US3524497A
(en)
*
|
1968-04-04 |
1970-08-18 |
Ibm |
Heat transfer in a liquid cooling system
|
US3554669A
(en)
*
|
1968-12-04 |
1971-01-12 |
Gen Electric |
Electric-fluid energy converter
|
US3654988A
(en)
*
|
1970-02-24 |
1972-04-11 |
American Standard Inc |
Freeze protection for outdoor cooler
|
DE2102254B2
(de)
*
|
1971-01-19 |
1973-05-30 |
Robert Bosch Gmbh, 7000 Stuttgart |
Kuehlvorrichtung fuer leistungshalbleiterbauelemente
|
FR2216537B1
(fr)
*
|
1973-02-06 |
1975-03-07 |
Gaz De France |
|
US4138996A
(en)
*
|
1977-07-28 |
1979-02-13 |
Rheem Manufacturing Company |
Solar heater freeze protection system
|
US4312012A
(en)
*
|
1977-11-25 |
1982-01-19 |
International Business Machines Corp. |
Nucleate boiling surface for increasing the heat transfer from a silicon device to a liquid coolant
|
US4194559A
(en)
*
|
1978-11-01 |
1980-03-25 |
Thermacore, Inc. |
Freeze accommodating heat pipe
|
US4248295A
(en)
*
|
1980-01-17 |
1981-02-03 |
Thermacore, Inc. |
Freezable heat pipe
|
US4450472A
(en)
*
|
1981-03-02 |
1984-05-22 |
The Board Of Trustees Of The Leland Stanford Junior University |
Method and means for improved heat removal in compact semiconductor integrated circuits and similar devices utilizing coolant chambers and microscopic channels
|
US4573067A
(en)
*
|
1981-03-02 |
1986-02-25 |
The Board Of Trustees Of The Leland Stanford Junior University |
Method and means for improved heat removal in compact semiconductor integrated circuits
|
US4494171A
(en)
*
|
1982-08-24 |
1985-01-15 |
Sundstrand Corporation |
Impingement cooling apparatus for heat liberating device
|
US4516632A
(en)
*
|
1982-08-31 |
1985-05-14 |
The United States Of America As Represented By The United States Deparment Of Energy |
Microchannel crossflow fluid heat exchanger and method for its fabrication
|
US4567505A
(en)
*
|
1983-10-27 |
1986-01-28 |
The Board Of Trustees Of The Leland Stanford Junior University |
Heat sink and method of attaching heat sink to a semiconductor integrated circuit and the like
|
US4664181A
(en)
*
|
1984-03-05 |
1987-05-12 |
Thermo Electron Corporation |
Protection of heat pipes from freeze damage
|
US4568431A
(en)
*
|
1984-11-13 |
1986-02-04 |
Olin Corporation |
Process for producing electroplated and/or treated metal foil
|
US4903761A
(en)
*
|
1987-06-03 |
1990-02-27 |
Lockheed Missiles & Space Company, Inc. |
Wick assembly for self-regulated fluid management in a pumped two-phase heat transfer system
|
US5016138A
(en)
*
|
1987-10-27 |
1991-05-14 |
Woodman John K |
Three dimensional integrated circuit package
|
US4894709A
(en)
*
|
1988-03-09 |
1990-01-16 |
Massachusetts Institute Of Technology |
Forced-convection, liquid-cooled, microchannel heat sinks
|
US4896719A
(en)
*
|
1988-05-11 |
1990-01-30 |
Mcdonnell Douglas Corporation |
Isothermal panel and plenum
|
US4908112A
(en)
*
|
1988-06-16 |
1990-03-13 |
E. I. Du Pont De Nemours & Co. |
Silicon semiconductor wafer for analyzing micronic biological samples
|
US5009760A
(en)
*
|
1989-07-28 |
1991-04-23 |
Board Of Trustees Of The Leland Stanford Junior University |
System for measuring electrokinetic properties and for characterizing electrokinetic separations by monitoring current in electrophoresis
|
US5083194A
(en)
*
|
1990-01-16 |
1992-01-21 |
Cray Research, Inc. |
Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
|
US6176962B1
(en)
*
|
1990-02-28 |
