WO2017054981A1 - Module électronique pour un appareil de commande de transmission - Google Patents

Module électronique pour un appareil de commande de transmission Download PDF

Info

Publication number
WO2017054981A1
WO2017054981A1 PCT/EP2016/069343 EP2016069343W WO2017054981A1 WO 2017054981 A1 WO2017054981 A1 WO 2017054981A1 EP 2016069343 W EP2016069343 W EP 2016069343W WO 2017054981 A1 WO2017054981 A1 WO 2017054981A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
contact surface
contact
conductor
Prior art date
Application number
PCT/EP2016/069343
Other languages
German (de)
English (en)
Inventor
Uwe Liskow
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2017054981A1 publication Critical patent/WO2017054981A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Definitions

  • the invention generally relates to an electronic module.
  • the invention relates to an electronic module for a transmission control unit of a motor vehicle.
  • a motor vehicle electronic modules which are usually a transmission control unit with an electronic circuit ("transmission control unit", TCU), at least one connector for connection to a
  • Vehicle wiring harness electrical interfaces for driving actuators and at least one sensor element.
  • the sensor elements can be designed in particular for determining a rotational speed and / or for determining paths or positions in the transmission.
  • such sensor elements as
  • Hall sensors such as in the form of an integrated circuit (or an “Integrated Circuits”, IC) or in the form of an application-specific integrated circuit (or “Application-Specific Integrated Circuit", ASIC).
  • Electronic modules also called integrated transmission control modules, it may be necessary to protect the electronic components of the electronic module from the sometimes aggressive media, such as a transmission fluid, comprehensive and durable.
  • the electronic components are often encapsulated in a protective compound or coated with a protective varnish and / or protected with a lid.
  • the electronic circuit can also be contacted, for example, with a module printed circuit board, a flexible printed circuit board and / or a stamped grid and connected to other components.
  • DE 10 2010 039 187 A1 an electrical connection arrangement is known, in which an electronic module has a contact plate, which is contacted with a flexible flat conductor or a flexible conductor foil.
  • the flat cable is between the contact plate and a Gephasevorspung the connection assembly largely powerless plugged in and through
  • Forming the contact plate is an electrically conductive connection to produce.
  • Embodiments of the present invention may advantageously enable a robust, reliable, and economically producible electronic module for a transmission control unit of a motor vehicle
  • Gearbox control unit of a motor vehicle proposed which a
  • Printed circuit board having an electronic circuit, a conductor foil with recorded between a base layer and a cover layer traces for electrically contacting the electronic circuit and a base plate.
  • the circuit board has a mounting surface on which the electronic circuit is arranged, and one of the mounting surface
  • the mounting surface is at least partially, in particular completely, with a protective compound to protect the electronic
  • the circuit board is arranged with the contact surface on the base plate.
  • the electronic module is characterized in particular by the fact that at least a portion of the conductor foil between the base plate and the contact surface of the circuit board is arranged, and that on the contact surface of the circuit board, a plurality of contact points is formed, which for contacting the electronic circuit each with a conductor of the Conductive foil are electrically conductively connected.
  • the mounting surface of the printed circuit board may be an upper side of the printed circuit board and the contact surface may denote a lower side of the printed circuit board.
  • the conductor foil may in particular designate a flexible conductor foil, a flexible flat conductor and / or a "flexible printed circuit, FPC".
  • the electronic circuit can according to the invention on the opposite side of the electronic circuit or surface of the circuit board at the contact points of the printed circuit board with the portion of the conductor foil, which may for example denote a contact region of the conductor foil contacted or electrically conductively connected.
  • the portion of the conductor foil can be accommodated between the base plate and the circuit board, so that advantageously the electrical contacts between the contact points and the tracks of the conductor foil against transmission fluid and / or caused by transmission fluid or chips in the transmission fluid short and
  • the contact points are therefore only costly against influences of the transmission fluid, such as against short circuits and shunts, protectable and on the other hand space on the mounting surface of the circuit board is required for the contact points, which is then no longer available for the electronic circuit or It may therefore be necessary to use larger printed circuit boards.
  • Design of the electronic module can according to one for the
  • Components required area the entire mounting surface can be used for the electronic circuit and / or the circuit board can be made smaller overall.
  • the size of the printed circuit board which may be, for example, a "high-density interconnect, HDI" printed circuit board, may be limited when mounted through a working area for fine wire bonders. which connect the bare-die devices to the circuit board. If, for example, an existing system for the processing of two-inch printed circuit boards is available for the assembly of the printed circuit board with the components and the associated bonding or wiring, the size of the printed circuit board is limited to two inches. By the present invention, the entire mounting surface of the circuit board for the
  • Components of the electronic circuit can be used and on the tightly mounted mounting surface is not necessarily an edge area for a connection or a further Kontak ist be kept to the outside, as these connections are on the bottom or the contact surface. This allows the circuit board or mounting surface to be encapsulated directly after loading, e.g. by casting the components or the
  • Epoxy resin composition and / or electronic potting compound may be.
  • the circuit board or the mounting surface can be protected directly after loading by gluing a lid. Overall, an assembly effort for mounting the components of the electronic circuit can be reduced by the larger surface available, which in turn can be associated with a cost savings. Also, the electronic module can be made compact overall.
  • the protection provided by the protective composition may further according to the invention extend to the edge of the circuit board and also include the edges of the circuit board (e.g., cut edges). Therefore, when using an HDI circuit board with bonded and / or bonded bare dies, the mounting surface does not need to be ground with e.g. Solder mask, tinning or another
  • the topmost layer of the printed circuit board which e.g. can be arranged directly under the protective ground, is usually led out in conventional electronic modules from the protective material, for example, to a contact pad at the edge of the mounting surface of the circuit board, which, for. bare copper or gold plated and / or can be nickel-plated.
  • Such can be omitted in the electronic module according to the invention, since the entire mounting surface can be covered with protective material.
  • the contact points arranged on the contact surface can also be contacted or connected to the conductor foil prior to assembly of the printed circuit board on the baseplate, so that the contact points can be comprehensively protected.
  • the chip protection can be improved, whereby also about a use of a protective compound to protect the electrical contacts between the conductor foil and the contact points can be reduced. Furthermore, it is also possible to dispense with further contacting of the printed circuit board via contact plates, for example. Overall, according to the above, a compact, economically producible and robust electronic module can be provided.
  • a contact pad which protrudes from the contact surface and which is electrically conductively connected to one of the conductor tracks of the conductor foil, is arranged on the contact points of the printed circuit board formed on the contact surface.
  • secure and robust contact points can be provided, which can be contacted in a simple manner with the conductor tracks.
  • the conductor foil in the portion arranged between the base plate and the contact surface of the printed circuit board on a plurality of recesses introduced into the base layer or the cover layer, wherein each one of the contact pads of the circuit board is received in one of the recesses of the conductor foil.
  • the contact pads can partially and in particular completely in the
  • the chip protection can be further improved because e.g. a creepage distance for shorts and shunts may be increased.
  • electrical contacts of the electronic circuit are guided from the mounting surface through the printed circuit board to the arranged on the contact surface contact points of the printed circuit board.
  • the electrical contacts can be performed, for example, via conductor tracks integrated in the printed circuit board from the mounting surface to the contact surface, which can thus be comprehensively protected against influences of the transmission fluid.
