DE102019201150A1 - LITHOGRAPHY SYSTEM - Google Patents

Abstract

A lithographic system (100A, 100B) comprising a first component (202), a second component (204), and an adhesive connection (228) which materially connects the first component (202) to the second component (204), wherein the adhesive connection (228) an adhesive (230) and a heating wire (232), wherein the heating wire (232) is energized by energizing it from an inactivated state to an activated state, and wherein the heating wire (232) is configured to be in the activated state Heat (Q) in the adhesive (230) to reduce the modulus of elasticity, the tensile strength and / or the tensile shear strength of the adhesive (230), so that the first component (202) and the second component (204) by means of a the adhesive bond (228) acting force (F) are non-destructively separable from each other.

Description

The present invention relates to a lithographic apparatus.

Microlithography is used to fabricate microstructured devices such as integrated circuits. The microlithography process is performed with a lithography system having an illumination system and a projection system. The image of a mask (reticle) illuminated by means of the illumination system is projected onto a photosensitive layer (photoresist) coated in the image plane of the projection system substrate, for example a silicon wafer, by the projection system to the mask structure on the photosensitive coating of the substrate transferred to.

Driven by the quest for ever smaller structures in the manufacture of integrated circuits, EUV lithography systems are currently being developed which use light with a wavelength in the range of 0.1 nm to 30 nm, in particular 13.5 nm. In such EUV lithography equipment, because of the high absorption of most materials of light of that wavelength, reflective optics, that is, mirrors, must be substituted for refractive optics, that is, lenses, as heretofore.

In the manufacture and / or commissioning of such lithographic systems, it may be necessary to measure the optics in their position, for example via an interferometer. For this purpose, the optics are initially provided with so-called targets, in particular interferometer targets. These interferometer targets can be designed as ceramic components with a corresponding optically active surface, in particular a mirror surface, which is hit by the interferometer beam for measuring and is reflected back to the interferometer.

These interferometer targets can be glued, for example, with the corresponding optics, for example with a mirror back side. However, it may also be necessary to separate these interferometer targets again from the optics. That is, it may be necessary to separate the adhesive bond between the respective interferometer target and the optics, in particular to detackify. For this purpose, the adhesive bond is to be heated so that the modulus of elasticity or the tensile strength and / or tensile shear strength of the adhesive bond drops below a critical limit.

Subsequently, the interferometer target to be removed can be removed again with little effort from the optics. In this Entklebevorgang the heat input into the components to be separated is a very high requirement for this, since it is in both the optics and the interferometer targets are preferably ceramic components, which are accordingly poor heat conductors.

Against this background, an object of the present invention is to provide an improved lithography system.

Accordingly, a lithography system is proposed. The lithographic system comprises a first component, a second component, and an adhesive bond connecting the first component to the second component, wherein the adhesive connection comprises an adhesive and a heating wire, wherein the heating wire by means of energizing the same from an inactivated state to an activated state is engageable, and wherein the heating wire is adapted to bring in the activated state, heat in the adhesive to reduce the modulus of elasticity, the tensile strength and / or the tensile shear strength of the adhesive, so that the first component and the second component by means of a the adhesive bond-acting force are non-destructively separable from each other.

By virtue of the fact that the adhesive bond comprises the heating wire, the tensile strength and / or the tensile shear strength and / or the modulus of elasticity of the adhesive can be reduced without having to introduce heat directly into the first component and / or into the second component. As a result, the components can be solved without damage to each other. In particular, the heating wire selectively introduces the heat only in the adhesive. With the help of the heating wire, the components are separable from one another even with very different thermal masses, since the components themselves do not have to be heated. Due to the non-destructive separation of the components, these can be reused several times.

The adhesive is preferably a thermoplastic adhesive or a thermosetting adhesive. The adhesive is, for example, an epoxy adhesive. In the present case, a "heating wire" is to be understood as meaning a thin, elongate component which is electrically conductive. The heating wire can have any cross section. For example, the heating wire may have a circular or a polygonal, in particular rectangular, cross-section. The heating wire can be produced by means of a wire drawing process. However, the heating wire may also be made by means of a deposition process or a printing process. In this case, the heating wire can be deposited directly on one of the two components or on these be printed. It can be provided a variety of heating wires. For example, the heating wire is a constantan wire. The heating wire may for example have a diameter of about 200 microns.

