprises synthetic HSVRM structure is connected with manifold structure and lid structure, make that manifold layer is configured to fluid is delivered to the HSVRM structure, and will comprise that the flat bed structure of the 3rd material and synthetic HSVRM structure, manifold structure and lid structure link together, so that form micro heat exchanger.
In this regard, the HSVRM structure preferably forms according to described method, heat conduction layer copper preferably wherein, and they preferably link together by brazing technology.In addition, lid, manifold peace understructure preferably use the money base brazing material to link together by brazing technology and HSVRM structure.Silver preferably is plated on lid, manifold and the understructure, its thickness about 1 and about 10 microns between.Preferably, comprise the about 1 micron silver of heat conduction layer plating of HSVRM structure, and manifold, the about 4 microns silver of lid and bottom holder structure plating.In other embodiment of brazing technology, the silver that the manifold plating is about 4 microns, and the hot silver that conducts 1 micron of HSVRM structure plating keep not plating and build peaceful understructure.
Preferably, after the micro heat exchanger assembling, the flat bed structure is ground into meticulous fineness.In addition, in being preferably formed in lid or manifold structure so that make that a plurality of apertures of flowing out in the fluid from outside fluid network, the micro heat exchanger of assembling provides liquid close structure for the auxiliary heat exchanger of fluid.
In a preferred embodiment of the invention, comprise that the quantity of a plurality of heat conduction layers that synthesize the HSVRM structure and the pressure that thickness is selected to the optimization micro heat exchanger fall and resistive properties.
In another aspect of this invention, the heat exchanger of microstructureization comprises a plurality of heat conduction layers, each heat conduction layer has and passes wherein a plurality of elongated microcosmic opening that forms, wherein a plurality of elongated microcosmic openings aim at and a plurality of heat conduction layer links together so that form the HSVRM structure, and wherein the elongated open more than three of the heat conduction layer that each elongated open in first heat conduction layer is adjacent with at least one is communicated with.
The heat exchanger of microstructureization preferably includes the heat conduction layer that has copper and link together by brazing technology.In addition, form though they can select technology via plurality of optional, as previously described embodiment of the present invention, the microcosmic opening preferably forms by the isotropism wet etching process.In addition, the quantity of a plurality of heat conduction layers and the thickness pressure that preferably is selected to the heat exchanger of optimizing microstructureization falls and resistive properties.
In still another aspect of the invention, the heat exchanger of microstructureization comprises a plurality of heat conduction layers, each heat conduction layer comprises and passes wherein a plurality of elongated microcosmic opening that forms, wherein a plurality of elongated microcosmic openings are aimed at and a plurality of heat conduction layer links together so that forms the HSVRM structure, and wherein interior each elongated open of first heat conduction layer is communicated with unique elongated open of any adjacent heat conduction layer.
It is identical that a plurality of elongated microcosmic openings are preferably in each heat conduction layers of a plurality of heat conduction layers.Moreover the microcosmic opening is preferably by comprising that the isotropism wet etching process that carries out on a plurality of heat conduction layers of copper forms, and uses the brazing material that comprises silver to combine by brazing technology subsequently.Preferably, the quantity of a plurality of heat conduction layers and the thickness pressure that preferably is selected to the heat exchanger of optimizing microstructureization falls and resistive properties.
Select among the embodiment of the present invention, a plurality of Window layer form by the material deposition methods of for example CVD, PVD, molecular beam epitaxial growth, sputtering sedimentation, hydatogenesis or plating, and link together in described mode.
The present invention can be used to form multiple heat exchange structure.For example; The present invention includes the structure that forms via above measure, these structures of and the heat exchange structure of instructing in following this patent application of describing in detail more. comprise the heat exchange structure of instruction in the U.S. Patent Application Serial Number 10/439635 in the together examination that is entitled as " METHODS FORFLEXIBLE FLUID DELIVERY AND HOTSPOT COOLING OF MICROCHANNELHEATSINS " of submitting on May 15th, 2003, the heat exchange structure of instruction in the U.S. Patent Application Serial Number 10/439912 in the together examination that is entitled as " INTERWOVEN MANIFOLDS FORPRESSURE DROP REDUCTION IN MICROCHANNEL HEAT EXCHANGERS " that on May 16th, 2003 submitted to, the heat exchange structure of instruction in the U.S. Patent Application Serial Number 10/612241 in the U.S. Patent Application Serial Number 10/680584 in the together examination that is entitled as " METHOD AND APPARATUS FOR EFFICIENTVERTICAL FLUID DELIVERY FOR COOLING A HEAT PRODUCING DEVICE " that on October 6th, 2003 submitted in the together examination that is entitled as " MULTI-LEVEL MICROCHANNEL HEATEXCHANGERS " of the heat exchange structure of instruction and submission on July 1st, 2003.
Description of drawings
Figure 1A represents to use according to embodiments of the invention the partial section of two heat conduction layers of two micro-patterns formation;
Figure 1B represents to use according to embodiments of the invention the perspective view of the heat conduction layer of two micro-patterns formation;
Fig. 1 C represents the perspective view of the HSVRM structure that formed by a plurality of heat conduction layers according to embodiments of the invention;
Fig. 2 A represents the decomposition view according to the micro heat exchanger of the embodiment of the invention;
Fig. 2 B represents the perspective view according to the assembling micro heat exchanger of the embodiment of the invention;
Fig. 3 A represents the top view according to the manifold layer selected of heat exchanger of the present invention;
Fig. 3 B represents to have according to the present invention the decomposition view of the heat exchanger selected that can select manifold layer;
Fig. 4 represents the perspective view according to the manifold layer that interweaves of the present invention;
Fig. 5 represents to have according to the present invention the top view of the manifold layer that interweaves of boundary layer;
Fig. 6 A represents to have along the present invention of line A-A the sectional view of the manifold layer that interweaves of boundary layer;
Fig. 6 B represents to have along the present invention of line B-B the sectional view of the manifold layer that interweaves of boundary layer;
Fig. 6 C represents to have along the present invention of line C-C the sectional view of the manifold layer that interweaves of boundary layer;
Fig. 7 A represents the decomposition view with the manifold layer that interweaves of boundary layer of the present invention;
Fig. 7 B represents the perspective view of the selected embodiment of boundary layer of the present invention;
Fig. 8 A represents the top view of selecting manifold layer according to of the present invention
Fig. 8 B represents the top view according to boundary layer of the present invention;
Fig. 8 C represents the top view according to boundary layer of the present invention;
Fig. 9 A represents the side view according to the selected embodiment of three layers of heat exchanger of the present invention;
Fig. 9 B represents the side view according to the selected embodiment of two-layer heat exchanger of the present invention;
Figure 10 A-10E represents to have according to the present invention the perspective view of the boundary layer of different miniature pin arrays;
Figure 11 represents the sectional perspective view of selecting heat exchanger according to of the present invention;
Figure 12 A represents the decomposition view according to heat exchanger of the present invention;
Figure 12 B represents the decomposition view of selecting heat exchanger according to of the present invention;
Figure 12 C represents the perspective view of selecting circulation layer according to of the present invention;
Figure 12 D represents the perspective view according to the downside of inlet layer of the present invention;
Figure 12 E represents the perspective view according to the downside of the layer of selecting to enter the mouth of the present invention;
Figure 12 F represents the perspective view according to the downside of outlet layer of the present invention;
Figure 12 G represents the perspective view of selecting the downside of outlet layer according to of the present invention;
Figure 12 H represents the sectional view according to heat exchanger of the present invention;
Figure 12 I represents the sectional view of selecting heat exchanger according to of the present invention;
Figure 13 represents to have according to the present invention the top view of the circulation layer of the entrance and exit configuration that is used for monophasic fluid stream;
Figure 14 represents to have according to the present invention the top view of the circulation layer of the entrance and exit configuration that is used for two-phase fluid stream.
The specific embodiment
The present invention describes and a kind ofly forms conducting shell and a plurality of layer is linked together so that form the method for three-dimensional micro structured region.According to the present invention, the microstructure zone comprises micro grid detection, minitype channel or some other microstructure.Figure 1A represents first embodiment in micro grid detection zone, and Fig. 2 A represents second embodiment in micro grid detection zone.Fig. 1 C represents according to embodiments of the invention formation and links together so that form a plurality of layers of minitype channel.
Figure 1A represents two Window layer 100,150 of being formed by two heat conduction layers according to the present invention.Preferably, two heat conduction layers use wet etching process to form, and wherein use the photograph instrument to determine the position and the pattern of the microcosmic opening 120,170 of Window layer 100,150.Two Window layer comprise a plurality of abundant core bar 110,160 and the thin solid hopkinson bar 130,180 that forms microcosmic opening 120,170.
In the embodiment shown in fig. 1, the microcosmic opening 120 of Window layer 100 and the microcosmic opening 170 of Window layer 150 are configured to overlapped, make that each opening 120 in the Window layer 150 is communicated with the opening more than three 170 of Window layer 150.In this embodiment, Window layer 100 uses first micro-pattern to form, and Window layer 150 uses second micro-pattern to form.First and second micro-patterns are designed to form the overlapping micro grid detection structure shown in Figure 1A when layer 100 and 150 links together.
Figure 1B represents the single window layer 200 that formed by heat conduction layer according to the present invention.Layer 200 comprises first sublayer and the abundant core bar 260 of microcosmic of formation microcosmic opening 250 and second sublayer of thin solid hopkinson bar 240 of the abundant core bar 210 of microcosmic and the thin solid hopkinson bar 230 of formation microcosmic opening 220.
In the embodiment shown in Figure 1B, microcosmic opening 220 and microcosmic opening 250 are elongated, and form overlappedly, make each opening 220 be communicated with opening 250 more than three.In this embodiment, use first micro-pattern that opening 220 is formed on first side of heat conduction layer, and use second micro-pattern opening 250 to be formed on second side of the heat conduction layer that is formed with Window layer 200.In the forming process of Window layer 200, employed first and second micro-patterns are designed to form the overlapping micro grid detection structure shown in Figure 1B in single window layer 200.
Fig. 1 C represents to comprise and links together so that form the material structure 300 of microstructureization of a plurality of Window layer 310 of a plurality of high aspect ratio minitype channels 320.Each Window layer 310 comprises the zone of microstructureization, and this zone comprises abundant core bar 330 and thin solid hopkinson bar 340.When Window layer 310 was assembled into structure 300, bar 330 and 340 formed minitype channel 320.According to the present invention, the minitype channel in each Window layer 310 was aimed at before a plurality of Window layer 310 are linked together.This aligning guarantees to have desired properties by the synthetic microstructure that a plurality of heat conduction layers combine.Because aim at, minitype channel structure 320 has the aspect ratio of the quantity that depends primarily on the Window layer 310 that bonds together.
