CN101248327B

CN101248327B - Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems

Info

Publication number: CN101248327B
Application number: CN200680007455XA
Authority: CN
Inventors: M·达塔; M·麦马斯特; R·布鲁尔; P·周; P·曹; G·乌帕达亚; M·蒙奇
Original assignee: Cooligy Inc
Current assignee: Cooligy Inc
Priority date: 2005-01-07
Filing date: 2006-01-06
Publication date: 2012-11-14
Anticipated expiration: 2026-01-06
Also published as: WO2006074353A2; JP2008530482A; DE112006000160T5; WO2006074353A3; CN101248327A

Abstract

An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.

Description

High surface to volume ratio structure and with the combining of micro heat exchanger

Technical field

The present invention relates to a kind of field of heat exchanger.Be more especially, the present invention relates to a kind ofly make the method for high surface to volume ratio material structures and relate to said structure is attached in the heat exchanger device of microscopic structureization of liquid-cooling system so that effectively heat absorption by a plurality of layers.

Background technology

Effectively the heat conduction needs working fluid to contact so that from cooling device, absorb heat with the thermally coupled surf zone as far as possible in liquid-cooling system.Reliable and the effectively manufacturing so extremely important for the effective micro heat exchanger of exploitation of high surface to volume ratio material (HSVRM) structure.Using the micro-silicon passage is a kind of heat collection device structure in the early stage liquid-cooling system that proposes of assignee of the present invention.For example, with reference to the U.S. Patent Application Serial Number 10/643684 in the together examination of submitting on August 18th, 2003 that is entitled as " APPARATUS AND METHOD OF FORMING CHANNELS IN AHEAT-EXCHANG ING DEVICE ".

High aspect ratio passage is made through the anisotropic etching of silicon, has been found that this method is widely used among little processing and the MEMS.But silicon is with respect to many other materials, particularly have low heat conductivity with respect to the true metal.Though have the method by higher conductive of material manufacturing and design micro heat exchanger in the prior art, these methods are used the expensive manufacturing technology or the labyrinth of appointment, and do not have clear and definite economically viable manufacturing approach.

For example, the United States Patent (USP) NO.6415860 that authorizes people such as K.W.Kelly is described in the minitype channel that all LIGA form in the cross flow one micro heat exchanger.The method of describing in the Kelley patent that is hereby expressly incorporated by reference is used LIGA, the little processing of the known high aspect ratio of a kind of prior art (HARM).LIGA is the rapid technology of multistep, and it comprises the miniature molded of photoetching, plating and formation HSVRM structure, but owing to uses extraneous material and need synchrotron radiation and cost is high.

The method of authorizing the United States Patent (USP) NO.5274920 of J.A.Matthews is described and is a kind ofly made the technology of miniature interchanger through a plurality of plates and recessed area level are forced together.This method forms the microstructure that comprises a plurality of microcosmic strias.Though intactly described the structure of each plate, be hereby expressly incorporated by and upgradeable method.

The United States Patent (USP) NO.6014312 that authorizes people such as J.Schulz-Harder describes a kind of through comprising one group of fin that layer is constructed of opening separately.This layer is stacked one by one, forms stream.The said patent that is hereby expressly incorporated by reference is described polygon ring structure opening, but does not describe the method for making this layer.

Summary of the invention

The heat exchanger for example coolant of fluid that circulates, this material absorb heat and heat are carried the hot generation source of leaving from heat generation source, the heat of cooling produces the source thus.Therefore heat exchanger can be used for cooling off multiple thermal source, for example any source of semiconductor devices, battery, motor, processing cavity locular wall and generation heat.

According to the present invention, put forward the method that a kind of manufacturing comprises the heat exchanger of microstructure.In one embodiment, thus this method comprises materials used to be removed technology and forms a plurality of Window layer and pass the step that a plurality of heat conduction layers form a plurality of miniature openings; And a plurality of Window layer are linked together so that form the step of synthetic microstructure.

In a preferred embodiment of the invention, heat conduction layer comprises copper, and is linked together through brazing technology by a plurality of Window layer that heat conduction layer forms.Brazing is preferably in vacuum or for example in stove, carries out in the reducing atmosphere of forming gas or pure hydrogen.Preferably brazing realizes through the brazing material that comprises silver.Use silver, stove preferably is heated to about 850 ℃, and under this temperature, silver is diffused in the copper, forms Cu-Ag-metal complex alloys, and this alloy melting provides outstanding heat and mechanical cohesive bond property thus.

Owing to be formed on the microcosmic length ratio of the opening in the heat conduction layer, carefully control brazing technology, make brazing material not exclusively or the part occlusion of openings.Preferably, before brazing, silver is plated on the heat conduction layer, for the heat conduction layer of about 150 micron thick, silver-colored thickness about 0.25 and about 2 microns between change.Before the method for making heat exchanger preferably also is included in a plurality of Window layer is linked together in each layer of a plurality of Window layer the step of aligned.The synthetic microstructure that this aligning guarantees to come from the combination of a plurality of heat conduction layers has desirable characteristics.For example, if form the minitype channel structure, aim at and guarantee that its aspect ratio depends primarily on the quantity of the heat conduction layer that bonds together.

The present invention considers the kinds of processes that is used to form Window layer, comprises technology of removing based on material and the technology that deposits based on material.Illustrative processes includes but is not limited to laser lead plug, Laser Processing, wet etching, LIGA, photoetching, ion beam milling, chemical vapor deposition (CVD), physical vapor deposition (PVD), sputtering sedimentation, hydatogenesis, molecular beam epitaxial growth, electroless and electrolytic coating.Though wherein many is HARM technology, the present invention does not need HARM technology.

Preferably, the microcosmic opening forms through wet etching process.Preferred wet etching process is the isotropism wet etching process.Heat conduction layer comprises in the preferred embodiment of copper therein, and the technology that forms the microcosmic opening can be to connect mask chemical etching (also being known as photochemistry processing or PCM), perforation mask electron chemistry etching (also being known as the little processing of electroetching or electrochemistry) or some other suitable wet etching process.

Comprise micro grid detection, a plurality of minitype channel or some other high surface to volume ratio material structure through the synthetic microstructure that a plurality of heat conduction layers are joined together to form.In the present invention; The microcosmic opening of each layer formation of microstructure through passing a plurality of heat conduction layers constitutes, and preferably uses first side that is included in each heat conduction layer to form first micro-pattern and forms second micro-pattern in second side of each heat conduction layer.In this way, first and second micro-patterns are complementary, so that in heat conduction layer, form continuous minitype channel.As selection, first and second micro-patterns are designed in heat conduction layer, form overlapping micro grid detection.

A plurality of heat conduction layers preferably have about 50 and about 250 microns between thickness.In addition, be formed on microcosmic opening in the heat conduction layer preferably have about 50 and about 300 microns between size.

In another aspect of this invention, a kind of method of making micro heat exchanger is provided, this heat exchanger comprises heat conduction, high surface to volume ratio material (HSVRM) structure.This method comprises the steps: to provide lid structure, the connection of being processed by first material to be processed and be configured to distribute the manifold structure of cooling fluid, materials used removal technology to pass a plurality of heat conduction layers that comprise heat conducting material and form a plurality of microcosmic openings so that form a plurality of Window layer from the lid structure by second material.This method also comprises a plurality of Window layer is linked together; So that form the synthetic HSVRM structure comprise heat conducting material, the specific microcosmic hatch frame that wherein is formed in each layer of a plurality of heat conduction layers is designed to when heat conduction layer links together, form synthetic HSVRM structure.This method also comprises synthetic HSVRM structure is connected with manifold structure and lid structure; Make that manifold layer is configured to fluid is delivered to the HSVRM structure; And will comprise that the flat bed structure of the 3rd material and synthetic HSVRM structure, manifold structure and lid structure link together, so that form micro heat exchanger.

In this regard, the HSVRM structure preferably forms according to described method, heat conduction layer copper preferably wherein, and they preferably link together through brazing technology.In addition, lid, manifold peace understructure preferably use the money base brazing material to link together through brazing technology and HSVRM structure.Silver preferably is plated on lid, manifold and the understructure, its thickness about 1 and about 10 microns between.Preferably, comprise the about 1 micron silver of heat conduction layer plating of HSVRM structure, and manifold, the about 4 microns silver of lid and bottom holder structure plating.In other embodiment of brazing technology, the silver that the manifold plating is about 4 microns, and the hot silver that conducts 1 micron of HSVRM structure plating keep not plating and build peaceful understructure.

Preferably, after the micro heat exchanger assembling, the flat bed structure is ground into meticulous fineness.In addition, in being preferably formed in lid or manifold structure so that make that a plurality of apertures of flowing out in the fluid from outside fluid network, the micro heat exchanger of assembling is that the auxiliary heat exchanger of fluid provides liquid close structure.

In a preferred embodiment of the invention, comprise that the quantity of a plurality of heat conduction layers that synthesize the HSVRM structure and the pressure that thickness is selected to the optimization micro heat exchanger fall and resistive properties.

In another aspect of this invention; The heat exchanger of microstructureization comprises a plurality of heat conduction layers; Each heat conduction layer has and passes wherein a plurality of elongated microcosmic opening that forms; Wherein a plurality of elongated microcosmic openings aim at and a plurality of heat conduction layer links together so that form the HSVRM structure, and the elongated open more than three of the heat conduction layer that wherein each elongated open in first heat conduction layer is adjacent with at least one is communicated with.

The heat exchanger of microstructureization preferably includes the heat conduction layer that has copper and link together through brazing technology.In addition, form though they can select technology via plurality of optional, as the embodiment that front of the present invention is described, the microcosmic opening preferably forms through the isotropism wet etching process.In addition, the quantity of a plurality of heat conduction layers and the thickness pressure that preferably is selected to the heat exchanger of optimizing microstructureization falls and resistive properties.

In still another aspect of the invention; The heat exchanger of microstructureization comprises a plurality of heat conduction layers; Each heat conduction layer comprises and passes wherein a plurality of elongated microcosmic opening that forms; Wherein a plurality of elongated microcosmic openings are aimed at and a plurality of heat conduction layer links together so that forms the HSVRM structure, and wherein interior each elongated open of first heat conduction layer is communicated with unique elongated open of any adjacent heat conduction layer.

It is identical that a plurality of elongated microcosmic openings are preferably in each heat conduction layers of a plurality of heat conduction layers.Moreover the microcosmic opening is preferably through comprising that the isotropism wet etching process that carries out on a plurality of heat conduction layers of copper forms, and uses the brazing material that comprises silver to combine through brazing technology subsequently.Preferably, the quantity of a plurality of heat conduction layers and the thickness pressure that preferably is selected to the heat exchanger of optimizing microstructureization falls and resistive properties.

Select among the embodiment of the present invention, a plurality of Window layer form through the material deposition methods of for example CVD, PVD, molecular beam epitaxial growth, sputtering sedimentation, hydatogenesis or plating, and link together with described mode.

The present invention can be used to form multiple heat exchange structure.For example, the present invention includes the structure that forms via above measure, and the heat exchange structure of instructing in following this patent application of describing in detail more.These structures include the May 15, 2003, entitled "METHODS? FORFLEXIBLE? FLUID? DELIVERY? AND? HOTSPOT? COOLING? OF? MICROCHANNELHEATSINS" with the review of U.S. Patent Application Serial No. 10/439635 teaches a heat exchange medium structure, May 16, 2003, entitled "INTERWOVEN? MANIFOLDS? FORPRESSURE? DROP? REDUCTION? IN? MICROCHANNEL? HEAT? EXCHANGERS" with the review of U.S. Patent application Serial No. 10/439912 taught in heat exchange structure , Oct. 6, 2003, entitled "METHOD? AND? APPARATUS? FOR? EFFICIENTVERTICAL? FLUID? DELIVERY? FOR? COOLING? A? HEAT? PRODUCING? DEVICE" with the review of U.S. Patent application Serial No. 10 / 680,584 taught in heat exchange structure, and July 1, 2003, entitled "MULTI-LEVEL? MICROCHANNEL? HEATEXCHANGERS" together with the review of U.S. Patent application Serial No. 10/612241 taught in heat exchange structure.

