DE102014115375A1 - Träger für eine LED - Google Patents
Träger für eine LED Download PDFInfo
- Publication number
- DE102014115375A1 DE102014115375A1 DE102014115375.8A DE102014115375A DE102014115375A1 DE 102014115375 A1 DE102014115375 A1 DE 102014115375A1 DE 102014115375 A DE102014115375 A DE 102014115375A DE 102014115375 A1 DE102014115375 A1 DE 102014115375A1
- Authority
- DE
- Germany
- Prior art keywords
- carrier
- led
- metallic
- integrated
- internal electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors; Arresters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/60—Arrangements for protection of devices protecting against electrostatic charges or discharges, e.g. Faraday shields
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Led Device Packages (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (8)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014115375.8A DE102014115375A1 (de) | 2014-08-08 | 2014-10-22 | Träger für eine LED |
| PCT/EP2015/068280 WO2016020537A1 (de) | 2014-08-08 | 2015-08-07 | Träger für eine led |
| JP2017506875A JP2017524261A (ja) | 2014-08-08 | 2015-08-07 | Led用担体 |
| DE202015009825.8U DE202015009825U1 (de) | 2014-08-08 | 2015-08-07 | Träger für eine LED |
| CN201580042669.XA CN106575692B (zh) | 2014-08-08 | 2015-08-07 | 用于led的载体 |
| EP15750372.3A EP3178117B1 (de) | 2014-08-08 | 2015-08-07 | Träger für eine led |
| US15/501,162 US9978912B2 (en) | 2014-08-08 | 2015-08-07 | Carrier for an LED |
| JP2019003096A JP2019083328A (ja) | 2014-08-08 | 2019-01-11 | Led用担体 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014111363 | 2014-08-08 | ||
| DE102014111363.2 | 2014-08-08 | ||
| DE102014115375.8A DE102014115375A1 (de) | 2014-08-08 | 2014-10-22 | Träger für eine LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102014115375A1 true DE102014115375A1 (de) | 2016-02-11 |
Family
ID=55134667
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102014115375.8A Withdrawn DE102014115375A1 (de) | 2014-08-08 | 2014-10-22 | Träger für eine LED |
| DE202015009825.8U Expired - Lifetime DE202015009825U1 (de) | 2014-08-08 | 2015-08-07 | Träger für eine LED |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE202015009825.8U Expired - Lifetime DE202015009825U1 (de) | 2014-08-08 | 2015-08-07 | Träger für eine LED |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9978912B2 (https=) |
| EP (1) | EP3178117B1 (https=) |
| JP (2) | JP2017524261A (https=) |
| CN (1) | CN106575692B (https=) |
| DE (2) | DE102014115375A1 (https=) |
| WO (1) | WO2016020537A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016122014A1 (de) * | 2016-11-16 | 2018-05-17 | Epcos Ag | Leistungsmodul mit verringerter Defektanfälligkeit und Verwendung desselben |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102017118490B4 (de) | 2017-08-14 | 2025-03-27 | Tdk Electronics Ag | Anordnung mit LED-Modul |
| DE102017126268A1 (de) * | 2017-11-09 | 2019-05-09 | Osram Opto Semiconductors Gmbh | Träger, Anordnung mit einem Substrat und einem Träger und Verfahren zum Herstellen eines Trägers |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070297108A1 (en) * | 2004-02-25 | 2007-12-27 | Philips Lumileds Lighting Company, Llc | Ceramic Substrate for Light Emitting Diode Where the Substrate Incorporates ESD Protection |
| DE102008024479A1 (de) * | 2008-05-21 | 2009-12-03 | Epcos Ag | Elektrische Bauelementanordnung |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3475910B2 (ja) * | 2000-05-24 | 2003-12-10 | 株式会社村田製作所 | 電子部品、電子部品の製造方法および回路基板 |