2001-01-23 |
Aclara Biosciences, Inc. |
Methods for fabricating enclosed microchannel structures
|
US5858188A
(en)
*
|
1990-02-28 |
1999-01-12 |
Aclara Biosciences, Inc. |
Acrylic microchannels and their use in electrophoretic applications
|
US6054034A
(en)
*
|
1990-02-28 |
2000-04-25 |
Aclara Biosciences, Inc. |
Acrylic microchannels and their use in electrophoretic applications
|
US5016090A
(en)
*
|
1990-03-21 |
1991-05-14 |
International Business Machines Corporation |
Cross-hatch flow distribution and applications thereof
|
US5096388A
(en)
*
|
1990-03-22 |
1992-03-17 |
The Charles Stark Draper Laboratory, Inc. |
Microfabricated pump
|
US5265670A
(en)
*
|
1990-04-27 |
1993-11-30 |
International Business Machines Corporation |
Convection transfer system
|
JPH07114250B2
(ja)
*
|
1990-04-27 |
1995-12-06 |
インターナショナル・ビジネス・マシーンズ・コーポレイション |
熱伝達システム
|
US5088005A
(en)
*
|
1990-05-08 |
1992-02-11 |
Sundstrand Corporation |
Cold plate for cooling electronics
|
US5203401A
(en)
*
|
1990-06-29 |
1993-04-20 |
Digital Equipment Corporation |
Wet micro-channel wafer chuck and cooling method
|
US5099910A
(en)
*
|
1991-01-15 |
1992-03-31 |
Massachusetts Institute Of Technology |
Microchannel heat sink with alternating flow directions
|
US5099311A
(en)
*
|
1991-01-17 |
1992-03-24 |
The United States Of America As Represented By The United States Department Of Energy |
Microchannel heat sink assembly
|
JPH06342990A
(ja)
*
|
1991-02-04 |
1994-12-13 |
Internatl Business Mach Corp <Ibm> |
統合冷却システム
|
US5125451A
(en)
*
|
1991-04-02 |
1992-06-30 |
Microunity Systems Engineering, Inc. |
Heat exchanger for solid-state electronic devices
|
US5275237A
(en)
*
|
1992-06-12 |
1994-01-04 |
Micron Technology, Inc. |
Liquid filled hot plate for precise temperature control
|
US5308429A
(en)
*
|
1992-09-29 |
1994-05-03 |
Digital Equipment Corporation |
System for bonding a heatsink to a semiconductor chip package
|
US5380956A
(en)
*
|
1993-07-06 |
1995-01-10 |
Sun Microsystems, Inc. |
Multi-chip cooling module and method
|
US5727618A
(en)
*
|
1993-08-23 |
1998-03-17 |
Sdl Inc |
Modular microchannel heat exchanger
|
US5704416A
(en)
*
|
1993-09-10 |
1998-01-06 |
Aavid Laboratories, Inc. |
Two phase component cooler
|
US5514906A
(en)
*
|
1993-11-10 |
1996-05-07 |
Fujitsu Limited |
Apparatus for cooling semiconductor chips in multichip modules
|
US5383340A
(en)
*
|
1994-03-24 |
1995-01-24 |
Aavid Laboratories, Inc. |
Two-phase cooling system for laptop computers
|
US5539153A
(en)
*
|
1994-08-08 |
1996-07-23 |
Hewlett-Packard Company |
Method of bumping substrates by contained paste deposition
|
US5508234A
(en)
*
|
1994-10-31 |
1996-04-16 |
International Business Machines Corporation |
Microcavity structures, fabrication processes, and applications thereof
|
US5585069A
(en)
*
|
1994-11-10 |
1996-12-17 |
David Sarnoff Research Center, Inc. |
Partitioned microelectronic and fluidic device array for clinical diagnostics and chemical synthesis
|
US5632876A
(en)
*
|
1995-06-06 |
1997-05-27 |
David Sarnoff Research Center, Inc. |
Apparatus and methods for controlling fluid flow in microchannels
|
US5876655A
(en)
*
|
1995-02-21 |
1999-03-02 |
E. I. Du Pont De Nemours And Company |
Method for eliminating flow wrinkles in compression molded panels
|
US6227809B1
(en)
*
|
1995-03-09 |
2001-05-08 |
University Of Washington |
Method for making micropumps
