DE102014225199A1 - Connecting arrangement for a lithography system - Google Patents

Abstract

A connection arrangement (200A, 200B) for a lithography system (100) is disclosed which comprises a first component (212), a second component (206), a first interface element (210) connected to the first component (212) at a first component Joining point (220) is releasably connected, and a second interface element (218) which is releasably connected to the second component (206) at a second joint (222) comprises. The first interface element (210) has a first contact surface (226), the second interface element (218) has a second contact surface (228) and at least one of the two contact surfaces (226, 228) is arranged before connecting the two contact surfaces (226 , 228) are aligned and / or selected at a third joint (224) to compensate for an offset between the first component (212) and the second component (206). The first contact surface (226) of the first interface element (210) and the second contact surface (228) of the second interface element (218) are connected to the third joint (224) via a material connection.

Description

The present invention relates to a connection arrangement, a lithography system with a connection arrangement and a method for producing a connection arrangement.

Lenses consist of material and production due to various components, in particular support structures and optical devices. This results in that the support structures are connected via joints with the optical devices. However, depending on how the joints are realized, they create stresses and deformations that adversely affect the optical devices. In particular, due to the requirement of a minimum mechanical rigidity, it has hitherto scarcely been possible to add stress-free and deformation-free.

In addition to the process-induced formation of stress and deformation, it is also important to compensate for form and position tolerances of the components during joining, without creating additional stresses and deformations. The WO2005 / 106557 This effect takes account of the fact that deformations generated due to a frictional connection are absorbed by decoupling elements. Since the decoupling effect is directly related to the mechanical rigidity, this approach is only conditionally suitable for systems which require high mechanical rigidity.

Against this background, an object of the present invention is to improve a connection arrangement for a lithographic system, wherein in particular the connection arrangement is on the one hand solvable and on the other the components are connected in the installed position almost free of tension and deformation. In particular, it is an object of the present invention to provide a lithography apparatus with a connection arrangement or a method for producing a connection arrangement.

This object is achieved by a connection arrangement for a lithography system which has a first component, a second component, a first interface element which is releasably connected to the first component at a first joint, and a second interface element which is connected to the second component at a second Joining point is releasably connected, has. The first interface element has a first contact surface. The second interface element has a second contact surface. At least one of the two contact surfaces is adapted to be aligned and / or selected before connecting the two contact surfaces at a third joint to compensate for an offset between the first component and the second component. The first contact surface of the first interface element and the second contact surface of the second interface element are connected to the third joint via a cohesive connection.

The first component may be a support structure. The second component may be an optical device. The optical device may comprise an optical element and a holder for the optical element. However, one of the components can also be a measuring interface, a reference structure or a structural component of the lithography system.

The first interface element is detachably connected to the first component. The second interface element is detachably connected to the second component. The detachable connections can be non-positive and / or positive connections. A frictional connection requires a normal force on the surfaces to be joined together. Frictional connections can be realized by friction or by magnetic adhesion. The mutual displacement of the surfaces is prevented as long as the counter-force caused by the static friction or the magnetic adhesion is not exceeded. A positive connection is created by the interaction of at least two connection partners.

The first contact surface of the first interface element and the second contact surface of the second interface element are connected via a cohesive connection. In cohesive connections, the connection partners are held together by atomic or molecular forces. Cohesive connections are non-detachable connections that can only be separated by destroying the connection means. Cohesively, e.g. be joined by gluing, soldering, welding or vulcanization.

The expression "at least one of the two contact surfaces is adapted to be aligned and / or selected between the first component and the second component before a connection of the two contact surfaces at a third joint" is to be interpreted so that at least one of both contact surfaces can be tilted suitable and / or that the interface elements can be selected accordingly, so that at least one of the two contact surfaces is suitably aligned after selecting.

For cohesive compounds, the compound may be in a state of relative Voltage of the components take place. If the components are stored without contact in the installation position during gluing, then the gluing can compensate for the tolerances in the gluing gap and only adhesive-related stresses are generated.

Because the connection arrangement has two detachable joints, both the first component and the second component can be exchanged non-destructively. Characterized in that at least one of the two contact surfaces of the interface elements to compensate for an offset between the first component and the second component is adjustable, the connection arrangement can be aligned as it is to be installed in the lithographic system. The integral connection at the third joint, i. between the first and the second interface element, then ultimately provides a tension and deformation free connection. The fact that the two contact surfaces of the interface elements are aligned with each other, a very thin cohesive connection can be realized at the third joint. This leads to a highly rigid connection arrangement. The fact that the two contact surfaces of the interface elements are aligned with each other, also a parallel cohesive connection can be realized at the third joint. This results in the minimization of torques which would otherwise occur, e.g. can arise during curing of bonds.

