KR102507693B1 - Connecting arrangement for a lithography system - Google Patents

Abstract

A first component (212), a second component (206), a first interface element (210) releasably connected to the first component (212) at a first junction (220), and a second junction (222). A connection device (200A, 200B) for a lithography system (100) having a second interface element (218) releasably connected to a second component (206) at ) is disclosed. The first interface element 210 has a first contact surface 226, the second interface element 218 has a second contact surface 228, and at least one of the two contact surfaces 226 and 228 has two contact surfaces ( 226 , 228 are configured to be aligned and/or selected to compensate for an offset between the first component 212 and the second component 206 prior to joining at the third joint 224 . The first contact surface 226 of the first interface element 210 and the second contact surface 228 of the second interface element 218 are connected by a material fit connection at the third junction 224 .

Description

Connecting device for lithography system {CONNECTING ARRANGEMENT FOR A LITHOGRAPHY SYSTEM}

This application claims priority to German Patent Application No. 10 2014 225 199.0 filed on 9 December 2014. This German application is incorporated herein by reference in its entirety.

The present invention relates to a connecting arrangement, a lithographic system having a connecting arrangement, and a method for manufacturing the connecting arrangement.

For reasons of material and manufacture, lenses consist of various components, in particular support structures and optical devices. Thus, the support structure is connected to the optical device via the junction. Depending on the way the joints are made, these joints generate stresses and strains that have a detrimental effect on the optical device. In particular, because of the requirement for minimum mechanical strength, stress- and strain-free assemblies are conventionally rarely possible.

Because of the stresses and strains generated by this method, it is also important during assembly that additional stresses and strains are not thereby generated and compensate for shape and positional tolerances of the components. WO2005/106557 considers this effect by means of the deformation caused by the press-fit connection being absorbed by decoupling the elements. Since the decoupling effect is directly related to mechanical stiffness, this procedure is only of limited suitability for systems requiring high mechanical stiffness.

Against this background, it is an object of the present invention to improve a connection device for a lithography system, in particular wherein the connection device is releasable on the one hand and, on the other hand, connects virtually stress- and strain-free in the installed position of the components. has been In particular, it is an object of the present invention to provide a lithography system having a connecting device, and a method for manufacturing the connecting device.

This object is directed to a first component, a second component, a first interface element releasably connected to the first component at a first junction, and a second interface releasably connected to the second component at a second junction. This is achieved by a connecting device for a lithography system having elements. The first interface element has a first contact surface and the second interface element has a second contact surface. At least one of the two contact surfaces is configured to be aligned and/or selected to compensate for an offset between the first component and the second component before the two contact surfaces are joined at a third joint. The first contact surface of the first interface element and the second contact surface of the second interface element are connected by a material fit connection at the third junction.

The first component may be a support structure. The second component may be an optical device. The optical device may have an optical element and a frame for the optical element. However, one of the components may also be a structural component such as a measurement interface, a reference structure or a lithography system.

A first interface element is releasably connected to the first component. A second interface element is releasably connected to the second component. A releasable connection may be a press-fit and/or form-fit connection. A press-fit connection presupposes a normal force on the surfaces to be connected to one another. A press-fit connection may be achieved by friction locking or by magnetic force fit. Mutual displacement of the surfaces is prevented as long as the counterforce generated by static friction or magnetic fit is not exceeded.

The first contact surface of the first interface element and the second contact surface of the second interface element are connected by a material fit connection. In the case of a material-fit connection, the connection partners are held together by atomic or molecular forces. A material fit connection is a non-releasable connection that can only be separated by destroying the connecting means. The material fit connection may be effected, for example, by adhesive bonding, brazing, welding or vulcanization.

The expression “at least one of the two contact surfaces is configured to be aligned and/or selected to compensate for an offset between the first component and the second component before the two contact surfaces are joined at a third joint” means: It should be interpreted as meaning that at least one of the two contact surfaces can be suitably inclined and/or interface elements can be selected correspondingly, so that at least one of the two contact surfaces will be suitably aligned after selection.

In the case of a material-fit connection, the connection may occur with a relative degree of freedom from the stresses of the components. If the components are contactlessly mounted at the installation location during adhesive bonding, the adhesive bonding can compensate for tolerances in the bonding gap, and only stress due to bonding is generated.

