DE10216671A1 - Beschichtungsanlage - Google Patents
BeschichtungsanlageInfo
- Publication number
- DE10216671A1 DE10216671A1 DE2002116671 DE10216671A DE10216671A1 DE 10216671 A1 DE10216671 A1 DE 10216671A1 DE 2002116671 DE2002116671 DE 2002116671 DE 10216671 A DE10216671 A DE 10216671A DE 10216671 A1 DE10216671 A1 DE 10216671A1
- Authority
- DE
- Germany
- Prior art keywords
- cathode
- substrate
- space
- coating system
- gas supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0089—Reactive sputtering in metallic mode
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0021—Reactive sputtering or evaporation
- C23C14/0036—Reactive sputtering
- C23C14/0068—Reactive sputtering characterised by means for confinement of gases or sputtered material, e.g. screens, baffles
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Electrodes For Compound Or Non-Metal Manufacture (AREA)
- Fuel Cell (AREA)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002116671 DE10216671A1 (de) | 2002-04-15 | 2002-04-15 | Beschichtungsanlage |
EP03746233A EP1495152A2 (de) | 2002-04-15 | 2003-04-11 | Beschichtungsanlage |
CN 03813834 CN1662672A (zh) | 2002-04-15 | 2003-04-11 | 覆层设备 |
PCT/DE2003/001216 WO2003087426A2 (de) | 2002-04-15 | 2003-04-11 | Beschichtungsanlage |
US10/511,389 US20050145487A1 (en) | 2002-04-15 | 2003-04-11 | Coating installation |
JP2003584359A JP2005522584A (ja) | 2002-04-15 | 2003-04-11 | 被覆装置 |
AU2003232604A AU2003232604A1 (en) | 2002-04-15 | 2003-04-11 | Coating installation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2002116671 DE10216671A1 (de) | 2002-04-15 | 2002-04-15 | Beschichtungsanlage |
Publications (1)
Publication Number | Publication Date |
---|---|
DE10216671A1 true DE10216671A1 (de) | 2003-12-18 |
Family
ID=29224490
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE2002116671 Withdrawn DE10216671A1 (de) | 2002-04-15 | 2002-04-15 | Beschichtungsanlage |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1495152A2 (ru) |
JP (1) | JP2005522584A (ru) |
CN (1) | CN1662672A (ru) |
AU (1) | AU2003232604A1 (ru) |
DE (1) | DE10216671A1 (ru) |
WO (1) | WO2003087426A2 (ru) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8192597B2 (en) * | 2006-03-28 | 2012-06-05 | Nv Bekaert Sa | Coating apparatus |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4428811A (en) * | 1983-04-04 | 1984-01-31 | Borg-Warner Corporation | Rapid rate reactive sputtering of a group IVb metal |
DE3331707A1 (de) * | 1983-09-02 | 1985-03-21 | Leybold-Heraeus GmbH, 5000 Köln | Verfahren und vorrichtung zum reaktiven aufstaeuben von verbindungen von metallen und halbleitern |
JPS62287074A (ja) * | 1986-06-04 | 1987-12-12 | Sumitomo Bakelite Co Ltd | ロ−ルコ−タ−装置 |
JPH042771A (ja) * | 1990-04-18 | 1992-01-07 | Fujitsu Ltd | スパッタリング装置 |
JPH05132774A (ja) * | 1991-11-12 | 1993-05-28 | Fujitsu Ltd | スパツタ装置 |
JPH0641733A (ja) * | 1992-07-28 | 1994-02-15 | Matsushita Electric Ind Co Ltd | 反応性スパッタリング装置 |
JPH06172995A (ja) * | 1992-12-09 | 1994-06-21 | Tokyo Electron Ltd | マグネトロンスパッタリング装置及びスパッタリングガン |
DE4413378A1 (de) * | 1994-04-19 | 1995-10-26 | Leybold Ag | Einrichtung zum Beschichten eines Substrats |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8200902A (nl) * | 1982-03-05 | 1983-10-03 | Philips Nv | Magnetron-kathodesputtersysteem. |
US5427665A (en) * | 1990-07-11 | 1995-06-27 | Leybold Aktiengesellschaft | Process and apparatus for reactive coating of a substrate |
ZA956811B (en) * | 1994-09-06 | 1996-05-14 | Boc Group Inc | Dual cylindrical target magnetron with multiple anodes |
DE19609970A1 (de) * | 1996-03-14 | 1997-09-18 | Leybold Systems Gmbh | Vorrichtung zum Aufbringen dünner Schichten auf ein Substrat |
EP0860513A3 (en) * | 1997-02-19 | 2000-01-12 | Canon Kabushiki Kaisha | Thin film forming apparatus and process for forming thin film using same |
US6238527B1 (en) * | 1997-10-08 | 2001-05-29 | Canon Kabushiki Kaisha | Thin film forming apparatus and method of forming thin film of compound by using the same |
-
2002
- 2002-04-15 DE DE2002116671 patent/DE10216671A1/de not_active Withdrawn
-
2003
- 2003-04-11 CN CN 03813834 patent/CN1662672A/zh active Pending
- 2003-04-11 EP EP03746233A patent/EP1495152A2/de not_active Withdrawn
- 2003-04-11 WO PCT/DE2003/001216 patent/WO2003087426A2/de not_active Application Discontinuation
- 2003-04-11 AU AU2003232604A patent/AU2003232604A1/en not_active Abandoned
- 2003-04-11 JP JP2003584359A patent/JP2005522584A/ja not_active Withdrawn
