DE1037014B - Verfahren zur Herstellung eines fuer Starkstrom geeigneten, hermetisch verschlossenen Gleichrichters - Google Patents

Verfahren zur Herstellung eines fuer Starkstrom geeigneten, hermetisch verschlossenen Gleichrichters

Info

Publication number
DE1037014B
DE1037014B DEB26660A DEB0026660A DE1037014B DE 1037014 B DE1037014 B DE 1037014B DE B26660 A DEB26660 A DE B26660A DE B0026660 A DEB0026660 A DE B0026660A DE 1037014 B DE1037014 B DE 1037014B
Authority
DE
Germany
Prior art keywords
cup
plate
semiconductor
soldered
rectifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DEB26660A
Other languages
German (de)
English (en)
Inventor
Robert Guy Hibberd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
British Thomson Houston Co Ltd
Original Assignee
British Thomson Houston Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Thomson Houston Co Ltd filed Critical British Thomson Houston Co Ltd
Publication of DE1037014B publication Critical patent/DE1037014B/de
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/632—Organic additives
    • C04B35/634—Polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
    • H01J5/32—Seals for leading-in conductors
    • H01J5/40—End-disc seals, e.g. flat header
    • H01J5/42—End-disc seals, e.g. flat header using intermediate part
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/62—Forming laminates or joined articles comprising holes, channels or other types of openings
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/64—Forming laminates or joined articles comprising grooves or cuts
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/76—Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/80—Joining the largest surface of one substrate with a smaller surface of the other substrate, e.g. butt joining or forming a T-joint
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/82—Two substrates not completely covering each other, e.g. two plates in a staggered position
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/84—Joining of a first substrate with a second substrate at least partially inside the first substrate, where the bonding area is at the inside of the first substrate, e.g. one tube inside another tube
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/88—Joining of two substrates, where a substantial part of the joining material is present outside of the joint, leading to an outside joining of the joint
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2893/00—Discharge tubes and lamps
    • H01J2893/0033—Vacuum connection techniques applicable to discharge tubes and lamps
    • H01J2893/0034—Lamp bases

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Rectifiers (AREA)
DEB26660A 1952-08-08 1953-07-22 Verfahren zur Herstellung eines fuer Starkstrom geeigneten, hermetisch verschlossenen Gleichrichters Pending DE1037014B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2002452A GB714976A (en) 1952-08-08 1952-08-08 Improvements relating to electric rectifiers

Publications (1)

Publication Number Publication Date
DE1037014B true DE1037014B (de) 1958-08-21

Family

ID=10139098

Family Applications (1)

Application Number Title Priority Date Filing Date
DEB26660A Pending DE1037014B (de) 1952-08-08 1953-07-22 Verfahren zur Herstellung eines fuer Starkstrom geeigneten, hermetisch verschlossenen Gleichrichters

Country Status (6)

Country Link
CH (1) CH316010A (US06291589-20010918-C00001.png)
DE (1) DE1037014B (US06291589-20010918-C00001.png)
FR (1) FR1086898A (US06291589-20010918-C00001.png)
GB (1) GB714976A (US06291589-20010918-C00001.png)
IT (1) IT504354A (US06291589-20010918-C00001.png)
NL (1) NL180358C (US06291589-20010918-C00001.png)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1148660B (de) * 1960-01-06 1963-05-16 Pacific Semiconductors Inc Verfahren zum Zusammenbau einer Halbleiter-Kristallanordnung

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR1094755A (US06291589-20010918-C00001.png) * 1955-01-20 1955-05-24
US3299331A (en) * 1955-05-10 1967-01-17 Texas Instruments Inc Transistor structure with heatconductive housing for cooling
NL207356A (US06291589-20010918-C00001.png) * 1955-05-23
NL104068C (US06291589-20010918-C00001.png) * 1955-08-09
US2922092A (en) * 1957-05-09 1960-01-19 Westinghouse Electric Corp Base contact members for semiconductor devices
CH393547A (de) * 1962-05-03 1965-06-15 Bbc Brown Boveri & Cie Gehäuse für einen Halbleitergleichrichter
JPS5946434B2 (ja) * 1978-01-10 1984-11-12 キヤノン株式会社 半導体レ−ザ装置
WO2020045495A1 (ja) * 2018-08-30 2020-03-05 京セラ株式会社 セラミックス構造体