Description of drawings

Figure 1A representes to use according to embodiments of the invention the partial section of two heat conduction layers of two micro-patterns formation;

Figure 1B representes to use according to embodiments of the invention the perspective view of the heat conduction layer of two micro-patterns formation;

The perspective view of the HSVRM structure that Fig. 1 C representes to be formed by a plurality of heat conduction layers according to embodiments of the invention;

Fig. 2 A representes the decomposition view according to the micro heat exchanger of the embodiment of the invention;

Fig. 2 B representes the perspective view according to the assembling micro heat exchanger of the embodiment of the invention;

Fig. 3 A representes the top view according to the manifold layer selected of heat exchanger of the present invention;

Fig. 3 B representes to have according to the present invention the decomposition view of the heat exchanger selected that can select manifold layer;

Fig. 4 representes the perspective view according to the manifold layer that interweaves of the present invention;

Fig. 5 representes to have according to the present invention the top view of the manifold layer that interweaves of boundary layer;

Fig. 6 A representes to have along the present invention of line A-A the sectional view of the manifold layer that interweaves of boundary layer;

Fig. 6 B representes to have along the present invention of line B-B the sectional view of the manifold layer that interweaves of boundary layer;

Fig. 6 C representes to have along the present invention of line C-C the sectional view of the manifold layer that interweaves of boundary layer;

Fig. 7 A representes the decomposition view with the manifold layer that interweaves of boundary layer of the present invention;

Fig. 7 B representes the perspective view of the selected embodiment of boundary layer of the present invention;

Fig. 8 A representes the top view of selecting manifold layer according to of the present invention

Fig. 8 B representes the top view according to boundary layer of the present invention;

Fig. 8 C representes the top view according to boundary layer of the present invention;

Fig. 9 A representes the side view according to the selected embodiment of three layers of heat exchanger of the present invention;

Fig. 9 B representes the side view according to the selected embodiment of two-layer heat exchanger of the present invention;

Figure 10 A-10E representes to have according to the present invention the perspective view of the boundary layer of different miniature pin arrays;

Figure 11 representes the sectional perspective view of selecting heat exchanger according to of the present invention;

Figure 12 A representes the decomposition view according to heat exchanger of the present invention;

Figure 12 B representes the decomposition view of selecting heat exchanger according to of the present invention;

Figure 12 C representes the perspective view of selecting circulation layer according to of the present invention;

Figure 12 D representes the perspective view according to the downside of inlet layer of the present invention;

Figure 12 E representes the perspective view according to the downside of the layer of selecting to enter the mouth of the present invention;

Figure 12 F representes the perspective view according to the downside of outlet layer of the present invention;

Figure 12 G representes the perspective view of selecting the downside of outlet layer according to of the present invention;

Figure 12 H representes the sectional view according to heat exchanger of the present invention;

Figure 12 I representes the sectional view of selecting heat exchanger according to of the present invention;

Figure 13 representes to have according to the present invention the top view of the circulation layer of the entrance and exit configuration that is used for monophasic fluid stream;

Figure 14 representes to have according to the present invention the top view of the circulation layer of the entrance and exit configuration that is used for two-phase fluid stream.

The specific embodiment

The present invention describes and a kind ofly forms conducting shell and a plurality of layer is linked together so that form the method for three-dimensional micro structured region.According to the present invention, the microstructure zone comprises micro grid detection, minitype channel or some other microstructure.Figure 1A representes first embodiment in micro grid detection zone, and Fig. 2 A representes second embodiment in micro grid detection zone.Fig. 1 C representes according to embodiments of the invention formation and links together so that form a plurality of layers of minitype channel.

Figure 1A representes two Window layer 100,150 of being formed by two heat conduction layers according to the present invention.Preferably, two heat conduction layers use wet etching process to form, and wherein use the photograph instrument to confirm the position and the pattern of the microcosmic opening 120,170 of Window layer 100,150.Two Window layer comprise a plurality of abundant core bar 110,160 and the thin solid hopkinson bar 130,180 that forms microcosmic opening 120,170.

In the embodiment shown in fig. 1, the microcosmic opening 120 of Window layer 100 and the microcosmic opening 170 of Window layer 150 are configured to overlapped, make that each opening 120 in the Window layer 150 is communicated with the opening more than three 170 of Window layer 150.In this embodiment, Window layer 100 uses first micro-pattern to form, and Window layer 150 uses second micro-pattern to form.First and second micro-patterns are designed to when

layer

100 and 150 links together, form the overlapping micro grid detection structure shown in Figure 1A.

Figure 1B representes the single window layer 200 that formed by heat conduction layer according to the present invention.Layer 200 comprises first sublayer of abundant core bar 210 of the microcosmic that forms microcosmic opening 220 and thin solid hopkinson bar 230 and forms the abundant core bar 260 of microcosmic of microcosmic opening 250 and second sublayer of thin solid hopkinson bar 240.

In the embodiment shown in Figure 1B, microcosmic opening 220 is elongated with microcosmic opening 250, and forms overlappedly, makes each opening 220 be communicated with opening 250 more than three.In this embodiment, use first micro-pattern that opening 220 is formed on first side of heat conduction layer, and use second micro-pattern opening 250 to be formed on second side of the heat conduction layer that is formed with Window layer 200.In the forming process of Window layer 200, employed first and second micro-patterns are designed in single window layer 200, form the overlapping micro grid detection structure shown in Figure 1B.

Fig. 1 C representes to comprise and links together so that form the material structure 300 of microstructureization of a plurality of Window layer 310 of a plurality of high aspect ratio minitype channels 320.Each Window layer 310 comprises the zone of microstructureization, and this zone comprises abundant core bar 330 and thin solid hopkinson bar 340.When Window layer 310 was assembled into structure 300, bar 330 and 340 formed minitype channel 320.According to the present invention, the minitype channel in each Window layer 310 was aimed at before a plurality of Window layer 310 are linked together.This aligning guarantees to have desired properties by the synthetic microstructure that a plurality of heat conduction layers combine.Because aim at, minitype channel structure 320 has the aspect ratio of the quantity that depends primarily on the Window layer 310 that bonds together.

In a preferred embodiment of the invention, Window layer 310 comprises copper, and links together through brazing technology.Brazing is preferably in vacuum or for example in stove, carries out in the reducing atmosphere of forming gas or pure hydrogen.Preferably brazing realizes through the brazing material that comprises silver.Use silver, stove preferably is heated to about 850 ℃, and under this temperature, silver is diffused in the copper, forms Cu-Ag-metal complex alloys, and this alloy melting provides outstanding heat and mechanical cohesive bond property thus.

Owing to be formed on the microcosmic length ratio of the opening in the heat conduction layer, carefully control brazing technology, make brazing material not exclusively or the part occlusion of openings.Preferably, before brazing, silver is plated on the heat conduction layer, for the heat conduction layer of about 150 micron thick, silver-colored thickness about 0.25 and about 2 microns between change.

Fig. 2 A representes the decomposition view according to the micro heat exchanger 400 that the present invention includes heat conduction (HSVRM).Miniature interchanger 400 comprises lid structure 410, a plurality of Window layer 430 and the flat bed structure 440 that is connected with manifold structure 420.Manifold layer 420 is configured to distribute cooling fluid.Preferably, all parts of micro heat exchanger 400 link together through brazing.A plurality of Window layer 430 comprise microcosmic open area 435 separately.When a plurality of Window layer 430 linked together, they formed the synthetic HSVRM structure that comprises the heat conducting material that forms Window layer 430.

Lid structure 410, manifold structure 420 peaceful understructures 440 preferably with through using the money base brazing material via brazing technology Window layer 430 to be connected the HSVRM structure that forms connect.Silver is plated on and covers on structure 410, manifold structure 420 and the flat bed structure 440, its thickness about 1 and about 10 microns between.More preferably, comprise the about 1 micron silver of heat conduction layer 430 plating of HSVRM structure, and manifold structure 420, lid structure 410 and the about 4 microns silver of understructure 440 plating.At some among other the embodiment, the silver that manifold structure 420 plating are about 4 microns, and lid structure 410 peaceful understructures 440 plating not.

Preferably, after micro heat exchanger 400 assemblings, flat bed structure 440 is ground to meticulous fineness.In addition, cover in the structure 410 so that make fluid flow into the characteristic 425 of manifold structure 420 and flow into subsequently a plurality of apertures 415 of HSVRM structure except being preferably formed in, the heat exchanger that the micro heat exchanger 400 of assembling is assisted for fluid provides liquid close structure.Preferably, the fluid from outside fluid network flows out.

In a preferred embodiment of the invention, comprise that the quantity of a plurality of Window layer 430 of synthesizing the HSVRM structure and the pressure that thickness is selected to optimization micro heat exchanger 400 fall and resistive properties.

Fig. 2 B is the perspective view according to micro heat exchanger 500 of the present invention.Micro heat exchanger 500 comprises and covers structure 510, manifold structure 520, understructure 540 and a plurality of heat conduction layer 530, and each heat conduction layer has and passes a plurality of elongated microcosmic opening that wherein forms.A plurality of elongated microcosmic openings are aimed at, and a plurality of heat conduction layer links together, so that form the HSVRM structure.In addition, lid structure 510 comprises a plurality of fluid orifices 560,570, makes fluid flow through manifold structure 520 and HSVRM structure.

In an embodiment of the present invention, the Window layer shown in Figure 1A-2B preferably forms through wet etching process.Preferably, employed wet etching process is the isotropism wet etching process.Heat conduction layer comprises in the preferred embodiment of copper therein, and the technology that forms the microcosmic opening can be to connect mask chemical etching (also being known as photochemistry processing or PCM), perforation mask electron chemistry etching (also being known as the little processing of electroetching or electrochemistry) or some other suitable wet etching process.

Equally according to the present invention, the Window layer shown in Figure 1A-2B preferably have about 50 with about 250 microns thickness.In addition, be formed in the heat conduction layer in case form the microcosmic opening of Window layer preferably have about 50 and about 300 microns between size.

Will appreciate that boundary layer and manifold layer can otherwise form and make up according to the present invention.For example, Window layer can form via the technology that comprises technology based on material deposition, removes based on material and based on any of kinds of processes of the technology of material deformation.Though can use HARM technology, even each layer does not form via HARM technology, the present invention can be so that high-aspect-ratio structure be formed by Window layer.Illustrative processes is including, but not limited to laser lead plug, Laser Processing, wet etching, LIGA, photoetching, ion beam milling, chemical vapour deposition (CVD), physical vapour deposition (PVD), sputtering sedimentation, steam deposition, molecular beam epitaxial growth, electroless and electrolytic coating.Equally, can use punching press.As selection, these structures can be used the molded of metal injection-molding (MIM), plastic injection molded, other form or form through alternate manner.