According to one embodiment of the connection arrangement, the at least one of the two contact surfaces of the first and second interface element with respect to the shortest connecting path, with respect to the directions perpendicular to the shortest connecting path and / or with respect to the angle of the two contact surfaces aligned with each other. The orientability can include all directions and angles. Advantageously, the two contact surfaces can be aligned with a constant small distance. This allows a thin third joint and thus a highly rigid connection arrangement or at least one parallel joint with advantages in terms of the joint tension effect.

The at least one of the two contact surfaces is aligned with respect to the connecting path, i. the distance between the two contact surfaces can be adjusted. The at least one of the two contact surfaces is aligned with respect to the directions perpendicular to the connecting path, i. the at least one contact surface can be moved in such a way that it lies exactly above the other contact surface from a viewing direction perpendicular to the at least one contact surface. The at least one of the two contact surfaces is aligned with respect to. The angle of the two contact surfaces to each other, i. the contact surfaces can be aligned parallel to each other.

According to a further preferred embodiment of the connection arrangement, the contact surfaces are parallel to one another. That the contact surfaces have constant propriety to each other. As a result, a cohesive connection can be realized well and stresses in the emergence of the cohesive connection can not generate torques.

According to another embodiment of the connection arrangement, at least one of the interface elements has an asymmetrical shape to compensate for the offset between the components. Advantageously, the contact surfaces can thereby be positioned parallel to each other and at a small distance.

The at least one of the two interface elements can be selected from a plurality of interface elements. Characterized in that at least one of the interface elements is designed as an exchange element (Engl. Shims), the appropriately shaped interface element can be used as needed.

According to another embodiment of the connection arrangement, the asymmetrical shape is a wedge shape. Advantageously, a wedge-shaped interface element compensate for an inclination of the contact surfaces to each other.

According to a further embodiment of the connection arrangement, the first interface element has a base and a tiltable fixable element in order to tilt the first contact surface relative to the base. In this case, the base with the first component non-positively and / or positively connected. The tiltable fixable member may be tilted with respect to the base. After the tiltable fixable element is aligned, it can be fixed by means of the base. The first contact surface may be formed by a side of the tiltable fixable element of the first interface element.

Alternatively or additionally, the second interface element may include a base and a tiltable fixable member to tilt the second contact surface relative to the base. In this case, the base can be positively and / or positively connected to the second component. The tiltable fixable member may be tilted with respect to the base. After the tiltable fixable element is aligned, it can be fixed by means of the base. The second contact surface may be formed by one side of the tiltable fixable element of the second interface element.

According to a further embodiment of the connection arrangement, the first contact surface of the first interface element is flat and / or the second contact surface of the second interface element is flat. The fact that the contact surfaces of the interface elements are flat, the contact surfaces can be well bonded firmly together.

According to a further embodiment of the connection arrangement, the tiltable fixable element of the first interface element and / or the second interface element is formed as a dome and has the component to which the tiltable fixable element is fixed, a corresponding recess. In this case, the flat side of the cap on one of the two contact surfaces and the curved side of the dome can be clamped against the corresponding component.

According to a further embodiment of the connection arrangement, the base has a fixing element, which clamps the tiltable fixable element against the component for fixing. After the contact surface is aligned, the fixing element can fix the tiltable fixable element. The fixing element may have a Krümmumg. The tiltable fixable element may have a curvature corresponding to the curvature of the fixing element.

According to a further embodiment of the connection arrangement, the first component has a support structure and the second component has an optical device. Preferably, the connection arrangement can be realized with a support structure and an optical device.

According to a further embodiment of the connection arrangement, the optical device has a holder and a mirror or a lens. The optical device may comprise a holder for an optical element. The optical element may be a mirror or a lens.

Furthermore, a lithography system, in particular an EUV lithography system, with one or more connection arrangements, as described, provided.

Furthermore, a method for producing a connection arrangement for a lithography system is described. The method comprises the following steps. In a step a), a first interface element with a first component and a second interface element with a second component is releasably connected, so that a tiltable fixable element of the first interface element and / or a tiltable fixable element of the second interface element relative to the first component and / or the second component are tiltable / is. In a step b), a first contact surface of the first interface element and / or a second contact surface of the second interface element are aligned in order to compensate for an offset between the first and the second component. In a step c), the tiltable fixable element of the first interface element is fixed relative to the first component and / or the tiltable fixable element of the second interface element is fixed relative to the second component. In a step d), the first contact surface of the first interface element is adhesively connected to the second contact surface of the second interface element.