Since the connecting device has two releasable joints, both the first component and the second component can be exchanged non-destructively. Since at least one of the two contact surfaces of the interface element is adjustable to compensate for an offset between the first component and the second component, the connecting device can be arranged in a manner intended to be installed within a lithography system. The material-fitting connection at the third joint, ie between the first and second interface elements, then ultimately guarantees a stress-free and strain-free connection. Since the two contact surfaces of the interface element are aligned with each other, a very thin material fit connection can be created at the third joint. This leads to highly rigid linkages. Since the two contact surfaces of the interface element are aligned with each other, a parallel material-fitting connection can furthermore be created at the third junction. This leads to minimization of torques that might otherwise occur, for example during curing of the adhesive.

In one embodiment of the connection device, at least one of the two contact surfaces of the first and second interface elements is in relation to the shortest connection path or in relation to a direction perpendicular to the shortest connection path and/or of the two contact surfaces relative to each other. They can be aligned with respect to angles. Alignability may include all directions and angles in this case. Advantageously, the two contact surfaces may thus be aligned with a constant short distance. This allows for a thin third splice and thus a highly rigid connection device, or a parallel splice with advantages in relation to the adjacent stress effect.

At least one of the two contact surfaces can be aligned with respect to the connecting path, ie the distance between the two contact surfaces can be adjusted. At least one of the two contact surfaces can be aligned with respect to a direction perpendicular to the connection path, ie at least one contact surface can be moved in such a way that, when viewed in a direction perpendicular to the at least one contact surface, it lies exactly above the other contact surface. there is. At least one of the two contact surfaces may be aligned with respect to an angle of the two contact surfaces relative to each other, ie the contact surfaces may be aligned parallel to each other.

According to another preferred embodiment of the connecting device, the contact surfaces are parallel to each other. That is, the contact surfaces have a certain distance from each other. In this way, the material-fitting connection can be well implemented, and during the creation of the material-fitting connection, no stress can occur.

According to another embodiment of the connecting device, at least one of the interface elements has an asymmetrical shape to compensate for an offset between the components. Advantageously, the contact surfaces can thus be positioned parallel and at a certain short distance from one another.

At least one of the two interface elements may be selected from a plurality of interface elements. Since at least one of the interface elements is configured as a replaceable element (shim), suitably shaped interface elements can be used as required.

According to another embodiment of the connecting device, the asymmetric shape is a wedge shape. Advantageously, the wedge-shaped interface elements can compensate for the inclined positioning of the contact surfaces relative to each other.

According to another embodiment of the connecting device, the first interface element has a base and an inclined lockable element for inclining the first contact surface relative to the base. In this case, the base may be connected to the first component in a press and/or form-fitting manner. The tilted lockable element may be tilted relative to the base. After the inclined fastenable element is aligned, it can be secured by means of the base. The first contact surface may be formed by a side surface of the inclined lockable element of the first interface element.

Alternatively or additionally, the second interface element has a base and an inclined lockable element for inclining the second contact surface relative to the base. In this case, the base may be connected to the second component in a press and/or form-fitting manner. The tilted lockable element may be tilted relative to the base. After the inclined fastenable element is aligned, it can be secured by means of the base. The second contact surface may be formed by a side surface of the inclined lockable element of the second interface element.

According to another embodiment of the connection device, the first contact surface of the first interface element is planar and/or the second contact surface of the second interface element is planar. Since the contact surfaces of the interface elements are planar, they can be well connected to each other with a material fit.

According to another embodiment of the connection device, the inclined fastenable element of the first interface element and/or of the second interface element is configured as a spherical cap, and the component to which the inclined fastenable element is fastened has a corresponding recess. . In this case, the planar side of the spherical cap has one of the two contact surfaces, and the curved side of the spherical cap can be clamped against the corresponding component.

According to another embodiment of the connecting device, the base has a fixing element for clamping the inclined lockable element to the component for fixation. After the contact surfaces are aligned, the fixing element can secure the inclined lockable element. The fixing element may have a curvature. The inclined fastenable element may have a curvature corresponding to the curvature of the fastening element.

According to another embodiment of the connecting device, the first component has a support structure and the second component has an optical device. Preferably, the connecting device may be manufactured with a support structure and an optical device.

According to another embodiment of the connecting device, the optical device has a frame and a mirror or lens element. The optical device may have a frame for the optical element. The optical element may be a mirror or lens element.

A lithography system, particularly an EUV lithography system, having one or more connecting devices as described above is also provided.

A method for manufacturing a connecting device for a lithography system is also described. The method has the following steps. In step a), the first interface element is such that the tiltable fastenable element of the first interface element and/or the tiltable fastenable element of the second interface element are tiltable relative to the first component and/or the second component. is releasably connected to the first component and the second interface element is releasably connected to the second component. In step b), the first contact surface of the first interface element and/or the second contact surface of the second interface element are aligned to compensate for the offset between the first and second components. In step c), the tiltable lockable element of the first interface element is fixed relative to the first component and/or the tiltable lockable element of the second interface element is fixed relative to the second component. In step d), the first contact surface of the first interface element is connected to the second contact surface of the second interface element with a material fit.

