Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
  • H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
  • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
  • F04D13/00—Pumping installations or systems
  • F04D13/02—Units comprising pumps and their driving means
  • F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
  • F04D13/0686—Mechanical details of the pump control unit
• • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
  • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
  • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
  • F04D29/00—Details, component parts, or accessories
  • F04D29/58—Cooling; Heating; Diminishing heat transfer
  • F04D29/5813—Cooling the control unit
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K7/00—Constructional details common to different types of electric apparatus
  • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
  • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
  • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
  • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
  • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
  • H01L23/367—Cooling facilitated by shape of device

Definitions

• the invention relates to a centrifugal pump with a two-part electronics housing, a first housing part being a heat sink and at least one printed circuit board with electronic components being mounted within the electronics housing.
• centrifugal pumps are becoming increasingly complex with increasing demands on the energy efficiency of the pumps.
• Energy-efficient pump operation especially in the area of heating circulating pumps, requires speed control in order to be able to dynamically adapt the current pump speed to the current system and environmental conditions.
• a frequency converter is required for the associated speed adjustment, the power modules of which require semiconductor switches, among other things.
• the electronics housing is at least partially formed by a first housing part, which at the same time assumes the function of a heat sink for heat dissipation to the outside.
• the components with the highest heat dissipation should ideally be thermally conductively coupled directly to the heat sink. Due to the construction, e.g. due to different component heights, a direct thermal coupling is not always possible.
• IC modules integrated circuits
• An example of such an IC module is a component for realizing a power correction filter.
• a separate heat sink adapted to the module package is fixed directly to the module housing. It is important here that the heat sink is pressed onto the surface of the IC modules with the necessary contact pressure, which complicates and takes a lot of effort to assemble, often with screw connections. In addition to the resulting increased assembly effort, the unit costs in series production naturally also increase due to the additional component.
• the object of the present invention is therefore to provide a cost-effective electronics for a centrifugal pump that can be made particularly small and space-saving and reduces the number of components required.
• IC module integrated circuit
• Such an IC module has a chip with the applied integrated circuit, which is encapsulated in a module housing for protection and for easier contacting.
• the IC module can be an electronic component with increased cooling requirements, which requires a dedicated heat sink in the conventional design.
• the IC module is vertically aligned on the circuit board, its large side surfaces preferably protrude perpendicularly from the circuit board, while a transverse or longitudinal end face of the module housing rests on the circuit board or is aligned parallel to the circuit board with a small distance from it.
• the vertical design of the IC module and its vertical assembly or laying on the circuit board reduces the space required on the circuit board.
• the IC module into a slot in the opposite Ge housing wall, ie the component can be inserted into a slot in the first housing part and consequently thermally coupled directly to the heat sink.
• the heat loss generated can therefore be dissipated better through the housing part designed as a heat sink and a separate, dedicated heat sink for the IC module can be dispensed with. This not only reduces the time required for pump assembly, but also reduces unit costs due to the saving of an additional component.
• the dimensioning of the slot is adapted to the thickness of the IC module, i.e. the package size of the module housing.
• the minimized gap dimension between slotted wall and component ensures an improved thermal connection, at the same time the component can be additionally stabilized and fixed by the heat sink.
• the opposite, large-area side walls of the module housing of the IC module are in contact with the slotted walls. This achieves cooling of the IC module on both sides.
• at least one longitudinal or transverse end face of the module housing is in contact with the bottom of the slot.
• the longitudinal or transverse end face can also be spaced apart from the bottom of the slot. The end faces projecting perpendicularly from the circuit board can be exposed.
• a single projection with a slot-like depression is conceivable. It is also conceivable to form at least two separate projections whose spatial distance from one another defines the slot.
• the shape of the one or more projections is fundamentally arbitrary. If two projections are provided, they should each be designed with at least one surface projecting perpendicularly from the housing wall. The vertically projecting surfaces of the at least two projections face each other and consequently form the slot walls. At least one, preferably both projections can be shaped like a ramp.
• the electronics board it makes sense for the electronics board to be separated by the first housing part, i. H. stored by the heatsink, which means that the IC module is simultaneously inserted into the slot provided for this purpose in the heatsink when the circuit board is mounted.
• the heat sink Since the heat sink is usually made of metal or an electrically conductive material, it is often grounded.
• the electrical conductivity of the heat sink means that there must be electrical insulation between the IC module and the heat sink.
• the aforementioned heat-conducting pad is applied to the IC module before the circuit board is installed inside the heat sink.
• the thermal pad can be connected to the side surfaces of the IC module must be glued.
• the heat-conducting pad used can consist of a tear-resistant material, so that when the sealed IC module is inserted into the recess of the heat sink, there is no undesirable material abrasion due to shearing forces or frictional forces.
• the thermally conductive pad can be made of a reinforced material, in particular can include a woven mesh.
• the IC module addressed is preferably a power electronics module which is characterized by a comparatively large cooling requirement. It is conceivable, for example, that the IC module is a power factor correction filter (PFC) module for the pump electronics.
• the IC module can have a DIP package that enables it to be installed vertically on the circuit board.
• the board can be populated on one or both sides. With one-sided assembly, the available circuit board space can be optimally utilized through vertical installation.
• the slot in the wall of the first housing part can already be created during the manufacture of the housing blank, which is preferably formed using a casting process. Alternatively, this can be produced later using a machining process, in particular milling. However, the latter means an additional production step.
• the centrifugal pump can preferably be an in-line pump, particularly preferably a heating circulating pump.
• Figure 1 a plan view of the main circuit board of the pump electronics for a heating circulation pump
• FIG. 2 a detailed representation of the IC module introduced into the slot.
• the exemplary embodiment described below shows the centrifugal pump according to the invention, which is designed here by way of example as a heating circulating pump.
• FIG. 1 shows the main circuit board 1 used for the pump electronics, which has a large number of electronic components for realizing a frequency converter.
• a power correction filter 10 is also installed, which is intended to reduce the network load by suppressing unwanted harmonics.
• a PFC includes at least one semiconductor switching element whose switching operations ensure increased heat dissipation.
• the circuit board 1 is only equipped on one side, with the equipped circuit board side 1a facing the heat sink 20 in the installed position (see FIG. 2).
• the circuit of the power correction filter 10 is not formed by discrete components, but instead an integrated circuit (IC module), i.e. a PFC module 10, e.g. with the shown DIP housing (Dual In-line package) soldered to circuit board 1.
• IC module integrated circuit
• the PFC module 10 is not soldered to the circuit board surface 1a in a horizontal design, but instead stands vertically so that the largest side surfaces 10a, 10b of the PFC module project perpendicularly from the circuit board side 1a. Due to the design with DIP housing, the metal feet of module 10 are passed through holes on the unequipped circuit board side and soldered there.
• the electronics housing of the centrifugal pump is also designed in two parts, with a first housing part consisting of a metallic heat sink 20, in particular made of aluminum.
• the electronics board 1 is mounted on the inside of the heat sink 20 and additionally fixed to it, in particular screwed.
• the equipped circuit board side 1a thus faces the inner wall of the heat sink 20 in the installed position.
• On the inner housing wall of the heat sink 20 are located at the height of the PFC module 10, two ramp-like projections 21a, 21b of the heatsink pers 20, which are spatially separated from one another.
• the walls 22a, 22b of the projections 21a, 21b projecting perpendicularly from the inner wall of the housing lie opposite one another and form the slot 23 according to the invention for receiving the PFC module 10.
• the spacing of the walls 22a, 22b from one another and their dimensions is based on the The thickness and height of the PFC housing are matched so that the module 10 is embedded within the slot with the smallest possible gap.
• the PFC module 10 When mounting the electronic circuit board 1 on the structure of the heat sink 20, the PFC module 10 is pushed into the slot 23 at the same time, the large-area sides 10a, 10b of the PFC module 10 coming into contact with the vertically projecting slot walls 22a, 22b. which results in an ideal thermal coupling between the PFC module 10 and the heat sink 20 and cooling of the module 10 on both sides is achieved.
• a thermally conductive pad 11 is applied to the PFC module 10 before the circuit board is mounted, so that the large side walls 10a, 10b and the longitudinal end face of the PFC Module 10 are covered.
• the heat-conducting pad 11 consists of a flat and flexible material that is glued to at least the side surfaces 10a, 10b of the PFC module.
• the material of the thermally conductive pad is reinforced with a woven mesh to prevent or minimize damage to the pad surface caused by friction when inserting the module 10 into the slot 23.
• thermally conductive pad 11 does not end with the side surfaces 10a, 10b in the area of the circuit board 1, but projects beyond it and outwards is angled or turned over.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Mechanical Engineering (AREA)
• General Engineering & Computer Science (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Priority Applications (2)

Applications Claiming Priority (2)

Publications (1)

Family

ID=81448422

Family Applications (1)

Country Status (4)

Citations (8)

Family Cites Families (4)

• 2021
  • 2021-04-01 DE DE102021001714.5A patent/DE102021001714A1/de active Pending
• 2022
  • 2022-03-30 EP EP22719857.9A patent/EP4316223A1/de active Pending
  • 2022-03-30 WO PCT/EP2022/058448 patent/WO2022207725A1/de active Application Filing
  • 2022-03-30 CN CN202280024904.0A patent/CN117099493A/zh active Pending

Patent Citations (8)

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