By "energizing" the heating wire is meant, in particular, that a voltage is applied to the heating wire. For this purpose, for example, be provided a DC power source. The "activated state" may also be referred to as "energized state" and the "inactivated state" may also be referred to as "de-energized state". Depending on the type of adhesive used and / or a thickness of an adhesive gap provided between the components, the heat is introduced into the adhesive by means of energizing the heating wire. In this case, for example, a defined temperature profile or heating profile can be traversed. For example, the temperature profile may include temperature ramps and / or constant temperature hold times.

The force may be either the weight of one of the two components and / or an externally applied force. In particular, the force is applied to one of the two components or both components and transferred from these to the adhesive bond. By "tensile strength" herein is meant a material property, namely the maximum mechanical tensile stress that can occur in the material, that is, the adhesive. The dimension of the tensile strength is force per area. The SI unit of tensile strength is N / mm ² . By "tensile shear strength" herein is also meant a material property of the adhesive. The tensile shear strength can be tested according to the standard DIN EN 1465. The dimension of tensile shear strength is force per area. The SI unit of tensile shear strength is also N / mm ² .

Preferably, the lithography system comprises a connection arrangement comprising the first component, the second component and the adhesive connection. The connection arrangement can be part of the lithography system. In particular, the connection arrangement can be a projection system or part of a projection system of such a lithography system. Furthermore, the connection arrangement may also be a beam-forming and lighting system or a part of such a beam-forming and lighting system.

At least one of the components may be made of a non-metallic material. Both components can be made of a non-metallic material. For example, the components or at least one of the components are made of a ceramic material. As a material for the components or at least one of the components, for example, comes Titanium silicate glass (Engl .: Ultra Low Expansion Glass, ULE), an inorganic, non-porous lithium-aluminum-silica glass ceramic, in particular Zerodur, aluminum silicate magnesium silicate, especially cordierite, or the like for use.

However, at least one of the components can also be made of a metal alloy, in particular of an iron-nickel alloy, for example of Invar, or of any stainless steel alloy. One of the components can also be made of a different material, which has a significantly higher thermal conductivity than ceramic. This is the case, for example, in various stainless steel alloys. Preferably, the components are different in size and / or have different thermal masses.

The term "non-destructive" means that the first component and the second component can be separated from one another, it being understood in particular that in the separation process neither the first component nor the second component are damaged. The adhesive bond itself is destroyed, however. After separating the adhesive bond residues of the adhesive may remain on one of the components or on both components. These can be removed before reuse of the components, for example with the aid of a solvent.

According to one embodiment, the first component is an optical element and / or the second component is an optical element.

In the present case, an "optical element" is to be understood as meaning a component which has light-reflecting or refractive properties. Preferably, at least the first component is an optical element, in particular a mirror. The second component may be an attachment attached to the first component. The second component may be, for example, an encoder scale, a reference mirror, an interferometer target, a temperature sensor, a grounding cable, a mirror bushing, a so-called corner cube, a prism or the like. That is, the second component may also be an optical element.

According to a further embodiment, an adhesive gap is provided between the first component and the second component, in which the adhesive connection is at least partially accommodated, wherein the heating wire is disposed within the adhesive gap or outside the adhesive gap.

The adhesive gap is defined by means of two facing adhesive surfaces of the components. The adhesive connection in particular connects the adhesive surfaces cohesively with each other. In the case where the heating wire is positioned outside the bonding gap, the diameter of the heating wire can be made larger than the bonding gap is thick. The heating wire may be partially embedded in the adhesive. Alternatively, however, the heating wire may also be unwetted by the adhesive. In the latter case, the heat can be transferred purely by thermal radiation to the adhesive. In the event that the heating wire is positioned within the adhesive gap, the heating wire may be completely wetted by the adhesive. The heat is then transferred to the adhesive by thermal conduction.

According to a further embodiment, the adhesive connection further comprises spacers, in particular spacer balls, for adjusting the adhesive gap.

The spacers may be spherical and have a diameter of 10 .mu.m to 100 .mu.m. For example, the spacers may be plastic, glass or ceramic balls. With the help of spacers thus the thickness of the adhesive gap is adjustable. Even the heating wire itself can act as a spacer.

According to a further embodiment, the second component comprises a plurality of adhesive pads which are adhesively bonded to the first component by means of a plurality of adhesive bonds.

Instead of the adhesive pads, a full-surface bonding can be provided. The adhesive pads can also be referred to as adhesive feet. Alternatively, the adhesive pads may also be provided on the first component. The adhesive pads may be, for example, round, oval or polygonal. For example, the heating wire is wound around each of its associated adhesive pad.

According to a further embodiment, the first component has a first adhesive surface, wherein the second component has a second adhesive surface, wherein the first adhesive surface is adhesively bonded by means of the adhesive bond with the second adhesive surface, wherein provided on the first adhesive surface a groove for receiving the heating wire is, and / or wherein on the second adhesive surface, a groove for receiving the heating wire is provided.

The grooves may be rectangular in cross-section. Preferably, a plurality of grooves are provided. Either grooves are provided only on the first component, only on the second component or on both components. In the latter case, each component can be assigned its own heating wire. However, the groove or the grooves are particularly preferably provided only on the smaller of the two components, namely on the second component.

According to a further embodiment, the heating wire is printed on the first component, and / or the heating wire is printed on the second component.

For this purpose, a screen printing process can be used. The heating wire is thus firmly connected to the respective adhesive surface. Due to the use of a printing process, the heating wire has a rectangular cross-section. In the realization of the heating wire by means of a printing process, the positioning of the heating wire with lithographic accuracy in the μ-range is possible. Furthermore, the finest structures can be produced. Either the heating wire is provided only on the first component, only on the second component or on both components. In the latter case, each component can be assigned its own heating wire. The heating wire can also be produced by a deposition method, for example by a galvanic deposition method.

According to a further embodiment, a plurality of heating wires is provided, wherein the plurality of heating wires are connected in parallel and / or in series.

It may also be provided a combination of parallel connection and series connection. The heating wires of the individual adhesive pads can also be connected as desired in parallel and / or in series.

According to a further embodiment, the heating wire runs meandering through the adhesive.

As a result, an improved heat transfer is achieved due to the longer contact distance between the heating wire and the adhesive.

In another embodiment, the heating wire spirals through the adhesive.

This arrangement also allows improved heat transfer.

The lithography system may be an EUV lithography system or a DUV lithography system. EUV stands for "extreme ultraviolet" and denotes a working light wavelength between 0.1 nm and 30 nm. DUV stands for "deep ultraviolet" and denotes a working light wavelength between 30 nm and 250 nm.

In the present case, "a" is not necessarily to be understood as restricting to exactly one element. Rather, several elements, such as two, three or more, may be provided. Also, any other count word used herein is not to be understood as being limited to just the stated number of elements. Rather, numerical deviations up and down are possible, unless stated otherwise.

Further possible implementations of the invention also include not explicitly mentioned combinations of features or embodiments described above or below with regard to the exemplary embodiments. The skilled person will also add individual aspects as improvements or additions to the respective basic form of the invention.

• 1A zeigt eine schematische Ansicht einer Ausführungsform einer EUV-Lithographieanlage;
• 1B zeigt eine schematische Ansicht einer Ausführungsform einer DUV-Lithographieanlage;
• 2 zeigt eine schematische Schnittansicht einer Ausführungsform einer Verbindungsanordnung für die Lithographieanlage gemäß 1A oder 1B;
• 3 zeigt die Detailansicht III gemäß 2;
• 4 zeigt eine schematische Schnittansicht einer weiteren Ausführungsform einer Verbindungsanordnung für die Lithographieanlage gemäß 1A oder 1B;
• 5 zeigt eine schematische Schnittansicht einer weiteren Ausführungsform einer Verbindungsanordnung für die Lithographieanlage gemäß 1A oder 1B;
• 6 zeigt eine schematische Schnittansicht einer weiteren Ausführungsform einer Verbindungsanordnung für die Lithographieanlage gemäß 1A oder 1B;
• 7 zeigt eine schematische Schnittansicht einer weiteren Ausführungsform einer Verbindungsanordnung für die Lithographieanlage gemäß 1A oder 1B;
• 8 zeigt eine schematische Schnittansicht einer weiteren Ausführungsform einer Verbindungsanordnung für die Lithographieanlage gemäß 1A oder 1B;
• 9 zeigt eine schematische Schnittansicht einer weiteren Ausführungsform einer Verbindungsanordnung für die Lithographieanlage gemäß 1A oder 1B;
• 10 zeigt eine schematische Draufsicht einer Ausführungsform einer Klebeverbindung für die Verbindungsanordnungen gemäß den 2 bis 9;
• 11 zeigt eine schematische Draufsicht einer weiteren Ausführungsform einer Klebeverbindung für die Verbindungsanordnungen gemäß den 2 bis 9; und
• 12 zeigt eine schematische Draufsicht einer weiteren Ausführungsform einer Klebeverbindung für die Verbindungsanordnungen gemäß den 2 bis 9.

