DE102016201545A1 - Laserbearbeitungsvorrichtung - Google Patents
Laserbearbeitungsvorrichtung Download PDFInfo
- Publication number
- DE102016201545A1 DE102016201545A1 DE102016201545.1A DE102016201545A DE102016201545A1 DE 102016201545 A1 DE102016201545 A1 DE 102016201545A1 DE 102016201545 A DE102016201545 A DE 102016201545A DE 102016201545 A1 DE102016201545 A1 DE 102016201545A1
- Authority
- DE
- Germany
- Prior art keywords
- laser beam
- pulsed laser
- repetition frequency
- scanner
- coordinates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 30
- 238000009826 distribution Methods 0.000 claims abstract description 58
- 230000010355 oscillation Effects 0.000 claims abstract description 39
- 239000004065 semiconductor Substances 0.000 description 39
- 239000002390 adhesive tape Substances 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 10
- 238000001514 detection method Methods 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 8
- 238000003384 imaging method Methods 0.000 description 8
- 239000012216 imaging agent Substances 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000003754 machining Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- BUHVIAUBTBOHAG-FOYDDCNASA-N (2r,3r,4s,5r)-2-[6-[[2-(3,5-dimethoxyphenyl)-2-(2-methylphenyl)ethyl]amino]purin-9-yl]-5-(hydroxymethyl)oxolane-3,4-diol Chemical compound COC1=CC(OC)=CC(C(CNC=2C=3N=CN(C=3N=CN=2)[C@H]2[C@@H]([C@H](O)[C@@H](CO)O2)O)C=2C(=CC=CC=2)C)=C1 BUHVIAUBTBOHAG-FOYDDCNASA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910009372 YVO4 Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0823—Devices involving rotation of the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015-021457 | 2015-02-05 | ||
| JP2015021457A JP6510829B2 (ja) | 2015-02-05 | 2015-02-05 | レーザー加工装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102016201545A1 true DE102016201545A1 (de) | 2016-08-11 |
Family
ID=56498732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102016201545.1A Pending DE102016201545A1 (de) | 2015-02-05 | 2016-02-02 | Laserbearbeitungsvorrichtung |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6510829B2 (zh) |
| KR (1) | KR102351455B1 (zh) |
| CN (1) | CN105855724B (zh) |
| DE (1) | DE102016201545A1 (zh) |
| TW (1) | TWI660804B (zh) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008062261A (ja) | 2006-09-06 | 2008-03-21 | Disco Abrasive Syst Ltd | ビアホールの加工方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3774138B2 (ja) * | 2000-11-13 | 2006-05-10 | 住友重機械工業株式会社 | 加工計画方法、装置、及び、加工方法、装置 |
| TWI289896B (en) * | 2001-11-09 | 2007-11-11 | Semiconductor Energy Lab | Laser irradiation apparatus, laser irradiation method, and method of manufacturing a semiconductor device |
| JP4562577B2 (ja) | 2005-03-31 | 2010-10-13 | 信越半導体株式会社 | レーザーマーキング装置およびレーザーマーキング方法 |
| JP4846282B2 (ja) | 2005-06-29 | 2011-12-28 | ミヤチテクノス株式会社 | 電子部品パッケージ封止方法及び装置 |
| JP2008212999A (ja) * | 2007-03-06 | 2008-09-18 | Disco Abrasive Syst Ltd | レーザー加工装置 |
| JP5133033B2 (ja) * | 2007-11-26 | 2013-01-30 | 日立ビアメカニクス株式会社 | レーザ加工装置 |
| JP2012091218A (ja) * | 2010-10-28 | 2012-05-17 | Disco Corp | レーザー加工装置 |
| US8557683B2 (en) * | 2011-06-15 | 2013-10-15 | Applied Materials, Inc. | Multi-step and asymmetrically shaped laser beam scribing |
| US20120322235A1 (en) * | 2011-06-15 | 2012-12-20 | Wei-Sheng Lei | Wafer dicing using hybrid galvanic laser scribing process with plasma etch |
-
2015
- 2015-02-05 JP JP2015021457A patent/JP6510829B2/ja active Active
-
2016
- 2016-01-08 TW TW105100540A patent/TWI660804B/zh active
- 2016-01-29 CN CN201610066609.8A patent/CN105855724B/zh active Active
- 2016-02-02 KR KR1020160012857A patent/KR102351455B1/ko active IP Right Grant
- 2016-02-02 DE DE102016201545.1A patent/DE102016201545A1/de active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008062261A (ja) | 2006-09-06 | 2008-03-21 | Disco Abrasive Syst Ltd | ビアホールの加工方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160096551A (ko) | 2016-08-16 |
| JP2016140914A (ja) | 2016-08-08 |
| JP6510829B2 (ja) | 2019-05-08 |
| TWI660804B (zh) | 2019-06-01 |
| CN105855724B (zh) | 2019-05-31 |
| KR102351455B1 (ko) | 2022-01-13 |
| TW201636141A (zh) | 2016-10-16 |
| CN105855724A (zh) | 2016-08-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed | ||
| R016 | Response to examination communication |