  • Conductor foil connected in each case via a solder depot with the contact points of the circuit board, and / or the conductor tracks of the conductor foil are soldered to the contact points of the circuit board, for example by means of ironing and / or light soldering.
  • This can advantageously be a cost effective and reliable be made electrical connection between the conductors and the contact points.
  • Printed circuit board attached by means of an adhesive bond to the base plate.
  • Forming the adhesive bond may be, for example, an adhesive and / or a e.g. epoxy resin-based potting compound can be used.
  • the electronic circuit can be encapsulated with protective compound prior to mounting the circuit board on the base plate. Therefore, the circuit board can also be fixed with a silicone-containing potting compound or a silicone-containing adhesive on the base plate. If the electronic circuit was potted with protective compound only after mounting the circuit board on the base plate, then no silicone-containing potting compound should be used for the adhesive bond, since during curing silicone outgassing could occur, which could chemically alter the surface finish of the circuit board so that the protective material is no longer sufficient could stick to the mounting surface. Thus, by using a low-cost silicone-containing standard material for the adhesive bond, the cost of the
  • a heat-conducting film and / or a heat-conducting adhesive for dissipating heat from the printed circuit board to the base plate is arranged between the base plate and the contact surface at least in a partial region.
  • the heat-conducting adhesive may also be silicone-containing for the reasons explained above and / or the heat-conducting adhesive may be used to produce the adhesive bond between the printed circuit board and the base plate.
  • a heat conducting foil with a thermal conductivity of e.g. greater than or equal to about 3 W / mK can also heat conduction compared to a use of a thermal adhesive with about 1 W / mK be further increased and robustness and reliability of the electronic module can be further increased.
  • the heat-conducting film and / or the heat-conducting adhesive is enclosed on an outer periphery by an adhesive with which the printed circuit board and / or the contact surface of the printed circuit board is fastened to the base plate.
  • the heat-conducting film and / or the thermal adhesive is completely of the adhesive, which is about an adhesive and / or a Potting compound can be enclosed.
  • the heat-conducting foil and / or the heat-conducting adhesive can be arranged in a central region of the contact surface and enclosed on the outer periphery by the adhesive so that the heat-conducting foil and / or the heat-conducting adhesive need not be resistant to transmission fluid and / or must be further protected.
  • Adhesive composition therefore does not have to be optimized with regard to thermal conductivity, since increased thermal conductivity is at the expense of resistance to heat
  • Transmission fluid can go.
  • a cost-effective and reliable against transmission fluid resistant adhesive can be used, which can be cured, for example thermally, such as by heating the base plate.
  • a protective compound for protecting the contact points of the printed circuit board is arranged at least in a partial region of an outer circumference of the printed circuit board.
  • the contact points and / or edges of the circuit board can be further protected against transmission fluid.
  • the conductor foil has a
  • Fig. 1A shows an electronic module according to an embodiment of the invention.
  • Fig. 1B shows a section through the electronic module of Fig. 1 A.
  • FIG. 2 shows a detailed view of a part of an electronic module according to an embodiment of the invention.
  • Fig. 1A shows an electronic module 10 for a transmission control unit of a
  • FIG. 1B shows a section through the electronic module 10 from FIG. 1A.
  • the electronic module 10 has a printed circuit board 12 with a mounting surface 14 and a contact surface 16 arranged opposite to the mounting surface 14.
  • the mounting surface 14 and the contact surface 16 may refer to two opposite sides of the printed circuit board 12.
  • the mounting surface 14 may be an upper surface of the printed circuit board 12, and the contact surface 16 may be a lower surface of the printed circuit board 12.
  • an electronic circuit 18 is arranged with a plurality of electronic components 19.
  • the components 19 may comprise, for example, bare components, surface mounted devices (SMD) and / or application specific integrated circuit (ASIC) devices.
  • the electronic circuit 18 may include sensors, capacitors, printed conductors,
  • the electronic circuit 18 may be at least partially embedded in the protective mass 28.
  • the protective compound 28 may also cover one or more flanks 17 or cut edges 17 of the printed circuit board 12.
  • the protective compound 28 may, for example, an epoxy resin-based mass and / or to be a protective varnish.
  • the protective compound 28 may be thermally and / or light-curing.
  • the electronic module 10 has a base plate 30, which
  • the electronic module 10 for example, made of metal, such as aluminum, and / or plastic and which is designed for attachment of the electronic module 10, for example via screw-on points 31, to other components and / or for dissipating heat.
  • the printed circuit board 12 is arranged with the contact surface 16 on the base plate 30 or is a normal vector of the contact surface 16 directed in the direction of the base plate 30.
  • a heat-conducting film 32 and / or a thermal adhesive 32 is further arranged, which (r) rests flat against the contact surface and is designed for dissipating heat from the circuit board 12 to the base plate 30.
  • the heat-conducting foil 32 or the heat-conducting adhesive 32 is arranged at least in a partial region 13 of the contact surface 16, preferably in a central central region 13 of the contact surface 16.
  • the heat-conducting foil 32 and / or the heat-conducting adhesive 32 can also extend to an edge of the contact surface 16.
  • the thermal adhesive 32 may serve to secure the printed circuit board 12 to the base plate 30.
  • the heat-conducting film 32 and / or the thermal adhesive 32 are at one
  • the adhesive 34 may denote a potting compound, similar to the protective compound 28, and / or an adhesive.
  • the electronic module 10 at least one, in particular a plurality of flexible conductor foils 20 for contacting or
  • the flexible conductor foil 20 may, for example, denote an FPC ("flexible printed circuit"), a flex foil, a flat conductor or the like .
  • the conductor foils 20 each have conductor tracks 26 accommodated between a base layer 22 and a cover layer 24 (see detailed view of FIG.
  • Various conductor foils 20 of a Electronic module 10 can be arranged on different flanks 17 of the respective electronic module 10 and / or protrude from different flanks 17 of the electronic module 10.
  • a plurality of conductor foils 20 may be arranged on an edge 17 of the electronic module and / or protrude from this edge 17.
  • each conductor foil 20 is between the
  • the partial regions 21 may be at least partially embedded in the adhesive 34 and / or the adhesive 34 may at least partially surround the partial regions 21 on an outer circumference, so that the
  • Conductor foils 20 are each fixed.
  • the conductor tracks 26 of each conductor foil 20 are each electrically conductively connected to a contact point 15 arranged on the contact surface 16 of the printed circuit board 12.
  • the printed circuit board 12 has a plurality of arranged on the contact surface 16
  • Contact points 15 which are each connected to one of the conductor tracks 26 of a conductor foil. Thereby, as explained in detail above, the contact points 15 and the electrical contacts between the tracks 26 and the pads 15 are fully protected against environmental influences, such as shavings in the transmission fluid caused by short circuits and shunts, and the electronic module 10 can be more compact and robust manner.
  • the contact points 15 are connected to electrical contacts of the electronic circuit 18.
  • the electrical contacts of the electronic circuit 18 can be integrated by means of the printed circuit board 12
  • the contact points 15 do not necessarily have in an edge region of
  • the conductor foil 20 used for contacting has a projection 25 which is finger-like or projecting in a cooperatively configured recess
  • the electronic module 10 may have a protective compound 36, which the printed circuit board 12 at least in a partial area on an outer periphery and / or on the flanks 17th the circuit board 12 can enclose.
  • the protective compound 36 may consist of the same material as the protective compound 28.
  • the protective compound 36 may be a different material than the protective compound 28, in particular the protective compound 36 may be a silicone-containing standard material.
  • FIG. 2 shows a detailed view of part of an electronic module 10 according to an embodiment of the invention. Unless otherwise described, the electronics module 10 of FIG. 2 may have the same elements and features as the electronics module 10 of FIGS. 1A and 1B.
  • the electronic module 10 in each case has a contact point 15 arranged on the contact surface 16
  • the contact pad 38 protrudes at least partially from the contact surface 16.
  • solder deposit 40 is arranged in the recess 27 and the conductor track 26 is soldered to the contact pad 38.
  • the solder deposit 40 or the conductor track 26 can be approximately by means of ironing and / or light soldering of the recess 27th