The method produces a connection arrangement with two detachable joints. As a result, both the first component and the second component can be replaced. The use of one or more tiltable fixable elements makes it possible to align a first contact surface of the first interface element and / or a second contact surface of the second interface element. Subsequently, the tiltable fixable element or the tiltable fixable elements are fixed. Then, by gluing a very thin cohesive connection between the interface elements can be realized. This leads to a highly rigid connection arrangement. In addition, the cohesive connection takes place at the third joint as the last step. As a result, a voltage and deformation-free connection arrangement can be realized.

The designation of the individual process steps does not specify an order.

According to a further embodiment of the method, step b) comprises tilting the first contact surface of the first interface element by bringing the first contact surface of the first interface element and the second contact surface of the second interface element into contact, wherein the tiltable fixable element of the first interface element is tilted so that the first contact surface of the first interface element and the second contact surface of the second interface element have constant distance from each other, and / or tilting the second contact surface of the second interface element by contacting the second contact surface of the second interface element and the first contact surface of the first interface element, wherein the tiltable fixable element of the second interface element is tilted so that the first contact surface of the first interface element and the second contact surface of the second interface lenelements constant distance from each other. Advantageously, a contact surface can be aligned by means of a tiltable fixable element.

Furthermore, a method for producing a connection arrangement for a lithography system is described. The method comprises the following steps. In a step a), a first interface element and a second interface element are selected and / or manufactured. In a step b), the first interface element is detachably connected to a first component. In a step c), the second interface element is detachably connected to a second component. In a step d), the first contact surface of the first interface element is adhesively connected to the second contact surface of the second interface element.

The method produces a connection arrangement with two detachable joints. As a result, both the first component and the second component can be replaced. By selecting and / or fabricating the interface elements, the appropriate interface elements may be provided to compensate for misalignment between the components. As a result, the contact surfaces of the interface elements can be aligned parallel to each other. Then, by gluing a very thin cohesive connection between the interface elements can be realized. This leads to a highly rigid connection arrangement. In addition, the cohesive connection takes place at the third joint as the last step. As a result, a voltage and deformation-free connection arrangement can be realized.

The designation of the individual process steps does not specify an order.

According to a further embodiment of the method, it is first measured which space is available between the first component and the second component in order to be able to select the interface elements with the appropriate shape. Advantageously, the contact surfaces of the interface elements after selecting and connecting to the components are aligned parallel to each other.

According to another embodiment of the method, step a) comprises: selecting the first interface element and / or the second interface element from a set of interface elements, wherein the set of interface elements comprises a plurality of interface elements of different geometry. Advantageously, the appropriate interface elements can be selected from a set of interface elements.

According to a further embodiment of the method, step a) comprises: manufacturing the first interface element and / or the second interface element by means of grinding, milling or cutting. Advantageously, the interface elements can be easily manufactured starting from a basic shape.

According to a further embodiment of the method, step d) comprises the following steps: In step d1), the first contact surface and the second contact surface are moved apart, so that adhesive can be applied to at least one of the two contact surfaces. In step d2) adhesive is applied to at least one of the two contact surfaces. In step d3), the contact surfaces are moved together and glued. Advantageously, by means of the cohesive connection a stress and deformation-free connection can be generated.

The embodiments and features described for the proposed device apply correspondingly to the proposed methods.

Further possible implementations of the invention also include not explicitly mentioned combinations of features or embodiments described above or below with regard to the exemplary embodiments. The skilled person will also add individual aspects as improvements or additions to the respective basic form of the invention.

Further advantageous embodiments and aspects of the invention are the subject of the dependent claims and the embodiments of the invention described below. Furthermore, the invention will be explained in more detail by means of preferred embodiments with reference to the attached figures.

1 shows a schematic view of an EUV lithography system;

2A shows a schematic view of a support structure and an optical device;

2 B shows a schematic view of a first embodiment of a connection arrangement with the support structure and the optical device 2A ;

3 shows a schematic view of a second embodiment of a connection arrangement;

4 shows a detailed sectional view of the connection arrangement 3 ;

5 shows a schematic view of an apparatus for producing the connection arrangement 3 and 4 ; and

6 FIG. 12 is a schematic flow diagram of a method for generating the connection arrangement. FIG 3 and 4 , with the device off 5 ,

Unless otherwise indicated, like reference numerals in the figures denote like or functionally identical elements. It should also be noted that the illustrations in the figures are not necessarily to scale.