Further advantageous embodiments and aspects of the invention are the subject of the dependent claims and the embodiments of the invention described below. Furthermore, the invention will be explained in more detail by means of preferred embodiments with reference to the attached figures.

• 1A shows a schematic view of an embodiment of an EUV lithography system;
• 1B shows a schematic view of an embodiment of a DUV lithography system;
• 2 shows a schematic sectional view of an embodiment of a connection assembly for the lithographic system according to 1A or 1B ;
• 3 shows the detail view III according to 2 ;
• 4 shows a schematic sectional view of another embodiment of a connection arrangement for the lithographic system according to 1A or 1B ;
• 5 shows a schematic sectional view of another embodiment of a connection arrangement for the lithographic system according to 1A or 1B ;
• 6 shows a schematic sectional view of another embodiment of a connection arrangement for the lithographic system according to 1A or 1B ;
• 7 shows a schematic sectional view of another embodiment of a connection arrangement for the lithographic system according to 1A or 1B ;
• 8th shows a schematic sectional view of another embodiment of a connection arrangement for the lithographic system according to 1A or 1B ;
• 9 shows a schematic sectional view of another embodiment of a connection arrangement for the lithographic system according to 1A or 1B ;
• 10 shows a schematic plan view of an embodiment of an adhesive joint for the connection arrangements according to the 2 to 9 ;
• 11 shows a schematic plan view of another embodiment of an adhesive bond for the connection arrangements according to the 2 to 9 ; and
• 12 shows a schematic plan view of another embodiment of an adhesive bond for the connection arrangements according to the 2 to 9 ,

In the figures, the same or functionally identical elements have been given the same reference numerals, unless stated otherwise. It should also be noted that the illustrations in the figures are not necessarily to scale.

1A shows a schematic view of an EUV lithography system 100A which is a beam shaping and illumination system 102 and a projection system 104 includes. EUV stands for "extreme ultraviolet" (English: extreme ultraviolet, EUV) and refers to a wavelength of working light between 0.1 nm and 30 nm. The beam shaping and illumination system 102 and the projection system 104 are each provided in a vacuum housing, not shown, wherein each vacuum housing is evacuated by means of an evacuation device, not shown. The vacuum housings are surrounded by a machine room, not shown, in which drive devices are provided for the mechanical method or adjustment of optical elements. Furthermore, electrical controls and the like may be provided in this engine room.

The EUV lithography system 100A has an EUV light source 106A on. As an EUV light source 106A For example, a plasma source (or a synchrotron) can be provided, which radiation 108A in the EUV range (extreme ultraviolet range), so for example in the wavelength range of 5 nm to 20 nm emits. In the beam-forming and lighting system 102 becomes the EUV radiation 108A bundled and the desired operating wavelength from the EUV radiation 108A filtered out. The from the EUV light source 106A generated EUV radiation 108A has a relatively low Transmissivity due to air, which is why the beam guiding spaces in the beam-forming and lighting system 102 and in the projection system 104 are evacuated.

This in 1A illustrated beam shaping and illumination system 102 has five mirrors 110 . 112 . 114 . 116 . 118 on. After passing through the beam shaping and lighting system 102 becomes the EUV radiation 108A on a photomask (English: reticle) 120 directed. The photomask 120 is also designed as a reflective optical element and can be outside the systems 102 . 104 be arranged. Next, the EUV radiation 108A by means of a mirror 122 on the photomask 120 be steered. The photomask 120 has a structure which, by means of the projection system 104 reduced to a wafer 124 or the like is mapped.