The method manufactures a connecting device having two releasable splices. In this way, both the first component and the second component can be replaced. The use of one or more inclined lockable elements allows alignment of the first contact surface of the first interface element and/or of the second contact surface of the second interface element. Subsequently, the inclined fastenable elements are fixed, or the inclined fastenable elements are fixed. A very thin material fit-on connection can then be created between the interface elements by adhesive bonding. This leads to highly rigid linkages. Moreover, the material fit connection at the third junction is performed as a final step. In this way, a stress- and strain-free connection device can be produced.

No sequence is specified by the designation of individual method steps.

According to another embodiment of the method, step b) is a step of inclining the first contact surface of the first interface element by bringing the first contact surface of the first interface element and the second contact surface of the second interface element into contact, comprising: The inclined fastenable element of the interface element is a sloped step of the first contact surface, and/or a second interface element, in which the first contact surface of the first interface element and the second contact surface of the second interface element are inclined to have a certain distance from each other. inclining the second contact surface of the second interface element by bringing the second contact surface of the first interface element into contact with the second contact surface of the second interface element, wherein the inclined fastenable element of the second interface element and a step of inclining the second contact surface, wherein the contact surface and the first contact surface of the first interface element are inclined to have a certain distance from each other. Advantageously, the contact surface may be aligned by means of an inclined lockable element.

A method for manufacturing a connecting device for a lithography system is further described. The method has the following steps. In step a), a first interface element and a second interface element are selected and/or manufactured. In step b), a first interface element is releasably connected to the first component. In step c), a second interface element is releasably connected to the second component. In step d), the first contact surface of the first interface element is connected to the second contact surface of the second interface element with a material fit.

The method manufactures a connecting device having two releasable splices. In this way, both the first component and the second component can be replaced. By selecting and/or manufacturing interface elements, suitable interface elements can be provided to compensate for offsets between components. In this way, the contact surfaces of the interface elements can be aligned parallel to each other. A very thin material fit-on connection can then be created between the interface elements by adhesive bonding. This leads to highly rigid linkages. Moreover, the material fit connection at the third junction is performed as a final step. In this way, a stress- and strain-free connection device can be produced.

No sequence is specified by the designation of individual method steps.

According to another embodiment of the method, a measurement of the space available between the first component and the second component is made to enable selecting an interface element having a suitable shape. Advantageously, the contact surfaces of the interface elements are aligned parallel to each other after selection and connection to the component.

According to another embodiment of the method, step a) comprises selecting a first interface element and/or a second interface element from the set of interface elements, wherein the set of interface elements comprises a plurality of interface elements having different geometries. have Advantageously, a suitable interface element can be selected from a set of interface elements.

According to another embodiment of the method, step a) comprises manufacturing of the first interface element and/or of the second interface element by grinding, milling or cutting. Advantageously, the interface element can be simply manufactured from basic shapes.

According to another embodiment of the method, step d) comprises the following steps: In step d1), the first contact surface and the second contact surface are spaced apart from each other so that adhesive can be applied at least on one of the two contact surfaces. are moved In step d2), adhesive is applied on at least one of the two contact surfaces. In step d3), the contact surfaces are brought together and adhesively bonded. Advantageously, a stress- and strain-free connection device can be produced by means of a material fit connection.

The embodiments and features described for the proposed device apply accordingly for the proposed method.

Other possible implementations of the present invention also include combinations not explicitly mentioned of features or embodiments described above or below with respect to exemplary embodiments. In this case, the person skilled in the art will also add individual aspects as refinements or enhancements of each basic form of the invention.

Other advantageous configurations and aspects of the invention are the subject of the dependent claims and of exemplary embodiments of the invention as described below. Moreover, the present invention will be explained in more detail with the aid of preferred embodiments with reference to the accompanying drawings.
1 shows a schematic diagram of an EUV lithography system.
2A shows a schematic diagram of a support structure and an optical device.
Fig. 2b shows a schematic diagram of a first embodiment of a connecting device having the optical device and the carrier structure of Fig. 2a.
3 shows a schematic diagram of a second embodiment of a connection device.
FIG. 4 shows a detailed sectional view of the connecting device of FIG. 3 .
FIG. 5 shows a schematic diagram of a device for manufacturing the connecting devices of FIGS. 3 and 4 .
Fig. 6 shows a schematic flow diagram of a method for manufacturing the connection device of Figs. 3 and 4 with the device of Fig. 5;

Unless otherwise indicated, like reference numbers in the drawings indicate identical or functionally equivalent elements. Moreover, it should be noted that representations in the drawings are not necessarily drawn to scale.