1 shows a schematic view of an EUV lithography system 100 which is a beam-forming system 102 , a lighting system 104 and a projection system 106 includes. The beam-forming system 102 , the lighting system 104 and the projection system 106 are each provided in a vacuum housing, which is evacuated by means of an evacuation device, not shown. The vacuum housings are surrounded by a machine room, not shown, in which the drive devices are provided for the mechanical method or adjustment of the optical elements. Furthermore, electrical controls and the like may be provided in this engine room.

The beam-forming system 102 has an EUV light source 108 , a collimator 110 and a monochromator 112 on. As an EUV light source 108 For example, a plasma source or a synchrotron can be provided which emit radiation in the EUV range (extreme ultraviolet range), ie, for example, in the wavelength range from 5 nm to 20 nm. The from the EUV light source 108 Exiting radiation is first through the collimator 110 bundled, after which by the monochromator 112 the desired operating wavelength is filtered out. Thus, the beam shaping system fits 102 the wavelength and spatial distribution of the EUV light source 108 emitted light. The from the EUV light source 108 generated EUV radiation 114 has a relatively low transmissivity by air, which is why the beam guiding spaces in the beam-forming system 102 , in the lighting system 104 and in the projection system or projection objective 106 are evacuated.

The lighting system 104 has a first mirror in the example shown 116 and a second mirror 118 on. These mirrors 116 . 118 For example, they can be designed as facet mirrors for pupil shaping and guide the EUV radiation 114 on a photomask 120 ,

The photomask 120 is also designed as a reflective optical element and can be outside the systems 102 . 104 . 106 be arranged. The photomask 120 has a structure which, by means of the projection system 106 reduced to a wafer 122 or the like is mapped. For this purpose, the projection system 106 in the beam guiding room, for example, a third mirror 124 and a fourth mirror 202 on. It should be noted that the number of mirrors of the EUV lithography system 100 is not limited to the number shown, and it may also be provided more or less mirror. Furthermore, the mirrors are usually curved at the front for beam shaping.

2A shows by way of example the fourth mirror 202 , The fourth mirror 202 is on a bracket 204 (Engl. Mirror Support Frame) applied. The fourth mirror 202 and the holder 204 can together create an optical device 206 form. The holder 204 has a wedge-shaped projection 208-1 and a lead 208-2 on. This wedge-shaped projection 208-1 represents an arbitrarily shaped contact element of the holder 204 , Opposite the wedge-shaped projection 208-1 there is a first interface element 210-1 and opposite the projection 208-2 there is also a first interface element 210-2 , The first interface elements 210-1 . 210-2 are each with a detachable connection 216 , For example, a non-positive and / or positive connection, in particular a screw, on a supporting structure 212 attached. Between the wedge-shaped projection 208-1 and the opposite first interface element 210-1 and the lead 208-2 and the opposite first interface element 210-2 is each a gap 214 to see. The gap 214 provides the space required for a second interface element 218 and the joint gap.

2 B shows a first embodiment of a connection arrangement 200A with the supporting structure 212 and the optical device 206 out 2A , The gap 214 are with a wedge-shaped second interface element 218-1 and with a second interface element 218-2 closed. The supporting structure 212 and the first interface element 210-1 opposite the wedge-shaped projection 208-1 are at a first joint 220 connected to a detachable connection. The wedge-shaped projection 208-1 the holder 204 is with the wedge-shaped second interface element 218-1 at a second joint 222 releasably connected. The first interface element 210-1 opposite the wedge-shaped projection 208-1 has a first contact surface 226 on that towards the second interface element 218-1 shows. The wedge-shaped second interface element 218-1 has a second contact surface 228 up in the direction of the first interface element 210-1 shows. The first interface element 210-1 and the wedge-shaped second interface element 218-1 be at a third joint 224 that is between the first contact surface 226 and the second contact surface 228 lies, cohesively connected to each other.

The direct connection distance or the gap between the first contact surface 226 and the second contact surface 228 ie the distance between the two contact surfaces 226 . 228 , can be selected by choosing different interface elements 210-1 . 218-1 influence. With respect to the directions perpendicular to the direct connection, an adjustment of the two contact surfaces 226 . 228 relative to each other and / or a selection of equal contact surfaces takes place 226 . 228 by choosing suitable interface elements 210-1 . 218-1 , The angle of the two contact surfaces 226 . 228 each other can via the choice of the angle of the wedge-shaped interface element 218-1 to be influenced. For this purpose, the interface element 218-1 be selected from a variety of wedge-shaped interface elements with different wedge angle. By a machining of an interface element, such as. Loops, a wedge-shaped interface element 218-1 be realized.