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4428811A (en) * | 1983-04-04 | 1984-01-31 | Borg-Warner Corporation | Rapid rate reactive sputtering of a group IVb metal |
DE3331707A1 (de) * | 1983-09-02 | 1985-03-21 | Leybold-Heraeus GmbH, 5000 Köln | Verfahren und vorrichtung zum reaktiven aufstaeuben von verbindungen von metallen und halbleitern |
JPS62287074A (ja) * | 1986-06-04 | 1987-12-12 | Sumitomo Bakelite Co Ltd | ロ−ルコ−タ−装置 |
JPH042771A (ja) * | 1990-04-18 | 1992-01-07 | Fujitsu Ltd | スパッタリング装置 |
JPH05132774A (ja) * | 1991-11-12 | 1993-05-28 | Fujitsu Ltd | スパツタ装置 |
JPH0641733A (ja) * | 1992-07-28 | 1994-02-15 | Matsushita Electric Ind Co Ltd | 反応性スパッタリング装置 |
JPH06172995A (ja) * | 1992-12-09 | 1994-06-21 | Tokyo Electron Ltd | マグネトロンスパッタリング装置及びスパッタリングガン |
DE4413378A1 (de) * | 1994-04-19 | 1995-10-26 | Leybold Ag | Einrichtung zum Beschichten eines Substrats |
Also Published As
Publication number | Publication date |
---|---|
EP1495152A2 (de) | 2005-01-12 |
WO2003087426A2 (de) | 2003-10-23 |
AU2003232604A8 (en) | 2003-10-27 |
AU2003232604A1 (en) | 2003-10-27 |
WO2003087426A3 (de) | 2004-02-19 |
CN1662672A (zh) | 2005-08-31 |
JP2005522584A (ja) | 2005-07-28 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0205028B1 (de) | Vorrichtung zum Aufbringen dünner Schichten auf ein Substrat | |
DE4005796C2 (de) | Vorrichtung zur Herstellung einer Dünnschicht | |
DE973156C (de) | Verfahren zur Herstellung lichtelektrisch leitender Schichten fuer Photowiderstaende | |
EP0812368B1 (de) | Verfahren zur reaktiven beschichtung | |
DE3927869C2 (ru) | ||
DE4106513C2 (de) | Verfahren zur Regelung eines reaktiven Sputterprozesses und Vorrichtung zur Durchführung des Verfahrens | |
EP0282836B1 (de) | Verfahren und Vorrichtung zum Aufstäuben hochohmiger Schichten durch Katodenzerstäubung | |
DE2750611A1 (de) | Verfahren und vorrichtung zur beschichtung eines substrats | |
DE2215151A1 (de) | Verfahren zum herstellen von duennen schichten aus tantal | |
EP0416241A2 (de) | Vorrichtung zum Beschichten eines Substrats | |
DE102011075851B4 (de) | Verfahren zur stabilen reaktiven Abscheidung von Oxiden von einer Rohrmagnetronanordnung in Vakuumbeschichtungsanlagen und Anordnung zur Durchführung des Verfahrens | |
CH641498A5 (de) | Verfahren und vorrichtung zur regelung der verdampfungsrate oxidierbarer stoffe beim reaktiven vakuumaufdampfen. | |
EP0767483B1 (de) | Vorrichtung zum Beschichten von Substraten im Vakuum | |
DE3602804A1 (de) | Verfahren zur herstellung von substraten mit gleichmaessiger verteilung extrem feiner koerner | |
EP1759036A1 (de) | Beschichtungsvorrichtung zum beschichten eines substrats, sowie ein verfahren zum beschichten | |
EP0504477B1 (de) | Vorrichtung zum Beschichten eines Substrats | |
DE1515300A1 (de) | Vorrichtung zur Herstellung hochwertiger duenner Schichten durch Kathodenzerstaeubung | |
DE10216671A1 (de) | Beschichtungsanlage | |
DE19506513A1 (de) | Einrichtung zur reaktiven Beschichtung | |
WO2005059197A2 (de) | Verfahren und vorrichtung zum magnetronsputtern | |
DE1181519B (de) | Verfahren, um auf einem Werkstueck mittels Kathodenzerstaeubung einen UEberzug aus zwei oder mehreren Stoffen niederzuschlagen, sowie Vorrichtung zur Durchfuehrung des Verfahrens | |
DE19605932A1 (de) | Verfahren zum Ablagern einer optisch transparenten und elektrisch leitenden Schicht auf einem Substrat aus durchscheinendem Werkstoff | |
DE3426145A1 (de) | Verfahren zur regelung der plasmaparameter in vakuumbeschichtungseinrichtungen mit bogenentladungen | |
DE4131181C1 (ru) | ||
EP3019640B1 (de) | Target zur reaktiven sputter-abscheidung elektrisch-isolierender schichten |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
OM8 | Search report available as to paragraph 43 lit. 1 sentence 1 patent law | ||
8127 | New person/name/address of the applicant |
Owner name: APPLIED FILMS GMBH & CO. KG, 63755 ALZENAU, DE |
|
8127 | New person/name/address of the applicant |
Owner name: FRAUNHOFER INSTITUT FUER SCHICHT- UND OBERFLAECHENTECHNIK Owner name: APPLIED FILMS GMBH & CO. KG, 63755 ALZENAU, DE |
|
8127 | New person/name/address of the applicant |
Owner name: APPLIED MATERIALS GMBH & CO. KG, 63755 ALZENAU, DE Owner name: VERITAS AG, 63571 GELNHAUSEN, DE |
|
8127 | New person/name/address of the applicant |
Owner name: FRAUNHOFER INSTITUT FUER SCHICHT- UND OBERFLAE, DE Owner name: APPLIED MATERIALS GMBH & CO. KG, 63755 ALZENAU, DE |
|
8139 | Disposal/non-payment of the annual fee |