DE102013022563B4 - Verfahren und Vorrichtung zum Prägen von Strukturen - Google Patents

Verfahren und Vorrichtung zum Prägen von Strukturen

Info

Publication number
DE102013022563B4
DE102013022563B4 DE102013022563.9A DE102013022563A DE102013022563B4 DE 102013022563 B4 DE102013022563 B4 DE 102013022563B4 DE 102013022563 A DE102013022563 A DE 102013022563A DE 102013022563 B4 DE102013022563 B4 DE 102013022563B4
Authority
DE
Germany
Prior art keywords
embossing
compound
die
mass
lenses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102013022563.9A
Other languages
German (de)
English (en)
Other versions
DE102013022563A1 (cg-RX-API-DMAC7.html
Inventor
Dominik Treiblmayr
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EV Group E Thallner GmbH
Original Assignee
EV Group E Thallner GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51845390&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE102013022563(B4) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by EV Group E Thallner GmbH filed Critical EV Group E Thallner GmbH
Publication of DE102013022563A1 publication Critical patent/DE102013022563A1/de
Application granted granted Critical
Publication of DE102013022563B4 publication Critical patent/DE102013022563B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
    • B29C39/22—Component parts, details or accessories; Auxiliary operations
    • B29C39/24—Feeding the material into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/021—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles characterised by the shape of the surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0017—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor for the production of embossing, cutting or similar devices; for the production of casting means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B29C2059/023—Microembossing

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Micromachines (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE102013022563.9A 2013-11-29 2013-11-29 Verfahren und Vorrichtung zum Prägen von Strukturen Active DE102013022563B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102013113241.3A DE102013113241B4 (de) 2013-11-29 2013-11-29 Verfahren zum Prägen von Strukturen
PCT/EP2014/072638 WO2015078637A1 (de) 2013-11-29 2014-10-22 Verfahren und vorrichtung zum prägen von strukturen

Publications (2)

Publication Number Publication Date
DE102013022563A1 DE102013022563A1 (cg-RX-API-DMAC7.html) 2015-06-03
DE102013022563B4 true DE102013022563B4 (de) 2026-08-06

Family

ID=51845390

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102013022563.9A Active DE102013022563B4 (de) 2013-11-29 2013-11-29 Verfahren und Vorrichtung zum Prägen von Strukturen
DE102013113241.3A Revoked DE102013113241B4 (de) 2013-11-29 2013-11-29 Verfahren zum Prägen von Strukturen

Family Applications After (1)

Application Number Title Priority Date Filing Date
DE102013113241.3A Revoked DE102013113241B4 (de) 2013-11-29 2013-11-29 Verfahren zum Prägen von Strukturen

Country Status (9)

Country Link
US (1) US10088746B2 (cg-RX-API-DMAC7.html)
JP (1) JP6559130B2 (cg-RX-API-DMAC7.html)
KR (2) KR102250979B1 (cg-RX-API-DMAC7.html)
CN (1) CN105745575B (cg-RX-API-DMAC7.html)
AT (2) AT526564B1 (cg-RX-API-DMAC7.html)
DE (2) DE102013022563B4 (cg-RX-API-DMAC7.html)
SG (1) SG11201604314VA (cg-RX-API-DMAC7.html)
TW (2) TWI688467B (cg-RX-API-DMAC7.html)
WO (1) WO2015078637A1 (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6495947B2 (ja) 2014-06-26 2019-04-03 エーファウ・グループ・エー・タルナー・ゲーエムベーハー 基板の近接により接合材料を分配することで基板を貼り合わせる方法
TWI707766B (zh) * 2018-07-16 2020-10-21 奇景光電股份有限公司 壓印系統、供膠裝置及壓印方法
EP4300191A3 (de) * 2019-11-19 2024-07-03 EV Group E. Thallner GmbH Vorrichtung und verfahren zum prägen von mikro- und/oder nanostrukturen
CN116954019A (zh) * 2023-06-21 2023-10-27 湖北大学 一种基于液态镓的冷冻离心纳米压印方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050276919A1 (en) 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method for dispensing a fluid on a substrate
US20070228608A1 (en) 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
US20080054508A1 (en) 2006-03-20 2008-03-06 Heptagon Oy Method and tool for manufacturing optical elements
JP2012011720A (ja) 2010-07-02 2012-01-19 Toshiba Mach Co Ltd レンズの製造方法およびレンズの製造装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6916584B2 (en) 2002-08-01 2005-07-12 Molecular Imprints, Inc. Alignment methods for imprint lithography
US6943117B2 (en) 2003-03-27 2005-09-13 Korea Institute Of Machinery & Materials UV nanoimprint lithography process using elementwise embossed stamp and selectively additive pressurization
US7811505B2 (en) 2004-12-07 2010-10-12 Molecular Imprints, Inc. Method for fast filling of templates for imprint lithography using on template dispense
JP5443103B2 (ja) * 2009-09-10 2014-03-19 株式会社東芝 パターン形成方法
WO2012160769A1 (ja) * 2011-05-24 2012-11-29 コニカミノルタアドバンストレイヤー株式会社 樹脂成形品の製造方法
WO2012169120A1 (ja) * 2011-06-07 2012-12-13 コニカミノルタアドバンストレイヤー株式会社 複合体の製造方法および複合体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050276919A1 (en) 2004-06-01 2005-12-15 Molecular Imprints, Inc. Method for dispensing a fluid on a substrate
US20080054508A1 (en) 2006-03-20 2008-03-06 Heptagon Oy Method and tool for manufacturing optical elements
US20070228608A1 (en) 2006-04-03 2007-10-04 Molecular Imprints, Inc. Preserving Filled Features when Vacuum Wiping
JP2012011720A (ja) 2010-07-02 2012-01-19 Toshiba Mach Co Ltd レンズの製造方法およびレンズの製造装置

Also Published As

Publication number Publication date
TW201532784A (zh) 2015-09-01
JP6559130B2 (ja) 2019-08-14
CN105745575A (zh) 2016-07-06
WO2015078637A1 (de) 2015-06-04
TW201932279A (zh) 2019-08-16
AT526564A5 (de) 2024-05-15
KR20160091333A (ko) 2016-08-02
TWI688467B (zh) 2020-03-21
TWI705884B (zh) 2020-10-01
KR102250979B1 (ko) 2021-05-12
KR102361175B1 (ko) 2022-02-10
DE102013022563A1 (cg-RX-API-DMAC7.html) 2015-06-03
DE102013113241A1 (de) 2015-06-03
KR20210054597A (ko) 2021-05-13
CN105745575B (zh) 2019-12-17
AT526564B1 (de) 2024-05-15
US10088746B2 (en) 2018-10-02
SG11201604314VA (en) 2016-07-28
AT526465A1 (de) 2024-02-15
US20170031242A1 (en) 2017-02-02
JP2017500738A (ja) 2017-01-05
DE102013113241B4 (de) 2019-02-21

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