1 shows a schematic diagram of an EUV lithography system 100 that includes a beam shaping system 102 , an illumination system 104 and a projection system 106 . The beam forming system 102, illumination system 104 and projection system 106 are each provided within a vacuum housing that is evacuated with the aid of an evacuation device (not shown in detail). The vacuum housing is surrounded by a mechanical space (not shown in detail) provided with a drive for mechanical movement or adjustment of the optical element. An electrical control unit or the like may furthermore be provided in the mechanical space.

The beamforming system 102 has an EUV light source 108 , a collimator 110 and a monochromator 112 . For example, a plasma source or synchrotron that emits radiation in the EUV range (extreme ultraviolet range), ie in the wavelength range of 5 nm to 20 nm, may be provided as the EUV light source 108 . Radiation emitted by the EUV light source 108 is first collimated by a collimator 110, where the desired operating wavelength is filtered by a monochromator 112. Thus, beam shaping system 102 adapts to the wavelength and spatial distribution of light emitted by EUV light source 108 . EUV radiation 114 generated by EUV light source 108 has a relatively low transmittance through air, for which reason within beam shaping system 102 , within illumination system 104 and within projection system or projection lens 106 . The beam guide space is evacuated.

In the example represented, the illumination system 104 has a first mirror 116 and a second mirror 118 . These mirrors 116 , 118 may be configured as facet mirrors, for example for pupil shaping, and guide the EUV radiation 114 onto the photomask 120 .

The photomask 120 is likewise configured as a reflective optical element and may be arranged external to the system 102 , 104 , 106 . The photomask 120 has a structure that is imaged on a reduced scale by the projection system 106 onto a wafer 122 or the like. For this purpose, the projection system 106 has, for example, a third mirror 124 and a fourth mirror 202 in the beam guiding space. It should be noted that the number of mirrors in EUV lithography system 100 is not limited to the number represented, and more or fewer mirrors may be provided. Moreover, the mirrors are usually curved on their front side for beam shaping.

2A shows the fourth mirror 202 as an example. The fourth mirror 202 is applied on a frame 204 (mirror support frame). The fourth mirror 202 and frame 204 may together form an optical device 206 . Frame 204 has wedge-shaped projections 208-1 and projections 208-2. This wedge-shaped protrusion 208 - 1 represents in this case an arbitrarily shaped contact element of the frame 204 . There is a first interface element 210-1 opposite the wedge-shaped protrusion 208-1, and likewise a first interface element 210-2 opposite the protrusion 208-2. The first interface elements 210-1 and 210-2 are each fastened onto the support structure 212 by means of a releasable connection 216, for example a press-and/or form-fit connection, in particular screwing. do. A gap ( 214) can be shown respectively. Gaps 214 represent space requirements and assembly gaps for second interface elements 218 .

FIG. 2B shows a first embodiment of a connecting device 200A having the support structure 212 and optical device 206 of FIG. 2A . Gap 214 is closed with wedge-shaped second interface element 218-1 and with second interface element 218-2. The first interface element 210-1 opposite the support structure 212 and the wedge-shaped protrusion 208-1 are connected at a first junction 220 with a releasable connection. Wedge-shaped protrusion 208-1 of frame 204 is releasably connected to wedge-shaped second interface element 218-1 at second junction 222. Opposite the wedge-shaped protrusion 208-1, the first interface element 210-1 has a first contact surface 226 directed in the direction of the second interface element 218-1. The wedge-shaped second interface element 218-1 has a second contact surface 228 that faces in the direction of the first interface element 210-1. The first interface element 210-1 and the wedge-shaped second interface element 218-1 are subject to material fit at a third abutment 224 lying between the first contact surface 226 and the second contact surface 228. connected to each other by

The direct connection path, or gap dimension, between the first contact surface 226 and the second contact surface 228, i.e., the distance between the two contact surfaces 226 and 228, of the interface elements 210-1 and 218-1 of different thicknesses. You can be affected by your choices. With respect to the direction perpendicular to the direct connection path, an adjustment of the two contact surfaces 226, 228 relative to each other is performed, and a selection of equally large contact surfaces 226, 228 results in a suitable interface element 210-1, 218- 1) is performed by selection. The angle of the two contact surfaces 226, 228 relative to each other can be influenced by the choice of angle of the wedge-shaped interface element 218-1. Because of this, interface element 218-1 may be selected from a number of wedge-shaped interface elements having different wedge angles. Wedge-shaped interface element 218-1 may be implemented by machining, eg, grinding, of the interface element.

