DE102016220757A1 - Verfahren und Vorrichtung zur Materialbahnbeobachtung und Materialbahninspektion - Google Patents

Verfahren und Vorrichtung zur Materialbahnbeobachtung und Materialbahninspektion Download PDF

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Publication number
DE102016220757A1
DE102016220757A1 DE102016220757.1A DE102016220757A DE102016220757A1 DE 102016220757 A1 DE102016220757 A1 DE 102016220757A1 DE 102016220757 A DE102016220757 A DE 102016220757A DE 102016220757 A1 DE102016220757 A1 DE 102016220757A1
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Germany
Prior art keywords
binning
web
section
control unit
matrix chip
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Pending
Application number
DE102016220757.1A
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German (de)
English (en)
Inventor
Markus Herrmann
Manfred Kröhn
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texmag GmbH Vertriebsgesellschaft
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Texmag GmbH Vertriebsgesellschaft
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=60083792&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE102016220757(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Texmag GmbH Vertriebsgesellschaft filed Critical Texmag GmbH Vertriebsgesellschaft
Priority to DE102016220757.1A priority Critical patent/DE102016220757A1/de
Priority to EP17195965.3A priority patent/EP3312596B1/de
Priority to KR1020170135385A priority patent/KR102416273B1/ko
Priority to US15/788,333 priority patent/US10878552B2/en
Priority to CN201710979576.0A priority patent/CN107976450B/zh
Priority to JP2017203346A priority patent/JP7266362B2/ja
Publication of DE102016220757A1 publication Critical patent/DE102016220757A1/de
Priority to JP2022045740A priority patent/JP7311665B2/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901—Optical details; Scanning details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G01N21/8901—Optical details; Scanning details
    • G01N21/8903—Optical details; Scanning details using a multiple detector array
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/69—Control of means for changing angle of the field of view, e.g. optical zoom objectives or electronic zooming
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/90—Arrangement of cameras or camera modules, e.g. multiple cameras in TV studios or sports stadiums
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/44—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array
    • H04N25/443—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by partially reading an SSIS array by reading pixels from selected 2D regions of the array, e.g. for windowing or digital zooming
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/40—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled
    • H04N25/46—Extracting pixel data from image sensors by controlling scanning circuits, e.g. by modifying the number of pixels sampled or to be sampled by combining or binning pixels
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8861—Determining coordinates of flaws
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8861—Determining coordinates of flaws
    • G01N2021/8864—Mapping zones of defects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8867—Grading and classifying of flaws using sequentially two or more inspection runs, e.g. coarse and fine, or detecting then analysing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10148—Varying focus
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10141—Special mode during image acquisition
    • G06T2207/10152—Varying illumination
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30124—Fabrics; Textile; Paper

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Signal Processing (AREA)
  • Textile Engineering (AREA)
  • Multimedia (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Theoretical Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
DE102016220757.1A 2016-10-21 2016-10-21 Verfahren und Vorrichtung zur Materialbahnbeobachtung und Materialbahninspektion Pending DE102016220757A1 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102016220757.1A DE102016220757A1 (de) 2016-10-21 2016-10-21 Verfahren und Vorrichtung zur Materialbahnbeobachtung und Materialbahninspektion
EP17195965.3A EP3312596B1 (de) 2016-10-21 2017-10-11 Verfahren und vorrichtung zur materialbahnbeobachtung und materialbahninspektion
KR1020170135385A KR102416273B1 (ko) 2016-10-21 2017-10-18 소재 웹 관찰 및 소재 웹 검사를 위한 방법 및 장치
US15/788,333 US10878552B2 (en) 2016-10-21 2017-10-19 Method and device for material web monitoring and material web inspection
CN201710979576.0A CN107976450B (zh) 2016-10-21 2017-10-19 用于材料幅观测和材料幅检查的方法和设备
JP2017203346A JP7266362B2 (ja) 2016-10-21 2017-10-20 帯状材料観察および帯状材料検査のための方法および装置
JP2022045740A JP7311665B2 (ja) 2016-10-21 2022-03-22 帯状材料観察および帯状材料検査のための方法および装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102016220757.1A DE102016220757A1 (de) 2016-10-21 2016-10-21 Verfahren und Vorrichtung zur Materialbahnbeobachtung und Materialbahninspektion

