DE102021001714A1 - Kreiselpumpe mit Kühlung der Elektronik innerhalb eines Elektronikgehäuses - Google Patents

Kreiselpumpe mit Kühlung der Elektronik innerhalb eines Elektronikgehäuses Download PDF

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Publication number
DE102021001714A1
DE102021001714A1 DE102021001714.5A DE102021001714A DE102021001714A1 DE 102021001714 A1 DE102021001714 A1 DE 102021001714A1 DE 102021001714 A DE102021001714 A DE 102021001714A DE 102021001714 A1 DE102021001714 A1 DE 102021001714A1
Authority
DE
Germany
Prior art keywords
module
housing
centrifugal pump
slot
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE102021001714.5A
Other languages
German (de)
English (en)
Inventor
David Krill
Manuel Schwert
Federico Di Santo
Mattia Liboni
Carlo Prearo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KSB SE and Co KGaA
Original Assignee
KSB SE and Co KGaA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KSB SE and Co KGaA filed Critical KSB SE and Co KGaA
Priority to DE102021001714.5A priority Critical patent/DE102021001714A1/de
Priority to PCT/EP2022/058448 priority patent/WO2022207725A1/de
Priority to CN202280024904.0A priority patent/CN117099493A/zh
Priority to EP22719857.9A priority patent/EP4316223A1/de
Publication of DE102021001714A1 publication Critical patent/DE102021001714A1/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D13/00—Pumping installations or systems
    • F04D13/02—Units comprising pumps and their driving means
    • F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D13/0686—Mechanical details of the pump control unit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/5813—Cooling the control unit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
DE102021001714.5A 2021-04-01 2021-04-01 Kreiselpumpe mit Kühlung der Elektronik innerhalb eines Elektronikgehäuses Pending DE102021001714A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE102021001714.5A DE102021001714A1 (de) 2021-04-01 2021-04-01 Kreiselpumpe mit Kühlung der Elektronik innerhalb eines Elektronikgehäuses
PCT/EP2022/058448 WO2022207725A1 (de) 2021-04-01 2022-03-30 Kreiselpumpe mit kühlung der elektronik innerhalb eines elektronikgehäuses
CN202280024904.0A CN117099493A (zh) 2021-04-01 2022-03-30 带有在电子器件壳体内的电子器件的冷却的离心泵
EP22719857.9A EP4316223A1 (de) 2021-04-01 2022-03-30 Kreiselpumpe mit kühlung der elektronik innerhalb eines elektronikgehäuses

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102021001714.5A DE102021001714A1 (de) 2021-04-01 2021-04-01 Kreiselpumpe mit Kühlung der Elektronik innerhalb eines Elektronikgehäuses

Publications (1)

Publication Number Publication Date
DE102021001714A1 true DE102021001714A1 (de) 2022-10-06

Family

ID=81448422

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102021001714.5A Pending DE102021001714A1 (de) 2021-04-01 2021-04-01 Kreiselpumpe mit Kühlung der Elektronik innerhalb eines Elektronikgehäuses

Country Status (4)

Country Link
EP (1) EP4316223A1 (zh)
CN (1) CN117099493A (zh)
DE (1) DE102021001714A1 (zh)
WO (1) WO2022207725A1 (zh)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007016255A1 (de) 2006-04-28 2007-11-08 Bühler Motor GmbH Kreiselpumpe
US20070287005A1 (en) 2002-02-08 2007-12-13 Saikumar Jayaraman Phase change material containing fusible particles as thermally conductive filler
DE102013002629A1 (de) 2013-02-15 2014-08-21 HKR Seuffer Automotive GmbH & Co. KG Deckelelement und Gehäusevorrichtung zur Verwendung des Deckelelements
DE112013004625T5 (de) 2012-09-21 2015-06-03 Hitachi Automotive Systems, Ltd. Elektronische Steuerungsvorrichtung

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4707726A (en) * 1985-04-29 1987-11-17 United Technologies Automotive, Inc. Heat sink mounting arrangement for a semiconductor
US5309979A (en) * 1993-06-08 1994-05-10 Delco Electronics Corp. Self clamping heat sink assembly
JP5603045B2 (ja) * 2009-09-24 2014-10-08 三菱電機株式会社 電動パワーステアリング装置用モータ装置
DE102009044368B4 (de) * 2009-10-30 2014-07-03 Lear Corporation Gmbh Kühlanordnung
DE102013202335A1 (de) * 2013-02-13 2014-08-14 Mahle International Gmbh Elektrische Fluidpumpe
DE102015202142A1 (de) * 2015-02-06 2016-08-11 Mahle International Gmbh Elektrische Einrichtung
JP6693706B2 (ja) * 2015-04-06 2020-05-13 株式会社デンソー 電子制御装置
EP3557080A1 (fr) * 2018-04-20 2019-10-23 Belenos Clean Power Holding AG Pompe à chaleur comprenant un compresseur de fluide

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070287005A1 (en) 2002-02-08 2007-12-13 Saikumar Jayaraman Phase change material containing fusible particles as thermally conductive filler
DE102007016255A1 (de) 2006-04-28 2007-11-08 Bühler Motor GmbH Kreiselpumpe
DE112013004625T5 (de) 2012-09-21 2015-06-03 Hitachi Automotive Systems, Ltd. Elektronische Steuerungsvorrichtung
DE102013002629A1 (de) 2013-02-15 2014-08-21 HKR Seuffer Automotive GmbH & Co. KG Deckelelement und Gehäusevorrichtung zur Verwendung des Deckelelements

Also Published As

Publication number Publication date
WO2022207725A1 (de) 2022-10-06
CN117099493A (zh) 2023-11-21
EP4316223A1 (de) 2024-02-07

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