The projection system 104 (also called projection lens) has six mirrors M1 to M6 for imaging the photomask 120 on the wafer 124 on. It can single mirror M1 to M6 of the projection system 104 symmetrical to an optical axis 126 of the projection system 104 be arranged. It should be noted that the number of mirrors M1 to M6 the EUV lithography system 100A is not limited to the number shown. There may also be more or less mirrors M1 to M6 be provided. Furthermore, the mirrors M1 to M6 usually curved at its front for beam shaping.

1B shows a schematic view of a DUV lithography system 100B which is a beam shaping and illumination system 102 and a projection system 104 includes. DUV stands for "deep ultraviolet" (English: deep ultraviolet, DUV) and refers to a wavelength of working light between 30 nm and 250 nm. The beam shaping and illumination system 102 and the projection system 104 can - as already related to 1A described - arranged in a vacuum housing and / or surrounded by a machine room with corresponding drive devices.

The DUV lithography system 100B has a DUV light source 106B on. As a DUV light source 106B For example, an ArF excimer laser can be provided, which radiation 108B in the DUV range at, for example, 193 nm emitted.

This in 1B illustrated beam shaping and illumination system 102 directs the DUV radiation 108B on a photomask 120 , The photomask 120 is designed as a transmissive optical element and can be outside the systems 102 . 104 be arranged. The photomask 120 has a structure which, by means of the projection system 104 reduced to a wafer 124 or the like is mapped.

The projection system 104 has several lenses 128 and / or mirrors 130 for imaging the photomask 120 on the wafer 124 on. This can be individual lenses 128 and / or mirrors 130 of the projection system 104 symmetrical to an optical axis 126 of the projection system 104 be arranged. It should be noted that the number of lenses 128 and mirrors 130 the DUV lithography system 100B is not limited to the number shown. There may also be more or fewer lenses 128 and / or mirrors 130 be provided. Furthermore, the mirrors 130 usually curved at its front for beam shaping.

An air gap between the last lens 128 and the wafer 124 can be through a liquid medium 132 be replaced, which has a refractive index> 1. The liquid medium 132 can be, for example, high purity water. Such a structure is also referred to as immersion lithography and has an increased photolithographic resolution. The medium 132 can also be referred to as immersion liquid.

2 shows an embodiment of a connection arrangement 200 , The connection arrangement 200 can be part of a lithography system as explained above 100A . 100B be. In particular, the connection arrangement 200 a projection system 104 or part of such a projection system 104 be. Furthermore, the connection arrangement 200 also a beam shaping and lighting system 102 or part of such a beamforming and illumination system 102 be.

The connection arrangement 200 includes a first component 202 and a second component 204 , At least one of the components 202 . 204 can be made of a non-metallic material. It can also be both components 202 . 204 be made of a non-metallic material. For example, the components 202 . 204 or at least one of the components 202 . 204 made of a ceramic material. As a material for the components 202 . 204 For example, titanium-silicate glass (English: Ultra Low Expansion Glass, ULE), an inorganic, non-porous lithium-aluminum-silica glass ceramic, in particular Zerodur, aluminum silicate magnesium silicate, especially cordierite, or the like is used. At least one of the components 202 . 204 may also be made of a metal alloy, in particular of an iron-nickel alloy, for example Invar or any other stainless steel alloy or the like.

The first component 202 may be an optical element, such as one of the mirrors 110 . 112 . 114 . 116 . 118 . 122 . 130 . M1 to M6 or one of the lenses 128 be. The second component 204 is preferably an attachment attached to the first component 202 is attached. The second component 204 For example, an encoder scale, a reference mirror, an interferometer target, a temperature sensor, a ground wire, a mirror receptacle, a so-called corner cube, a prism, or the like. That means also the second component 204 may be an optical element. Generally speaking, each of the components can 202 . 204 either an optical component or optical element, for example with reflective or refractive properties, or a non-optical component or non-optical element.

Preferably, the components 202 . 204 different sizes and / or have significantly different masses. Like in the 2 shown is the first component 202 significantly larger than the second component 204 and also has a larger mass than these. However, the size and / or mass ratios can also be reversed.