Publications (1)

Publication Number Publication Date
DE102016220757A1 true DE102016220757A1 (de) 2018-04-26

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DE102016220757.1A Pending DE102016220757A1 (de) 2016-10-21 2016-10-21 Verfahren und Vorrichtung zur Materialbahnbeobachtung und Materialbahninspektion

Country Status (6)

Country Link
US (1) US10878552B2 (enExample)
EP (1) EP3312596B1 (enExample)
JP (2) JP7266362B2 (enExample)
KR (1) KR102416273B1 (enExample)
CN (1) CN107976450B (enExample)
DE (1) DE102016220757A1 (enExample)

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EP3502637A1 (en) * 2017-12-23 2019-06-26 ABB Schweiz AG Method and system for real-time web manufacturing supervision
JP6927124B2 (ja) 2018-03-30 2021-08-25 東洋紡株式会社 熱収縮性ポリエステル系フィルム
JP2020000580A (ja) * 2018-06-29 2020-01-09 株式会社三洋物産 遊技機
JP2020000581A (ja) * 2018-06-29 2020-01-09 株式会社三洋物産 遊技機
JP2020000578A (ja) * 2018-06-29 2020-01-09 株式会社三洋物産 遊技機
JP2020000577A (ja) * 2018-06-29 2020-01-09 株式会社三洋物産 遊技機
EP3661191A1 (de) * 2018-11-27 2020-06-03 B&R Industrial Automation GmbH Verfahren zum auslesen eines flächensensors
KR102629343B1 (ko) * 2018-12-21 2024-01-26 삼성전자주식회사 다중 셀 구조의 카메라 모듈 및 그 카메라 모듈을 포함하는 휴대용 통신 장치
US20200371040A1 (en) * 2019-05-21 2020-11-26 Industrial Maintenance Engineering, Inc. d/b/a AIS Gauging Static full width measurement system
US11218641B2 (en) * 2019-09-09 2022-01-04 Qualcomm Incorporated Image capture mode adaptation
CN111586289A (zh) * 2020-03-31 2020-08-25 广东利元亨智能装备股份有限公司 一种高速飞拍控制方法及系统
JP7552181B2 (ja) 2020-09-16 2024-09-18 東洋製罐グループホールディングス株式会社 表面検査システム
KR102580271B1 (ko) 2021-02-25 2023-09-20 삼성전자주식회사 이미지센서를 이용한 다중 생체신호 측정 장치 및 방법과, 전자장치
KR102785049B1 (ko) * 2022-08-05 2025-03-21 코어포토닉스 리미티드 자동 조정 가능한 줌 시야를 갖는 줌 디지털 카메라용 시스템 및 방법
CN116718276A (zh) * 2023-04-20 2023-09-08 中国人民解放军93236部队 一种基于f数和像元尺寸匹配重构的红外成像系统

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US20050226466A1 (en) * 2004-04-06 2005-10-13 Quad/Tech, Inc. Image acquisition assembly
WO2007088250A1 (en) * 2006-02-01 2007-08-09 Viconsys Oy Device for monitoring a web
US20110141269A1 (en) * 2009-12-16 2011-06-16 Stephen Michael Varga Systems And Methods For Monitoring On-Line Webs Using Line Scan Cameras
US9377329B2 (en) * 2010-12-30 2016-06-28 Alltec Angewandte Laserlicht Technologie Gmbh Sensor apparatus
DE102012101310B3 (de) 2012-02-17 2013-04-11 Stephan Krebs Vorrichtung und Verfahren zur Druckbildkontrolle

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Publication number Publication date
KR20180044198A (ko) 2018-05-02
JP7311665B2 (ja) 2023-07-19
EP3312596A1 (de) 2018-04-25
JP2022091853A (ja) 2022-06-21
US10878552B2 (en) 2020-12-29
US20180114308A1 (en) 2018-04-26
JP2018066740A (ja) 2018-04-26
JP7266362B2 (ja) 2023-04-28
EP3312596B1 (de) 2021-11-17
KR102416273B1 (ko) 2022-07-05
CN107976450B (zh) 2021-10-29
CN107976450A (zh) 2018-05-01

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