In a preferred embodiment of the invention, Window layer 310 comprises copper, and links together by brazing technology.Brazing is preferably in vacuum or for example carries out in stove in the reducing atmosphere of forming gas or pure hydrogen.Preferably brazing realizes by the brazing material that comprises silver.Use silver, stove preferably is heated to about 850 ℃, and under this temperature, silver is diffused in the copper, forms Cu-Ag-metal complex alloys, and this alloy melting provides outstanding heat and mechanical cohesive bond thus.
Owing to be formed on the microcosmic length ratio of the opening in the heat conduction layer, carefully control brazing technology, make brazing material not exclusively or the part occlusion of openings.Preferably, before brazing, silver is plated on the heat conduction layer, for the heat conduction layer of about 150 micron thickness, silver-colored thickness about 0.25 and about 2 microns between change.
Fig. 2 A represents the decomposition view according to the micro heat exchanger 400 that the present invention includes heat conduction (HSVRM).Miniature interchanger 400 comprises lid structure 410, a plurality of Window layer 430 and the flat bed structure 440 that is connected with manifold structure 420.Manifold layer 420 is configured to distribute cooling fluid.Preferably, all parts of micro heat exchanger 400 link together by brazing.A plurality of Window layer 430 comprise microcosmic open area 435 separately.When a plurality of Window layer 430 linked together, they formed the synthetic HSVRM structure that comprises the heat conducting material that forms Window layer 430.
Preferably, after micro heat exchanger 400 assemblings, flat bed structure 440 is ground to meticulous fineness.In addition, cover in the structure 410 so that make fluid flow into the feature 425 of manifold structure 420 and flow into subsequently a plurality of apertures 415 of HSVRM structure except being preferably formed in, the micro heat exchanger 400 of assembling provides liquid close structure for the auxiliary heat exchanger of fluid.Preferably, the fluid from outside fluid network flows out.
In a preferred embodiment of the invention, comprise that the quantity of a plurality of Window layer 430 of synthesizing the HSVRM structure and the pressure that thickness is selected to optimization micro heat exchanger 400 fall and resistive properties.
Fig. 2 B is the perspective view according to micro heat exchanger 500 of the present invention.Micro heat exchanger 500 comprises and covers structure 510, manifold structure 520, understructure 540 and a plurality of heat conduction layer 530, and each heat conduction layer has and passes a plurality of elongated microcosmic opening that wherein forms.A plurality of elongated microcosmic openings are aimed at, and a plurality of heat conduction layer links together, so that form the HSVRM structure.In addition, lid structure 510 comprises a plurality of fluid orifices 560,570, makes fluid flow through manifold structure 520 and HSVRM structure.
In an embodiment of the present invention, the Window layer shown in Figure 1A-2B preferably forms by wet etching process.Preferably, employed wet etching process is the isotropism wet etching process.Heat conduction layer comprises in the preferred embodiment of copper therein, and the technology that forms the microcosmic opening can be to connect mask chemical etching (also being known as photochemistry processing or PCM), perforation mask electron chemistry etching (also being known as the little processing of electroetching or electrochemistry) or some other suitable wet etching process.
Equally according to the present invention, the Window layer shown in Figure 1A-2B preferably has about 50 and about 250 microns thickness.In addition, be formed in the heat conduction layer in case form the microcosmic opening of Window layer preferably have about 50 and about 300 microns between size.
Will appreciate that boundary layer and manifold layer can otherwise form and make up according to the present invention.For example, Window layer can form via the technology that comprises technology based on material deposition, removes based on material and based on any of kinds of processes of the technology of material deformation.Though can use HARM technology, even each layer does not form via HARM technology, the present invention can be so that high-aspect-ratio structure be formed by Window layer.Illustrative processes is including, but not limited to laser lead plug, Laser Processing, wet etching, LIGA, photoetching, ion beam milling, chemical vapour deposition (CVD), physical vapour deposition (PVD), sputtering sedimentation, steam deposition, molecular beam epitaxial growth, electroless and electrolytic coating.Equally, can use punching press.As selection, these structures can be used the molded of metal injection-molding (MIM), plastic injection molded, other form or form by alternate manner.
Provide the level and smooth stream that wherein flows through coolant and hyperbranched flow pattern according to heat exchanger of the present invention.This structure has reduced via the load on the pump of heat exchanger pumping coolant.The method of making heat exchanger according to embodiments of the invention is relatively inexpensive.Wet etching is a chemical etching process, and preferably using is chemicals, so that form the final groove that forms stream.Compare with other device fabrication, the wet chemical use cost is low and quick.Therefore the present invention can be used for making at an easy rate and be used for cooling off for example heat exchanger of the multiple device of the device of semiconductor processing, motor, light-emitting device, battery, processing cavity locular wall, MEMS and any generation heat.The coolant of various ways can transmit by heat exchanger, including, but not limited to the cold-producing medium of the liquid of for example water, air, other gas, steam, for example freon or can effectively absorb and any material or the combination of materials of transfer of heat.
Fig. 3 B represents to have the decomposition view of selecting three layers of heat exchanger 100 that can select manifold layer according to the present invention.Selected embodiment shown in Fig. 3 B is three layers of heat exchanger 100 that comprise boundary layer 102, at least one intermediate layer 104 and at least one manifold layer 106.As selection, as following description, heat exchanger 100 is the two-layer equipment that comprises boundary layer 102 and manifold layer 106.
Fig. 3 A represents the top view of selecting manifold layer 106 of the present invention.Particularly, shown in Fig. 3 B, manifold layer 106 comprises four sidepieces and top surface 130 and basal surface 132.But top surface 130 is removed in Fig. 3 A so that fully represent and illustrate the work of manifold layer 106.Shown in 3A, manifold layer 106 has series of passages or path 116,118,120,122 and formation aperture 108,109 wherein.Finger 118,120 extends through the main body of manifold layer 106 fully shown in Fig. 3 B on the Z direction.As selection, finger 118 and 120 extends through manifold layer 106 on Z direction top, and has the opening shown in Fig. 3 A.In addition, passage 116 and 122 parts extend through manifold layer 106.Remaining area between the entrance and exit passage 116,120 (being denoted as 107) extends to basal surface 132 from top surface 130, and forms the main body of manifold layer 106.
As shown in Figure 3A, fluid enters manifold layer 106 and flow to from a plurality of fingers 118 of passage 116 in X and/or Y direction top set along access road 116 via inlet aperture 108, so that fluid is applied to institute's favored area in the boundary layer 102.Finger 118 is configured on the different predetermined directions, so that fluid is delivered in the focus place or near regional corresponding position in the thermal source in the boundary layer 102.After this these positions in the boundary layer 102 are called the hot spot region, interface.Finger is configured to the hot spot region, interface that fixing and interim cooling changes.As shown in Figure 3A, passage 116,122 and finger 118,120 are arranged in manifold layer 106 on X and/or the Y direction.Therefore, the change direction of passage 116,122 and finger 118 and 120 can delivery of fluids, so that focus in the cooling thermal source 99 and/or the pressure that reduce in the heat exchanger 100 fall.As selection, passage 116,122 and finger 118,120 periodically are arranged in the manifold layer 106, and have the such a kind of pattern of example as shown in Figure 5.
The size of passage 116 and finger 118 and quantity depend on multiple factor.In one embodiment, entrance and exit finger 118,120 has identical width dimensions.As selection, entrance and exit finger 118,120 has different width dimensions.The width dimensions of finger 118,120 is positioned at the scope that comprises the 0.25-0.50 millimeter.In one embodiment, entrance and exit finger 118,120 has identical length and depth dimensions.As selection, entrance and exit finger 118,120 has different length and depth dimensions.In another embodiment, entrance and exit finger 118,120 length along finger have the width dimensions of variation.The length dimension of entrance and exit finger 118,120 is comprising 0.5 millimeter in the scope of three times of the sizes of thermal source length.In addition, finger 118,120 has height or the depth dimensions in the scope that comprises the 0.25-0.5 millimeter.In addition, per minute rice is less than 10 or alternately be arranged on the manifold layer 106 greater than 30 finger.But, those skilled in the art will appreciate that the finger that in manifold layer, can consider between per minute rice 10 and 30.
Can consider that within the scope of the invention the geometry with finger 118,120 and passage 116,122 changes over acyclic configuration, to help to optimize the cooling of thermal source focus.In order to realize uniform temperature on thermal source 99, heat is delivered to the spatial distribution of fluid and the spatial distribution coupling that heat produces.When boundary layer flowed via minitype channel 110, its temperature increased, and it begins to convert to steam under the two-phase state thus at fluid.Therefore, fluid expands significantly, causes speed significantly to increase thus.Usually, flow, improved the heat efficient that is delivered to fluid from boundary layer for high-speed.Therefore, can send and remove the sectional dimension of finger 118,120 and passage 116,122 and regulate the efficient that heat is delivered to fluid by regulating fluids in the heat exchanger 100.
For example, specific finger can be designed near the higher thermal source of porch heat generation.In addition, advantageously for the fluid in finger 118,120 and the passage 116,122 and steam the zone design larger cross-section that mixes appears.Though not shown, finger can be designed to begin with the small bore area in the exit, so that cause the flow at high speed of fluid.Special finger or passage also can be configured to expand into larger cross-section at the lower exit place, flow to cause than low velocity.This structure of finger or passage makes heat exchanger reduce pressure in owing to the zone that becomes steam to cause fluid volumes, acceleration and speed to increase from liquid transition in two-phase flow to fall, and optimizes the focus cooling.
In addition, finger 118,120 and passage 116,122 can be designed to widen and narrow down along its length, so that the diverse location place in microchannel heat exchanger 100 increases fluid velocity.As selection, suitable is with finger and channel size from diminishing greatly, and repeatedly becomes again once more, so that distribute the profile adjustment heat transference efficiency according to the institute's calorific requirement on the thermal source 99.The above description that should be understood that the varying dimensions of finger and passage is equally applicable to described other embodiment, and is not limited to this embodiment.
As selection, as shown in Figure 3A, manifold layer 106 comprises the one or more openings 119 that are positioned at inlet finger 118.In three layers of heat exchanger 100, the fluid that flows along finger 118 flow to intermediate layer 104 along opening 119.As selection, in two-layer heat exchanger 100, the fluid that flows along finger 118 flows directly to boundary layer 102 along opening 119.In addition, as shown in Figure 3A, manifold layer 106 comprises the opening 121 that is positioned at outlet finger 120.In three layers of heat exchanger 100,104 fluids that flow out flow upward to outlet finger 120 along opening 121 from the intermediate layer.As selection, in two-layer heat exchanger 100, the fluid that flows out from boundary layer 102 upwards flows directly into outlet finger 120 along opening 121.