In an analogous way, the lead 208-2 , the second interface element 218-2 , the first interface element 210-2 opposite the projection 208-2 and the support structure 212 connected with each other.

In 2 B is the connection arrangement 200A with two protrusions 208-1 . 208-2 shown. Alternatively, several projections could 208 or just a lead 208 to be available. In this case, three projections distributed over the connection area are advantageous. In another alternative is no advantage 208 available. In this case, the second interface element is 218 directly detachable with the holder 204 connected.

Because of the support structure 212 and the first interface element 210 as well as the holder 204 with a lead 208 and the second interface element 218 detachably connected to each other, the supporting structure 212 and the optical device 206 be replaced. Because of the gap 214 with a second interface element 218 can be closed accurately, the first contact surface 226 and the second contact surface 228 be aligned parallel to each other. This allows a very thin third joint 224 , which in turn leads to a highly rigid connection arrangement 200A leads.

This in 2 B shown second interface element 218-1 is wedge-shaped. Alternatively, if desired, the wedge-shaped second interface element could 218-1 or the first interface element 210-1 be exchanged for an interface element of any asymmetrical or symmetrical shape when the first contact surface 226 thereby parallel to the second contact surface 228 align.

3 shows a second embodiment of a connection arrangement 200B with a supporting structure 212 and an optical device 206 , The optical device 206 has the fourth mirror 202 out 1 and a holder 204 on. The supporting structure 212 is with a first interface element 210 at a first joint 220 releasably connected. The optical device 206 is by means of the holder 204 with the second interface element 218 at a second joint 222 releasably connected. The first interface element 210 has a first contact surface 226 on that towards the second interface element 218 shows. The second interface element 218 has a second contact surface 228 on that towards the first interface element 210 shows. The first interface element 210 and the second interface element 218 be at a third joint 224 that is between the first contact surface 226 and the second contact surface 228 lies, cohesively connected to each other.

The second interface element 218 can relative to the optical device 206 to be turned around. This allows the second contact surface 228 parallel to the first contact surface 226 align. Thereafter, the second interface element 218 at the optical device 206 be fixed so that no rotation is possible. The parallel alignment of the contact surfaces 226 . 228 allows a very thin third joint 224 , which in turn leads to a highly rigid connection arrangement 200B leads. Because of the support structure 212 and the first interface element 210 as well as the holder 204 the optical device 206 and the second interface element 218 detachably connected to each other, the supporting structure 212 and the optical device 206 be replaced.

The second interface element 218 can a base (in 3 not shown) and a tiltable fixable element 300 exhibit. The base can be detachable with the bracket 204 the optical device 206 get connected. The tiltable fixable element 300 of the second interface element 218 can the second contact surface 228 exhibit. The second contact surface 228 can then relative to the base and for mounting 204 be tilted. After the second contact surface 228 is aligned, the tiltable fixable element 300 through the base to the bracket 204 be fixed.

The supporting structure 212 is preferably made of ceramic. Also the holder 204 can be made of ceramic or metal. The interface elements 210 . 218 preferably have ceramic or metal. The metals used are preferably Invar, ie an iron-nickel alloy with very low thermal expansion behavior. The gluing at the third joint 224 Can be done with multi-component adhesives.

2A . 2 B and 3 each show the fourth mirror 202 from the EUV lithography system 1 , The connection arrangements 200A . 200B However, they can also be used for every other mirror of the EUV lithography system 100 or for another optical device 206 the EUV lithography system 100 be used.

4 shows a detailed sectional view of in 3 only schematically illustrated connection arrangement 200B , The first interface element 210 is with a screw 316 on the supporting structure 212 releasably secured. An axial spacer 314 can be between the first interface element 210 and the support structure 212 be used. The second interface element 218 has a tiltable fixable element 300 and a base 302 on. The tiltable fixable element 300 is how in 4 to see trained as a dome. The axial spacer 314 compensates for the shortest link, while the tiltable fixable element 300 ensures the tilt compensation. Alternatively, an interface element 210 . 218 be executed in several parts to meet several different functions.

The optical device 206 has a contact element 304 for contacting the tiltable fixable element 300 on. The base 302 can about a mother 308 with the optical device 206 or their holder 204 be releasably attached. Between the mother 308 and the contact element 302 can be a washer 310 are located. The contact element 304 has at its tiltable fixable element 300 lying side to a corresponding recess on this. Is the mother 308 solved, then the tiltable fixable element 300 , guided by the recess, be tilted. If the nut tightened, then presses a fixing 312 the base 302 against the tiltable fixable element 300 , so this at the second joint 222 non-positively against the contact element 304 is clamped. The tiltable fixable element 300 is then fixed in position. By tilting the tiltable fixable element 300 can be the first contact surface 226 and the second contact surface 228 be aligned parallel to each other. After that, at the third joint 224 between the first contact surface 226 and the second contact surface 228 the cohesive connection takes place.