Similarly, the protrusion 208-2, the second interface element 218-2, the first interface element 210-2 opposite the protrusion 208-2, and the support structure 212 can be connected to each other.

In FIG. 2B, connection device 200A is shown with two protrusions 208-1 and 208-2. Alternatively, a plurality of protrusions 208 or only one protrusion 208 may also be present. In this case, three protrusions distributed over the connection area are preferred. In another alternative, protrusions 208 are not present. In this case, the second interface element 218 is releasably connected directly to the frame 204 .

Since the support structure 212 and the first interface element 210 as well as the frame 204 having the projections 208 and the second interface element 218 are releasably connected to each other, the support structure 212 and the optical device (206) can be replaced. Since the gap 214 can be closed with a precise fit with the second interface element 218, the first contact surface 226 and the second contact surface 228 can be aligned parallel to each other. This allows for a very thin third splice 224, which in turn leads to a highly rigid connection device 200A.

The second interface element 218-1 shown in FIG. 2B is wedge-shaped. Alternatively, if desired, the wedge-shaped second interface element 218-1 or the first interface element 210-1 is such that this first contact surface 226 is thereby aligned parallel to the second contact surface 228. If possible, it may be replaced with an interface element having any desired asymmetrical or symmetrical shape.

FIG. 3 shows a second embodiment of a connecting device 200B having a support structure 212 and an optical device 206 . The optical device 206 has the fourth mirror 202 and the frame 204 of FIG. 1 . The support structure 212 is releasably connected to the first interface element 210 at a first splice 220 . The optical device 206 is releasably connected by the frame 204 to the second interface element 218 at the second splice 222 . The first interface element 210 has a first contact surface 226 that faces in the direction of the second interface element 218 . The second interface element 218 has a second contact surface 228 that faces in the direction of the first interface element 210 . The first interface element 210 and the second interface element 218 are connected to each other by a material fit at a third joint 224 lying between the first contact surface 226 and the second contact surface 228 .

The second interface element 218 can be rotated relative to the optical device 206 . In this way, the second contact surface 228 can be aligned parallel to the first contact surface 226 . The second interface element 218 may then be secured onto the optical device 206 so that rotation is no longer possible. The parallel alignment of the contact surfaces 226, 228 allows for a very thin third abutment 224, which in turn leads to a highly rigid connection device 200B. Since the support structure 212 and the first interface element 210 as well as the frame 204 of the optical device 206 and the second interface element 218 are releasably connected to each other, the support structure 212 and the optical device (206) can be replaced.

The second interface element 218 may have a base (not shown in FIG. 3 ) and a sloped lockable element 300 . The base may be releasably connected to the frame 204 of the optical device 206 . The inclined lockable element 300 of the second interface element 218 may include a second contact surface 228 . The second contact surface 228 may then be inclined relative to the base and relative to the frame 204 . After the second contact surfaces 228 are aligned, the inclined fastenable element 300 can be secured by the base onto the frame 204 .

Support structure 212 is preferably made of ceramic. Frame 204 may also be made of ceramic or metal. Interface elements 210 and 218 preferably include ceramic or metal. In the case of metals, Invar, ie an iron-nickel alloy with very low thermal expansion behavior, is preferably used. Adhesive bonding at the third joint 224 may be performed with a multi-component adhesive.

2A, 2B and 3 respectively illustrate the fourth mirror 202 of the EUV lithography system of FIG. 1 . However, connection arrangements 200A and 200B may be used for any other mirrors in EUV lithography system 100 or for other optical devices 206 in EUV lithography system 100 .

FIG. 4 shows a detailed sectional view of the connecting device 200B, which is only schematically represented in FIG. 3 . The first interface element 210 is releasably fastened to the support structure 212 with screws 316 . An axial spacer 314 may be inserted between the first interface element 210 and the support structure 212 . The second interface element 218 has an inclined lockable element 300 and a base 302 . The inclined lockable element 300 is configured as a spherical cap, as can be seen in FIG. 4 . The axial spacer 314 compensates for the shortest connecting path, while the tiltable lockable element 300 ensures tilt compensation. Alternatively, interface elements 210 and 218 may also be composed of multiple parts to enable them to fulfill multiple different functions.