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE502229A (US06291589-20010918-C00001.png) * 1950-03-31
US2595475A (en) * 1949-12-23 1952-05-06 Rca Corp Electrode support for semiconductor devices
DE863372C (de) * 1944-09-30 1953-01-15 Siemens Ag Kristalldetektor zur Spannungsmessung oder Demodulation elektrischer Wellen
DE872602C (de) * 1951-03-20 1953-04-02 Siemens Ag Verfahren zur Befestigung von Halbleitern

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE863372C (de) * 1944-09-30 1953-01-15 Siemens Ag Kristalldetektor zur Spannungsmessung oder Demodulation elektrischer Wellen
US2595475A (en) * 1949-12-23 1952-05-06 Rca Corp Electrode support for semiconductor devices
BE502229A (US06291589-20010918-C00001.png) * 1950-03-31
DE872602C (de) * 1951-03-20 1953-04-02 Siemens Ag Verfahren zur Befestigung von Halbleitern

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1148660B (de) * 1960-01-06 1963-05-16 Pacific Semiconductors Inc Verfahren zum Zusammenbau einer Halbleiter-Kristallanordnung

Also Published As

Publication number Publication date
NL180358C (nl)
GB714976A (en) 1954-09-08
IT504354A (US06291589-20010918-C00001.png)
FR1086898A (fr) 1955-02-16
CH316010A (de) 1956-09-15

Similar Documents

Publication Publication Date Title
DE10054962B4 (de) Leistungsmodul
DE2808531A1 (de) Lichtgetriggertes hochleistungs-halbleiterbauelement
DE2748350A1 (de) Waermeableitvorrichtung fuer monolithisch integrierte halbleiterschaltungen
DE1045551B (de) Halbleiteranordnung
DE1037014B (de) Verfahren zur Herstellung eines fuer Starkstrom geeigneten, hermetisch verschlossenen Gleichrichters
DE2748567C2 (de) Leistungshalbleiterbauelement
DE102013219959A1 (de) Halbleitervorrichtung und Verfahren zum Herstellen derselben
DE1013010B (de) Gehaeuse fuer einen Flaechengleichrichter
EP0169356B1 (de) Wechsellastbeständiges, schaltbares Halbleiterbauelement
DE2012440C3 (de) Halbleiteranordnung für gasdicht abgeschlossene scheibenförmige Halbleiterelemente
DE1564371B2 (de) Gleichrichter aus einer Vielzahl von Halbleiterdioden
DE2108850C2 (de) Verfahren zur Befestigung von Zuleitungen an Halbleiterplättchen
DE1846705U (de) Aufbau einer halbleiterdiodenanordnung.
DE102016224068B4 (de) Leistungshalbleiteranordnung und Verfahren zum Herstellen derselben
DE1943219A1 (de) Halbleitereinrichtung
DE102018200161B4 (de) Halbleiteranordnung und verfahren zum herstellen der halbleiteranordnung
DE69007419T2 (de) Anordnung von elektronischen Leistungsbauelementen.
DE7505830U (de) Vorrichtung zum hochspannungsfesten und gut waermeleitenden einbau von halbleiter-bauelementen
DE1464401A1 (de) Halbleiteranordnung
DE2940571A1 (de) Modul aus wenigstens zwei halbleiterbauelementen
DE1083439C2 (de) Verfahren zur Herstellung gekapselter Halbleiteranordnungen
DE2802439A1 (de) Halbleiter-sockel
DE4133198A1 (de) Duese fuer ein werkzeug zur materialbearbeitung
DE102018217420B4 (de) Halbleitervorrichtung
AT232131B (de) In ein Gehäuse eingeschlossene Halbleiteranordnung