The first component 202 has one of the second component 204 facing away from the front 206 and one of the front 206 opposite rear side 208 on. The shape and geometry of the front 206 and the back 208 is arbitrary. The front side is preferred 206 an optically active surface, in particular a mirror surface. The backside 208 is preferably optically inactive. The front 206 and the back 208 are on a substrate 210 , in particular on a mirror substrate, provided.

The first component 202 can at her back 208 an optional recess 212 exhibit. The backside 208 but it can also be smooth. The recess 212 may be, for example, a circular cylindrical bore or a groove. The recess 212 has a floor 214 on, parallel to and spaced from the back 208 is positioned. From the soil 214 extends towards the back 208 a pen-shaped base 216 , The socket is 216 optional. If the back 208 is smooth, the pedestal can 216 omitted or directly from the back 208 extend out.

On the pedestal 216 is the second component 204 with the help of one in the 2 Glued adhesive bond not shown. Depending on the requirements of the adhesive bond, this can have a large number of individual adhesive pads or can also comprise a full-surface adhesive geometry.

3 shows the detail view III according to the 2 , where the 3 only one exemplary embodiment of the connection arrangement 200 shows. In the 3 is from the first component 202 only the socket 216 shown. The base 216 includes a first adhesive surface 218 , The first adhesive surface 218 is preferably parallel to and spaced from the backside 208 the first component 202 positioned.

The second component 204 includes a front side 220 , The front 220 may be an optically active surface, for example a mirror surface. The front 220 turned away is a back 222 intended. The backside 222 is preferably optically inactive. The backside 222 is the first adhesive surface 218 facing. From the back 222 extends a variety of adhesive feet or adhesive pads 224 out of which in the 3 however, only one is shown. The number of adhesive pads 224 is arbitrary. The adhesive pads 224 For example, they can be round, square or oval. Each adhesive pad 224 includes a second adhesive surface 226 , the first adhesive surface 218 the first component 202 is facing. Between the adhesive surfaces 218 . 226 is a glue gap S intended. A thickness of the glue gap S can be fractions of a millimeter to a few millimeters. The thickness of the adhesive gap is particularly preferred S but only about 10 microns to 100 microns.

The connection arrangement 200 includes besides the components 202 . 204 one the first component 202 cohesively with the second component 204 connecting adhesive joint 228 that the glue gap S fills. The adhesive connection 228 especially connects the adhesive surfaces 218 . 226 together. In cohesive connections, the connection partners are held together by atomic or molecular forces. Cohesive connections are non-detachable compounds, which can only be destroyed by the connection means, in particular the adhesive connection 228 , let separate. Every adhesive pad 224 is an adhesive bond 228 assigned.

Every adhesive connection 228 includes an adhesive 230 and a heating wire 232 , with the help of which the adhesive bond 228 destructible or separable to the components 202 . 204 without separating them from each other. The adhesive 230 For example, it may be an epoxy adhesive or any other suitable adhesive. The adhesive connection 228 Optionally can still spacers 234 include. The spacers 234 may be spherical and have a diameter of 10 microns to 100 microns. The spacers 234 may be so-called spacer beads or referred to as such. For example, the spacers 234 Plastic, glass or Be ceramic balls. With the help of spacers 234 is the glue gap S adjustable.

The heating wire 323 may be circular, oval or rectangular in cross-section. However, the heating wire can 232 have any cross-section. The heating wire 232 is outside the glue gap S positioned. This allows a diameter of the heating wire 232 bigger than the glue gap S is thick. For example, the heating wire 232 a diameter of about 200 microns. The heating wire 232 May be partially in the glue 230 be embedded. Alternatively, the heating wire 232 but also from the glue 230 be unwetted. For example, the heating wire 232 around the adhesive pad 224 wound.