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne un module électronique (10) qui est destiné à un appareil de commande de transmission d'un véhicule automobile et qui comprend une carte de circuit imprimé (12) équipée d'un circuit électronique (18), un film conducteur (20) et une plaque de base (30). La carte de circuit imprimé (12) comprend une surface de montage (14), sur laquelle est disposé le circuit électronique (18), et une surface de contact (16) en regard de la surface de montage (14). La surface de montage (14) est recouverte au moins en partie par une masse de protection (28) tandis que la carte de circuit imprimé (12) est disposée avec la surface de contact (16) sur la plaque de base (30). Le module électronique (10) est caractérisé en particulier en ce qu'au moins une sous-partie (21) du film conducteur (20) est disposé entre la plaque de base (30) et la surface de contact (16) de la carte de circuit imprimé (12), et en ce qu'une pluralité de plots de contact (15) sont formés sur la surface de contact (16) de la carte de circuit imprimé (12), chaque plot de contact étant en liaison électroconductrice avec un tracé conducteur (26) du film conducteur (20). On obtient de cette façon un module électronique (10) robuste, fiable et pouvant être produit de manière économique.
PCT/EP2016/069343 2015-10-02 2016-08-15 Module électronique pour un appareil de commande de transmission WO2017054981A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015219072.2 2015-10-02
DE102015219072.2A DE102015219072A1 (de) 2015-10-02 2015-10-02 Elektronikmodul für ein Getriebesteuergerät