|
JP3029792B2
(ja)
*
|
1995-12-28 |
2000-04-04 |
日本サーボ株式会社 |
多相永久磁石型回転電機
|
WO1997025741A1
(fr)
*
|
1996-01-04 |
1997-07-17 |
Daimler-Benz Aktiengesellschaft |
Element de refroidissement avec des ergots
|
US6010316A
(en)
*
|
1996-01-16 |
2000-01-04 |
The Board Of Trustees Of The Leland Stanford Junior University |
Acoustic micropump
|
US5885470A
(en)
*
|
1997-04-14 |
1999-03-23 |
Caliper Technologies Corporation |
Controlled fluid transport in microfabricated polymeric substrates
|
US5870823A
(en)
*
|
1996-11-27 |
1999-02-16 |
International Business Machines Corporation |
Method of forming a multilayer electronic packaging substrate with integral cooling channels
|
WO1998049548A1
(fr)
*
|
1997-04-25 |
1998-11-05 |
Caliper Technologies Corporation |
Dispositifs microfluidiques a geometrie de canaux amelioree
|
US5880524A
(en)
*
|
1997-05-05 |
1999-03-09 |
Intel Corporation |
Heat pipe lid for electronic packages
|
US5869004A
(en)
*
|
1997-06-09 |
1999-02-09 |
Caliper Technologies Corp. |
Methods and apparatus for in situ concentration and/or dilution of materials in microfluidic systems
|
US5901037A
(en)
*
|
1997-06-18 |
1999-05-04 |
Northrop Grumman Corporation |
Closed loop liquid cooling for semiconductor RF amplifier modules
|
US6019882A
(en)
*
|
1997-06-25 |
2000-02-01 |
Sandia Corporation |
Electrokinetic high pressure hydraulic system
|
US6013164A
(en)
*
|
1997-06-25 |
2000-01-11 |
Sandia Corporation |
Electokinetic high pressure hydraulic system
|
US6001231A
(en)
*
|
1997-07-15 |
1999-12-14 |
Caliper Technologies Corp. |
Methods and systems for monitoring and controlling fluid flow rates in microfluidic systems
|
US6034872A
(en)
*
|
1997-07-16 |
2000-03-07 |
International Business Machines Corporation |
Cooling computer systems
|
US6907921B2
(en)
*
|
1998-06-18 |
2005-06-21 |
3M Innovative Properties Company |
Microchanneled active fluid heat exchanger
|
US6012902A
(en)
*
|
1997-09-25 |
2000-01-11 |
Caliper Technologies Corp. |
Micropump
|
US5842787A
(en)
*
|
1997-10-09 |
1998-12-01 |
Caliper Technologies Corporation |
Microfluidic systems incorporating varied channel dimensions
|
US6174675B1
(en)
*
|
1997-11-25 |
2001-01-16 |
Caliper Technologies Corp. |
Electrical current for controlling fluid parameters in microchannels
|
US6019165A
(en)
*
|
1998-05-18 |
2000-02-01 |
Batchelder; John Samuel |
Heat exchange apparatus
|
US6196307B1
(en)
*
|
1998-06-17 |
2001-03-06 |
Intersil Americas Inc. |
High performance heat exchanger and method
|
US6553253B1
(en)
*
|
1999-03-12 |
2003-04-22 |
Biophoretic Therapeutic Systems, Llc |
Method and system for electrokinetic delivery of a substance
|
US6388385B1
(en)
*
|
1999-03-19 |
2002-05-14 |
Fei Company |
Corrugated style anode element for ion pumps
|
US6234240B1
(en)
*
|
1999-07-01 |
2001-05-22 |
Kioan Cheon |
Fanless cooling system for computer
|
US6396706B1
(en)
*
|
1999-07-30 |
2002-05-28 |
Credence Systems Corporation |
Self-heating circuit board
|
US6675875B1
(en)
*
|
1999-08-06 |
2004-01-13 |
The Ohio State University |
Multi-layered micro-channel heat sink, devices and systems incorporating same
|
JP3518434B2
(ja)
*
|
1999-08-11 |
2004-04-12 |
株式会社日立製作所 |
マルチチップモジュールの冷却装置
|
US6216343B1
(en)
*
|
1999-09-02 |
2001-04-17 |
The United States Of America As Represented By The Secretary Of The Air Force |
Method of making micro channel heat pipe having corrugated fin elements
|
US6210986B1
(en)
*
|
1999-09-23 |
2001-04-03 |
Sandia Corporation |
Microfluidic channel fabrication method
|
JP2001110956A
(ja)
*
|
1999-10-04 |
2001-04-20 |
Matsushita Electric Ind Co Ltd |
電子部品用の冷却機器
|
US6729383B1
(en)
*
|
1999-12-16 |
2004-05-04 |
The United States Of America As Represented By The Secretary Of The Navy |
Fluid-cooled heat sink with turbulence-enhancing support pins
|
US6337794B1
(en)
*
|
2000-02-11 |
2002-01-08 |
International Business Machines Corporation |
Isothermal heat sink with tiered cooling channels
|
US6508301B2
(en)
*
|
2000-04-19 |
2003-01-21 |
Thermal Form & Function |
Cold plate utilizing fin with evaporating refrigerant
|
US6366462B1
(en)
*
|
2000-07-18 |
2002-04-02 |
International Business Machines Corporation |
Electronic module with integral refrigerant evaporator assembly and control system therefore
|
US6388317B1
(en)
*
|
2000-09-25 |
2002-05-14 |
Lockheed Martin Corporation |
Solid-state chip cooling by use of microchannel coolant flow
|
US6537437B1
(en)
*
|
2000-11-13 |
2003-03-25 |
Sandia Corporation |
Surface-micromachined microfluidic devices
|
US6578626B1
(en)
*
|
2000-11-21 |
2003-06-17 |
Thermal Corp. |
Liquid cooled heat exchanger with enhanced flow
|
US6367544B1
(en)
*
|
2000-11-21 |
2002-04-09 |
Thermal Corp. |
Thermal jacket for reducing condensation and method for making same
|
US6336497B1
(en)
*
|
2000-11-24 |
2002-01-08 |
Ching-Bin Lin |
Self-recirculated heat dissipating means for cooling central processing unit
|
CA2329408C
(fr)
*
|
2000-12-21 |
2007-12-04 |
Long Manufacturing Ltd. |
Echangeur de chaleur a plaques a ailettes
|
US6519151B2
(en)
*
|
2001-06-27 |
2003-02-11 |
International Business Machines Corporation |
Conic-sectioned plate and jet nozzle assembly for use in cooling an electronic module, and methods of fabrication thereof
|
US6825127B2
(en)
*
|
2001-07-24 |
2004-11-30 |
Zarlink Semiconductor Inc. |
Micro-fluidic devices
|
US6385044B1
(en)
*
|
2001-07-27 |
2002-05-07 |
International Business Machines Corporation |
Heat pipe heat sink assembly for cooling semiconductor chips
|
US6533029B1
(en)
*
|
2001-09-04 |
2003-03-18 |
Thermal Corp. |
Non-inverted meniscus loop heat pipe/capillary pumped loop evaporator
|
US6942018B2
(en)
*
|
2001-09-28 |
2005-09-13 |
The Board Of Trustees Of The Leland Stanford Junior University |
Electroosmotic microchannel cooling system
|
US6719535B2
(en)
*
|
2002-01-31 |
2004-04-13 |
Eksigent Technologies, Llc |
Variable potential electrokinetic device
|
US6881039B2
(en)
*
|
2002-09-23 |
2005-04-19 |
Cooligy, Inc. |
Micro-fabricated electrokinetic pump
|
DE10246990A1
(de)
*
|
2002-10-02 |
2004-04-22 |
Atotech Deutschland Gmbh |
Mikrostrukturkühler und dessen Verwendung
|
US7000684B2
(en)
*
|
2002-11-01 |
2006-02-21 |
Cooligy, Inc. |
Method and apparatus for efficient vertical fluid delivery for cooling a heat producing device
|
US7210227B2
(en)
*
|
2002-11-26 |
2007-05-01 |
Intel Corporation |
Decreasing thermal contact resistance at a material interface
|
US6934154B2
(en)
*
|
2003-03-31 |
2005-08-23 |
Intel Corporation |
Micro-channel heat exchangers and spreaders
|
US6992891B2
(en)
*
|
2003-04-02 |
2006-01-31 |
Intel Corporation |
Metal ball attachment of heat dissipation devices
|
TWM248227U
(en)
*
|
2003-10-17 |
2004-10-21 |
Hon Hai Prec Ind Co Ltd |
Liquid cooling apparatus
|