The functionality of the connection arrangement 200 is explained below. The heating wire 232 is when gluing the components 202 . 204 on or in the adhesive connection 228 attached or inserted. After curing the adhesive 230 is the heating wire 232 then part of the adhesive bond 228 ,

For detacking or separating the components 202 . 204 apart from each other, the heating wire 232 be brought from an inactivated state to an activated state. For this purpose, the heating wire 232 energized. That is, in the inactivated state is the heating wire 232 de-energized and in the activated state is the heating wire 232 energized. In the activated state brings the heating wire 232 warmth Q in the glue 230 one. The heat Q can in the event that the glue 230 the heating wire 232 wetted by heat conduction in the adhesive 230 be introduced. In the event that the glue 230 the heating wire 232 not moistened, the heat can Q over heat radiation in the adhesive 230 be introduced.

Depending on the type of adhesive 230 and / or the thickness of the adhesive gap S gets the heat Q with the help of energizing the heating wire 232 in the glue 230 brought in. In this case, for example, a defined temperature profile or heating profile can be traversed. For example, the temperature profile may include temperature ramps and / or constant temperature hold times. Objective in the introduction of heat Q in the glue 230 is the damage or destruction of the same to the components 202 . 204 to be able to separate again from each other without damaging them and without placing too much thermal stress on them. The components 202 . 204 can thereby be reused.

In particular, the heating wire 232 in the activated state, the elastic modulus, the tensile strength and / or the tensile shear strength of the adhesive 230 to reduce, so the components 202 . 204 non-destructively separable from each other. Due to the entry of heat Q becomes the glue 230 either melted or chemically modified, for example pyrolyzed.

The adhesive connection 228 fails or can be separated with little effort. This allows the second component 204 damage-free from the first component 202 be separated. One for separating the adhesive connection 228 applied force F For example, the weight of the second component 204 and / or an externally applied force.

4 shows the detail view III according to the 2 with a further embodiment of the connection arrangement 200 , The embodiment of the connection arrangement 200 according to the 4 differs from the embodiment of the connection arrangement 200 according to the 3 just by doing without the spacers 234 , The functionality of the connection arrangement 200 does not change.

5 shows the detail view III according to the 2 with a further embodiment of the connection arrangement 200 , In this embodiment of the connection arrangement 200 is the heating wire 232 in contrast to the connection arrangement 200 according to the 3 not outside, but within the glue gap S positioned. That is, the glue 230 wets the heating wire 232 full. The heating wire 232 can also act as a spacer for adjusting the glue gap S serve.

6 shows the detail view III according to the 2 with a further embodiment of the connection arrangement 200 , The connection arrangement 200 according to the 6 differs from the connection arrangement 200 according to the 5 only in that at the first gluing surface 218 the first component 202 groove 236 . 238 are provided, through which the heating wire 232 is guided. The heating wire 232 can completely in the grooves 236 . 238 be included or, as in the 6 shown slightly above the first adhesive surface 218 survive. The grooves 236 . 238 may be rectangular or any other geometry.

7 shows the detail view III according to the 2 with a further embodiment of the connection arrangement 200 , The connection arrangement 200 according to the 7 differs from the connection arrangement 200 according to the 6 only in that not at the first adhesive surface 218 the first component 202 groove 236 . 238 are provided, but that the second adhesive surface 226 the second component 204 groove 240 . 242 includes. Through the grooves 240 . 242 is in turn the heating wire 232 guided.

8th shows the detail view III according to the 2 with a further embodiment of the connection arrangement 200 , The connection arrangement 200 according to the 8th differs from the connection arrangement 200 according to the 5 only in that the heating wire 232 not as of the components 202 . 204 is executed separate component, but in a printing process, in particular in a screen printing process, directly on the first adhesive surface 218 the first component 202 applied, in particular imprinted. The heating wire 232 is thus firm with the first adhesive surface 218 connected. Due to the use of a printing process, the heating wire 232 a rectangular cross section. In the realization of the heating wire 232 using a printing process is the positioning of the heating wire 232 possible with lithographic accuracy in the μ-range. Furthermore, the finest structures can be produced.

9 shows the detail view III according to the 2 with a further embodiment of the connection arrangement 200 , The connection arrangement 200 according to the 9 differs from the connection arrangement 200 according to the 8th only in that the heating wire 232 not on the first adhesive surface 218 the first component 202 but on the second adhesive surface 226 the second component 204 is printed.