The optical device can for thermal compensation of a radial or thermal decoupler 306 exhibit. The radial or thermal decoupler 306 may include metal, especially Invar. The in 4 shown thermal decouplers 306 includes the contact element 304 , a footbridge 318 and a volume volume element 320 , The volume element 320 is in the optical device 206 or in their holder 204 by means of an adhesive 330 glued.

In the 4 illustrated base 302 has the shape of a flanged hollow cylinder. The base 302 sticks out through an execution 322 of the tiltable fixable element 300 , The fixing element 312 is formed by the flange of the hollow cylinder. The fixing element 312 , ie the flange of the hollow cylinder, is in a recess 324 of the tiltable fixable element 300 sunk. If the mother 308 is attracted, then becomes a bottom 326 of the fixing against a top 328 the recess 324 of the tiltable fixable element 300 pressed. This is the tiltable fixable element 300 against the contact element 304 pressed and thus fixed.

Alternatively or additionally, the first interface element 210 One Base 302 and a tiltable fixable element 300 exhibit. Then the first contact surface 226 with regard to the supporting structure 212 tiltable.

For a spherical geometry of the interface element 210 . 218 can the corresponding contact element 304 have a pan-shaped spherical geometry.

Preferably, the first and the second contact surface 226 . 228 just. Then a thin third joint can be realized well.

Alternatively, an interface element 210 . 218 have a tiltable fixable element, wherein the tilting mechanism is located within the interface element, and not as in the 3 and 4 by means of the adjacent component 206 . 212 is realized. In this case, the Verkipp mechanism can be done with a ball joint or with a swivel joint.

5 shows a device 416 for generating the connection arrangement 200B out 3 and 4 , The device 416 for generating the connection arrangement 200B has a first positioning 400 and a second positioning device 410 on. The first positioning device 400 keeps the support structure 212 , The supporting structure 212 can by means of the positioning 400 in the x, y and z directions. Next, the positioning device 400 a first rotary or ball joint 402 on. This is a turn 404 the supporting structure 212 possible. The second positioning device 410 holds the bracket 204 the optical device 206 , The holder 204 can by means of the positioning 410 in the x, y and z directions. Next, the positioning device 410 a second rotary or ball joint 412 on. This is a turn 414 the holder 204 possible.

The supporting structure 212 and the holder 204 can through the positioning 400 . 410 in the installed position, ie in the orientation, as it requires the subsequent use to be aligned. In this installation position, the connection arrangement 200B assembled without tension and deformation.

6 shows a method as with the device 416 out 5 a connection arrangement 200B to 3 and 4 can be realized. In a first step S1, the first interface element 210 with the supporting structure 212 as well as the second interface element 218 with the bracket 204 the optical device 206 releasably connected. Here is the tiltable fixable element 300 of the second interface element 218 opposite the bracket 204 the optical device 206 tiltable.

In a second step S2, the second contact surface 228 of the second interface element 218 aligned to an offset between the support structure 212 and the holder 204 the optical device 206 compensate. The first contact surface 226 and the second contact surface 228 are brought into contact. This tilts the second contact surface 228 of the second interface element 218 , The tiltable fixable element 300 of the second interface element 218 is thereby also tilted. After contact have the contact surfaces 226 . 228 a constant distance from each other, ie they are aligned in parallel.

In a third step S3, the tiltable fixable element 300 of the second interface element 218 opposite the bracket 204 the optical device 206 fixed. After aligning the tiltable fixable element 300 of the second interface element 218 by means of the fixing element 312 the base 302 against the contact element 304 the optical device 206 or the holder 204 clamped. The tiltable fixable element 300 is fixed with it.

In a fourth step S4, the now already aligned parallel first and second contact surface 226 . 228 cohesively at the third joint 224 connected. These are the first and second contact surface 226 . 228 so far apart that glue on the contact surfaces 226 . 228 can be applied. After application of the adhesive, the contact surfaces become 226 . 228 moved together again and glued together.

Alternatively, the tiltable fixable element could 300 also in the first interface element 210 be arranged. Next could both interface elements 210 . 218 a tiltable fixable element 300 exhibit.

Alternatively or additionally, it is possible to measure which space between the support structure before the first two steps 212 and the optical device 206 is available. Based on the result of this measurement, the interface elements 210 . 218 be selected with the appropriate asymmetrical or symmetrical shape and the correct thickness, such as in connection with 2 B described.