According to heat exchanger of the present invention the level and smooth stream that wherein flows through coolant and hyperbranched flow pattern are provided.This structure has reduced via the load on the pump of heat exchanger pumping coolant.The method of making heat exchanger according to embodiments of the invention is relatively inexpensive.Wet etching is a chemical etching process, and preferably using is chemicals, so that form the final groove that forms stream.Compare with other device fabrication, the wet chemical use cost is low and quick.Therefore the present invention can be used for making at an easy rate and be used for cooling off the for example heat exchanger of the multiple device of the device of semiconductor processing, motor, light-emitting device, battery, processing cavity locular wall, MEMS and any generation heat.The coolant of various ways can transmit through heat exchanger, including, but not limited to the cold-producing medium of the liquid of for example water, air, other gas, steam, for example freon or can effectively absorb and any material or the combination of materials of transfer of heat.

Fig. 3 B representes to have the decomposition view of selecting three layers of heat exchanger 100 that can select manifold layer according to the present invention.Selected embodiment shown in Fig. 3 B is three layers of heat exchanger 100 that comprise boundary layer 102, at least one intermediate layer 104 and at least one manifold layer 106.As selection, as following description, heat exchanger 100 is the two-layer equipment that comprises boundary layer 102 and manifold layer 106.

Fig. 3 A representes the top view of selecting manifold layer 106 of the present invention.Particularly, shown in Fig. 3 B, manifold layer 106 comprises four sidepieces and top surface 130 and basal surface 132.But top surface 130 is removed in Fig. 3 A so that fully represent and explain the work of manifold layer 106.Shown in 3A, manifold layer 106 has series of passages or path 116,118,120,122 and forms aperture 108,109 wherein.Finger 118,120 extends through the main body of manifold layer 106 fully shown in Fig. 3 B on the Z direction.As selection,

finger

118 and 120 extends through manifold layer 106 on Z direction top, and has the opening shown in Fig. 3 A.In addition,

passage

116 and 122 parts extend through manifold layer 106.Entrance and exit passage 116, the remaining area between 120 (being denoted as 107) extend to basal surface 132 from top surface 130, and form the main body of manifold layer 106.

Shown in Fig. 3 A, fluid gets into manifold layer 106 via inlet aperture 108 and flow to from a plurality of fingers 118 of passage 116 in X and/or Y direction top set along access road 116, so that fluid is applied to the institute's favored area in the boundary layer 102.Finger 118 is configured on the different predetermined directions, so that fluid is delivered in the focus place or near regional corresponding position in the thermal source in the boundary layer 102.After this these positions in the boundary layer 102 are called the hot spot region, interface.Finger is configured to the hot spot region, interface that fixing and interim cooling changes.Shown in Fig. 3 A, passage 116,122 and finger 118,120 are arranged in manifold layer 106 on X and/or the Y direction.Therefore, the change direction of passage 116,122 and

finger

118 and 120 can delivery of fluids, so that focus in the cooling thermal source 99 and/or the pressure that reduce in the heat exchanger 100 fall.As selection, passage 116,122 and finger 118,120 periodically are arranged in the manifold layer 106, and have the such a kind of pattern of instance as shown in Figure 5.

Finger

118 and 120 configuration and size consider that the focuses in the thermal source 99 that need be cooled confirm.The position of focus and near or the amount of heat that produces at each focus place be used for constructing manifold layer 106, make finger 118,120 in boundary layer 102, be placed on the hot spot region, interface or near.Manifold layer 106 preferably makes single-phase and/or two-phase fluid be recycled to boundary layer 102, and does not make the significant pressure of heat exchanger 100 interior appearance fall.The fluid that is delivered to the hot spot region, interface forms even temperature at place, hot spot region, interface and near the zone in the thermal source of hot spot region, interface.

The size and the quantity of passage 116 and finger 118 depend on multiple factor.In one embodiment, entrance and exit finger 118,120 has identical width dimensions.As selection, entrance and exit finger 118,120 has the different widths size.The width dimensions of finger 118,120 is positioned at the scope that comprises the 0.25-0.50 millimeter.In one embodiment, entrance and exit finger 118,120 has identical length and depth dimensions.As selection, entrance and exit finger 118,120 has different length and depth dimensions.In another embodiment, entrance and exit finger 118,120 length along finger have the width dimensions of variation.The length dimension of entrance and exit finger 118,120 is comprising 0.5 millimeter in the scope of three times of the sizes of thermal source length.In addition, finger 118,120 has height or the depth dimensions in the scope that comprises the 0.25-0.5 millimeter.In addition, per minute rice is less than 10 or alternately be arranged on the manifold layer 106 greater than 30 finger.But, those skilled in the art will appreciate that the finger that in manifold layer, can consider between per minute rice 10 and 30.

Can consider that within the scope of the invention the geometry with finger 118,120 and passage 116,122 changes over acyclic configuration, to help to optimize the cooling of thermal source focus.In order on thermal source 99, to realize uniform temperature, heat is delivered to the spatial distribution of fluid and the spatial distribution coupling that heat produces.When boundary layer flowed via minitype channel 110, its temperature increased, and it begins to convert to steam under two phase states thus at fluid.Therefore, fluid expands significantly, causes speed significantly to increase thus.Usually, flow, improved the heat efficient that is delivered to fluid from boundary layer for high-speed.Therefore, can send and remove the sectional dimension of finger 118,120 and passage 116,122 and regulate the efficient that heat is delivered to fluid through regulating fluids in the heat exchanger 100.

For example, specific finger can be designed near the higher thermal source of porch heat generation.In addition, advantageously for the fluid in finger 118,120 and the passage 116,122 and steam the zone design larger cross-section that mixes appears.Though not shown, finger can be designed to begin with the small bore area in the exit, so that cause the flow at high speed of fluid.Special finger or passage also can be configured to expand into larger cross-section at the lower exit place, flow to cause than low velocity.This structure of finger or passage makes heat exchanger reduce pressure in owing to the zone that in two-phase flow, becomes steam to cause fluid volumes, acceleration and speed to increase from liquid transition to fall, and optimizes the focus cooling.

In addition, finger 118,120 and passage 116,122 can be designed to widen and narrow down along its length, so that the diverse location place in microchannel heat exchanger 100 increases fluid velocity.As selection, suitable is with finger and channel size from diminishing greatly, and repeatedly becomes again once more, so that distribute the profile adjustment heat transference efficiency according to the institute's calorific requirement on the thermal source 99.The above description that should be understood that the varying dimensions of finger and passage is equally applicable to described other embodiment, and is not limited to this embodiment.

As selection, shown in Fig. 3 A, manifold layer 106 comprises the one or more openings 119 that are positioned at inlet finger 118.In three layers of heat exchanger 100, flow to intermediate layer 104 along opening 119 along finger 118 flowing fluids.As selection, in two-layer heat exchanger 100, flow directly to boundary layer 102 along opening 119 along finger 118 flowing fluids.In addition, shown in Fig. 3 A, manifold layer 106 comprises the opening 121 that is positioned at outlet finger 120.In three layers of heat exchanger 100, the fluid of 104 outflows flows upward to outlet finger 120 along opening 121 from the intermediate layer.As selection, in two-layer heat exchanger 100, the fluid that flows out from boundary layer 102 upwards flows directly into outlet finger 120 along opening 121.

Can select among the embodiment, entrance and exit finger the 118, the 120th does not have the open channel of opening.The basal surface 103 of manifold layer 106 abuts the top surface in intermediate layer 104 or in two-layer interchanger, abuts boundary layer 102 in three layers of interchanger 100.Therefore, in three layers of heat exchanger 100, fluid freely commutes intermediate layer 104 and manifold layer 106.Fluid commutes suitable hot spot region, interface through conduit 105 and intermediate layer 104.Those of ordinary skills understand that conduit 105 directly aims at finger as following description, perhaps be positioned on other position at three-tier system.

Though Fig. 3 B representes to have the three layers of heat exchanger 100 of selecting that can select manifold layer; Heat exchanger 100 is double-layer structure alternatively; Comprising manifold layer 106 and boundary layer 102, fluid directly flows through between manifold layer 106 and boundary layer 102 thus, and without boundary layer 104.The structure that those skilled in the art will appreciate that manifold, centre and boundary layer is represented as illustration purpose, and the structure shown in being not limited to.

Shown in Fig. 3 B, intermediate layer 104 comprises a plurality of conduits 105 that extend through wherein.Inflow catheter 105 will be directed to the hot spot region, appointment interface of boundary layer 102 from the fluid that manifold layer 106 gets into.Similarly, opening 105 also is directed to discharge currents body orifice 109 with fluid from boundary layer 102.Therefore, intermediate layer 104 also provides the fluid that is delivered to discharge currents body orifice 109 from boundary layer 102, and wherein discharge currents body orifice 108 is communicated with manifold layer 106.

According to including, but not limited to the position of hot spot region, interface, for the multiple factor of abundant cooling thermal source 99 required fluid flow and fluid temperature (F.T.) in the hot spot region, interface, conduit 105 is positioned in the boundary layer 104 with predetermined pattern.Although can consider to reach other width dimensions of several millimeters, conduit has 100 microns width dimensions.In addition, according at least one described factor, conduit 105 has other size.Those skilled in the art will appreciate that each conduit 105 in the intermediate layer 104 is of similar shape and/or size, though this not necessarily.For example, the finger shown in being similar to, conduit can be used as and selectively have variation length and/or width dimensions.In addition, conduit 105 has constant depth or the height dimension that passes intermediate layer 104.As selection, conduit 105 has the varying depth size of passing intermediate layer 104, for example trapezoidal or nozzle form.Though the horizontal shape of conduit 105 is expressed as rectangle in Fig. 2 C, conduit 105 can have any other shape in addition, including, but not limited to circular (Fig. 3 A), bending, oval.As selection, one or more conduits 105 are shaped and have a part or whole profiles of described one or more fingers.

Intermediate layer 104 horizontal location in heat exchanger 100, conduit 105 perpendicular positionings wherein.As selection, locate in heat exchanger 100 on what its direction in office, including, but not limited to diagonal and curve form in intermediate layer 104.As selection, conduit 105 is positioned in intermediate layer 104 on level, diagonal, bending or any other direction.In addition, intermediate layer 104 is along the whole length horizontal-extending of heat exchanger 100, and separate boundary layer 102 with manifold layer 106 fully in intermediate layer 104 thus, so that conduit 105 is passed through in the fluid guiding.As selection, the part of heat exchanger 100 does not comprise the intermediate layer 104 between manifold layer 106 and the boundary layer 102, and fluid flows freely between it thus.In addition, intermediate layer 104 can vertically be extended between manifold layer 106 and boundary layer 102 as selecting, so that form unique interlayer region of separating.As selection, intermediate layer 104 not exclusively extends to boundary layer 102 from manifold layer 106.

Fig. 3 B representes the perspective view according to another embodiment of boundary layer 102 of the present invention.Shown in Fig. 3 B, boundary layer 102 comprises basal surface 103 and a plurality of minitype channel walls 110, and the zone between the minitype channel wall 110 guides fluid or guiding along fluid flowing path thus.Basal surface 103 is put down, and has high thermal conductivity, makes heat from thermal source 99, fully conduct.As selection, basal surface 103 comprises groove and/or the summit that is designed to collect or get rid of from ad-hoc location fluid.Minitype channel wall 110 is configured to plan-parallel structure, shown in Fig. 3 B, thus fluid between minitype channel wall 110 along flow path.

Those skilled in the art will appreciate that minitype channel wall 110 is as selecting the factor according to above description to constitute with any other appropriate structuring.For example, has groove between the section of boundary layer 102 alternatively in minitype channel wall 110, shown in Fig. 8 C.In addition, minitype channel wall 110 has the size that the pressure that reduce in the boundary layer 102 fall or differ from.Also understand and except minitype channel wall 110, also can consider any further feature, including, but not limited to flute surfaces and miniature loose structure, for example sintering metal and silicon foam body.But for purpose of explanation, the parallel minitype channel wall 110 shown in Fig. 3 B is used for describing boundary layer 102 of the present invention.As selection, minitype channel wall 110 has uneven structure.