Can select among the embodiment, entrance and exit finger the 118, the 120th does not have the open channel of opening.The basal surface 103 of manifold layer 106 abuts the top surface in intermediate layer 104 or abut boundary layer 102 in two-layer interchanger in three layers of interchanger 100.Therefore, in three layers of heat exchanger 100, fluid freely commutes intermediate layer 104 and manifold layer 106.Fluid commutes suitable hot spot region, interface by conduit 105 and intermediate layer 104.Those of ordinary skills understand that conduit 105 directly aims at finger as following description, perhaps be positioned on other position at three-tier system.
Though Fig. 3 B represents to have the three layers of heat exchanger 100 of selecting that can select manifold layer, heat exchanger 100 is double-layer structure alternatively, comprising manifold layer 106 and boundary layer 102, fluid directly flows through between manifold layer 106 and boundary layer 102 thus, and without boundary layer 104.Those skilled in the art will appreciate that the structure expression as illustrative purposes of manifold, centre and boundary layer, and the structure shown in being not limited to.
Shown in Fig. 3 B, intermediate layer 104 comprises a plurality of conduits 105 that extend through wherein.Inflow catheter 105 will be directed to the hot spot region, appointment interface of boundary layer 102 from the fluid that manifold layer 106 enters.Similarly, opening 105 also is directed to discharge currents body orifice 109 with fluid from boundary layer 102.Therefore, intermediate layer 104 also provides the fluid that is delivered to discharge currents body orifice 109 from boundary layer 102, and wherein discharge currents body orifice 108 is communicated with manifold layer 106.
According to including, but not limited to the position of hot spot region, interface, for the multiple factor of abundant cooling thermal source 99 required fluid flow and fluid temperature (F.T.) in the hot spot region, interface, conduit 105 is positioned in the boundary layer 104 with predetermined pattern.Although can consider to reach other width dimensions of several millimeters, conduit has 100 microns width dimensions.In addition, according at least one described factor, conduit 105 has other size.Those skilled in the art will appreciate that each conduit 105 in the intermediate layer 104 is of similar shape and/or size, though this not necessarily.For example, the finger shown in being similar to, conduit can be used as and selectively have variation length and/or width dimensions.In addition, conduit 105 has constant depth or the height dimension that passes intermediate layer 104.As selection, conduit 105 has the varying depth size of passing intermediate layer 104, for example trapezoidal or nozzle form.Though the horizontal shape of conduit 105 is expressed as rectangle in Fig. 2 C, conduit 105 can have any other shape in addition, including, but not limited to circular (Fig. 3 A), bending, oval.As selection, one or more conduits 105 are shaped and have part or all profile of described one or more fingers.
Intermediate layer 104 horizontal location in heat exchanger 100, conduit 105 perpendicular positionings wherein.As selection, locate in heat exchanger 100 on what its direction in office, including, but not limited to diagonal and curve form in intermediate layer 104.As selection, conduit 105 is positioned in intermediate layer 104 on level, diagonal, bending or any other direction.In addition, intermediate layer 104 is along the whole length horizontal-extending of heat exchanger 100, and separate boundary layer 102 fully with manifold layer 106 in intermediate layer 104 thus, so that conduit 105 is passed through in the fluid guiding.As selection, the part of heat exchanger 100 does not comprise the intermediate layer 104 between manifold layer 106 and the boundary layer 102, and fluid flows freely between it thus.In addition, intermediate layer 104 can vertically be extended between manifold layer 106 and boundary layer 102 as selecting, so that form unique interlayer region of separating.As selection, intermediate layer 104 not exclusively extends to boundary layer 102 from manifold layer 106.
Fig. 3 B represents the perspective view according to another embodiment of boundary layer 102 of the present invention.Shown in Fig. 3 B, boundary layer 102 comprises basal surface 103 and a plurality of minitype channel wall 110, and the zone between the minitype channel wall 110 guides fluid or guiding along fluid flowing path thus.Basal surface 103 is flat, and has high thermal conductivity, makes heat fully conduct from thermal source 99.As selection, basal surface 103 comprises groove and/or the summit that is designed to collect or get rid of from ad-hoc location fluid.Minitype channel wall 110 is configured to plan-parallel structure, shown in Fig. 3 B, thus fluid between minitype channel wall 110 along flow path.
Those skilled in the art will appreciate that minitype channel wall 110 constitutes with any other appropriate structuring according to factor described above as selecting.For example, has groove between the section of boundary layer 102 alternatively in minitype channel wall 110, shown in Fig. 8 C.In addition, minitype channel wall 110 has the size that the pressure that reduce in the boundary layer 102 fall or differ from.Also understand and except minitype channel wall 110, also can consider any further feature, including, but not limited to flute surfaces and miniature loose structure, for example sintering metal and silicon foam body.But for purpose of explanation, the parallel minitype channel wall 110 shown in Fig. 3 B is used for describing boundary layer 102 of the present invention.As selection, minitype channel wall 110 has uneven structure.
Refer back to the assembly of Fig. 3 B, the top surface of manifold layer 106 is cutd open so that represent passage 116,122 and finger 118,120 in manifold layer 106 main bodys.The thermal source 99 interior positions that produce more heats refer to focus here, and the positions that produce less heat thus in the thermal source 99 refer to warm spot here.Shown in Fig. 3 B, thermal source 99 is shown in A place, position and has the hot spot region, and has the warm spot zone at position B place.Zone in abutting connection with the boundary layer 102 of focus and warm spot correspondingly refers to the hot spot region, interface.Shown in Fig. 3 B, boundary layer 102 comprises hot spot region, the interface A that is positioned on the A of position and is positioned at hot spot region, interface B on the B of position.
Shown in Fig. 3 A and 3B, fluid begins to enter heat exchanger 100 via an inlet aperture 108.Fluid then flows to an access road 116.As selection, heat exchanger 100 comprises more than one access road 116.Shown in Fig. 3 A and 3B, the fluid that flows from inlet aperture 108 along access road 116 begins to be branched off into finger 118D.In addition, the fluid that continues along the other parts of access road 116 flows to independent finger 118B and 118C etc.
In Fig. 3 B, travel permit is fed to hot spot region, interface A by flowing to finger 118A, and fluid is downward through finger 118A to the intermediate layer 104 thus.Fluid then flows through the access road 105A that is positioned under the finger 118A to boundary layer 102, and fluid and thermal source 99 carry out heat exchange thus.As mentioned above, the minitype channel in the boundary layer 102 can be constructed in any direction.Therefore, the minitype channel 111 in the interface zone A is perpendicular to other minitype channel 110 location in the boundary layer 102.Therefore, though fluid flows on other direction along other zone of boundary layer 102, the fluid that comes from conduit 105A flows along minitype channel 111, shown in Fig. 3 B.Heated fluid then upwards flows through conduit 105B to outlet finger 120A.
Similarly, fluid is downward through finger 118E and 118F to the intermediate layer 104 on the Z direction.Fluid then is downward through access road 105C to boundary layer 102 on the Z direction.Heated fluid then upwards flows through delivery channel 105D to outlet finger 120E and 120F from boundary layer 102 on the Z direction.Heat exchanger 100 exports finger 120 thus and is communicated with exit passageway 122 via the fluid that is heated in the outlet finger 120 removal intermediate layers 106.Exit passageway 122 makes fluid flow out from heat exchanger via an outlet aperture 109.
Preferably flow into and flow out conduit 105 and equally directly or almost directly be positioned on the hot spot region, suitable interface, so that fluid is applied directly on the focus in the thermal source 99.In addition, for the specific interface hot spot region, each outlet finger 120 is configured to the most close finger 118 location that enter the mouth separately, so that the pressure that reduces wherein falls.Therefore, leaving boundary layer 102 before the outlet finger 120A, fluid enters boundary layer 102 and flows through minimum distance along the basal surface 103 of boundary layer 102 via inlet finger 118A.Should be understood that fluid is enough to remove the heat that thermal source 99 produces along a described segment distance of basal surface 103 operations, the pressure of aequum falls and do not produce not.In addition, shown in Fig. 3 A and 3B, the turning in the finger 118,120 is crooked to fall along the pressure that finger 118 flows so that reduce fluid.
The structure that those skilled in the art will appreciate that the manifold layer 106 shown in Fig. 3 A and the 3B is exemplary.The passage 116 in the manifold layer 106 and the structure of finger 118 depend on multiple factor, including, but not limited to the position of hot spot region, interface, the heat that produces of the amount of flow that commutes the hot spot region, interface and hot spot region, interface endogenous pyrogen.For example, a kind of possible structure of manifold layer 106 comprises the global pattern that replaces the parallel entrance and exit finger of arranging along the width of manifold layer, also following description shown in Fig. 4-7A.In addition, can consider any other structure of passage 116 and finger 118.
Fig. 4 represents the perspective view according to the manifold layer selected 406 of heat exchanger of the present invention.Manifold layer 406 among Fig. 4 comprises a plurality of interweaving or crosslinked parallel fluid finger 411,412, and these fingers make single-phase and/or two-phase fluid is recycled to boundary layer 402, and does not make the significant pressure of heat exchanger 400 interior appearance fall.As shown in Figure 8, inlet finger 411 and outlet finger 412 alternate configurations.But, those skilled in the art will appreciate that the inlet of some or export finger and can closely mutually locate, and be not limited to alternate configuration shown in Figure 4 thus.In addition, finger can be used as and selects to be designed so that parallel finger is from another parallel finger branch or connect on it.Therefore, can so that the inlet finger more than the outlet finger, and vice versa.
The fluid that inlet finger or path 411 will enter heat exchanger is fed to boundary layer 402, and outlet finger or path 412 remove fluids from boundary layer 402, and fluid then leaves heat exchanger 400.Structure shown in the manifold layer 406 makes fluid enter boundary layer 402 and before entering exit passageway 412, moves very short distance in boundary layer 402.Fluid significantly reduces to make pressure in the heat exchanger 400 to fall significantly to reduce along the length of boundary layer 402 operation.
Shown in Fig. 4-5, comprise as the manifold layer of selecting 406 being communicated with two entries 411 and providing the path 414 of fluid for it.Shown in Fig. 8-9, manifold layer 406 comprises three exit passageways 412 that are communicated with path 418.Path 414 in the manifold layer 406 has the flat bottom surface that fluid is directed to finger 411,412.As selection, path 414 has the gradient slightly that helps fluid is directed to selected fluid passage 411.As selection, access road 414 comprises the one or more openings that are positioned at its basal surface, makes the part of fluid flow down to boundary layer 402.Similarly, the path 418 in the manifold layer has the flat bottom surface that comprises fluid and fluid is directed to aperture 408.As selection, path 418 has the gradient slightly that helps fluid is directed to selected oral pore mouth 408.In addition, though can selectively consider any other width dimensions, path 411,418 has about 2 millimeters width dimensions.
