DE102015219072A1 - Elektronikmodul für ein Getriebesteuergerät - Google Patents
Elektronikmodul für ein Getriebesteuergerät Download PDFInfo
- Publication number
- DE102015219072A1 DE102015219072A1 DE102015219072.2A DE102015219072A DE102015219072A1 DE 102015219072 A1 DE102015219072 A1 DE 102015219072A1 DE 102015219072 A DE102015219072 A DE 102015219072A DE 102015219072 A1 DE102015219072 A1 DE 102015219072A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- contact surface
- contact
- electronic module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10977—Encapsulated connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015219072.2A DE102015219072A1 (de) | 2015-10-02 | 2015-10-02 | Elektronikmodul für ein Getriebesteuergerät |
PCT/EP2016/069343 WO2017054981A1 (fr) | 2015-10-02 | 2016-08-15 | Module électronique pour un appareil de commande de transmission |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102015219072.2A DE102015219072A1 (de) | 2015-10-02 | 2015-10-02 | Elektronikmodul für ein Getriebesteuergerät |
Publications (1)
Publication Number | Publication Date |
---|---|
DE102015219072A1 true DE102015219072A1 (de) | 2017-04-06 |
Family
ID=56740224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE102015219072.2A Withdrawn DE102015219072A1 (de) | 2015-10-02 | 2015-10-02 | Elektronikmodul für ein Getriebesteuergerät |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102015219072A1 (fr) |
WO (1) | WO2017054981A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102018217481A1 (de) * | 2018-10-12 | 2020-04-16 | Robert Bosch Gmbh | Elektrische Verbindungsanordnung |
US11772179B2 (en) | 2018-07-06 | 2023-10-03 | Endress+Hauser SE+Co. KG | Method for producing a high-temperature resistant lead free solder joint, and high-temperature-resistant lead-free solder joint |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010039187A1 (de) | 2010-08-11 | 2012-02-16 | Robert Bosch Gmbh | Elektrische Verbindungsanordnung |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6300566B1 (en) * | 1998-03-13 | 2001-10-09 | Siemens Aktiengesellschaft | Electrical connection of a circuit carrier to a conductor-track carrier |
JP2006140273A (ja) * | 2004-11-11 | 2006-06-01 | Denso Corp | 電子制御装置およびその製造方法 |
JP5249096B2 (ja) * | 2009-03-13 | 2013-07-31 | アイシン・エィ・ダブリュ株式会社 | 電子回路装置 |
DE102010003927A1 (de) * | 2010-04-13 | 2011-10-13 | Zf Friedrichshafen Ag | Steuermodul |
-
2015
- 2015-10-02 DE DE102015219072.2A patent/DE102015219072A1/de not_active Withdrawn
-
2016
- 2016-08-15 WO PCT/EP2016/069343 patent/WO2017054981A1/fr active Application Filing
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010039187A1 (de) | 2010-08-11 | 2012-02-16 | Robert Bosch Gmbh | Elektrische Verbindungsanordnung |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11772179B2 (en) | 2018-07-06 | 2023-10-03 | Endress+Hauser SE+Co. KG | Method for producing a high-temperature resistant lead free solder joint, and high-temperature-resistant lead-free solder joint |
DE102018217481A1 (de) * | 2018-10-12 | 2020-04-16 | Robert Bosch Gmbh | Elektrische Verbindungsanordnung |
Also Published As
Publication number | Publication date |
---|---|
WO2017054981A1 (fr) | 2017-04-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP2163148B2 (fr) | Unité de commande électrique | |
DE102010047646B4 (de) | Harz-versiegelte elektronische Steuervorrichtung und Verfahren zur Herstellung derselben | |
DE102007042593B4 (de) | Modul für eine integrierte Steuerelektronik mit vereinfachtem Aufbau | |
EP3257339B1 (fr) | Composant mécatronique et son procédé de fabrication | |
EP2936556A1 (fr) | Module électronique contenant un circuit électronique enrobé de matière plastique et procédé pour le fabriquer | |
WO2015135734A1 (fr) | Composant électronique de puissance intégré dans une carte de circuit imprimé | |
DE102011085170A1 (de) | Steuermodul mit verklebter Trägerplatte | |
EP3292593B1 (fr) | Dispositif de connexion électrique | |
WO2016169711A1 (fr) | Module électronique et procédé pour encapsuler ledit module | |
DE102007019098B4 (de) | Modul für eine integrierte Steuerelektronik mit vereinfachtem Aufbau | |
DE102008019797A1 (de) | Kühlanordnung und Umrichter | |
DE102015219072A1 (de) | Elektronikmodul für ein Getriebesteuergerät | |
WO2016173747A1 (fr) | Module électronique, en particulier pour un module de commande de transmission | |
DE102014216587A1 (de) | Sensormodul mit einem gehäusten Sensor in einer Mehrlagenleiterplatte | |
DE102015218706B4 (de) | Elektronische Komponente | |
DE102007031562B4 (de) | Gehäuse mit einem elektrischen Modul | |
DE102007032594B4 (de) | Steuervorrichtung und Verfahren zur Herstellung einer Steuervorrichtung | |
WO2015135733A1 (fr) | Module capteur comportant un capteur encapsulé, dans une carte de circuit imprimé multicouche | |
DE102014216585A1 (de) | Kompakte Mehrlagenleiterplatte mit integriertem Sensor zum Einsatz in einem KFZ-Steuergerät | |
EP3284327A1 (fr) | Module électronique pour dispositif de commande de transmission | |
DE102017204438A1 (de) | Verfahren zum Herstellen eines elektronischen Steuermoduls und elektronisches Steuermodul | |
DE102017205216A1 (de) | Elektronikmodul für eine Getriebesteuereinheit und Getriebesteuereinheit | |
DE102016217554A1 (de) | Elektronische Baugruppe, insbesondere für ein Getriebesteuermodul, und Verfahren zum Herstellen einer elektronischen Baugruppe | |
DE102015210103A1 (de) | Verfahren zur Herstellung einer elektronischen Komponente und elektronische Komponente | |
DE102015217570B4 (de) | KFZ-Steuergerät mit integriertem Sensor und Sensortragkörper |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R119 | Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee |