WO2006074353A3 - High surface to volume ratio structures and their integration in microheat exchangers - Google Patents

High surface to volume ratio structures and their integration in microheat exchangers Download PDF

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Publication number
WO2006074353A3
WO2006074353A3 PCT/US2006/000434 US2006000434W WO2006074353A3 WO 2006074353 A3 WO2006074353 A3 WO 2006074353A3 US 2006000434 W US2006000434 W US 2006000434W WO 2006074353 A3 WO2006074353 A3 WO 2006074353A3
Authority
WO
WIPO (PCT)
Prior art keywords
integration
volume ratio
high surface
ratio structures
microstructured region
Prior art date
Application number
PCT/US2006/000434
Other languages
French (fr)
Other versions
WO2006074353A2 (en
Inventor
Madhav Datta
Mark Mcmaster
Rick Brewer
Peng Zhou
Paul Tsao
Girish Upadhaya
Mark Munch
Original Assignee
Cooligy Inc
Madhav Datta
Mark Mcmaster
Rick Brewer
Peng Zhou
Paul Tsao
Girish Upadhaya
Mark Munch
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cooligy Inc, Madhav Datta, Mark Mcmaster, Rick Brewer, Peng Zhou, Paul Tsao, Girish Upadhaya, Mark Munch filed Critical Cooligy Inc
Priority to JP2007550493A priority Critical patent/JP2008530482A/en
Priority to CN200680007455XA priority patent/CN101248327B/en
Priority to DE112006000160T priority patent/DE112006000160T5/en
Publication of WO2006074353A2 publication Critical patent/WO2006074353A2/en
Publication of WO2006074353A3 publication Critical patent/WO2006074353A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
    • F28F7/02—Blocks traversed by passages for heat-exchange media
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2260/00—Heat exchangers or heat exchange elements having special size, e.g. microstructures
    • F28F2260/02—Heat exchangers or heat exchange elements having special size, e.g. microstructures having microchannels

Abstract

An structure and method of manufacturing a microstructure for use in a heat exchanger is disclosed. The heat exchanger comprises a manifold layer and an microstructured region. The manifold layer comprises a structure to deliver fluid to the microstructured region. The microstructured region is formed from multiple windowed layers formed from heat conductive layers through which a plurality of microscaled apertures have been formed by a wet etching process. The plurality of windowed layers are then coupled together to form a composite microstructure.
PCT/US2006/000434 2005-01-07 2006-01-06 High surface to volume ratio structures and their integration in microheat exchangers WO2006074353A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007550493A JP2008530482A (en) 2005-01-07 2006-01-06 Heat exchanger manufacturing method, micro heat exchanger manufacturing method, and micro heat exchanger
CN200680007455XA CN101248327B (en) 2005-01-07 2006-01-06 Fabrication of high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling systems
DE112006000160T DE112006000160T5 (en) 2005-01-07 2006-01-06 Production of structures with a high surface / volume ratio and their integration into micro heat exchangers for liquid cooling systems

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US64228405P 2005-01-07 2005-01-07
US60/642,284 2005-01-07

Publications (2)

Publication Number Publication Date
WO2006074353A2 WO2006074353A2 (en) 2006-07-13
WO2006074353A3 true WO2006074353A3 (en) 2007-10-18

Family

ID=36648202

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/000434 WO2006074353A2 (en) 2005-01-07 2006-01-06 High surface to volume ratio structures and their integration in microheat exchangers

Country Status (4)

Country Link
JP (1) JP2008530482A (en)
CN (1) CN101248327B (en)
DE (1) DE112006000160T5 (en)
WO (1) WO2006074353A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120018811A (en) * 2009-05-27 2012-03-05 쿠라미크 엘렉트로닉스 게엠베하 Cooled electric unit
US9303925B2 (en) 2012-02-17 2016-04-05 Hussmann Corporation Microchannel suction line heat exchanger
US11172770B2 (en) 2013-09-20 2021-11-16 Hussmann Corporation High efficient night cover
WO2015087451A1 (en) * 2013-12-13 2015-06-18 富士通株式会社 Loop-type heat pipe, method for manufacturing same, and electronic equipment
CN104134807B (en) * 2014-07-25 2016-10-05 华南理工大学 A kind of alternate intercommunicating reticulated porous structures plate and manufacture method thereof and application
JP6439326B2 (en) 2014-08-29 2018-12-19 株式会社Ihi Reactor
CN106440868B (en) * 2015-08-13 2019-09-03 四平巨元换热系统集成有限公司 Special-shaped capillary channel heat exchanger

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5199487A (en) * 1991-05-31 1993-04-06 Hughes Aircraft Company Electroformed high efficiency heat exchanger and method for making
US6787052B1 (en) * 2000-06-19 2004-09-07 Vladimir Vaganov Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811062A (en) * 1994-07-29 1998-09-22 Battelle Memorial Institute Microcomponent chemical process sheet architecture
US6129973A (en) * 1994-07-29 2000-10-10 Battelle Memorial Institute Microchannel laminated mass exchanger and method of making
US6907921B2 (en) * 1998-06-18 2005-06-21 3M Innovative Properties Company Microchanneled active fluid heat exchanger
JP2003247796A (en) * 2002-02-26 2003-09-05 Sumitomo Precision Prod Co Ltd Regeneration heat exchanger for micro gas turbine
JP2003279283A (en) * 2002-03-25 2003-10-02 Mitsubishi Heavy Ind Ltd Heat exchanger and method of manufacture
JP2004028538A (en) * 2002-06-28 2004-01-29 Sumitomo Precision Prod Co Ltd Regenerative heat exchanger for micro gas turbine
US6988534B2 (en) * 2002-11-01 2006-01-24 Cooligy, Inc. Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
JP2004278840A (en) * 2003-03-13 2004-10-07 Denso Corp Heat transport device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5199487A (en) * 1991-05-31 1993-04-06 Hughes Aircraft Company Electroformed high efficiency heat exchanger and method for making
US6787052B1 (en) * 2000-06-19 2004-09-07 Vladimir Vaganov Method for fabricating microstructures with deep anisotropic etching of thick silicon wafers

Also Published As

Publication number Publication date
DE112006000160T5 (en) 2007-11-22
CN101248327A (en) 2008-08-20
JP2008530482A (en) 2008-08-07
WO2006074353A2 (en) 2006-07-13
CN101248327B (en) 2012-11-14

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