DE10295162D2 - Integriertes Halbleiterbauelement für Hochfrequenzmessungen und dessen Verwendung - Google Patents

Integriertes Halbleiterbauelement für Hochfrequenzmessungen und dessen Verwendung

Info

Publication number
DE10295162D2
DE10295162D2 DE10295162T DE10295162T DE10295162D2 DE 10295162 D2 DE10295162 D2 DE 10295162D2 DE 10295162 T DE10295162 T DE 10295162T DE 10295162 T DE10295162 T DE 10295162T DE 10295162 D2 DE10295162 D2 DE 10295162D2
Authority
DE
Germany
Prior art keywords
semiconductor device
integrated semiconductor
frequency measurements
measurements
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE10295162T
Other languages
English (en)
Inventor
Ewald Schmidt
Heinz Pfizenmaier
Hans Irion
Juergen Hasch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Priority to DE10295162T priority Critical patent/DE10295162D2/de
Application granted granted Critical
Publication of DE10295162D2 publication Critical patent/DE10295162D2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B9/00—Generation of oscillations using transit-time effects
    • H03B9/12—Generation of oscillations using transit-time effects using solid state devices, e.g. Gunn-effect devices
    • H03B9/14—Generation of oscillations using transit-time effects using solid state devices, e.g. Gunn-effect devices and elements comprising distributed inductance and capacitance
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B5/00—Generation of oscillations using amplifier with regenerative feedback from output to input
    • H03B5/08—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance
    • H03B5/12—Generation of oscillations using amplifier with regenerative feedback from output to input with frequency-determining element comprising lumped inductance and capacitance active element in amplifier being semiconductor device
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/02—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S13/00
    • G01S7/03—Details of HF subsystems specially adapted therefor, e.g. common to transmitter and receiver
    • G01S7/032—Constructional details for solid-state radar subsystems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
    • H01L29/861—Diodes
    • H01L29/864—Transit-time diodes, e.g. IMPATT, TRAPATT diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
    • H01Q19/062—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens for focusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0428—Substantially flat resonant element parallel to ground plane, e.g. patch antenna radiating a circular polarised wave
    • H01Q9/0435—Substantially flat resonant element parallel to ground plane, e.g. patch antenna radiating a circular polarised wave using two feed points
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03B—GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING, BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN A NON-SWITCHING MANNER; GENERATION OF NOISE BY SUCH CIRCUITS
    • H03B9/00—Generation of oscillations using transit-time effects
    • H03B9/12—Generation of oscillations using transit-time effects using solid state devices, e.g. Gunn-effect devices
    • H03B9/14—Generation of oscillations using transit-time effects using solid state devices, e.g. Gunn-effect devices and elements comprising distributed inductance and capacitance
    • H03B9/147—Generation of oscillations using transit-time effects using solid state devices, e.g. Gunn-effect devices and elements comprising distributed inductance and capacitance the frequency being determined by a stripline resonator
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16135—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/16145—Disposition the bump connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12032—Schottky diode
DE10295162T 2001-11-09 2002-08-16 Integriertes Halbleiterbauelement für Hochfrequenzmessungen und dessen Verwendung Expired - Lifetime DE10295162D2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE10295162T DE10295162D2 (de) 2001-11-09 2002-08-16 Integriertes Halbleiterbauelement für Hochfrequenzmessungen und dessen Verwendung

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10156258A DE10156258A1 (de) 2001-11-09 2001-11-09 Integriertes Halbleiterbauelement für Hochfrequenzmessungen und dessen Verwendung
DE10295162T DE10295162D2 (de) 2001-11-09 2002-08-16 Integriertes Halbleiterbauelement für Hochfrequenzmessungen und dessen Verwendung
PCT/DE2002/003004 WO2003041117A2 (de) 2001-11-09 2002-08-16 Integrirertes halbleiterbauelement für hochfrequenzmessungen und dessen verwendung

Publications (1)

Publication Number Publication Date
DE10295162D2 true DE10295162D2 (de) 2004-11-11

Family

ID=7705944

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10156258A Withdrawn DE10156258A1 (de) 2001-11-09 2001-11-09 Integriertes Halbleiterbauelement für Hochfrequenzmessungen und dessen Verwendung
DE10295162T Expired - Lifetime DE10295162D2 (de) 2001-11-09 2002-08-16 Integriertes Halbleiterbauelement für Hochfrequenzmessungen und dessen Verwendung

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10156258A Withdrawn DE10156258A1 (de) 2001-11-09 2001-11-09 Integriertes Halbleiterbauelement für Hochfrequenzmessungen und dessen Verwendung