The optical device 206 has a contact element 304 for contacting the inclined fastenable element 300 . The base 302 may be releasably fastened by a nut 308 to the optical device 206 or its frame 204 . A washer 310 may be present between the nut 308 and the contact element 304 . The contact element 304 has a corresponding recess on its side which lies towards the inclined lockable element 300 . When the nut 308 is loosened, the tiltable lockable element 300 can tilt while being guided by the recess. When the nut is tightened, the locking element 312 of the base 302 presses against the tiltable lockable element 300 so that the tiltable lockable element presses against the contact element 304 at the second abutment 222. It is clamped with a fit. The tilted lockable element 300 is then secured in place. Due to the inclination of the inclined fixable element 300, the first contact surface 226 and the second contact surface 228 can be aligned parallel to each other. A material fit connection between the first contact surface 226 and the second contact surface 228 may then be performed at the third abutment 224 .

The optical device may have a radial or thermal decoupler 306 for thermal compensation. The radial or thermal decoupler 306 may include a metal, particularly invar. The thermal decoupler 306 shown in FIG. 4 includes a contact element 304 , a web 318 and a volume element 320 . The volume element 320 is adhesively bonded into the optical device 206 by adhesive 330 or into its frame 204 .

The base 302 represented in FIG. 4 has the shape of a flanged hollow cylinder. Base 302 extends through opening 322 of sloped lockable element 300 . The fixing element 312 is formed by the flange of the hollow cylinder. The anchoring element 312 , ie the flange of the hollow cylinder, is sunk in the recess 324 of the inclined anchorable element 300 . When the nut 308 is tightened, the lower side 326 of the locking element is pressed against the upper side 328 of the recess 324 of the inclined lockable element 300 . The inclined fastenable element 300 is thereby pressed against the element 304 and thus secured.

Alternatively or in addition, the first interface element 210 may have a base 302 and an inclined lockable element 300 . The first contact surface 226 is then tiltable relative to the support structure 212 .

In the case of the spherical geometry of the interface elements 210 and 218, the corresponding contact element 304 may have a pan-shaped spherical geometry.

Preferably, the first and second contact surfaces 226, 228 are planar. A thin third junction can then be implemented as well.

Alternatively, the interface elements 210 and 218 can be tilted lockable elements, where the tilting mechanism lies within the interface element, and is not implemented by adjacent components 206, 212, as in FIGS. 3 and 4. may have The tilting mechanism may then be performed with a ball joint or with a rotary joint.

FIG. 5 shows a device 416 for manufacturing the connection device 200B of FIGS. 3 and 4 . The apparatus 416 for manufacturing the connecting apparatus 200B has a first positioning device 400 and a second positioning device 410 . The first positioning device 400 holds a support structure 212 . The support structure 212 can be moved by the positioning device 400 in the x, y and z directions. Moreover, the positioning device 400 has a first rotatable or ball joint 402 . Thus, rotation 404 of the support structure 212 is possible. The second positioning device 410 holds the frame 204 of the optical device 206 . The frame 204 can be moved by the positioning device in the x, y and z directions. Moreover, the positioning device 410 has a second rotatable or ball joint 412 . Thus, rotation 414 of the frame 204 is possible.

Support structure 212 and frame 204 can be aligned by positioning devices 400 and 410 in the installed position, ie in the alignment required by subsequent use. In this installation position, the connecting device 200B is assembled without stress and deformation.

FIG. 6 shows how the connection device 200B according to FIGS. 3 and 4 can thereby be manufactured into the device 416 of FIG. 5 . In a first step S1 , the first interface element 210 is releasably connected to the support structure 212 and the second interface element 218 is releasably connected to the frame 204 of the optical device 206 . Connected. In this case, the tiltable lockable element 300 of the second interface element 218 is tiltable relative to the frame 204 of the optical device 206 .

In a second step S2 , the second contact surface 228 of the second interface element 218 is aligned to compensate for the offset between the frame 204 of the optical device 206 and the support structure 212 . The first contact surface 226 and the second contact surface 228 are brought into contact. The second contact surface 228 of the second interface element 218 is thereby inclined. The tiltable lockable element 300 of the second interface element 218 is thereby likewise tilted. After being brought into contact, the contact surfaces 226 and 228 are a certain distance from each other, ie they are aligned parallel.

In a third step S3 , the tiltable lockable element 300 of the second interface element 218 is tiltable relative to the frame 204 of the optical device 206 . After alignment, the slanted fastenable element 300 of the second interface element 218 is positioned against the contact element 304 of the optical device 206, or the fastening element 312 of the base 302 relative to its frame 204. clamped by Thus, the inclined fastenable element 300 is fixed.