Path 411,418 is communicated with aperture 408,409, and the aperture is connected on the interior fluid line of cooling system thus.Manifold layer 406 comprises the fluid orifice 408,409 of horizontal tectonics.As selection, manifold layer 406 comprises fluid orifice 408,409 vertical and/or the diagonal structure, as following description, though not shown in Fig. 4-7.As selection, manifold layer 406 does not comprise path 414.Therefore, fluid directly 408 is fed to finger 418 from the aperture.Moreover manifold layer 411 is as selecting not comprise path 418, and the fluid in the finger 412 is via aperture 408 direct outflow heat exchangers 400 thus.Though be apparent that two apertures 408 are expressed as being communicated with path 414,418,, can utilize any amount of aperture as selection.
Entry 411 has the size that makes fluid run to boundary layer, falls and do not produce big pressure along path 411.Though can consider any other width dimensions as selecting, entry 411 has the size that comprises 0.25-5 millimeter scope.In addition, entry 411 has and comprises 0.5 millimeter length dimension in the scope of the triple scale of thermal source length cun.As selection, can consider other length dimension.In addition, entry 411 extends downwards or slightly on the height of minitype channel 411, makes fluid directly be directed to minitype channel 410.Access road 411 has the height dimension in the scope that comprises the 0.25-0.5 millimeter.Those skilled in the art will appreciate that path 411 does not extend downwardly into minitype channel 410, and as selecting to consider any other height dimension.Have identical size though those skilled in the art will appreciate that entry 411, can consider that entry 411 is of different sizes as selecting.In addition, entry 411 is as the distance between width, sectional dimension and/or the adjacent finger of selecting to have variation.Particularly, path 411 has the bigger width or the degree of depth, and the zone that has the narrower width and the degree of depth along its length.The size that changes makes multithread body more be delivered to predetermined interface hot spot region in the boundary layer 402 via wider portion, limits simultaneously via narrow part and flow to hot spot region, warm spot interface.
In addition, exit passageway 412 has the size that makes fluid run to boundary layer and do not fall along the big pressure of path 412 generations.Though can consider any other width dimensions as selecting, exit passageway 412 comprises the size of 0.25-5 millimeter scope.In addition, exit passageway 412 has and comprises 0.5 millimeter length dimension in the scope of three times of the sizes of thermal source length.In addition, exit passageway 412 extends downwardly into the height of minitype channel 410, after minitype channel 410 bottom horizontal flow sheet, make fluid easily in exit passageway 412 on flow.Though as selecting to consider any other height, access road 411 has the height dimension in the scope that comprises the 0.25-5.0 millimeter.Though those of ordinary skills understand exit passageway 412 and have identical size, can consider as selecting exit passageway 412 to be of different sizes.Moreover access road 412 is as the distance of selecting to have between varying width, sectional dimension and/or the adjacent finger.
Entrance and exit path 411,412 is by disjunction and be separated from each other, and shown in Figure 4 and 5, the fluid in the path does not mix thus.Particularly, as shown in Figure 8, two exit passageways are along the outward flange location of manifold layer 406, and exit passageway 412 is positioned at the centre of manifold layer 406.In addition, two entries 411 are configured to be positioned on the sides adjacent of central exit path 412.This particular configuration causes the fluid short distance of operation in boundary layer 402 before flowing out boundary layer 402 via exit passageway 412 that enters boundary layer 402.But, those skilled in the art will appreciate that entry and exit passageway with any other appropriate structuring location, and be not limited to shown in this disclosure thus and the structure of describing.The quantity of entrance and exit finger 411,412 in manifold layer 406 greater than three, and on manifold layer 406 less than 10 in per minute rice.Those of ordinary skills also understand the entry and the exit passageway that can use other quantity, and are not limited to the quantity of describing and representing in this disclosure thus.
Can select among the embodiment, though not shown in figures, intermediate layer 104 (Fig. 3 B) is positioned between manifold layer 406 and the boundary layer 402.Intermediate layer 104 (Fig. 3 B) is directed to hot spot region, appointment interface in the boundary layer 402 with fluid.In addition, it is mobile that intermediate layer 104 (Fig. 3 B) can be used to provide the homogeneous (uniform) fluid that enters boundary layer 402.Equally, intermediate layer 104 is used for fluid is offered hot spot region, interface in the boundary layer 402 so that fully cool off focus, and in thermal source 99 the formation temperature uniformity.Entrance and exit path 411 and 412 in thermal source 99 near focus or on focus, locate, so that fully cool off focus, though this not necessarily.
Fig. 7 A represents to have the decomposition view of selecting the manifold layer selected 406 of boundary layer 102 of the present invention.Boundary layer 102 comprises the continuous configuration of minitype channel wall 110, shown in Fig. 3 B.In overall operation, be similar to the manifold layer 106 shown in Fig. 3 B, fluid enters manifold layer 406 at fluid bore 408 places, and through path 414 and towards fluid finger or path 411 operations.Fluid enters the opening of inlet finger 411 and flow through the length of finger 411 as shown by arrows on directions X.In addition, fluid is flowing to the boundary layer 402 that is positioned under the manifold layer 406 downwards on the Z direction.Shown in Fig. 7 A, the fluid in the boundary layer 402 moves on the X of boundary layer 402 and Y direction along basal surface, and carries out heat exchange with thermal source 99.By upwards flowing via outlet finger 412 on the Z direction, heated fluid leaves boundary layer 402, exports finger 412 thus heated fluid is directed to path 418 in the manifold layer 406 on directions X.Fluid then flows and leaves heat exchanger by tap hole 409 along path 418.
Boundary layer comprises a series of grooves 416 that are arranged between many group minitype channels 410 shown in Fig. 7 A, help to guide fluid to commute path 411,412.Particularly, groove 416A is located immediately under the entry 411 of manifold layer 406 alternately, and the fluid that enters boundary layer 402 via entry 411 directly is directed to the minitype channel near groove 416A thus.Therefore, groove 416A makes fluid directly be directed to specific appointment stream from entry 411, as shown in Figure 5.Similarly, boundary layer 402 is included in the groove 416B that directly is positioned on the Z direction under the exit passageway 412.Therefore, the fluid along minitype channel 410 towards the exit passageway bottom horizontal flow sheet is directed to groove 416B by level and by the exit passageway 412 of vertical guide on the groove 416B.
Fig. 6 A represents to have the sectional view of the heat exchanger 400 of manifold layer 406 and boundary layer 402.Particularly, Fig. 6 A represents the entry 411 that interweaves with exit passageway 412, and fluid upwards flows downwards and along exit passageway 412 along entry 411 thus.In addition, as shown in Figure 6A, fluid levels flows through to be arranged between entry and the exit passageway and by groove 416A and 146B and divides the minitype channel wall of opening 410.As selection, the minitype channel wall is continuous (Fig. 3 B), and not by minitype channel 410 not separately.As shown in Figure 6A, entrance and exit path 411 and one of 412 or both be in its place, end in position and have curved surface 420 near groove 416.Curved surface 420 will flow towards the minitype channel 410 near path 411 along the fluid that path 411 flows downward.Therefore, the fluid that enters boundary layer 102 is easier of minitype channel 410 guiding, rather than flows directly to groove 416A.Similarly, the curved surface 420 in the exit passageway 412 helps fluid is directed to exit passageway 412 from minitype channel 410.
In alternate embodiments, shown in Fig. 7 B, boundary layer 402 ' comprises entry 411 ' and the exit passageway of describing with reference to manifold layer 406 412 ' (Fig. 8-9).In alternate embodiments, fluid directly 408 ' is fed to boundary layer 402 ' from the aperture.Fluid 411 ' flows along path 414 ' towards entry.Fluid then is horizontally through along minitype channel 410 ' in groups, and carries out heat exchange with the thermal source (not shown), and flows to exit passageway 412 '.Fluid then flows to path 418 ' along exit passageway 412 ', and fluid leaves boundary layer 402 ' via aperture 409 ' thus.Aperture 408 ', 409 ' is configured in the boundary layer 402 ', and selectively is configured in the manifold layer 406 (Fig. 7 A).
Be expressed as levels operation though those skilled in the art will appreciate that all heat exchangers of the present invention, heat exchanger is selectively operated on the upright position.Though operate on the upright position, heat exchanger is selectively constructed, and makes each entry be positioned on the adjacent exit passageway.Therefore, fluid enters boundary layer and is directed to exit passageway naturally via entry.Any other structure that understands manifold layer and boundary layer equally can be used for making heat exchanger to operate on the upright position selectively.
Fig. 8 A-8C represents the top view according to another selected embodiment of heat exchanger of the present invention.Particularly, Fig. 8 A represents the top view of selecting manifold layer 206 according to of the present invention.Fig. 8 B and 8C represent the top view of intermediate layer 204 and boundary layer 202.In addition, Fig. 9 A represents to utilize three layers of heat exchanger can selecting manifold layer 206, and 9B represents to utilize the two-layer heat exchanger that can select manifold layer 206.
Shown in Fig. 8 A and 9A, manifold layer 206 comprises a plurality of fluid orifices 208 of level and vertical configuration.As selection, fluid orifice 208 is with respect to manifold layer 206 diagonal location or with any other direction location.Fluid orifice 208 is placed on the selected location in manifold layer 206, so that effectively fluid is delivered to the predetermined interface hot spot region in the heat exchanger 200.A plurality of fluid orifices 208 provide significant advantage, and this is because fluid can directly be delivered to the specific interface hot spot region from fluid orifice, significantly is not increased on the heat exchanger 200 and pressure is not fallen.In addition, fluid orifice 208 also is positioned in the manifold layer 206, makes that the minimum distance of fluid operation in the hot spot region, interface arrives delivery port 208, makes fluid realize temperature homogeneity, keeps the minimum pressure drop simultaneously between entrance and exit aperture 208.In addition, use manifold layer 206 to help in heat exchanger 200, to stablize two-phase flow, and equally distributed uniformity flow on the boundary layer 202.Should be noted that more than one manifold layer 206 selectively is included in the heat exchanger 200, manifold layer 206 guiding fluids commute heat exchanger 200 thus, and another manifold layer (not shown) control fluid is recycled to the speed of heat exchanger 200.As selection, a plurality of manifold layer 206 all are recycled to fluid the hot spot region, selected corresponding interface in the boundary layer 202.