Minitype channel wall 110 makes fluid carry out heat exchange along the selected hotspot location of hot spot region, interface, so that at this position cooling thermal source 99.According to power and the spot size and the heat flux density that comes from thermal source of thermal source 99, minitype channel wall 110 has at the width dimensions of 20-300 micrometer range and the height dimension in 100 microns to 1 millimeter scopes.As selection, can consider any other minitype channel wall size.Though can consider any other size of separation scope, according to the power of thermal source 99, minitype channel wall 110 separates the size of separation scope of 50-500 micron.

Refer back to the assembly of Fig. 3 B, the top surface of manifold layer 106 is cutd open so that represent passage 116,122 and the finger 118,120 in manifold layer 106 main bodys.The thermal source 99 interior positions that produce more heats refer to focus here, and the positions that produce less heat thus in the thermal source 99 refer to warm spot here.Shown in Fig. 3 B, thermal source 99 is shown in A place, position and has the hot spot region, and the B place has the warm spot zone in the position.Zone in abutting connection with the boundary layer 102 of focus and warm spot correspondingly refers to the hot spot region, interface.Shown in Fig. 3 B, boundary layer 102 comprises hot spot region, the interface A that is positioned on the A of position and is positioned at hot spot region, the interface B on the B of position.

Shown in Fig. 3 A and 3B, fluid begins to get into heat exchanger 100 via an inlet aperture 108.Fluid then flows to an access road 116.As selection, heat exchanger 100 comprises more than one access road 116.Shown in Fig. 3 A and 3B, 108 flowing fluids begin to be branched off into finger 118D from the inlet aperture along access road 116.In addition, the fluid that continues along other part of access road 116 flows to

independent finger

118B and 118C etc.

In Fig. 3 B, travel permit is fed to hot spot region, interface A through flowing to finger 118A, and fluid is downward through finger 118A to the intermediate layer 104 thus.Fluid then flows through the access road 105A that is positioned under the finger 118A to boundary layer 102, and fluid and thermal source 99 carry out heat exchange thus.As stated, the minitype channel in the boundary layer 102 can be gone up structure in any direction.Therefore, the minitype channel 111 in the interface zone A is perpendicular to other minitype channel 110 location in the boundary layer 102.Therefore, though fluid flows on other direction along other zone of boundary layer 102, the fluid that comes from conduit 105A flows along minitype channel 111, shown in Fig. 3 B.Heated fluid then upwards flows through conduit 105B to outlet finger 120A.

Similarly, fluid is downward through

finger

118E and 118F to the intermediate layer 104 on the Z direction.Fluid then is downward through access road 105C to boundary layer 102 on the Z direction.Heated fluid then upwards flows through delivery channel 105D to outlet finger 120E and 120F from boundary layer 102 on the Z direction.Heat exchanger 100 exports finger 120 thus and is communicated with exit passageway 122 via the fluid that is heated in the outlet finger 120 removal intermediate layers 106.Exit passageway 122 makes fluid flow out from heat exchanger via an outlet aperture 109.

Preferably flow into and flow out conduit 105 and equally directly or almost directly be positioned on the hot spot region, suitable interface, so that fluid is applied directly on the focus in the thermal source 99.In addition, for the specific interface hot spot region, each outlet finger 120 is configured to locate near the finger 118 that enters the mouth separately, so that the pressure that reduces wherein falls.Therefore, leaving boundary layer 102 before the outlet finger 120A, fluid gets into boundary layer 102 and flows through minimum distance along the basal surface 103 of boundary layer 102 via inlet finger 118A.Should be understood that fluid is enough to remove the heat that thermal source 99 produces along a said segment distance of basal surface 103 operations, the pressure of aequum falls and do not produce not.In addition, shown in Fig. 3 A and 3B, the turning in the finger 118,120 is crooked to fall along the pressure that finger 118 flows so that reduce fluid.

The structure that those skilled in the art will appreciate that the manifold layer 106 shown in Fig. 3 A and the 3B is exemplary.The passage 116 in the manifold layer 106 and the structure of finger 118 depend on multiple factor, including, but not limited to the position of hot spot region, interface, the heat that produces of the amount of flow that commutes the hot spot region, interface and hot spot region, interface endogenous pyrogen.For example, a kind of possible structure of manifold layer 106 comprises along the global pattern of the parallel entrance and exit finger of the width arranged alternate of manifold layer, shown in Fig. 4-7A and as follows, describes.In addition, can consider any other structure of passage 116 and finger 118.

Fig. 4 representes the perspective view according to the manifold layer selected 406 of heat exchanger of the present invention.Manifold layer 406 among Fig. 4 comprises a plurality of interweaving or crosslinked parallel fluid finger 411,412, and these fingers make single-phase and/or two-phase fluid is recycled to boundary layer 402, and does not make the significant pressure of heat exchanger 400 interior appearance fall.As shown in Figure 8, inlet finger 411 and outlet finger 412 alternate configurations.But, those skilled in the art will appreciate that the inlet of some or outlet finger can be each other near the location, and be not limited to alternate configuration shown in Figure 4 thus.In addition, finger can be used as and selects to be designed to make parallel finger from another parallel finger branch or connect on it.Therefore, can so that the inlet finger more than the outlet finger, and vice versa.

The fluid that inlet finger or path 411 will get into heat exchanger is fed to boundary layer 402, and outlet finger or path 412 be from boundary layer 402 removal fluids, and fluid then leaves heat exchanger 400.Structure shown in the manifold layer 406 makes fluid get into boundary layer 402 and before getting into exit passageway 412, in boundary layer 402, moves very short distance.Fluid significantly reduces to make pressure in the heat exchanger 400 to fall significantly to reduce along the length of boundary layer 402 operation.

Shown in Fig. 4-5, comprise as the manifold layer of selecting 406 being communicated with two entries 411 and the path 414 of fluid being provided for it.Shown in Fig. 8-9, manifold layer 406 comprises three exit passageways 412 that are communicated with path 418.Path 414 in the manifold layer 406 has the flat bottom surface that fluid is directed to finger 411,412.As selection, path 414 has the gradient slightly that helps fluid is directed to selected fluid passage 411.As selection, access road 414 comprises the one or more openings that are positioned at its basal surface, makes the part of fluid flow down to boundary layer 402.Similarly, the path 418 in the manifold layer has the flat bottom surface that comprises fluid and fluid is directed to aperture 408.As selection, path 418 has the gradient slightly that helps fluid is directed to selected outlet aperture 408.In addition, though can selectively consider any other width dimensions, path 411,418 has about 2 millimeters width dimensions.

Path 411,418 is communicated with aperture 408,409, and the aperture is connected on the fluid line in the cooling system thus.Manifold layer 406 comprises the fluid orifice 408,409 of horizontal tectonics.As selection, manifold layer 406 comprises fluid orifice 408,409 vertical and/or the diagonal structure, like following description, though not shown in Fig. 4-7.As selection, manifold layer 406 does not comprise path 414.Therefore, fluid directly 408 is fed to finger 418 from the aperture.Moreover manifold layer 411 is as selecting not comprise path 418, and the fluid in the finger 412 is via aperture 408 direct outflow heat exchangers 400 thus.Though be apparent that two apertures 408 are expressed as being communicated with path 414,418,, can utilize any amount of aperture as selection.

Entry 411 has the size that makes fluid run to boundary layer, falls and do not produce big pressure along path 411.Though can consider any other width dimensions as selecting, entry 411 has the size that comprises 0.25-5 millimeter scope.In addition, entry 411 has and comprises 0.5 millimeter length dimension in the scope of the triple scale of thermal source length cun.As selection, can consider other length dimension.In addition, entry 411 is to extending below or slightly on the height of minitype channel 411, making fluid directly be directed to minitype channel 410.Access road 411 has the height dimension in the scope that comprises the 0.25-0.5 millimeter.Those skilled in the art will appreciate that path 411 does not extend downwardly into minitype channel 410, and as selecting to consider any other height dimension.Have identical size though those skilled in the art will appreciate that entry 411, can consider that entry 411 is of different sizes as selecting.In addition, entry 411 is as the distance between width, sectional dimension and/or the adjacent finger of selecting to have variation.Particularly, path 411 has the bigger width or the degree of depth, and has the zone of the narrower width and the degree of depth along its length.The size that changes makes that more the multithread body is delivered to the predetermined interface hot spot region in the boundary layer 402 via wider portion, limits simultaneously via narrow part and flow to hot spot region, warm spot interface.

In addition, exit passageway 412 has the size that makes fluid run to boundary layer and do not fall along the big pressure of path 412 generations.Though can consider any other width dimensions as selecting, exit passageway 412 comprises the size of 0.25-5 millimeter scope.In addition, exit passageway 412 has and comprises 0.5 millimeter length dimension in the scope of three times of the sizes of thermal source length.In addition, exit passageway 412 extends downwardly into the height of minitype channel 410, after minitype channel 410 bottom horizontal flow sheet, make fluid easily in exit passageway 412 on flow.Though as selecting to consider any other height, access road 411 has the height dimension in the scope that comprises the 0.25-5.0 millimeter.Though those of ordinary skills understand exit passageway 412 and have identical size, can consider as selecting exit passageway 412 to be of different sizes.Moreover access road 412 can have the distance between varying width, sectional dimension and/or the adjacent finger as selecting.

Entrance and exit path 411,412 is by disjunction and be separated from each other, and shown in Figure 4 and 5, the fluid in the path does not mix thus.Particularly, as shown in Figure 8, two exit passageways are along the outward flange location of manifold layer 406, and exit passageway 412 is positioned at the centre of manifold layer 406.In addition, two entries 411 are configured to be positioned on the sides adjacent of central exit path 412.This particular configuration causes the fluid short distance of operation in boundary layer 402 before flowing out boundary layer 402 via exit passageway 412 that gets into boundary layer 402.But, those skilled in the art will appreciate that entry and exit passageway with any other appropriate structuring location, and be not limited to shown in this disclosure thus and the structure of describing.The quantity of entrance and exit finger 411,412 in manifold layer 406 greater than three, and on manifold layer 406 less than 10 in per minute rice.Those of ordinary skills also understand the entry and the exit passageway that can use other quantity, and are not limited to the quantity of describing and representing in this disclosure thus.

Manifold layer 406 is connected on the (not shown) of intermediate layer, and the intermediate layer (not shown) is connected on the boundary layer 402 thus, so that form three layers of heat exchanger 400.Intermediate layer described herein reference in the embodiment shown in Fig. 3 B.Intermediate layer 406 is connected on the boundary layer 402 and is positioned on the boundary layer 402 as selecting, so that form two-layer heat exchanger 400, shown in Fig. 7 A.Fig. 6 A-6C is illustrated in the schematic cross-section that is connected the manifold layer selected 406 on the boundary layer 402 in the two-layer heat exchanger.Particularly, Fig. 6 A representes along the sectional view of the heat exchanger 400 of the line A-A intercepting of Fig. 5.In addition, Fig. 6 B representes along the sectional view of the heat exchanger 400 of line B-B intercepting, and Fig. 6 C representes along the sectional view of the heat exchanger 400 of the line C-C intercepting of Fig. 5.As stated, entrance and exit path 411,412 top surfaces from manifold layer 406 extend to basal surface.When manifold layer 406 and boundary layer 402 interconnect, entrance and

exit path

411 and 412 in boundary layer 402, be positioned at the height place of minitype channel 410 or slightly more than the position on.The fluid that this structure causes fluid to come from entry 411 flows through micro channels 410 from path 411 easily.In addition, this structure causes the fluid that flows through minitype channel after flowing through minitype channel 410, upwards to flow through entry 412 easily.