In a fourth step S4 , the first and second contact surfaces 226 , 228 , previously aligned in parallel, are now connected with a material fit at the third junction 224 . To this end, the first and second contact surfaces 226, 228 are moved away from each other until adhesive can be applied onto the contact surfaces 226, 228. After the adhesive is applied, the contact surfaces 226 and 228 are brought back together and adhesively bonded to each other.

As an alternative, the tiltable lockable element 300 can also be arranged in the first interface element 210 . Moreover, both interface elements 210 and 218 may have inclined lockable elements 300 .

Alternatively or in addition, before the first two steps, measurements of the space available between the support structure 212 and the optical device 206 may be made. With the aid of the results of this measurement, interface elements 210 and 218 with suitable asymmetric or symmetrical shapes and correct densities may be selected, for example as described with respect to FIG. 2B .

Lithography system 100 need not be an EUV lithography system. Rather, light of a different wavelength may also be used (eg 193 nm by an ArF excimer laser). Moreover, instead of the mirrors described above, lens elements may also be used, in particular in the projection system 106 described above.

Although the present invention has been described with the aid of exemplary embodiments, it may be modified in a wide variety of ways.

100: EUV lithography system
102: beam forming system
104: lighting system
106: projection system
108: EUV light source
110: collimator
112 monochromator
114: EUV radiation
116: first mirror
118: second mirror
120: photomask
122: wafer
124: third mirror
200: connection device
200A: connection device according to the first embodiment
200B: connection device according to the second embodiment
202: fourth mirror
204: frame
206: optical device
208 Projection on frame
208-1: wedge-shaped protrusion on the frame
208-2: Projection on frame
210: first interface element
210-1: first interface element opposite to the wedge-shaped protrusion
210-2: first interface element facing the protrusion
212: support structure
214: gap
216: releasable connection
218: second interface element
218-1: wedge-shaped second interface element
218-2: second interface element
220: first junction
222: second junction
224 third junction
226: first contact surface
228: second contact surface
300: inclined fastenable element
302: donation
304: contact element
306: radial or thermal decoupler
308: nut
310: washer
312: fixed element
314: axial spacer
316: screw
318: web
320: volume element
322: Opening of inclined fastenable element
324: Recess of inclined lockable element
326: lower side of fixing element
328: upper side of the recess of the inclined fastenable element
330: adhesive
400: first positioning device
402: first rotary type or ball joint
404: Rotation of the support structure
410: second positioning device
412: second rotary type or ball joint
414: rotation of the frame
416 Device for manufacturing a connecting device
418: shortest connecting path
420: direction perpendicular to the shortest connecting path

Claims (19)