Selectable manifold layer 206 has the lateral dimension that closely mates with the size of boundary layer 202.In addition, manifold layer 206 has the size identical with thermal source 99.As selection, manifold layer 206 is greater than thermal source 99.The vertical dimension of manifold layer 26 is in 0.1 and 10 millimeter scope.In addition, the opening of the reception fluid orifice 208 in the manifold layer 206 is in the scope of the whole width of 1 millimeter and thermal source 99 or length.
Figure 10 A represents the perspective view according to the embodiment of boundary layer 302 of the present invention.Shown in Figure 10 A, boundary layer 302 comprises the basal surface 301 upwardly extending a series of columns 303 from boundary layer 302.In addition, Figure 10 A represents to be arranged in the miniature loose structure 301 on the basal surface of boundary layer 302.Will appreciate that the combination that boundary layer 302 can include only miniature loose structure 301 and have the miniature loose structure of any other boundary layer feature (for example minitype channel, column etc.).
Boundary layer 302 comprises from the vertical height that extend and contact with the basal surface of manifold layer of basal surface 301 and the closely spaced array of narrow column 303.As selection, column 303 does not contact the basal surface of manifold layer.In addition, at least one column 303 selectively extends with an angle with respect to the basal surface 301 of boundary layer 302.Column 303 also can be equally spaced mutually along boundary layer 302, makes that the capacity of heat transmission of boundary layer 302 is uniform on its basal surface 301.As selection, column 303 is not equally spaced shown in Figure 10 B, and wherein the column 303 in the middle of the boundary layer 203 is more farther at interval than the column 303 at edge.Column 303 separates according to the size and the position of the flow resistance of the size of thermal source 99, fluid and focus and the heat flux density that comes from thermal source 99.For example, more low-density column 303 will provide less resistance for flowing, but it is less with the heat conducting surface area of fluid to be used for boundary layer 302 equally.The structure that should be noted that the column 303 that the aperiodicity shown in Figure 10 B embodiment separates is not limited to this, and can come with any other arrangement according to the situation of thermal source and the action required of cooling system.
In addition, column 303 is circular columns preferably, shown in Figure 10 A, makes fluid flow to exit opening from the inlet opening with minimum drag.But, column 303 as select to have including, but not limited to square 303B (Figure 10 B), rhombus, oval 303C (Figure 10 C), hexagon 303D (Figure 10 D) or any other shape shape.In addition, boundary layer 302 is as the combination of selecting to have along basal surface 301 differing formed column.
For example, shown in Figure 10 E, boundary layer 302 is included in many groups rectangular fin 303E of mutual radial arrangement in its each group.In addition, boundary layer 302 comprises and is arranged in a plurality of column 303B between the rectangular fin 303E in groups.In one embodiment, the open border circular areas in the rectangular fin 303E of radial arrangement is placed under each inlet opening, and fin 303E helps fluid is directed to exit opening thus.Therefore, radially-arranged fin 303E helps to reduce pressure and falls, and makes cooling fluid almost evenly distribute on boundary layer 302 simultaneously.According to the size and the relative position of entrance and exit opening, having the many of column and/or fin may construct, and the selection of the best configuration of boundary layer 302 depends on whether fluid is single-phase flowing or the two-phase flow situation.The structure that those skilled in the art will appreciate that multiple pin 303 can combine with any embodiment described herein and modification thereof.
Figure 11 represents to have the sectional perspective view of selecting three layers of heat exchanger 200 of manifold layer 200 according to of the present invention.As shown in figure 11, according to the heat that the main body along thermal source 99 produces, heat exchanger 200 is divided into separate areas.The zone of cutting apart by the minitype channel wall construction in vertical centering control interbed 204 and/or the boundary layer 202 210 separately.But, those skilled in the art will appreciate that assembly shown in Figure 11 structure shown in being not limited to, and be for purpose of explanation.Heat exchanger 200 is connected on one or more pumps, and a pump is connected on the inlet 208A thus, and another pump is connected on the inlet 208B.
As shown in Figure 3, thermal source 99 is focus in the A of position and the warm spot in the B of position, and the focus in the A of position produces than the warm spot in the B of position and more manys heat thus.Should be understood that thermal source 99 is alternatively in having more than one focus and warm spot any preset time.In this example, because position A is a focus, and the more heats in the A of position are delivered to the boundary layer 202 on the position A (among Figure 11 as hot spot region, interface A), more the liquid stream of multithread body and/or fair speed offers hot spot region, the interface A in the heat exchanger 200, so that abundant cool position A.Be expressed as greater than hot spot region, interface A though should be understood that hot spot region, interface B, any other hot spot region, interface in hot spot region, interface A and B and the heat exchanger 200 can have virtually any size and/or structure each other.
As selection, as shown in figure 11, the fluid that enters heat exchanger via fluid orifice 208A is by 204 flowing to inflow catheter 205A and be directed to hot spot region, interface A along the intermediate layer.Fluid then flows down on the Z direction in hot spot region, the interface A of boundary layer 202 along inflow catheter 205A.Fluid flows between minitype channel 210A, and the heat that comes from position A thus is delivered on the fluid by the conduction with boundary layer 202.Heated fluid leaves heat exchanger 200 along boundary layer 202 towards fluid in the A of hot spot region, interface delivery port 209A flows.Those skilled in the art will appreciate that any amount of inlet aperture 208 and delivery port 209 can be used for a specific interface hot spot region or a class boundary face hot spot region.In addition, though delivery port 209A is expressed as near boundary layer 202A, delivery port 209A can be vertically located on any other position, on manifold layer 209B as selecting.
Similarly, in example shown in Figure 11, thermal source 99 has warm spot at the B place, position that generation is less than the position A heat of thermal source 99.The fluid that enters aperture 208B is directed to hot spot region, interface B by flow to flow ipe 205B along intermediate layer 204B.Fluid then flows down to hot spot region, the interface B of boundary layer 202 on the Z direction along inflow catheter 205B.Fluid flows between minitype channel 210 on X and Y direction, is delivered to fluid by thermal source at the heat that position B produces thus.Heated fluid upwards flow to delivery port 209B via the outflow conduit 205B in the intermediate layer 204 along whole interface layer 202B on the Z direction in the B of hot spot region, interface, fluid leaves heat exchanger 200 thus.
As selection, shown in Fig. 9 A, heat exchanger 200 can comprise the film 214 that is positioned at the Tou Guoed steam on the boundary layer 202 as selecting.The film 214 that can see through steam contacts with the madial wall sealing of heat exchanger 200.Film configuration becomes to have a plurality of little openings, and the feasible steam that produces along boundary layer 202 is through wherein arriving aperture 209.Film 214 also is configured to hydrophobic, flows through the opening of film 214 along boundary layer 202 so that prevent liquid fluid.Can see through among the U. S. application sequence number NO.10/366128 of more details in the together examination of submitting on February 12nd, 2003 that is entitled as " VAPORESCAPE MICROCHANNEL HEAT EXCHANGER " of film 114 of steam and describe, this patent is hereby expressly incorporated by reference.
Figure 12 A represents the decomposition view according to heat exchanger 300 of the present invention.Figure 12 B represents the decomposition view of selecting heat exchanger 300 ' according to of the present invention.Shown in Figure 12 A and 12B, heat exchanger 300,300 ' comprises boundary layer 302,302 ' and connect manifold layer 306,306' on it.As mentioned above, heat exchanger 300,300 ' is connected on the thermal source (not shown), perhaps (for example is embedded in the microprocessor) as selecting to be combined in fully in the thermal source.Those skilled in the art will appreciate that boundary layer 302,302 ' roughly is closed, and only for purpose of explanation, in Figure 12 A, be expressed as exposing.Preferably boundary layer 302,302 ' comprises a plurality of columns 303 of arranging along basal surface 301.In addition, column 303 is as the Any shape and/or the radially-arranged fin 303E that select to have as describing with reference to figure 10A-10E.Moreover boundary layer 302 is as selecting to have aforesaid any other feature (for example minitype channel, rough surface).Structure in boundary layer 302 and the layer 302 also preferably has aforesaid identical heat-conductive characteristic, and no longer is described.Though boundary layer 302 is expressed as more less than manifold layer 306, those skilled in the art will appreciate that boundary layer 302 and manifold layer 306 can be any other sizes each other and with respect to thermal source 99.Boundary layer 302,302 ' further feature have the performance identical with aforesaid boundary layer, and will not describe in detail more.
Usually, use and to send passage 322 in the manifold layer 306, the pressure that heat exchanger 300 reduces in the heat exchanger falls.Send passage 322 and be vertically located in the manifold layer 306, and fluid is vertically offered boundary layer 302, so that the pressure that reduces in the heat exchanger 300 falls.As mentioned above, reach significant time and/or distance because fluid flows on X and Y direction along boundary layer, pressure falls and forms in heat exchanger 300 or increase.By fluid vertically is urged to boundary layer 302, manifold layer 306 reduces flowing on X and the Y direction via a plurality of passages 322 of sending.In other words, a plurality of independent jet of fluid is applied directly on the boundary layer 302 from the top.Send passage 322 and be positioned on the optimum distance spaced apart from each other, make fluid on X and Y direction and upwards perpendicular flow leave boundary layer 302.Therefore, the power of independent stream of leaving the passage 322 of best orientation causes fluid to flow in stream upwards naturally and leaves boundary layer 302.In addition, individual passage 322 makes a plurality of passages 322 interior mobile differentiation of fluids in the boundary layer 302 maximize, and the pressure that reduces thus in the heat exchanger 300 falls, and the while is cooled off thermal source 99 effectively.In addition, the structure of heat exchanger 300 makes heat exchanger 300 have littler size than other heat exchanger, and this is owing to fluid need not flow big distance so that fully cool off thermal source 99 on X and Y direction.
Selectable manifold layer 306 ' shown in Figure 12 B comprises three individual courses.Particularly, manifold layer 306 ' comprises circulation layer 304 ', layer 308 ' and layer 312 '.Circulation layer 304 ' is connected on boundary layer 302 ' and the layer 308 '.Layer 308 ' is connected on circulation layer 304 ' and the layer 312 '.Though Figure 12 B presentation layer 312 ' is positioned on the layer 308 ', those skilled in the art will appreciate that layer 308 ' selectively is positioned on the layer 312 '.Those skilled in the art will appreciate that equally according to the present invention and selectively adopt any amount of layer.