Can select among the embodiment, though not shown in figures, intermediate layer 104 (Fig. 3 B) is positioned between manifold layer 406 and the boundary layer 402.Intermediate layer 104 (Fig. 3 B) is directed to the hot spot region, appointment interface in the boundary layer 402 with fluid.In addition, it is mobile that intermediate layer 104 (Fig. 3 B) can be used to provide the homogeneous (uniform) fluid that gets into boundary layer 402.Equally, intermediate layer 104 is used for fluid is offered the hot spot region, interface in the boundary layer 402 so that fully cool off focus, and in thermal source 99 the formation temperature uniformity.Entrance and

exit path

411 and 412 is located near focus or on focus in thermal source 99, so that fully cool off focus, though this not necessarily.

Fig. 7 A representes to have the decomposition view of selecting the manifold layer 406 of boundary layer 102 of the present invention.Boundary layer 102 comprises the continuous configuration of minitype channel wall 110, shown in Fig. 3 B.In overall operation, be similar to the manifold layer 106 shown in Fig. 3 B, fluid gets into manifold layer 406 at fluid bore 408 places, and through path 414 and towards fluid finger or path 411 operations.Fluid gets into the opening of inlet finger 411 and on directions X, shown in arrow, flows through the length of finger 411.In addition, fluid is flowing to the boundary layer 402 that is positioned under the manifold layer 406 downwards on the Z direction.Shown in Fig. 7 A, the fluid in the boundary layer 402 moves on the X of boundary layer 402 and Y direction along basal surface, and carries out heat exchange with thermal source 99.Through on the Z direction, upwards flowing via outlet finger 412, heated fluid leaves boundary layer 402, exports finger 412 thus heated fluid is directed to the path 418 in the manifold layer 406 on directions X.Fluid then flows and leaves heat exchanger through tap hole 409 along path 418.

Boundary layer comprises a series of grooves 416 that are arranged between many group minitype channels 410 shown in Fig. 7 A, help to guide fluid to commute path 411,412.Particularly, groove 416A is located immediately under the entry 411 that replaces manifold layer 406, and the fluid that gets into boundary layers 402 via entry 411 thus directly is directed to the minitype channel near groove 416A.Therefore, groove 416A makes fluid directly be directed to specific appointment stream from entry 411, and is as shown in Figure 5.Similarly, boundary layer 402 is included in the groove 416B that directly is positioned on the Z direction under the exit passageway 412.Therefore, the fluid along minitype channel 410 towards the exit passageway bottom horizontal flow sheet is directed to groove 416B and is arrived the exit passageway 412 on the groove 416B by vertical guide by level.

Fig. 6 A representes to have the sectional view of the heat exchanger 400 of manifold layer 406 and boundary layer 402.Particularly, Fig. 6 A representes the entry 411 that interweaves with exit passageway 412, and fluid upwards flows downwards and along exit passageway 412 along entry 411 thus.In addition, shown in Fig. 6 A, fluid levels flows through to be arranged between entry and the exit passageway and through groove 416A and 146B and divides the minitype channel wall of opening 410.As selection, the minitype channel wall is continuous (Fig. 3 B), and does not open in 410 minutes through minitype channel.Shown in Fig. 6 A, entrance and exit path 411 and one of 412 or both be in its place, end in position and have curved surface 420 near groove 416.Curved surface 420 will flow towards the minitype channel 410 near path 411 along the fluid that path 411 flows downward.Therefore, the fluid that gets into boundary layer 102 guides towards minitype channel 410 more easily, rather than flows directly to groove 416A.Similarly, the curved surface 420 in the exit passageway 412 helps fluid is directed to exit passageway 412 from minitype channel 410.

In alternate embodiments, shown in Fig. 7 B, boundary layer 402 ' comprises the entry of describing with reference to manifold layer 406 411 ' and exit passageway 412 ' (Fig. 8-9).In alternate embodiments, fluid directly 408 ' is fed to boundary layer 402 ' from the aperture.Fluid 411 ' flows along path 414 ' towards entry.Fluid then is horizontally through along minitype channel 410 ' in groups, and carries out heat exchange with the thermal source (not shown), and flows to exit passageway 412 '.Fluid then flows to path 418 ' along exit passageway 412 ', and fluid leaves boundary layer 402 ' via aperture 409 ' thus.Aperture 408 ', 409 ' is configured in the boundary layer 402 ', and selectively is configured in the manifold layer 406 (Fig. 7 A).

Be expressed as levels operation though those skilled in the art will appreciate that all heat exchangers of the present invention, heat exchanger is selectively operated on the upright position.Though on the upright position, operate, heat exchanger is selectively constructed, and makes each entry be positioned on the adjacent exit passageway.Therefore, fluid gets into boundary layer and is directed to exit passageway naturally via entry.Any other structure that understands manifold layer and boundary layer equally can be used for making heat exchanger on the upright position, to operate selectively.

Fig. 8 A-8C representes the top view according to another selected embodiment of heat exchanger of the present invention.Particularly, Fig. 8 A representes the top view of selecting manifold layer 206 according to of the present invention.Fig. 8 B and 8C represent the top view of intermediate layer 204 and boundary layer 202.In addition, Fig. 9 A representes to utilize three layers of heat exchanger can selecting manifold layer 206, and 9B representes to utilize the two-layer heat exchanger that can select manifold layer 206.

Shown in Fig. 8 A and 9A, manifold layer 206 comprises a plurality of fluid orifices 208 of level and vertical configuration.As selection, fluid orifice 208 is with respect to manifold layer 206 diagonal location or with any other direction location.Fluid orifice 208 is placed on the selected location in manifold layer 206, so that effectively fluid is delivered to the predetermined interface hot spot region in the heat exchanger 200.A plurality of fluid orifices 208 provide significant advantage, and this is because fluid can directly be delivered to the specific interface hot spot region from fluid orifice, significantly is not increased on the heat exchanger 200 and pressure is not fallen.In addition, fluid orifice 208 also is positioned in the manifold layer 206, makes that the minimum distance of fluid operation in the hot spot region, interface arrives delivery port 208, makes fluid realize temperature homogeneity, between entrance and exit aperture 208, keeps the minimum pressure drop simultaneously.In addition, use manifold layer 206 to help in heat exchanger 200, to stablize two-phase flow, and equally distributed uniformity flow on the boundary layer 202.Should be noted that more than one manifold layer 206 selectively is included in the heat exchanger 200, manifold layer 206 guiding fluids commute heat exchanger 200 thus, and another manifold layer (not shown) control fluid is recycled to the speed of heat exchanger 200.As selection, a plurality of manifold layer 206 all are recycled to the hot spot region, selected corresponding interface in the boundary layer 202 with fluid.

Selectable manifold layer 206 has the lateral dimension with the size close match of boundary layer 202.In addition, manifold layer 206 has the size identical with thermal source 99.As selection, manifold layer 206 is greater than thermal source 99.The vertical dimension of manifold layer 26 is in 0.1 and 10 millimeter scope.In addition, the opening of the reception fluid orifice 208 in the manifold layer 206 is in 1 millimeter scope with the whole width of thermal source 99 or length.

Figure 10 A representes the perspective view according to the embodiment of boundary layer 302 of the present invention.Shown in Figure 10 A, boundary layer 302 comprises the basal surface 301 upwardly extending a series of columns 303 from boundary layer 302.In addition, Figure 10 A representes to be arranged in the miniature loose structure 301 on the basal surface of boundary layer 302.Will appreciate that the combination that boundary layer 302 can include only miniature loose structure 301 and have the miniature loose structure of any other boundary layer characteristic (for example minitype channel, column etc.).

Boundary layer 302 comprises column 303 rather than minitype channel, this be since the fluid that comes from the opening that enter the mouth flow to manifold layer 302 interior around exit opening (Figure 12 A).Will be below describe in detail more, Open Side Down flows to boundary layer 302 via a series of inlets for fluid, and fluid then leaves boundary layer 302 via a series of exit openings that separate optimum distance with the inlet opening thus.In other words, fluid leaves each inlet opening towards hithermost exit opening.In this embodiment, each inlet opening surrounds through exit opening.Therefore, get into boundary layer 302 fluid will towards around the direction of exit opening on flow.Therefore, the columns 303 in the boundary layer 302 hold the enough heats that are delivered to fluid, and make fluid stand minimum pressure to fall, flow to exit opening from the inlet opening simultaneously.

Boundary layer 302 comprises from the vertical height that extend and contact with the basal surface of manifold layer of basal surface 301 and the closely spaced array of narrow column 303.As selection, column 303 does not contact the basal surface of manifold layer.In addition, at least one column 303 selectively extends with an angle with respect to the basal surface 301 of boundary layer 302.Column 303 also can be equally spaced each other along boundary layer 302, makes that the capacity of heat transmission of boundary layer 302 is uniform on its basal surface 301.As selection, column 303 is not equally spaced shown in Figure 10 B, and wherein the column 303 in the middle of the boundary layer 203 is more farther at interval than the column 303 at edge.Column 303 separates according to the size and the position of the flow resistance of the size of thermal source 99, fluid and focus and the heat flux density that comes from thermal source 99.For example, more low-density column 303 will provide less resistance for flowing, but it is less with the heat conducting surface area of fluid to be used for boundary layer 302 equally.The structure that should be noted that the column 303 that the aperiodicity shown in Figure 10 B embodiment separates is not limited to this, and can come with any other arrangement according to the situation of thermal source and the action required of cooling system.

In addition, column 303 is circular columns preferably, shown in Figure 10 A, makes fluid flow to exit opening from the inlet opening with minimum drag.But, column 303 as select to have including, but not limited to square 303B (Figure 10 B), rhombus, oval 303C (Figure 10 C), hexagon 303D (Figure 10 D) or any other shape shape.In addition, boundary layer 302 is as the combination of selecting to have along basal surface 301 differing formed column.

For example, shown in Figure 10 E, boundary layer 302 is included in many groups rectangular fin 303E of mutual radial arrangement in its each group.In addition, boundary layer 302 comprises and is arranged in a plurality of column 303B between the rectangular fin 303E in groups.In one embodiment, the open border circular areas in the rectangular fin 303E of radial arrangement is placed under each inlet opening, and fin 303E helps fluid is directed to exit opening thus.Therefore, radially-arranged fin 303E helps to reduce pressure and falls, and makes cooling fluid on boundary layer 302, almost evenly distribute simultaneously.According to the size and the relative position of entrance and exit opening, having the many of column and/or fin possibly construct, and the selection of the best configuration of boundary layer 302 depends on whether fluid is single-phase flowing or the two-phase flow situation.The structure that those skilled in the art will appreciate that multiple pin 303 can combine with any embodiment described herein and modification thereof.

Figure 11 representes to have the sectional perspective view of selecting three layers of heat exchanger 200 of manifold layer 200 according to of the present invention.Shown in figure 11, according to the heat that the main body along thermal source 99 produces, heat exchanger 200 is divided into separate areas.Minitype channel wall construction in zone passage vertical centering control interbed of cutting apart 204 and/or the boundary layer 202 was opened in 210 minutes.But, those skilled in the art will appreciate that assembly shown in Figure 11 structure shown in being not limited to, and be for purpose of explanation.Heat exchanger 200 is connected on one or more pumps, and a pump is connected on the inlet 208A thus, and another pump is connected on the inlet 208B.