A lithography system (100) having one or more connection devices (200A, 200B);
first component 212;
a second component (206);
a first interface element (210) releasably connected to said first component (212) at a first splice (220); and
a second interface element (218) releasably connected to said second component (206) at a second junction (222);
The first interface element 210 has a first contact surface 226, the second interface element 218 has a second contact surface 228, and at least one of the two contact surfaces 226, 228 is having the two contact surfaces (226, 228) aligned and/or selected to compensate for an offset between the first component (212) and the second component (206) prior to joining at a third joint (224); configured for,
wherein the first contact surface (226) of the first interface element (210) and the second contact surface (228) of the second interface element (218) are connected by a material fit connection at a third joint (224). (100). 2. The method according to claim 1, wherein at least one of the two contact surfaces (226, 228) of the first and second interface elements (210, 218) is in a direction relative to or perpendicular to the shortest connection path (418). A lithography system (100) that can be aligned with respect to (420) and/or with respect to the angle of the two contact surfaces (226, 228) relative to each other. 3. A lithography system (100) according to claim 1 or 2, wherein the contact surfaces (226, 228) are parallel to each other. 3. A lithography system (100) according to claim 1 or 2, wherein at least one of the interface elements (210, 218) has an asymmetric shape (218-1) to compensate for an offset between the components (206, 212). ). 5. The lithography system (100) of claim 4, wherein the asymmetric shape (218-1) is a wedge shape. 3. The method of claim 1 or 2, wherein the first interface element (210) comprises a base (302) and an inclined lockable element (300) for inclining the first contact surface (226) relative to the base (302). and/or the second interface element 218 has a base 302 and a tiltable lockable element 300 for inclining the second contact surface 228 relative to the base 302. (100). 3. The method according to claim 1 or 2, wherein the first contact surface (226) of the first interface element (210) is planar and/or the second contact surface (228) of the second interface element (218) is planar. Lithography system 100. 7. The method according to claim 6, wherein the inclined fastenable element (300) of the first interface element (210) and/or of the second interface element (218) is configured as a spherical cap, the inclined fastenable element (300) The component (206, 212) to which ) is fixed has a corresponding recess. 7. The lithography system (100) of claim 6, wherein the base (302) has a fixation element (312) for clamping the inclined fixable element (300) to the component (206, 212) for fixation. 3. A lithographic system (100) according to claim 1 or 2, wherein the first component has a support structure (212) and the second component has an optical device (206). 11. The lithography system (100) of claim 10, wherein the optical device (206) has a frame (204) and a mirror (202) or lens element. The lithography system (100) of claim 1, wherein the lithography system (100) is an EUV lithography system. A method for manufacturing a lithography system (100) comprising connecting devices (200A, 200B),
a) the tiltable fastenable element 300 of the first interface element 210 or the tiltable fastenable element 300 of the second interface element 218 is the first component 212 or the second component 206 Releasable connection of the first interface element 210 to the first component 212 and of the second interface element 218 to the second component 206, so as to be able to tilt with respect to );
b) a first contact surface 226 of the first interface element 210 or a second contact surface of the second interface element 218 for compensating the offset between the first and second components 206, 212; an alignment step of (228);
c) fixation of the inclined fastenable element 300 of the first interface element 210 to the first component 212 or the second interface element 218 to the second component 206 the fixing step of the inclined fixable element 300 of, and
d) material fit connection of the first contact surface (226) of the first interface element (210) to the second contact surface (228) of the second interface element (218). 14. The method of claim 13, wherein step b)
The first contact surface of the first interface element 210 by bringing the first contact surface 226 of the first interface element 210 and the second contact surface 228 of the second interface element 218 into contact ( As the tilting step of 226), the tilted lockable element 300 of the first interface element 210 connects the first contact surface 226 of the first interface element 210 and the second interface element 218. an inclination step of the first contact surfaces, in which the second contact surfaces 228 are inclined to have a certain distance from each other, and/or
The second contact surface of the second interface element 218 by bringing the second contact surface 228 of the second interface element 218 and the first contact surface 226 of the first interface element 210 into contact ( As the tilt step of 228), the tiltable lockable element 300 of the second interface element 218 connects the second contact surface 228 of the second interface element 218 and the first interface element 210. and inclining the second contact surfaces, wherein the first contact surfaces (226) are inclined to have a constant distance from each other. A method for manufacturing a lithography system (100) comprising connecting devices (200A, 200B),
The connecting devices 200A and 200B are
first component 212;
a second component (206);
a first interface element (210) releasably connected to said first component (212) at a first splice (220); and
a second interface element (218) releasably connected to said second component (206) at a second junction (222);
The first interface element 210 has a first contact surface 226, the second interface element 218 has a second contact surface 228, and at least one of the two contact surfaces 226, 228 is having the two contact surfaces (226, 228) aligned and/or selected to compensate for an offset between the first component (212) and the second component (206) prior to joining at a third joint (224); configured for,
The first contact surface 226 of the first interface element 210 and the second contact surface 228 of the second interface element 218 are connected by a material fit connection at a third joint 224,
The method,
a) selecting and/or manufacturing the first interface element 210 and the second interface element 218;
b) a releasable connection of said first interface element (210) to a first component (212);
c) releasable connection of said second interface element (218) to a second component (206);
d) material fit connection of the first contact surface (226) of the first interface element (210) to the second contact surface (228) of the second interface element (218). 16. The method according to any one of claims 13 to 15, wherein, before step a), the first component is used to make it possible to select an interface element (210, 218) with a suitable shape (218-1). A method in which a measurement of the space available between (212) and the second component (206) is done. 16. The method of claim 15, wherein step a)
selecting the first interface element 210 and/or the second interface element 218 from the set of interface elements 210 , 218 , wherein the set of interface elements 210 , 218 is different A method of having a plurality of interface elements having geometric shapes. 18. A method according to claim 15 or 17, wherein step a) comprises a step of manufacturing the first interface element (210) and/or the second interface element (218) by grinding, milling or cutting. 18. The method according to any one of claims 13 to 15 and 17, wherein step d)
d1) moving the first contact surface 226 and the second contact surface 228 away from each other so that adhesive can be applied at least on one of the two contact surfaces 226, 228;
d2) applying adhesive on at least one of the two contact surfaces 226, 228, and
d3) bringing the contact surfaces (226, 228) together and adhesively bonding them.

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