In the lithography plant 100 it does not have to be an EUV lithography system. Rather, light of other wavelengths (for example 193 nm using ArF excimer laser). Furthermore, instead of the above-mentioned mirrors, it is also possible to use lenses in particular in the aforesaid projection system 106 be used.

Although the present invention has been described with reference to embodiments, it is variously modifiable.

LIST OF REFERENCE NUMBERS

100

 EUV lithography system

102

 Beam shaping system

104

 lighting system

106

 projection system

108

 EUV-light source

110

 collimator

112

 monochromator

114

 EUV radiation

116

 first mirror

118

 second mirror

120

 photomask

122

 wafer

124

 third mirror

200

 joint assembly

200A

 Connecting arrangement according to the first embodiment

200B

 Connecting arrangement according to the second embodiment

202

 fourth mirror

204

 bracket

206

 optical device

208

 Projection on the holder

208-1

 wedge-shaped projection on the holder

208-2

 Projection on the holder

210

 first interface element

210-1

 first interface element with respect to the wedge-shaped projection

210-2

 first interface element opposite the projection

212

 supporting structure

214

 gap

216

 Detachable connection

218

 second interface element

218-1

 wedge-shaped second interface element

218-2

 second interface element

220

 first joint

222

 second joint

224

 third joint

226

 first contact surface

228

 second contact surface

300

 tiltable fixable element

302

 Base

304

 contact element

306

 Radial or thermal decoupler

308

 mother

310

 washer

312

 fixing

314

 axial spacer

316

 screw

318

 web

320

 voxel

322

 Implementation of the tiltable fixable element

324

 Recess of the tiltable fixable element

326

 Bottom of the fixing element

328

 Top of the recess of the tiltable fixable element

330

 Glue

400

 first positioning device

402

 first rotary or ball joint

404

 Rotation of the supporting structure

410

 second positioning device

412

 second rotary or ball joint

414

 Rotation of the holder

416

 Device for creating a connection arrangement

418

 shortest distance

420

 Directions perpendicular to the shortest link

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• WO 2005/106557 [0003]

Claims (19)