Figure 12 C represents the perspective view according to circulation layer 304 ' of the present invention.Circulation layer 304 ' comprises top surface 304A ' and basal surface 304B '.Shown in Figure 12 B and 12C, circulation layer 304 ' comprises a plurality of openings 322 ' that extend through wherein.In one embodiment, the opening of opening 322 ' is concordant with basal surface 340B '.As selection, opening 322 ' extends beyond basal surface 304B ', so that fluid more closely is applied on the boundary layer 302 '.In addition, circulation layer 304 ' comprises a plurality of openings 324 ' that extend to basal surface 304B ' and vertically stretch out preset distance as cylindrical projection on the Z direction from top surface 304A'.Those skilled in the art will appreciate that opening 322 ', 324 ' can extend through circulation layer with an angle selectively, and do not need vertical fully.As mentioned above, in one embodiment, boundary layer 302 ' (Figure 12 B) is connected on the basal surface 304B ' of circulation layer 304 '.Therefore, fluid enters boundary layer 320 ' by only flowing through opening 322 ' on the Z direction enters boundary layer 302', and by only flowing through opening 324 ' on the Z direction leaves boundary layer 302 '.As following description, the fluid that enters boundary layer 302 ' via opening 322 ' keeps and separates via the fluid that opening 324 ' leaves boundary layer 302 ' by circulation layer 304 '.
Shown in Figure 12 C, the part of opening 324 ' preferably has the cylindrical member that extends from basal surface 304A ' from circulation layer 304 ' on the Z direction, makes fluid flow through opening 324 ' direct corridor 326 ' (Figure 12 F and 12G) in layer 312 '.Preferably, cylindrical projection is circular shown in Figure 12 C, but can have other shape as selecting.But along boundary layer 302 ', fluid flows to adjacent apertures 324 ' from each opening 322 ' in horizontal and vertical direction.Preferably opening 322 ' and opening 324 ' are heat insulation mutually makes that coming from the heat that is heated fluid that leaves boundary layer 302 ' via manifold layer 306 ' does not diffuse into via manifold layer 306 ' and flow in the fluid of the cooling on the boundary layer 302 '.
Figure 12 D represents the embodiment according to layer 308 of the present invention.Shown in Figure 12 D, layer 308 comprises top surface 308A and basal surface 308B.Preferably, the basal surface 308B of layer 308 is directly connected on the boundary layer 302, shown in Figure 12 A.Layer 308 comprises having the recessed corridor 320 that a plurality of fluids are sent passage 322, and passage 322 preferably is delivered to fluid boundary layer 302.Recessed corridor 320 contact with boundary layer 302 sealings, and the fluid that wherein leaves boundary layer 302 is 320 interior passages 302 and mobile between passage 302 around the corridor, and leaves via aperture 314.Should be noted that the fluid that leaves boundary layer 302 does not enter sends passage 322.
Figure 12 E represents the perspective view according to the downside of the selected embodiment of layer 308 ' of the present invention.Layer 308 ' comprises top surface 308A ' and basal surface 308B ', and the basal surface of layer 308B ' directly is connected circulation layer 304 ' and goes up (Figure 12 C) thus.Layer 308 ' preferably includes aperture 314 ', corridor 320 ' and a plurality of openings 322 ', 324 ' in basal surface 308B '.Those skilled in the art will appreciate that layer 308 ' comprises any amount of aperture and corridor.Opening 322 ', 324 ' in Figure 12 E is configured to towards circulation layer 304 '.Particularly, shown in Figure 12 E, the fluid guiding that opening 322 ' will enter corridor 320 ' flows into boundary layer 302 ', and opening 324 ' is directed to layer 312 ' with fluid from boundary layer.Opening 324 ' extends through the corridor 320 ' in the layer 308 ' fully.Opening 324' is separately and separates, make flow through opening 324 ' fluid not with flow through the fluid mixing relevant or contact with the post of opening 324 '.Opening 324 ' also can be independent, so that guarantee to flow through the fluid of each opening 324 ' along the flow path that provides by opening 324 '.Preferably, opening 324 ' vertical configuration.Therefore, fluid is by the major part of vertical guide through manifold layer 306 '.Should be understood that this is applicable to opening 322 ', particularly under layer is positioned at situation between boundary layer and this layer.
Though opening or hole 322 are illustrated as having same size, opening 322 can have the diameter of difference or variation along length.For example, the hole 322 in more close aperture 314 can have than minor diameter, so that fluid is wherein flow through in restriction.Less hole 322 therefore force fluid flows downward along the opening 322 away from aperture 314 more.This vary in diameter in hole 322 makes the fluid that enters boundary layer 302 more evenly distribute.The diameter that those skilled in the art will appreciate that hole 322 can change as selecting, so that cool off in the known interface hot spot region of boundary layer 302.Those skilled in the art will appreciate that above description is applicable to opening 324 ', the change in size of opening 324 ' or change thus is so that be applicable to the even effluent that comes from boundary layer 302.
In one embodiment, aperture 314 offers layer 308 and boundary layer 302 with fluid.Aperture 314 in Figure 12 D preferably extends to corridor 320 via the part of the main body of layer 308 from top surface 308A.As selection, aperture 314 extends to corridor 320 from the side or the bottom of layer 308.Preferably aperture 314 is connected on the aperture 315 of layer in 312 (Figure 12 A-12B).Corridor 320 is led in aperture 314, and the corridor is sealed shown in Figure 12 C, and is perhaps recessed shown in Figure 12 D.Corridor 320 preferably is used for fluid is directed to aperture 314 from boundary layer 302.As selection, corridor 320 314 is directed to boundary layer 302 with fluid from the aperture.
Shown in Figure 12 F and 12G, the aperture 315 in the layer 312 is preferably aimed at aperture 314 and is communicated with.With respect to Figure 12 A, fluid preferably enters heat exchanger 300 via aperture 316, and flows through corridor 328 down to sending passage 322 in the layer 308, arrives boundary layer 302 gradually.With respect to Figure 12 B, fluid can be used as and selectively enters heat exchanger 300 ', enters via aperture 315 ', and flows through the aperture 314 ' of layer in 308 ', and arrive boundary layer 302 ' gradually.Aperture 315 in Figure 12 F is preferably from the main body of top surface 312A extend past layer 312.As selection, extend from layer 312 1 side in aperture 315.As selection, layer 312 does not comprise aperture 315, and fluid enters heat exchanger 300 (12D and 12E) via aperture 314 thus.In addition, layer 312 comprises the aperture 316 that preferably fluid is directed to corridor 328 '.Those skilled in the art will appreciate that layer comprises any amount of aperture and corridor.Corridor 328 preferably is directed to fluid sends passage 322 and arrives boundary layer 302 gradually.
Figure 12 G represents the perspective underside view according to the selected embodiment of layer 312 ' of the present invention.Layer 312 ' is preferably in and is connected among Figure 12 E on the layer 308 '.Shown in Figure 12 F, layer 312 ' comprises the zone, recessed corridor 328 ' that exposes along basal surface 312B in main body.Recessed corridor 328 ' is communicated with aperture 316 ', and fluid directly flows to aperture 316 ' from recessed corridor 328 ' thus.Recessed corridor 328 ' is positioned on the top surface 308A ' of layer 308 ', makes fluid freely flow upward to corridor 328 ' from opening 324 '.The recline top surface 308A ' sealing of layer 312 ' of the periphery in recessed corridor 320 ' and basal surface 312B ' makes all fluids that come from opening 324 ' flow to aperture 316 via corridor 328 '.Each opening 330 ' in the basal surface 312B ' is aimed at the respective openings 321 ' in the layer 308 ' and is communicated with (Figure 12 E), thus opening 330 ' and layer 308 ' the concordant location of top surface 308A ' (Figure 12 E).As selection, opening 330 has slightly the diameter greater than the diameter of respective openings 324 ', and opening 324 ' extends through opening 330 ' and enters corridor 328 ' thus.
Figure 12 H represents the sectional view along the heat exchanger of Figure 12 A of line H-H intercepting according to the present invention.Shown in Figure 12 H, boundary layer 302 is connected on the thermal source 99.As mentioned above, heat exchanger 300 alternatively forms single parts with thermal source 99 integral body.Boundary layer 302 is connected on the basal surface 308B of layer 308.In addition, layer 312 preferably is connected on the layer 308, layer 308 the top surface basal surface 312B sealing of layer 312 that reclines thus.The periphery in the corridor 320 of layer 308 is communicated with boundary layer 302.In addition, the corridor 328 of layer in 312 and layer 308 interior opening 322 are communicated with.The recline top surface 308A sealing of layer 308 of layer 312 basal surface 312B makes fluid not leak between two layers 308,312.
Figure 12 I represents the sectional view along the heat exchanger selected of Figure 12 B of line I-I intercepting according to the present invention.Shown in Figure 12 I, boundary layer 302 ' is connected on the thermal source 99 '.Boundary layer 302 ' is connected on the basal surface 304B ' of circulation layer 304 '.Equally, circulation layer 304 is connected on the layer 308 ', the top surface 304A ' of circulation layer 304 ' layer 208 ' the basal surface 308 ' sealing that reclines thus.Layer 312 ' preferably is connected on the layer 308 ' in addition, layer 308 ' the top surface 308A ' basal surface 312B ' sealing of layer 312 that reclines thus.The open communication of the periphery in the corridor 320 ' of layer 308 ' and the top surface 304A ' of circulation layer 304 ' makes fluid not leak between two layers.In addition, the open communication in the periphery in the corridor 328 ' in the layer 312 ' and the top surface 308A ' of circulation layer 308 ' makes fluid not leak between two layers.
In operation, shown in Figure 12 A and 12H arrow, the fluid that is cooled enters heat exchanger 300 via the aperture 316 in the layer 312 '.The fluid that is cooled 316 flows down to corridor 328 along the aperture, and flows down to boundary layer 302 via sending passage 322.The fluid that is cooled in the corridor 320 does not mix or contacts with any fluid that is heated that leaves heat exchanger 300.The fluid and the thermal source 99 interior heats that produce that enter boundary layer 302 carry out heat exchanger and absorb this heat.Opening 322 best configuration become to make fluid flow through the distance of minimum on X and Y direction in boundary layer 302, so that the pressure that reduces in the heat exchanger 300 falls, effectively cool off thermal source 99 simultaneously.Be heated fluid and then on the Z direction, upwards flow to corridor 320 in the layer 308 from boundary layer 302.The fluid that is heated that leaves manifold layer 306 does not mix with any fluid that is cooled that enters manifold layer 306 or contacts.Be heated fluid and when entering corridor 320, flow to aperture 314 and 315, and leave heat exchanger 300.Those skilled in the art will appreciate that fluid is mobile on the contrary as selecting the mode with Figure 12 A and 12H, and do not depart from scope of the present invention.