Country Status (7)

Country Link
US (1) US7109917B2 (de)
EP (1) EP1446824A2 (de)
JP (1) JP2005509286A (de)
KR (1) KR20040053271A (de)
AU (1) AU2002320950A1 (de)
DE (2) DE10156258A1 (de)
WO (1) WO2003041117A2 (de)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10156258A1 (de) * 2001-11-09 2003-05-28 Bosch Gmbh Robert Integriertes Halbleiterbauelement für Hochfrequenzmessungen und dessen Verwendung
DE10156257A1 (de) * 2001-11-09 2003-05-28 Bosch Gmbh Robert Mikromechanischer Resonator
WO2005045466A1 (en) * 2003-11-04 2005-05-19 Cmte Development Limited Cavity monitoring system
US7796080B1 (en) * 2004-12-08 2010-09-14 Hrl Laboratories, Llc Wide field of view millimeter wave imager
DE102007034329A1 (de) * 2007-07-24 2009-01-29 Robert Bosch Gmbh Radarvorrichtung
US7830301B2 (en) * 2008-04-04 2010-11-09 Toyota Motor Engineering & Manufacturing North America, Inc. Dual-band antenna array and RF front-end for automotive radars
US20100152972A1 (en) * 2008-12-15 2010-06-17 Joe Charles Attard Parallel park assist
DE102010042276A1 (de) * 2010-10-11 2012-04-12 Robert Bosch Gmbh Sensor, Justageverfahren und Vermessungsverfahren für einen Sensor
JP5880508B2 (ja) * 2013-09-24 2016-03-09 日本電気株式会社 配線基板およびその製造方法
DE102018200647A1 (de) * 2018-01-16 2019-07-18 Vega Grieshaber Kg Radar-transceiver-chip

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3882419A (en) * 1974-03-01 1975-05-06 Rca Corp Varactor tuned impatt diode microwave oscillator
US4514707A (en) * 1982-06-15 1985-04-30 Motorola, Inc. Dielectric resonator controlled planar IMPATT diode oscillator
DE3322304A1 (de) * 1983-06-21 1985-01-03 Siemens AG, 1000 Berlin und 8000 München Streifenleitungsdopplerradar
US5511238A (en) * 1987-06-26 1996-04-23 Texas Instruments Incorporated Monolithic microwave transmitter/receiver
US4931799A (en) * 1989-04-24 1990-06-05 Hughes Aircraft Company Short-range radar transceiver employing a FET oscillator
US4982168A (en) * 1989-11-01 1991-01-01 Motorola, Inc. High peak power microwave oscillator
US5204641A (en) * 1992-03-11 1993-04-20 Space Systems/Loral, Inc. Conducting plane resonator stabilized oscillator
GB2291551B (en) * 1994-06-24 1998-03-18 Roscoe C Williams Limited Electronic viewing aid
US6133795A (en) * 1994-06-24 2000-10-17 Williams; Roscoe Charles Oscillator circuit
US5432482A (en) * 1994-07-28 1995-07-11 Bailey; Michael J. Variable-frequency microwave oscillator with multi-resonator matching circuit
DE19729095A1 (de) * 1997-07-08 1999-02-04 Bosch Gmbh Robert Kraftfahrzeug-Radarsystem
EP0978729A3 (de) * 1998-08-07 2002-03-20 Hitachi, Ltd. Hochfrequenz-Sende-Empfangsvorrichtung für Fahrzeug-Radarsysteme
DE19931928A1 (de) 1999-07-08 2001-01-11 Bosch Gmbh Robert Radarsender
DE10156258A1 (de) * 2001-11-09 2003-05-28 Bosch Gmbh Robert Integriertes Halbleiterbauelement für Hochfrequenzmessungen und dessen Verwendung
DE10156255A1 (de) * 2001-11-09 2003-05-22 Bosch Gmbh Robert Hochfrequenz-Oszillator für eine integrierte Halbleiterschaltung und dessen Verwendung

Also Published As

Publication number Publication date
KR20040053271A (ko) 2004-06-23
EP1446824A2 (de) 2004-08-18
DE10156258A1 (de) 2003-05-28
US7109917B2 (en) 2006-09-19
WO2003041117A2 (de) 2003-05-15
WO2003041117A3 (de) 2003-09-18
US20050001632A1 (en) 2005-01-06
AU2002320950A1 (en) 2003-05-19
JP2005509286A (ja) 2005-04-07

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Legal Events

Date Code Title Description
8141 Disposal/no request for examination