| JP4580633B2 (ja) * | 2003-11-14 | 2010-11-17 | スタンレー電気株式会社 | 半導体装置及びその製造方法 |
| WO2006106901A1 (ja) * | 2005-04-01 | 2006-10-12 | Matsushita Electric Industrial Co., Ltd. | Led部品およびその製造方法 |
| JP4915058B2 (ja) * | 2005-06-06 | 2012-04-11 | パナソニック株式会社 | Led部品およびその製造方法 |
| US7505239B2 (en) | 2005-04-14 | 2009-03-17 | Tdk Corporation | Light emitting device |
| JP4146849B2 (ja) | 2005-04-14 | 2008-09-10 | Tdk株式会社 | 発光装置 |
| WO2007058438A1 (en) | 2005-11-18 | 2007-05-24 | Amosense Co., Ltd. | Electronic parts packages |
| JP2008109079A (ja) * | 2006-09-26 | 2008-05-08 | Kyocera Corp | 表面実装型発光素子用配線基板および発光装置 |
| JP2008270325A (ja) | 2007-04-17 | 2008-11-06 | Matsushita Electric Ind Co Ltd | 静電気対策部品およびこれを用いた発光ダイオードモジュール |
| US20090020876A1 (en) * | 2007-07-20 | 2009-01-22 | Hertel Thomas A | High temperature packaging for semiconductor devices |
| US8536584B2 (en) * | 2007-11-14 | 2013-09-17 | Cree, Inc. | High voltage wire bond free LEDS |
| DE102008024480A1 (de) * | 2008-05-21 | 2009-12-03 | Epcos Ag | Elektrische Bauelementanordnung |
| JP2011187855A (ja) | 2010-03-11 | 2011-09-22 | Panasonic Corp | 多層セラミック基板の製造方法 |
| TWI533483B (zh) * | 2010-08-09 | 2016-05-11 | Lg伊諾特股份有限公司 | 發光裝置 |
| JP5735245B2 (ja) * | 2010-09-28 | 2015-06-17 | スタンレー電気株式会社 | 光半導体素子、発光ダイオード、およびそれらの製造方法 |
| DE102012104494A1 (de) * | 2012-05-24 | 2013-11-28 | Epcos Ag | Leuchtdiodenvorrichtung |
| JP2014116411A (ja) | 2012-12-07 | 2014-06-26 | Kyocera Corp | 発光素子搭載用基板および発光装置 |
-
2014
- 2014-10-22 DE DE102014115375.8A patent/DE102014115375A1/de not_active Withdrawn
-
2015
- 2015-08-07 CN CN201580042669.XA patent/CN106575692B/zh active Active
- 2015-08-07 DE DE202015009825.8U patent/DE202015009825U1/de not_active Expired - Lifetime
- 2015-08-07 WO PCT/EP2015/068280 patent/WO2016020537A1/de not_active Ceased
- 2015-08-07 JP JP2017506875A patent/JP2017524261A/ja active Pending
- 2015-08-07 US US15/501,162 patent/US9978912B2/en active Active
- 2015-08-07 EP EP15750372.3A patent/EP3178117B1/de active Active
-
2019
- 2019-01-11 JP JP2019003096A patent/JP2019083328A/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070297108A1 (en) * | 2004-02-25 | 2007-12-27 | Philips Lumileds Lighting Company, Llc | Ceramic Substrate for Light Emitting Diode Where the Substrate Incorporates ESD Protection |
| DE102008024479A1 (de) * | 2008-05-21 | 2009-12-03 | Epcos Ag | Elektrische Bauelementanordnung |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102016122014A1 (de) * | 2016-11-16 | 2018-05-17 | Epcos Ag | Leistungsmodul mit verringerter Defektanfälligkeit und Verwendung desselben |
| EP3542399B1 (de) * | 2016-11-16 | 2023-03-08 | TDK Electronics AG | Leistungsmodul mit verringerter defektanfälligkeit und verwendung desselben |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3178117B1 (de) | 2020-07-15 |
| DE202015009825U1 (de) | 2020-07-22 |
| JP2019083328A (ja) | 2019-05-30 |
| CN106575692A (zh) | 2017-04-19 |
| CN106575692B (zh) | 2019-07-05 |
| US9978912B2 (en) | 2018-05-22 |
| JP2017524261A (ja) | 2017-08-24 |
| EP3178117A1 (de) | 2017-06-14 |
| WO2016020537A1 (de) | 2016-02-11 |
| US20170229617A1 (en) | 2017-08-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R012 | Request for examination validly filed | ||
| R081 | Change of applicant/patentee |
Owner name: TDK ELECTRONICS AG, DE Free format text: FORMER OWNER: EPCOS AG, 81669 MUENCHEN, DE |
|
| R082 | Change of representative |
Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE |
|
| R120 | Application withdrawn or ip right abandoned |