In selectable operation, shown in the arrow of Figure 12 B and 12I, the fluid that is cooled enters heat exchanger 300 ' via the aperture 316 ' in the layer 312 '.The fluid that is cooled 315 ' flows to the aperture 314 ' of layer in 308 ' downwards along the aperture.Fluid then flows into corridor 320 ', and flows to boundary layer 302 ' downwards via the opening 322 ' in the circulation layer 304 '.But the fluid that is cooled in the corridor 320 ' does not mix or contacts with any fluid that is heated that leaves heat exchanger 300 '.The fluid and the thermal source 99 interior heats that produce that enter boundary layer 302 ' carry out heat exchange and absorb this heat.As following description, opening 322 ' and opening 324 ' are arranged such that fluid flows through best minimum distance to adjacent apertures 324 ' along boundary layer 302 ' from each opening 322 ', so that the pressure that reduces wherein falls, cool off thermal source 99 simultaneously effectively.Be heated fluid and then on the Z direction, upwards flow through the corridor 328 ' of layer 308 ' in layer 312 ' via a plurality of openings 324 ' from boundary layer 302 '.When opening 324 ' upwards flows, be heated fluid and do not mix or contact with any fluid that is cooled that enters manifold layer 306 '.Being heated fluid flows to aperture 316 ' and leaves heat exchanger 300 ' when entering the corridor 328 ' of layer in 312 '.Those skilled in the art will appreciate that fluid can be used as the mode of selecting with Figure 12 B and 12I and flows on the contrary, and do not depart from scope of the present invention.
In manifold layer 306, opening 322 is arranged such that the distance minimum that fluid flows in boundary layer 302, abundant simultaneously cooling thermal source 99.In selectable manifold layer 306 ', opening 322 ' and 324 ' is arranged such that the distance minimum that fluid flows in boundary layer 302 ', abundant simultaneously cooling thermal source 99.Particularly, shown opening 322 ', 324 ' provides the approximate vertical stream, makes to be flowing in heat exchanger 300 ' the inherent X and Y is transversely minimum.Therefore, heat exchanger 300,300 ' reduces fluid greatly and must flow so that fully cool off the distance of thermal source 99, reduces heat exchanger 300,300 ' the interior pressure that produces then greatly and falls.
The specific configuration and the sectional dimension of opening 322 and/or opening 324 depend on multiple factor, the heat and the rate of flow of fluid that produce including, but not limited to flow regime, temperature, by thermal source 99.Relate to opening 322 and 324 though should be noted that following description, should be understood that these descriptions are equally applicable to independent opening 322 or opening 324.
Opening 322,324 is spaced from each other optimum distance, is cooled to fully at thermal source 99 thus that minimum falls in pressure when temperature required.In this embodiment, by changing the size and the position of opening separately, the configuration of opening 322 and/or opening 324 and optimum distance make opening 322,324 and the stream that passes boundary layer 302 usually optimize separately.In addition, the configuration of this embodiment split shed has also significantly increased the total division of flowing that enters boundary layer, and by entering the fluid-cooled region quantity of each opening 322.
In one embodiment, opening 322,324 with alternate configuration or " chessboard " patterned arrangement in manifold layer 306, shown in Figure 13 and 14.Each opening 322,324 separates the minimum distance that fluid flows through in checkerboard pattern.But opening 322,324 must be separated from each other enough big distance, reaches time enough so that cooling fluid is offered boundary layer 302.Shown in Figure 13 and 14, preferably one or more openings 322 are near the aperture arrangement of respective numbers or vice versa, make the fluid that enters boundary layer 302 flow through the distance of minimum along boundary layer 302 before leaving boundary layer 302.Therefore, as shown in the figure, preferably opening 322,324 is mutually around radial distribution, to help flowing the distance of minimums to nearest opening 324 from any opening 322.For example, as shown in figure 13, via the fluid that enters boundary layer 302 of a certain openings 322 through the path of minimum drag to adjacent apertures 324.In addition, though opening can have any other shape, opening 322,324 is preferably round-shaped.
In addition, as mentioned above, though opening 324 is expressed as stretching out from circulation layer 304 or layer 308,312 as cylindrical member in the accompanying drawings, this opening can be used as selection and does not stretch out from manifold layer 306 interior any layers.Equally preferably manifold layer 306 has the rounding surface around the zone that fluid changes direction, falls with the pressure that helps to reduce in the heat exchanger 300.
The optimum distance of opening 322,324 structure and size depend on the temperature level of fluid under exposing along boundary layer 302.It is also important that the sectional dimension that is used for the stream in the opening 322,324 is enough big, so that the pressure that reduces in the heat exchanger 300 falls.Carry out single-phase mobile situation for fluid along 302 of boundary layers, each opening 322 preferably centers on symmetrical hexagon-shaped configuration by a plurality of adjacent apertures 324, as shown in figure 13.In addition, flow for single-phase, preferably number of openings in circulation layer 304 about equally.In addition, flow for single-phase, opening 322,324 is same diameter preferably.Those skilled in the art will appreciate that as any ratio of selecting to consider other configuration and opening 322,324.
Carry out the situation of two-phase flow for fluid along boundary layer 302, the symmetrical arrangements of opening 322,324 preferably is used for adapting to the acceleration of two-phase fluid.But, also can consider the balanced configuration of opening 322,324 for two-phase flow.For example, opening 322,324 can be arranged symmetrically in the circulation layer 304, and opening 324 has the big opening of ratio open 322 thus.As selection, for two-phase flow, in circulation layer 304, use hexagonal symmetry configuration shown in Figure 13, to compare with opening 322 thus, more openings 324 are positioned at circulation layer 304.
Should be noted that the opening 322,324 in the circulation layer can be used as the focus that selectively is configured to cool off in the thermal source 99.Therefore, for example two openings 322 are selectively mutually near being positioned in the circulation layer 304, and two openings 322 are near the hot spot regions, interface or locate on it thus.The opening 324 that should be understood that right quantity falls so that reduce boundary layer 302 interior pressure near two openings, 322 location.Therefore, two openings 322 are fed to the hot spot region, interface with cooling fluid, so that force the hot spot region, interface to form roughly the same temperature uniformly as mentioned above.
As mentioned above, heat exchanger 300 has significant advantage with respect to other heat exchanger.Fall owing to reduced the pressure that vertical stream causes, as selection, the structure of heat exchanger 300 can utilize the pump of medium-performance.In addition, the structure of heat exchanger 300 makes inlet and stream optimize separately along boundary layer 302.In addition, the layer of separation forms the basis of custom design, thereby optimizes heat conducting uniformity, reduce that pressure falls and the size of separate part.The pressure that the structure of heat exchanger 300 has also reduced in the system that fluid wherein carries out two-phase flow falls, and can be used for single-phase and binary system thus.In addition, as following description, heat exchanger adapts to many different manufacture methods, and for the purpose of tolerance, the geometry that can regulate parts.
The details of how to make and to produce the individual course in heat exchanger 100 and the heat exchanger 100 will be described below.The simple description describes below and is applicable to heat exchanger of the present invention though the heat exchanger 100 of Fig. 3 B and individual course wherein are for simple and clear purpose.Though those skilled in the art will appreciate that with respect to the details that the invention describes manufacturing/production, the details of making and producing is as selecting also to be applicable to conventional heat exchanger and utilize the two-layer of a fluid intake aperture and a fluid orifice and three layers of heat exchanger shown in Figure 1A-1C.
Preferably, boundary layer has the thermal coefficient of expansion (CTE) that is substantially equal to thermal source 99.Therefore, boundary layer preferably and thermal source 99 expand accordingly and shrink.As selection, the material of boundary layer 302 has the CTE of the CTE that is different from source materials.The boundary layer of being made by the material of for example silicon 302 has the CTE that mates with thermal source 99, and has enough heat conductivities, so that from thermal source 99 heat is delivered to fluid fully.But as selection, other material can be used for having the boundary layer 302 of the CTE that mates with thermal source 99.
Boundary layer preferably has high heat conductivity, make thermal source 99 and the fluid that flows along boundary layer 302 between fully conduct, make thermal source 99 not overheated.Boundary layer is preferably made by the material of the high heat conductivity with 100W/m-K.But, those skilled in the art will appreciate that boundary layer 302 has the heat conductivity that is greater than or less than 100W/m-K, and be not limited to this.
In order to realize preferred heat conductivity, boundary layer preferably is made of copper.As selection, boundary layer is made by any other material, and this material is including, but not limited to monocrystalline dielectric material, metal, aluminium, nickel, Semiconductor substrate, for example silicon, Kovar alloy, diamond, synthetic or any suitable alloy.The selectable material of boundary layer 302 is to form pattern or molded organic grid.
In conjunction with details, for specific embodiment the present invention is described, to help to understand structure of the present invention and operating principle.Therefore, do not plan to limit the scope of appended claim here for the reference of specific embodiment and details thereof.Those skilled in the art will appreciate that and can carry out modification selected embodiment, and without departing from the spirit and scope of the present invention.
Claims (43)
1. a manufacturing has the method for the heat exchanger of minitype channel, and this method comprises:
A. use material removal process to form and pass a plurality of microcosmic openings of a plurality of heat conduction layers so that form a plurality of Window layer; And
B. a plurality of Window layer are linked together so that form synthetic microstructure.
2. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that heat conduction layer comprises copper.
3. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that, a plurality of Window layer link together by brazing.
4. the method for manufacturing heat exchanger as claimed in claim 3 is characterized in that, brazing is finished by the brazing material that comprises silver.
5. the method for manufacturing heat exchanger as claimed in claim 3 is characterized in that, one or more layers plating brazing material before brazing.
6. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that, also is included in the step of aiming at opening before a plurality of Window layer are linked together in each layer of a plurality of Window layer.
7. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that, material removal process is the isotropism wet etching process.
8. the method for manufacturing heat exchanger as claimed in claim 7; it is characterized in that, the isotropism wet etching process be selected from comprise photochemistry processing, run through the mask chemical etching, run through the mask chemical etching, in the group of electronics etching and the miniature processing of electron chemistry.
9. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that, synthetic microstructure comprises micro grid detection.
10. the method for manufacturing heat exchanger as claimed in claim 1, it is characterized in that, the step of using material removal process to form the microcosmic opening of each layer that passes a plurality of heat conduction layers is included in the interior formation of first side first micro-pattern of each heat conduction layer, and forms second micro-pattern in second side of heat conduction layer.
11. the method for manufacturing heat exchanger as claimed in claim 10 is characterized in that, first and second micro-patterns are complementary, so that form continuous minitype channel in heat conduction layer.
12. the method for manufacturing heat exchanger as claimed in claim 10 is characterized in that, first and second micro-patterns are designed to form overlapping micro grid detection structure in heat conduction layer.
13. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that, synthetic microstructure comprises a plurality of minitype channels.
14. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that, heat conduction layer have about 50 and about 250 microns between thickness.
15. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that, be formed on microcosmic opening in the heat conduction layer have about 50 and about 300 microns between size.
16. a manufacturing comprises the method for the micro heat exchanger of heat conducting high surface to volume ratio material (HSVRM) structure, this method comprises:
A., the lid of being made by first material structure is provided;
B. manifold structure is connected with the lid structure, wherein manifold structure is made by second material, and is configured to distribute cooling fluid;
C. use material removal process, form a plurality of microcosmic openings that pass a plurality of heat conduction layers that comprise heat conducting material, so that form a plurality of Window layer;
D. a plurality of Window layer are linked together so that form the synthetic HSVRM structure that comprises heat conducting material, the HSVRM structure that wherein is formed in each layer of a plurality of heat conduction layers is designed to form synthetic HSVRM structure when heat conduction layer links together;
E. will synthesize HSVRM structure and manifold structure and link together, make that manifold layer is configured to fluid is delivered to the HSVRM structure with the lid structure; And
Flat bed structure and synthetic HSVRM structure, manifold structure and the lid structure that f. will comprise the 3rd material link together so that form micro heat exchanger.
17. the method for manufacturing micro heat exchanger as claimed in claim 16 is characterized in that heat conduction layer comprises copper.
18. the method for manufacturing micro heat exchanger as claimed in claim 16 is characterized in that, lid structure, manifold structure, a plurality of Window layer and flat bed structure all link together by brazing.
19. the method for manufacturing micro heat exchanger as claimed in claim 18 is characterized in that, brazing is finished by the brazing material that comprises silver.
20. the method for manufacturing micro heat exchanger as claimed in claim 16 is characterized in that, also is included in the step of aiming at opening before a plurality of Window layer are linked together in each layer of a plurality of Window layer.
21. the method for manufacturing micro heat exchanger as claimed in claim 16 is characterized in that, the microcosmic opening is formed in the heat conduction layer by the isotropism wet etching process.
22. the method for manufacturing micro heat exchanger as claimed in claim 21; it is characterized in that, the isotropism wet etching process be selected from comprise photochemistry processing, run through the mask chemical etching, run through the mask chemical etching, in the group of electronics etching and the miniature processing of electron chemistry.
23. the method for manufacturing micro heat exchanger as claimed in claim 16 is characterized in that, synthetic HSVRM structure comprises micro grid detection.
24. the method for manufacturing micro heat exchanger as claimed in claim 23, it is characterized in that, the step that forms the microcosmic opening of each layer pass a plurality of heat conduction layers by material removal process is included in first side of each heat conduction layer and forms first micro-pattern, and forms second micro-pattern in second side of heat conduction layer.
25. the method for manufacturing micro heat exchanger as claimed in claim 24 is characterized in that, first and second micro-patterns are complementary, so that form continuous minitype channel in heat conduction layer.
26. the method for manufacturing micro heat exchanger as claimed in claim 24 is characterized in that, first and second micro-patterns are designed to form overlapping micro grid detection structure in heat conduction layer.
27. the method for manufacturing micro heat exchanger as claimed in claim 16 is characterized in that, synthetic HSVRM structure comprises a plurality of minitype channels.
28. the method for manufacturing micro heat exchanger as claimed in claim 16 is characterized in that, also comprises the fine finishining of flat bed structure.
29. the method for manufacturing micro heat exchanger as claimed in claim 16 is characterized in that, also is included in to cover to form a plurality of fluid orifices in the structure.
30. the method for manufacturing micro heat exchanger as claimed in claim 16 is characterized in that, comprises that the quantity of a plurality of heat conduction layers that synthesize the HSVRM structure and the pressure that thickness is selected to the optimization micro heat exchanger fall and resistive properties.
31. the method for manufacturing heat exchanger as claimed in claim 16 is characterized in that, heat conduction layer have about 50 and about 250 microns between thickness.
32. the method for manufacturing micro heat exchanger as claimed in claim 16 is characterized in that, be formed on microcosmic opening in the heat conduction layer have about 50 and about 300 microns between size.
33. heat exchanger that comprises the microstructureization of a plurality of heat conduction layers, each heat conduction layer has by material removes a plurality of elongated microcosmic opening that forms, wherein a plurality of elongated microcosmic openings are aimed at, and a plurality of heat conduction layers link together so that form the HSVRM structure, and wherein the elongated open more than three of the heat conduction layer that each elongated open in first heat conduction layer is adjacent with at least one is communicated with.
34. the heat exchanger of microstructureization as claimed in claim 33 is characterized in that, a plurality of Window layer link together by brazing.
35. the heat exchanger of microstructureization as claimed in claim 33 is characterized in that, brazing is finished by the brazing material that comprises silver.
36. the heat exchanger of microstructureization as claimed in claim 33 is characterized in that, it is isotropic that material is removed.
37. the heat exchanger of microstructureization as claimed in claim 33 is characterized in that, the pressure that the quantity of a plurality of heat conduction layers and thickness are selected to the heat exchanger of optimizing microstructureization falls and resistive properties.
38. heat exchanger that comprises the microstructureization of a plurality of heat conduction layers, each heat conduction layer has by material removes a plurality of elongated microcosmic opening that forms, wherein a plurality of elongated microcosmic openings are aimed at, and a plurality of heat conduction layers link together so that form the HSVRM structure, and wherein each elongated open in first heat conduction layer is communicated with unique elongated open of any adjacent heat conduction layer.
39. the heat exchanger of microstructureization as claimed in claim 38 is characterized in that, a plurality of elongated microcosmic openings are identical in each layer of a plurality of heat conduction layers.
40. the heat exchanger of microstructureization as claimed in claim 38 is characterized in that, it is isotropic that material is removed.
41. the heat exchanger of microstructureization as claimed in claim 38 is characterized in that Window layer links together by brazing.
42. the heat exchanger of microstructureization as claimed in claim 38 is characterized in that, the pressure that the quantity of a plurality of heat conduction layers and thickness are selected to the heat exchanger of optimizing microstructureization falls and resistive properties.
43. a manufacturing has the method for the heat exchanger of minitype channel, this method comprises:
A. use the material depositing operation to form a plurality of Window layer, Window layer comprises heat conducting material and comprises a plurality of microcosmic openings; And
B. a plurality of Window layer are linked together so that form synthetic microstructure.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US64228405P | 2005-01-07 | 2005-01-07 | |
| US60/642,284 | 2005-01-07 | ||
| PCT/US2006/000434 WO2006074353A2 (en) | 2005-01-07 | 2006-01-06 | High surface to volume ratio structures and their integration in microheat exchangers |
Publications (2)
| Publication Number | Publication Date |
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| CN101248327A true CN101248327A (en) | 2008-08-20 |
| CN101248327B CN101248327B (en) | 2012-11-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200680007455XA Active CN101248327B (en) | 2005-01-07 | 2006-01-06 | Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2008530482A (en) |
| CN (1) | CN101248327B (en) |
| DE (1) | DE112006000160T5 (en) |
| WO (1) | WO2006074353A2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104134807A (en) * | 2014-07-25 | 2014-11-05 | 华南理工大学 | Staggered intercommunicating mesh porous structural plate and fabrication method and application thereof |
| CN106440868A (en) * | 2015-08-13 | 2017-02-22 | 吉林省同达换热系统集成有限公司 | Special-shaped capillary runner heat exchanger |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102449758A (en) * | 2009-05-27 | 2012-05-09 | 库拉米克电子学有限公司 | Cooled electric unit |
| US9303925B2 (en) | 2012-02-17 | 2016-04-05 | Hussmann Corporation | Microchannel suction line heat exchanger |
| US11172770B2 (en) | 2013-09-20 | 2021-11-16 | Hussmann Corporation | High efficient night cover |
| WO2015087451A1 (en) * | 2013-12-13 | 2015-06-18 | 富士通株式会社 | Loop-type heat pipe, method for manufacturing same, and electronic equipment |
| JP6439326B2 (en) | 2014-08-29 | 2018-12-19 | 株式会社Ihi | Reactor |
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| US5199487A (en) * | 1991-05-31 | 1993-04-06 | Hughes Aircraft Company | Electroformed high efficiency heat exchanger and method for making |
| US5811062A (en) * | 1994-07-29 | 1998-09-22 | Battelle Memorial Institute | Microcomponent chemical process sheet architecture |
| US6129973A (en) * | 1994-07-29 | 2000-10-10 | Battelle Memorial Institute | Microchannel laminated mass exchanger and method of making |
| US6907921B2 (en) * | 1998-06-18 | 2005-06-21 | 3M Innovative Properties Company | Microchanneled active fluid heat exchanger |
| US6787052B1 (en) * | 2000-06-19 | 2004-09-07 | Vladimir Vaganov | Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers |
| JP2003247796A (en) * | 2002-02-26 | 2003-09-05 | Sumitomo Precision Prod Co Ltd | Regeneration heat exchanger for micro gas turbine |
| JP2003279283A (en) * | 2002-03-25 | 2003-10-02 | Mitsubishi Heavy Ind Ltd | Heat exchanger and method of manufacture |
| JP2004028538A (en) * | 2002-06-28 | 2004-01-29 | Sumitomo Precision Prod Co Ltd | Regenerative heat exchanger for micro gas turbine |
| US6988534B2 (en) * | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
| JP2004278840A (en) * | 2003-03-13 | 2004-10-07 | Denso Corp | Heat transport device |
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2006
- 2006-01-06 JP JP2007550493A patent/JP2008530482A/en active Pending
- 2006-01-06 CN CN200680007455XA patent/CN101248327B/en active Active
- 2006-01-06 DE DE112006000160T patent/DE112006000160T5/en not_active Withdrawn
- 2006-01-06 WO PCT/US2006/000434 patent/WO2006074353A2/en active Application Filing
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104134807A (en) * | 2014-07-25 | 2014-11-05 | 华南理工大学 | Staggered intercommunicating mesh porous structural plate and fabrication method and application thereof |
| CN104134807B (en) * | 2014-07-25 | 2016-10-05 | 华南理工大学 | A kind of alternate intercommunicating reticulated porous structures plate and manufacture method thereof and application |
| CN106440868A (en) * | 2015-08-13 | 2017-02-22 | 吉林省同达换热系统集成有限公司 | Special-shaped capillary runner heat exchanger |
| CN106440868B (en) * | 2015-08-13 | 2019-09-03 | 四平巨元换热系统集成有限公司 | Special-shaped capillary channel heat exchanger |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101248327B (en) | 2012-11-14 |
| DE112006000160T5 (en) | 2007-11-22 |
| JP2008530482A (en) | 2008-08-07 |
| WO2006074353A2 (en) | 2006-07-13 |
| WO2006074353A3 (en) | 2007-10-18 |
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