Connection arrangement ( 200A . 200B ) for a lithography plant ( 100 ), comprising: a first component ( 212 ), a second component ( 206 ), a first interface element ( 210 ) associated with the first component ( 212 ) at a first joint ( 220 ) is detachably connected, and a second interface element ( 218 ) connected to the second component ( 206 ) at a second joint ( 222 ) is releasably connected, wherein the first interface element ( 210 ) a first contact surface ( 226 ), the second interface element ( 218 ) a second contact surface ( 228 ) and at least one of the two contact surfaces ( 226 . 228 ), before connecting the two contact surfaces ( 226 . 228 ) at a third joint ( 224 ) to compensate for an offset between the first component ( 212 ) and the second component ( 206 ) and / or selected, the first contact surface ( 226 ) of the first interface element ( 210 ) and the second contact surface ( 228 ) of the second interface element ( 218 ) at the third joint ( 224 ) are connected via a cohesive connection. Connecting arrangement according to claim 1, wherein the at least one of the two contact surfaces ( 226 . 228 ) of the first and second interface elements ( 210 . 218 ) with respect to the shortest link ( 418 ), regarding the directions ( 420 ) perpendicular to the shortest connecting path and / or with respect to the angle of the two contact surfaces ( 226 . 228 ) is aligned with each other. Connecting arrangement according to claim 1 or 2, wherein the contact surfaces ( 226 . 228 ) are parallel to each other. Connecting arrangement according to one of claims 1 to 3, wherein at least one of the interface elements ( 210 . 218 ) an asymmetric shape ( 218-1 ) to compensate for the misalignment between the components ( 206 . 212 ). Connecting arrangement according to claim 4, wherein the asymmetrical shape ( 218-1 ) is a wedge shape. Connecting arrangement according to one of claims 1 to 5, wherein the first interface element ( 210 ) One Base ( 302 ) and a tiltable fixable element ( 300 ) to the first contact surface ( 226 ) relative to the base ( 302 ) and / or wherein the second interface element ( 218 ) One Base ( 302 ) and a tiltable fixable element ( 300 ) to the second contact surface ( 228 ) relative to the base ( 302 ) to tilt. Connecting arrangement according to one of claims 1 to 6, wherein the first contact surface ( 226 ) of the first interface element ( 210 ) and / or wherein the second contact surface ( 228 ) of the second interface element ( 218 ) is just. Connecting arrangement according to claim 6 or 7, wherein the tiltable fixable element ( 300 ) of the first interface element ( 210 ) and / or the second interface element ( 218 ) is formed as a dome and the component ( 206 . 212 ) on which the tiltable fixable element ( 300 ) is fixed, has a corresponding recess. Connecting arrangement according to one of claims 6 to 8, wherein the base ( 302 ) a fixing element ( 312 ), which the tiltable fixable element ( 300 ) against the component ( 206 . 212 ) for fixation. Connecting arrangement according to one of claims 1 to 9, wherein the first component, a support structure ( 212 ) and the second component comprises an optical device ( 206 ) having. Connecting arrangement according to claim 10, wherein the optical device ( 206 ) a holder ( 204 ) and a mirror ( 202 ) or a lens. Lithography plant, in particular EUV lithography plant ( 100 ), with one or more connection arrangements ( 200A . 200B ) according to one of claims 1 to 11. Method for producing a connection arrangement ( 200A . 200B ) for a lithography plant ( 100 ), comprising the steps of: a) detachably connecting a first interface element ( 210 ) with a first component ( 212 ), as well as a second interface element ( 218 ) with a second component ( 206 ), so that a tiltable fixable element ( 300 ) of the first interface element ( 210 ) and / or a tiltable fixable element ( 300 ) of the second interface element ( 218 ) relative to the first component ( 212 ) and / or the second component ( 206 ) can be tilted, b) aligning a first contact surface ( 226 ) of the first interface element ( 210 ) and / or a second contact surface ( 228 ) of the second interface element ( 218 ) to offset between the first and second components ( 206 . 212 ), c) fixing the tiltable fixable element ( 300 ) of the first interface element ( 210 ) relative to the first component ( 212 ) and / or fixing the tiltable fixable element ( 300 ) of the second interface element ( 218 ) relative to the second component ( 206 ), and d) cohesive bonding of the first contact surface ( 226 ) of the first interface element ( 210 ) with the second contact surface ( 228 ) of the second interface element ( 218 ). The method of claim 13, wherein step b) comprises: tilting the first contact surface ( 226 ) of the first interface element ( 210 ) by contacting the first contact surface ( 226 ) of the first interface element ( 210 ) and the second contact surface ( 228 ) of the second interface element ( 218 ), wherein the tiltable fixable element ( 300 ) of the first interface element ( 210 ) is tilted so that the first contact surface ( 226 ) of the first interface element ( 210 ) and the second contact surface ( 228 ) of the second interface element ( 218 ) are at a constant distance from each other, and / or tilting of the second contact surface ( 228 ) of the second interface element ( 218 ) by contacting the second contact surface ( 228 ) of the second interface element ( 218 ) and the first contact surface ( 226 ) of the first interface element ( 210 ), wherein the tiltable fixable element ( 300 ) of the second interface element ( 218 ) is tilted so that the first contact surface ( 226 ) of the first interface element ( 210 ) and the second contact surface ( 228 ) of the second interface element ( 218 ) are at a constant distance from each other. Method for producing a connection arrangement ( 200A . 200B ) for a lithography plant ( 100 ), comprising the steps of: a) selecting and / or producing a first interface element ( 210 ) and a second interface element ( 218 b) releasably connecting the first interface element ( 210 ) with a first component ( 212 ), c) releasably connecting the second interface element ( 218 ) with a second component ( 206 ), d) cohesive bonding of the first contact surface ( 226 ) of the first interface element ( 210 ) with the second contact surface ( 228 ) of the second interface element ( 218 ). Method according to one of claims 13 to 15, wherein before step a) is measured, which space between the first component ( 212 ) and the second component ( 206 ) is available to the interface elements ( 210 . 218 ) with the appropriate shape ( 218-1 ) to be able to select. The method of claim 15 or 16, wherein step a) comprises: selecting the first interface element ( 210 ) and / or the second interface element ( 218 ) from a set of interface elements ( 210 . 218 ), the set of interface elements ( 210 . 218 ) has a plurality of interface elements of different geometry. Method according to one of claims 15 to 17, wherein step a) comprises: producing the first interface element ( 210 ) and / or the second interface element ( 218 ) by grinding, milling or cutting. Method according to one of claims 13 to 18, wherein step d) comprises: d1) moving apart of the first contact surface ( 226 ) and the second contact surface ( 228 ), so that at least one of the two contact surfaces ( 226 . 228 ) Adhesive can be applied, d2) application of adhesive to at least one of the two contact surfaces ( 226 . 228 ), and d3) moving together and bonding the contact surfaces ( 226 . 228 ).

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