10 shows a plan view of an embodiment of an adhesive bond 228 for the connection arrangements 200 according to the 2 to 9 , As the 10 shows is a plurality of parallel heating wires 232 provided, of which in the 10 only two are provided with a reference numeral. The heating wires 232 are with the help of two connectors 244 . 246 connected in parallel. The connections 244 . 246 can be connected to a power source to the heating wires 232 to energize.

11 shows a plan view of another embodiment of an adhesive bond 228 for the connection arrangements 200 according to the 2 to 9 , In contrast to the adhesive connection 228 according to the 10 Here are the heating wires 232 not parallel, but connected in series. In particular, the heating wires run 232 Meandering through the adhesive 230 therethrough.

12 shows a plan view of another embodiment of an adhesive bond 228 for the connection arrangements 200 according to the 2 to 9 , In contrast to the adhesive connection 228 according to the 11 the heating wires run 232 not meandering, but spirally through the adhesive 230 therethrough.

Although the present invention has been described with reference to embodiments, it is variously modifiable.

LIST OF REFERENCE NUMBERS

100A

EUV lithography system

100B

DUV lithography system

102

Beam shaping and lighting system

104

projection system

106A

EUV-light source

106B

DUV light source

108A

EUV radiation

108B

DUV radiation

110

mirror

112

mirror

114

mirror

116

mirror

118

mirror

120

photomask

122

mirror

124

wafer

126

optical axis

128

lens

130

mirror

132

medium

200

joint assembly

202

component

204

component

206

front

208

back

210

substratum

212

recess

214

ground

216

base

218

adhesive surface

220

front

222

back

224

adhesive pad

226

adhesive surface

228

adhesive bond

230

adhesive

232

heating wire

234

spacer

236

groove

238

groove

240

groove

242

groove

244

connection

246

connection

F

force

M1

mirror

M2

mirror

M3

mirror

M4

mirror

M5

mirror

M6

mirror

S

bonding gap

Q

warmth

Claims (10)

Lithography system (100A, 100B) comprising a first component (202), a second component (204), and an adhesive connection (228) which integrally connects the first component (202) to the second component (204), wherein the adhesive connection (228) comprises an adhesive (230) and a heating wire (232), the heating wire (232) being energized from the inactivated state to an activated state, and wherein the heating wire (232) is adapted to apply heat (Q) to the adhesive (230) in the activated state, the modulus of elasticity, the tensile strength and / or the tensile shear strength of the adhesive (230) so that the first component (202) and the second component (204) are non-destructively separable from each other by means of a force (F) acting on the adhesive joint (228). Lithography plant after Claim 1 wherein the first component (202) is an optical element and / or wherein the second component (204) is an optical element. Lithography plant after Claim 1 or 2 in that between the first component (202) and the second component (204) an adhesive gap (S) is provided, in which the adhesive connection (228) is at least partially received, and wherein the heating wire (232) within the adhesive gap (S) or outside the adhesive gap (S) is arranged. Lithography plant after Claim 3 wherein the adhesive bond (228) further comprises spacers (234), in particular spacer beads, for adjusting the bonding gap (S). Lithography plant according to one of Claims 1 - 4 wherein the second component (204) comprises a plurality of adhesive pads (224) which are adhesively bonded to the first component (202) by means of a plurality of adhesive bonds (228). Lithography plant according to one of Claims 1 - 5 wherein the first component (202) has a first adhesive surface (218), wherein the second component (204) has a second adhesive surface (226), wherein the first adhesive surface (218) by means of the adhesive connection (228) integrally with the second adhesive surface (226), wherein on the first adhesive surface (218) has a groove (236, 238) for receiving the heating wire (232) is provided, and / or wherein on the second adhesive surface (226) has a groove (240, 242) for Receiving the heating wire (232) is provided. Lithography plant according to one of Claims 1 - 6 wherein the heating wire (232) is printed on the first component (202), and / or wherein the heating wire (232) is printed on the second component (204). Lithography plant according to one of Claims 1 - 7 , wherein a plurality of heating wires (232) is provided, and wherein the plurality of heating wires (232) are connected in parallel and / or in series. Lithography plant according to one of Claims 1 - 8th wherein the heating wire (232) meanders through the adhesive (230). Lithography plant according to one of Claims 1 - 8th wherein the heating wire (232) spirals through the adhesive (230).

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