Publications (1)

Publication Number Publication Date
WO2017054981A1 true WO2017054981A1 (fr) 2017-04-06

Family

ID=56740224

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2016/069343 WO2017054981A1 (fr) 2015-10-02 2016-08-15 Module électronique pour un appareil de commande de transmission

Country Status (2)

Country Link
DE (1) DE102015219072A1 (fr)
WO (1) WO2017054981A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018116410A1 (de) 2018-07-06 2020-01-09 Endress+Hauser SE+Co. KG Verfahren zur Herstellung einer hochtemperaturfesten bleifreien Lotverbindung und hochtemperaturfeste bleifreie Lotverbindung
DE102018217481A1 (de) * 2018-10-12 2020-04-16 Robert Bosch Gmbh Elektrische Verbindungsanordnung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6300566B1 (en) * 1998-03-13 2001-10-09 Siemens Aktiengesellschaft Electrical connection of a circuit carrier to a conductor-track carrier
JP2006140273A (ja) * 2004-11-11 2006-06-01 Denso Corp 電子制御装置およびその製造方法
US20100232115A1 (en) * 2009-03-13 2010-09-16 Aisin Aw Co., Ltd. Electronic circuit device
DE102010003927A1 (de) * 2010-04-13 2011-10-13 Zf Friedrichshafen Ag Steuermodul

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010039187A1 (de) 2010-08-11 2012-02-16 Robert Bosch Gmbh Elektrische Verbindungsanordnung

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6300566B1 (en) * 1998-03-13 2001-10-09 Siemens Aktiengesellschaft Electrical connection of a circuit carrier to a conductor-track carrier
JP2006140273A (ja) * 2004-11-11 2006-06-01 Denso Corp 電子制御装置およびその製造方法
US20100232115A1 (en) * 2009-03-13 2010-09-16 Aisin Aw Co., Ltd. Electronic circuit device
DE102010003927A1 (de) * 2010-04-13 2011-10-13 Zf Friedrichshafen Ag Steuermodul

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