As shown in Figure 3, thermal source 99 is focus and the warm spots in the B of position in the A of position, and the focus in the A of position produces than the warm spot in the B of position and more manys heat thus.Should be understood that thermal source 99 is alternatively in having more than one focus and warm spot any preset time.In this example; Because position A is a focus; And the more heats in the A of position are delivered to the boundary layer 202 on the position A (among Figure 11 as hot spot region, interface A); More the flow of liquid of multithread body and/or fair speed offers hot spot region, the interface A in the heat exchanger 200, so that abundant cool position A.Be expressed as greater than hot spot region, interface A though should be understood that hot spot region, interface B, any other hot spot region, interface in hot spot region, interface A and B and the heat exchanger 200 can have virtually any size and/or structure each other.

As selection, shown in figure 11, the fluid that gets into heat exchanger via fluid orifice 208A is through 204 flowing to inflow catheter 205A and be directed to hot spot region, interface A along the intermediate layer.Fluid then flows down on the Z direction in hot spot region, the interface A of boundary layer 202 along inflow catheter 205A.Fluid flows between minitype channel 210A, and the heat that comes from position A thus is delivered on the fluid through the conduction with boundary layer 202.Heated fluid leaves heat exchanger 200 along boundary layer 202 towards fluid in the A of hot spot region, interface delivery port 209A flows.Those skilled in the art will appreciate that any amount of inlet aperture 208 and delivery port 209 can be used for a specific interface hot spot region or a class boundary face hot spot region.In addition, though delivery port 209A is expressed as near boundary layer 202A, delivery port 209A can be vertically located on any other position, on manifold layer 209B as selecting.

Similarly, in instance shown in Figure 11, thermal source 99 has warm spot at the B place, position that generation is less than the position A heat of thermal source 99.The fluid that gets into aperture 208B is through 204B flow to flow ipe 205B and is directed to hot spot region, interface B along the intermediate layer.Fluid then flows down to hot spot region, the interface B of boundary layer 202 on the Z direction along inflow catheter 205B.Fluid flows between minitype channel 210 on X and Y direction, is delivered to fluid through the thermal source heat that B produces in the position thus.Heated fluid upwards flow to delivery port 209B via the outflow conduit 205B in the intermediate layer 204 along whole interface layer 202B on the Z direction in the B of hot spot region, interface, fluid leaves heat exchanger 200 thus.

As selection, shown in Fig. 9 A, heat exchanger 200 can comprise the film 214 that is positioned at the Tou Guoed steam on the boundary layer 202 as selecting.The film 214 that can see through steam contacts with the madial wall sealing of heat exchanger 200.Film configuration becomes to have a plurality of little openings, and the feasible steam that produces along boundary layer 202 is through wherein arriving aperture 209.Film 214 also is configured to hydrophobic, flows through the opening of film 214 along boundary layer 202 so that prevent liquid fluid.Can see through among the U. S. application sequence number NO.10/366128 of more details in the together examination of submitting on February 12nd, 2003 that is entitled as " VAPORESCAPE MICROCHANNEL HEAT EXCHANGER " of film 114 of steam and describe, this patent is hereby expressly incorporated by reference.

Figure 12 A representes the decomposition view according to heat exchanger 300 of the present invention.Figure 12 B representes the decomposition view of selecting heat exchanger 300 ' according to of the present invention.Shown in Figure 12 A and 12B, heat exchanger 300,300 ' comprises boundary layer 302,302 ' and connect manifold layer 306, the 306' on it.As stated, heat exchanger 300,300 ' is connected on the thermal source (not shown), perhaps (for example is embedded in the microprocessor) as selecting to be combined in fully in the thermal source.Those skilled in the art will appreciate that boundary layer 302,302 ' roughly is closed, and only for purpose of explanation, in Figure 12 A, be expressed as exposing.Preferably boundary layer 302,302 ' comprises a plurality of columns 303 of arranging along basal surface 301.In addition, column 303 has Any shape and/or the radially-arranged fin 303E as describing with reference to figure 10A-10E as selecting.Moreover boundary layer 302 is as selecting to have aforesaid any other characteristic (for example minitype channel, rough surface).Structure in boundary layer 302 and the layer 302 also preferably has aforesaid identical heat-conductive characteristic, and no longer describes.Though boundary layer 302 is expressed as more less than manifold layer 306, those skilled in the art will appreciate that boundary layer 302 and manifold layer 306 can be any other sizes each other and with respect to thermal source 99.Boundary layer 302,302 ' further feature have the performance identical with aforesaid boundary layer, and will not describe in detail more.

Usually, use and to send passage 322 in the manifold layer 306, the pressure that heat exchanger 300 reduces in the heat exchanger falls.Send passage 322 and be vertically located in the manifold layer 306, and fluid is vertically offered boundary layer 302, so that the pressure that reduces in the heat exchanger 300 falls.As stated, reach significant time and/or distance because fluid flows on X and Y direction along boundary layer, pressure falls and in heat exchanger 300, forms or increase.Through fluid vertically is urged to boundary layer 302, manifold layer 306 reduces flowing on X and the Y direction via a plurality of passages 322 of sending.In other words, a plurality of independent jet of fluid is applied directly on the boundary layer 302 from the top.Send passage 322 and be positioned on the optimum distance spaced apart from each other, make fluid on X and Y direction and upwards perpendicular flow leave boundary layer 302.Therefore, the power of independent stream of leaving the passage 322 of best located causes fluid in stream upwards, to flow naturally and leaves boundary layer 302.In addition, individual passage 322 makes a plurality of passages 322 interior mobile differentiation of fluids in the boundary layer 302 maximize, and the pressure that reduces thus in the heat exchanger 300 falls, and the while is cooled off thermal source 99 effectively.In addition, the structure of heat exchanger 300 makes heat exchanger 300 have littler size than other heat exchanger, and this is owing to fluid need not flow big distance so that fully cool off thermal source 99 on X and Y direction.

Manifold layer 306 shown in Figure 12 A comprises two independent layers.Particularly, manifold layer 306 comprises layer 308 and layer 312.Layer 308 is connected on boundary layer 302 and the layer 312.Though Figure 12 presentation layer 312 is positioned on the layer 308, those skilled in the art will appreciate that layer 308 selectively is positioned on the layer 312.Those skilled in the art will appreciate that equally according to the present invention and can adopt any amount of layer selectively.

Selectable manifold layer 306 ' shown in Figure 12 B comprises three individual courses.Particularly, manifold layer 306 ' comprises circulation layer 304 ', layer 308 ' and layer 312 '.Circulation layer 304 ' is connected on boundary layer 302 ' and the layer 308 '.Layer 308 ' is connected on circulation layer 304 ' and the layer 312 '.Though Figure 12 B presentation layer 312 ' is positioned on the layer 308 ', those skilled in the art will appreciate that layer 308 ' selectively is positioned on the layer 312 '.Those skilled in the art will appreciate that equally according to the present invention and selectively adopt any amount of layer.

Figure 12 C representes the perspective view according to circulation layer 304 ' of the present invention.Circulation layer 304 ' comprises top surface 304A ' and basal surface 304B '.Shown in Figure 12 B and 12C, circulation layer 304 ' comprises a plurality of openings 322 ' that extend through wherein.In one embodiment, the opening of opening 322 ' is concordant with basal surface 340B '.As selection, opening 322 ' extends beyond basal surface 304B ', so that fluid more closely is applied on the boundary layer 302 '.In addition, circulation layer 304 ' comprises a plurality of openings 324 ' that extend to basal surface 304B ' and on the Z direction, vertically stretch out preset distance as cylindrical projection from top surface 304A'.Those skilled in the art will appreciate that opening 322 ', 324 ' can extend through circulation layer with an angle selectively, and do not need vertical fully.As stated, in one embodiment, boundary layer 302 ' (Figure 12 B) is connected on the basal surface 304B ' of circulation layer 304 '.Therefore, fluid gets into boundary layer 320 ' and gets into boundary layer 302' through only on the Z direction, flowing through opening 322 ', and through only on the Z direction, flowing through opening 324 ' leaves boundary layer 302 '.As following description, the fluid that gets into boundary layer 302 ' via opening 322 ' keeps and separates via the fluid that opening 324 ' leaves boundary layer 302 ' through circulation layer 304 '.

Shown in Figure 12 C, the part of opening 324 ' preferably has the cylindrical member that on the Z direction, extends from basal surface 304A ' from circulation layer 304 ', makes fluid flow through opening 324 ' and directly arrives the corridor 326 ' (Figure 12 F and 12G) in the layer 312 '.Preferably, cylindrical projection is circular shown in Figure 12 C, but can have other shape as selecting.But along boundary layer 302 ', fluid flows to adjacent apertures 324 ' from each opening 322 ' in horizontal and vertical direction.Preferably opening 322 ' and opening 324 ' are heat insulation each other makes that coming from the heat that is heated fluid that leaves boundary layer 302 ' via manifold layer 306 ' does not diffuse into via manifold layer 306 ' and flow in the fluid of the cooling on the boundary layer 302 '.

Figure 12 D representes the embodiment according to layer 308 of the present invention.Shown in Figure 12 D, layer 308 comprises top surface 308A and basal surface 308B.Preferably, the basal surface 308B of layer 308 is directly connected on the boundary layer 302, shown in Figure 12 A.Layer 308 comprises having the recessed corridor 320 that a plurality of fluids are sent passage 322, and passage 322 preferably is delivered to boundary layer 302 with fluid.Recessed corridor 320 contact with boundary layer 302 sealings, and the fluid that wherein leaves boundary layer 302 is 320 interior passages 302 and mobile between passage 302 around the corridor, and leaves via aperture 314.Should be noted that the fluid that leaves boundary layer 302 does not get into sends passage 322.

Figure 12 E representes the perspective view according to the downside of the selected embodiment of layer 308 ' of the present invention.Layer 308 ' comprises top surface 308A ' and basal surface 308B ', and the basal surface of layer 308B ' directly is connected circulation layer 304 ' and goes up (Figure 12 C) thus.Layer 308 ' preferably includes aperture 314 ', corridor 320 ' and a plurality of openings 322 ', 324 ' in basal surface 308B '.Those skilled in the art will appreciate that layer 308 ' comprises any amount of aperture and corridor.Opening 322 ', 324 ' in Figure 12 E is configured to towards circulation layer 304 '.Particularly, shown in Figure 12 E, the fluid guiding that opening 322 ' will get into corridor 320 ' flows into boundary layer 302 ', and opening 324 ' is directed to layer 312 ' with fluid from boundary layer.Opening 324 ' extends through the corridor 320 ' in the layer 308 ' fully.Opening 324' be separately with separate, make flow through opening 324 ' fluid not with flow through the fluid mixing relevant or contact with the post of opening 324 '.Opening 324 ' also can be independent, so that the fluid of guaranteeing to flow through each opening 324 ' is along the flow path that provides through opening 324 '.Preferably, opening 324 ' vertical configuration.Therefore, fluid is by the major part of vertical guide through manifold layer 306 '.Should be understood that this is applicable to opening 322 ', particularly be positioned under the situation between boundary layer and this layer at layer.

Though opening or hole 322 are illustrated as having same size, opening 322 can have the diameter of difference or variation along length.For example, more the hole 322 near aperture 314 can have than minor diameter, so that fluid is wherein flow through in restriction.Less hole 322 therefore force fluid along flowing downward away from the opening 322 in aperture 314 more.This vary in diameter in hole 322 makes the fluid that gets into boundary layer 302 more evenly distribute.The diameter that those skilled in the art will appreciate that hole 322 can change as selecting, so that in the known interface hot spot region of boundary layer 302, cool off.Those skilled in the art will appreciate that above description is applicable to opening 324 ', the change in size of opening 324 ' or change thus is so that be applicable to the even effluent that comes from boundary layer 302.

In one embodiment, aperture 314 offers layer 308 and boundary layer 302 with fluid.Aperture 314 in Figure 12 D preferably extends to corridor 320 via the part of the main body of layer 308 from top surface 308A.As selection, aperture 314 extends to corridor 320 from the side or the bottom of layer 308.Preferably aperture 314 is connected on the aperture 315 in the layer 312 (Figure 12 A-12B).Corridor 320 is led in aperture 314, and the corridor is sealed shown in Figure 12 C, and is perhaps recessed shown in Figure 12 D.Corridor 320 preferably is used for fluid is directed to aperture 314 from boundary layer 302.As selection, corridor 320 314 is directed to boundary layer 302 with fluid from the aperture.

Shown in Figure 12 F and 12G, the aperture 315 in the layer 312 is preferably aimed at aperture 314 and is communicated with.With respect to Figure 12 A, fluid preferably gets into heat exchangers 300 via aperture 316, and flows through corridor 328 down to sending passage 322 in the layer 308, arrives boundary layer 302 gradually.With respect to Figure 12 B, fluid can be used as and selectively gets into heat exchanger 300 ', gets into via aperture 315 ', and flows through the aperture 314 ' in the layer 308 ', and arrive boundary layer 302 ' gradually.Aperture 315 in Figure 12 F is preferably from the main body of top surface 312A extend past layer 312.As selection, extend from layer 312 1 side in aperture 315.As selection, layer 312 does not comprise aperture 315, and fluid gets into heat exchanger 300 (12D and 12E) via aperture 314 thus.In addition, layer 312 comprises the aperture 316 that preferably fluid is directed to corridor 328 '.Those skilled in the art will appreciate that layer comprises any amount of aperture and corridor.Corridor 328 preferably is directed to fluid and sends passage 322 and arrive boundary layer 302 gradually.

Figure 12 G representes the perspective underside view according to the selected embodiment of layer 312 ' of the present invention.Layer 312 ' is preferably in and is connected among Figure 12 E on the layer 308 '.Shown in Figure 12 F, layer 312 ' comprises in main body along the zone, recessed corridor 328 ' that basal surface 312B exposes.Recessed corridor 328 ' is communicated with aperture 316 ', and fluid directly flows to aperture 316 ' from recessed corridor 328 ' thus.Recessed corridor 328 ' is positioned on the top surface 308A ' of layer 308 ', makes fluid freely flow upward to corridor 328 ' from opening 324 '.The recline top surface 308A ' sealing of layer 312 ' of the periphery in recessed corridor 320 ' and basal surface 312B ', feasible all fluids that come from opening 324 ' flow to aperture 316 via corridor 328 '.Each opening 330 ' in the basal surface 312B ' is aimed at the respective openings 321 ' in the layer 308 ' and is communicated with (Figure 12 E), thus opening 330 ' and layer 308 ' the concordant location of top surface 308A ' (Figure 12 E).As selection, opening 330 has slightly the diameter greater than the diameter of respective openings 324 ', and opening 324 ' extends through opening 330 ' and gets into corridor 328 ' thus.

Figure 12 H representes the sectional view along the heat exchanger of Figure 12 A of line H-H intercepting according to the present invention.Shown in Figure 12 H, boundary layer 302 is connected on the thermal source 99.As stated, heat exchanger 300 alternatively forms single parts with thermal source 99 integral body.Boundary layer 302 is connected on the basal surface 308B of layer 308.In addition, layer 312 preferably is connected on the layer 308, layer 308 the top surface basal surface 312B sealing of layer 312 that reclines thus.The periphery in the corridor 320 of layer 308 is communicated with boundary layer 302.In addition, the corridor 328 in the layer 312 is communicated with layer 308 interior opening 322.The recline top surface 308A sealing of layer 308 of layer 312 basal surface 312B makes fluid not at two layers 308, leak between 312.

Figure 12 I representes the sectional view along the heat exchanger selected of Figure 12 B of line I-I intercepting according to the present invention.Shown in Figure 12 I, boundary layer 302 ' is connected on the thermal source 99 '.Boundary layer 302 ' is connected on the basal surface 304B ' of circulation layer 304 '.Equally, circulation layer 304 is connected on the layer 308 ', the top surface 304A ' of circulation layer 304 ' layer 208 ' the basal surface 308 ' sealing that reclines thus.Layer 312 ' preferably is connected on the layer 308 ' in addition, layer 308 ' the top surface 308A ' basal surface 312B ' sealing of layer 312 that reclines thus.The open communication of the periphery in the corridor 320 ' of layer 308 ' and the top surface 304A ' of circulation layer 304 ' makes fluid between two layers, not leak.In addition, the open communication in the periphery in the corridor 328 ' in the layer 312 ' and the top surface 308A ' of circulation layer 308 ' makes fluid between two layers, not leak.

In operation, shown in Figure 12 A and 12H arrow, the fluid that is cooled gets into heat exchanger 300 via the aperture in the layer 312 ' 316.The fluid that is cooled 316 flows down to corridor 328 along the aperture, and flows down to boundary layer 302 via sending passage 322.The fluid that is cooled in the corridor 320 does not mix or contacts with any fluid that is heated that leaves heat exchanger 300.The fluid and the thermal source 99 interior heats that produce that get into boundary layer 302 carry out heat exchanger and absorb this heat.Opening 322 best configuration become to make fluid in boundary layer 302, on X and Y direction, flow through the distance of minimum, so that the pressure that reduces in the heat exchanger 300 falls, effectively cool off thermal source 99 simultaneously.Be heated fluid and then on the Z direction, upwards flow to the corridor 320 in the layer 308 from boundary layer 302.The fluid that is heated that leaves manifold layer 306 does not mix with any fluid that is cooled that gets into manifold layer 306 or contacts.Be heated fluid and when getting into corridor 320, flow to aperture 314 and 315, and leave heat exchanger 300.Those skilled in the art will appreciate that fluid is mobile on the contrary as selecting the mode with Figure 12 A and 12H, and do not depart from scope of the present invention.

In selectable operation, shown in the arrow of Figure 12 B and 12I, the fluid that is cooled gets into heat exchanger 300 ' via the aperture in the layer 312 ' 316 '.The fluid that is cooled 315 ' flows to the aperture 314 ' of layer in 308 ' downwards along the aperture.Fluid then flows into corridor 320 ', and flows to boundary layer 302 ' downwards via the opening 322 ' in the circulation layer 304 '.But the fluid that is cooled in the corridor 320 ' does not mix or contacts with any fluid that is heated that leaves heat exchanger 300 '.The fluid and the thermal source 99 interior heats that produce that get into boundary layer 302 ' carry out heat exchange and absorb this heat.As following description, opening 322 ' is arranged such that with opening 324 ' fluid flows through best minimum distance to adjacent apertures 324 ' along boundary layer 302 ' from each opening 322 ', so that the pressure that reduces wherein falls, cool off thermal source 99 simultaneously effectively.Be heated fluid and then on the Z direction, upwards flow through the corridor 328 ' of layer 308 ' in layer 312 ' via a plurality of openings 324 ' from boundary layer 302 '.When opening 324 ' upwards flows, be heated fluid and do not mix or contact with any fluid that is cooled that gets into manifold layer 306 '.Flow to aperture 316 ' and leave heat exchanger 300 ' when being heated the corridor 328 ' of fluid in getting into layer 312 '.Those skilled in the art will appreciate that fluid can be used as the mode of selecting with Figure 12 B and 12I and flows on the contrary, and do not depart from scope of the present invention.

In manifold layer 306, opening 322 is arranged such that the distance minimum that fluid flows in boundary layer 302, abundant simultaneously cooling thermal source 99.In selectable manifold layer 306 ', opening 322 ' and 324 ' is arranged such that the distance minimum that fluid flows in boundary layer 302 ', abundant simultaneously cooling thermal source 99.Particularly, shown opening 322 ', 324 ' provides the approximate vertical stream, makes to be flowing in transversely minimum of heat exchanger 300 ' the inherent X and Y.Therefore, heat exchanger 300,300 ' reduces fluid greatly and must flow so that fully cool off the distance of thermal source 99, reduces heat exchanger 300,300 ' the interior pressure that produces then greatly and falls.

The specific configuration and the sectional dimension of opening 322 and/or opening 324 depend on multiple factor, the heat and the rate of flow of fluid that produce including, but not limited to flow regime, temperature, through thermal source 99.Relate to

opening

322 and 324 though should be noted that following description, should be understood that these descriptions are equally applicable to independent opening 322 or opening 324.

Opening 322,324 is spaced from each other optimum distance, is cooled to fully at thermal source 99 thus that minimum falls in pressure when temperature required.In this embodiment, through changing the size and the position of opening separately, the configuration of opening 322 and/or opening 324 and optimum distance make opening 322,324 and the stream that passes boundary layer 302 usually optimize separately.In addition, the configuration of this embodiment split shed has also significantly increased the total division of flowing that gets into boundary layer, and through getting into the fluid-cooled region quantity of each opening 322.

In one embodiment, opening 322,324 with alternate configuration or " chessboard " patterned arrangement in manifold layer 306, shown in Figure 13 and 14.Each opening 322,324 separates the minimum distance that fluid flows through in checkerboard pattern.But opening 322,324 must be separated from each other enough big distance, reaches time enough so that cooling fluid is offered boundary layer 302.Shown in Figure 13 and 14, preferably one or more openings 322 are near the aperture arrangement of respective numbers or vice versa, make the fluid that gets into boundary layer 302 before leaving boundary layer 302, flow through the distance of minimum along boundary layer 302.Therefore, as shown in the figure, preferably opening 322,324 is each other around radial distribution, to help flowing the distance of minimums to nearest opening 324 from any opening 322.For example, shown in figure 13, via the fluid of the entering boundary layer 302 of a certain openings 322 through the path of minimum drag to adjacent apertures 324.In addition, though opening can have any other shape, opening 322,324 is preferably round-shaped.

In addition, as stated, though opening 324 is expressed as stretching out from circulation layer 304 or layer 308,312 as cylindrical member in the accompanying drawings, this opening can be used as selection and does not stretch out from manifold layer 306 interior any layers.Equally preferably manifold layer 306 has the rounding surface around the zone that fluid changes direction, falls with the pressure that helps to reduce in the heat exchanger 300.

The optimum distance of opening 322,324 structure and size depend on the temperature level of fluid under exposing along boundary layer 302.It is also important that the sectional dimension that is used for the stream in the opening 322,324 is enough big, so that the pressure that reduces in the heat exchanger 300 falls.Carry out single-phase mobile situation for fluid along 302 of boundary layers, each opening 322 preferably centers on symmetrical hexagon-shaped configuration through a plurality of adjacent apertures 324, and is shown in figure 13.In addition, flow for single-phase, preferably number of openings in circulation layer 304 about equally.In addition, flow for single-phase, opening 322,324 is same diameter preferably.Those skilled in the art will appreciate that as any ratio of selecting to consider other configuration and opening 322,324.

Carry out the situation of two-phase flow for fluid along boundary layer 302, the symmetrical arrangements of opening 322,324 preferably is used for adapting to the acceleration of two-phase fluid.But, also can consider the balanced configuration of opening 322,324 for two-phase flow.For example, opening 322,324 can be arranged symmetrically in the circulation layer 304, and opening 324 has the big opening of ratio open 322 thus.As selection, for two-phase flow, in circulation layer 304, use hexagonal symmetry configuration shown in Figure 13, to compare with opening 322 thus, more openings 324 are positioned at circulation layer 304.

Should be noted that opening 322,324 in the circulation layer can be used as selectively is configured to cool off the focus in the thermal source 99.Therefore, for example two openings 322 are selectively each other near being positioned in the circulation layer 304, and two openings 322 are near the hot spot region, interface or on it, locate thus.The opening 324 that should be understood that right quantity falls so that reduce boundary layer 302 interior pressure near two openings, 322 location.Therefore, two openings 322 are fed to the hot spot region, interface with cooling fluid, so that force the hot spot region, interface to form roughly the same temperature uniformly as stated.

As stated, heat exchanger 300 has significant advantage with respect to other heat exchanger.Fall owing to reduced the pressure that vertical stream causes, as selection, the pump of the structure medium-performance capable of using of heat exchanger 300.In addition, the structure of heat exchanger 300 makes inlet and stream optimize separately along boundary layer 302.In addition, the layer of separation forms the basis of custom design, thereby optimizes heat conducting uniformity, reduce that pressure falls and the size of separate part.The pressure that the structure of heat exchanger 300 has also reduced in the system that fluid wherein carries out two-phase flow falls, and can be used for single-phase and binary system thus.In addition, as following description, heat exchanger adapts to many different manufacturing approaches, and starts from the purpose of tolerance, the geometry that can regulate parts.

The details of how to make and to produce the individual course in heat exchanger 100 and the heat exchanger 100 will be described below.Though the simple description from simple and clear purpose of the heat exchanger 100 of Fig. 3 B and individual course wherein describes below and is applicable to heat exchanger of the present invention.Though those skilled in the art will appreciate that with respect to the invention describes the details of manufacturing/production, the details of making and producing is as selecting also to be applicable to conventional heat exchanger and shown in Figure 1A-1C, utilizing the two-layer of a fluid intake aperture and a fluid orifice and three layers of heat exchanger.

Preferably, boundary layer has the thermal coefficient of expansion (CTE) that is substantially equal to thermal source 99.Therefore, boundary layer preferably and thermal source 99 expand accordingly and shrink.As selection, the material of boundary layer 302 has the CTE of the CTE that is different from source materials.The boundary layer of being processed by the material of for example silicon 302 has the CTE that matees with thermal source 99, and has enough heat conductivities, so that from thermal source 99 heat is delivered to fluid fully.But as selection, other material can be used for having the boundary layer 302 of the CTE that matees with thermal source 99.

Boundary layer preferably has high heat conductivity, makes thermal source 99 and between boundary layer 302 flowing fluids, fully conducting to make thermal source 99 not overheated.Boundary layer is preferably processed by the material of the high heat conductivity with 100W/m-K.But, those skilled in the art will appreciate that boundary layer 302 has the heat conductivity that is greater than or less than 100W/m-K, and be not limited to this.

In order to realize preferred heat conductivity, boundary layer preferably is made of copper.As selection, boundary layer is processed by any other material, and this material is including, but not limited to monocrystalline dielectric material, metal, aluminium, nickel, Semiconductor substrate, for example silicon, Kovar alloy, diamond, synthetic or any suitable alloy.The selectable material of boundary layer 302 is to form pattern or molded organic grid.

In conjunction with details, for specific embodiment the present invention is described, to help to understand structure of the present invention and operating principle.Therefore, do not plan to limit the scope of appended claim here for the reference of specific embodiment and details thereof.Those skilled in the art will appreciate that and can carry out modification selected embodiment, and without departing from the spirit and scope of the present invention.

Claims

1. a manufacturing comprises the method for the heat exchanger of microstructure, and this method comprises:

A. materials used remove technology form pass a plurality of heat conduction layers a plurality of microcosmic openings so that form a plurality of Window layer; And

B. in this synthetic microstructure, form micro grid detection through a plurality of Window layer being joined together to form synthetic microstructure.

2. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that heat conduction layer comprises copper.

3. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that, a plurality of Window layer link together through brazing.

4. the method for manufacturing heat exchanger as claimed in claim 3 is characterized in that, brazing is accomplished through the brazing material that comprises silver.

5. the method for manufacturing heat exchanger as claimed in claim 3 is characterized in that, said a plurality of Window layer one or more plating brazing material before the brazing.

6. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that, also be included in a plurality of Window layer are linked together before in each layer of a plurality of Window layer the step of aligned.

7. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that, material removal process is the isotropism wet etching process.

8. the method for manufacturing heat exchanger as claimed in claim 7 is characterized in that, the isotropism wet etching process be selected from comprise photochemistry processing, run through the mask chemical etching,, in the group of electroetching and the miniature processing of electrochemistry.

9. the method for manufacturing heat exchanger as claimed in claim 8 is characterized in that, the miniature processing of electrochemistry comprises and runs through the mask chemical etching.

10. the method for manufacturing heat exchanger as claimed in claim 1; It is characterized in that; The step that materials used removal technology forms said a plurality of microcosmic openings of each layer that passes a plurality of heat conduction layers is included in the interior formation of first side first micro-pattern of each heat conduction layer, and in second side of each heat conduction layer, forms second micro-pattern.

11. the method for manufacturing heat exchanger as claimed in claim 10 is characterized in that, first and second micro-patterns are designed in heat conduction layer, form overlapping micro grid detection structure.

12. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that, heat conduction layer have about 50 and about 250 microns between thickness.

13. the method for manufacturing heat exchanger as claimed in claim 1 is characterized in that, be formed on microcosmic opening in the heat conduction layer have about 50 and about 300 microns between length and width dimensions.

14. a manufacturing comprises the method for the micro heat exchanger of heat conducting high surface to volume ratio material (HSVRM) structure, this method comprises:

A., the lid of being processed by first material structure is provided;

B. manifold structure is connected with the lid structure, wherein manifold structure is processed by second material, and is configured to distribute cooling fluid;

C. materials used is removed technology, forms a plurality of microcosmic openings that pass a plurality of heat conduction layers that comprise heat conducting material, so that form a plurality of Window layer;

D. come in this synthetic HSVRM structure, to form micro grid detection through a plurality of Window layer being joined together to form the synthetic HSVRM structure that comprises heat conducting material, the HSVRM structure that wherein is formed in each layer of a plurality of heat conduction layers is designed to when heat conduction layer links together, form synthetic HSVRM structure;

E. will synthesize HSVRM structure and manifold structure and link together, make that manifold structure is configured to fluid is delivered to the HSVRM structure with the lid structure; And

Flat bed structure and synthetic HSVRM structure, manifold structure and the lid structure that f. will comprise the 3rd material link together so that form micro heat exchanger.

15. the method for manufacturing micro heat exchanger as claimed in claim 14 is characterized in that, heat conducting material is a copper.

16. the method for manufacturing micro heat exchanger as claimed in claim 14 is characterized in that, lid structure, manifold structure, a plurality of Window layer and flat bed structure all link together through brazing.

17. the method for manufacturing micro heat exchanger as claimed in claim 16 is characterized in that, brazing is accomplished through the brazing material that comprises silver.

18. the method for manufacturing micro heat exchanger as claimed in claim 14 is characterized in that, also be included in a plurality of Window layer are linked together before in each layer of a plurality of Window layer the step of aligned.

19. the method for manufacturing micro heat exchanger as claimed in claim 14 is characterized in that, the microcosmic opening is formed in the heat conduction layer through the isotropism wet etching process.

20. the method for manufacturing micro heat exchanger as claimed in claim 19 is characterized in that, material removal process is selected from and comprises photochemistry processing, runs through in the group of mask chemical etching, electroetching and the miniature processing of electrochemistry.

21. the method for manufacturing micro heat exchanger as claimed in claim 20 is characterized in that, the miniature processing of electrochemistry comprises and runs through the mask chemical etching.

22. the method for manufacturing micro heat exchanger as claimed in claim 21; It is characterized in that; The step that forms the microcosmic opening of each layer pass a plurality of heat conduction layers through material removal process is included in first side of each heat conduction layer and forms first micro-pattern, and in second side of each heat conduction layer, forms second micro-pattern.

23. the method for manufacturing micro heat exchanger as claimed in claim 22 is characterized in that, first and second micro-patterns are designed in heat conduction layer, form overlapping micro grid detection structure.

24. the method for manufacturing micro heat exchanger as claimed in claim 14 is characterized in that, also comprises the fine finishining of flat bed structure.

25. the method for manufacturing micro heat exchanger as claimed in claim 14 is characterized in that, also is included in to cover to form a plurality of fluid orifices in the structure.

26. the method for manufacturing micro heat exchanger as claimed in claim 14 is characterized in that, the quantity of a plurality of heat conduction layers of the synthetic HSVRM structure of composition and thickness are selected to the pressure of optimizing micro heat exchanger and fall and resistive properties.

27. the method for manufacturing heat exchanger as claimed in claim 14 is characterized in that, heat conduction layer have about 50 and about 250 microns between thickness.

28. the method for manufacturing micro heat exchanger as claimed in claim 14 is characterized in that, be formed on microcosmic opening in the heat conduction layer have about 50 and about 300 microns between length and width dimensions.

29. heat exchanger that comprises the microstructureization of a plurality of heat conduction layers; Each heat conduction layer has through material removes a plurality of elongated microcosmic opening that forms; Wherein a plurality of elongated microcosmic openings are aimed at; And a plurality of heat conduction layers link together so that form the HSVRM structure, have micro grid detection in the HSVRM structure, and the elongated open more than three of the heat conduction layer that wherein each elongated open in first heat conduction layer is adjacent with at least one is communicated with.

30. the heat exchanger of microstructureization as claimed in claim 29 is characterized in that heat conduction layer comprises copper.

31. the heat exchanger of microstructureization as claimed in claim 29 is characterized in that Window layer links together through brazing.

32. the heat exchanger of microstructureization as claimed in claim 29 is characterized in that, it is isotropic that material is removed.

33. the heat exchanger of microstructureization as claimed in claim 29 is characterized in that, the pressure that the quantity of a plurality of heat conduction layers and thickness are selected to the heat exchanger of optimizing microstructureization falls and resistive properties.

34. heat exchanger that comprises the microstructureization of a plurality of heat conduction layers; Each heat conduction layer has through material removes a plurality of elongated microcosmic opening that forms; Wherein a plurality of elongated microcosmic openings are aimed at; And a plurality of heat conduction layers link together so that form the HSVRM structure, have micro grid detection in the HSVRM structure, and wherein each elongated open in first heat conduction layer is communicated with unique elongated open of any adjacent heat conduction layer.

35. the heat exchanger of microstructureization as claimed in claim 34 is characterized in that, a plurality of elongated microcosmic openings are identical in each layer of a plurality of heat conduction layers.

36. the heat exchanger of microstructureization as claimed in claim 34 is characterized in that, it is isotropic that material is removed.

37. the heat exchanger of microstructureization as claimed in claim 34 is characterized in that Window layer links together through brazing.

38. the heat exchanger of microstructureization as claimed in claim 34 is characterized in that, the pressure that the quantity of a plurality of heat conduction layers and thickness are selected to the heat exchanger of optimizing microstructureization falls and resistive properties.

39. a manufacturing comprises the method for the heat exchanger of microstructure, this method comprises:

A. the materials used depositing operation forms a plurality of Window layer, and Window layer comprises heat conducting material and comprises a plurality of microcosmic openings; And

B. a plurality of Window layer are linked together so that form synthetic microstructure, have micro grid in this microstructure, the microcosmic open communication more than three of each a microcosmic opening in first heat conduction layer and an adjacent heat conduction layer.