DE102012219806A1 - Projektionsbelichtungsanlage mit mindestens einem Mittel zur Reduktion des Einflusses von Druckschwankungen - Google Patents

Projektionsbelichtungsanlage mit mindestens einem Mittel zur Reduktion des Einflusses von Druckschwankungen Download PDF

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Publication number
DE102012219806A1
DE102012219806A1 DE201210219806 DE102012219806A DE102012219806A1 DE 102012219806 A1 DE102012219806 A1 DE 102012219806A1 DE 201210219806 DE201210219806 DE 201210219806 DE 102012219806 A DE102012219806 A DE 102012219806A DE 102012219806 A1 DE102012219806 A1 DE 102012219806A1
Authority
DE
Germany
Prior art keywords
exposure apparatus
projection
projection exposure
mask table
lighting system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE201210219806
Other languages
German (de)
English (en)
Inventor
Toralf Gruner
Sascha Bleidistel
Alexander Wolf
Joachim Hartjes
Markus Schwab
Markus Hauf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss SMT GmbH
Original Assignee
Carl Zeiss SMT GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss SMT GmbH filed Critical Carl Zeiss SMT GmbH
Priority to DE201210219806 priority Critical patent/DE102012219806A1/de
Priority to JP2015540078A priority patent/JP6502258B2/ja
Priority to PCT/EP2013/069575 priority patent/WO2014067707A1/de
Publication of DE102012219806A1 publication Critical patent/DE102012219806A1/de
Priority to US14/674,800 priority patent/US10162267B2/en
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/7015—Details of optical elements
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation

Landscapes

  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Atmospheric Sciences (AREA)
  • Toxicology (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
DE201210219806 2012-10-30 2012-10-30 Projektionsbelichtungsanlage mit mindestens einem Mittel zur Reduktion des Einflusses von Druckschwankungen Withdrawn DE102012219806A1 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
DE201210219806 DE102012219806A1 (de) 2012-10-30 2012-10-30 Projektionsbelichtungsanlage mit mindestens einem Mittel zur Reduktion des Einflusses von Druckschwankungen
JP2015540078A JP6502258B2 (ja) 2012-10-30 2013-09-20 圧力変動の影響を減少させる手段を備える投影露光装置
PCT/EP2013/069575 WO2014067707A1 (de) 2012-10-30 2013-09-20 Druckschwankungen in einer projektionsbelichtungsanlage
US14/674,800 US10162267B2 (en) 2012-10-30 2015-03-31 Projection exposure apparatus including mechanism to reduce influence of pressure fluctuations

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE201210219806 DE102012219806A1 (de) 2012-10-30 2012-10-30 Projektionsbelichtungsanlage mit mindestens einem Mittel zur Reduktion des Einflusses von Druckschwankungen

Publications (1)

Publication Number Publication Date
DE102012219806A1 true DE102012219806A1 (de) 2014-04-30

Family

ID=50479689

Family Applications (1)

Application Number Title Priority Date Filing Date
DE201210219806 Withdrawn DE102012219806A1 (de) 2012-10-30 2012-10-30 Projektionsbelichtungsanlage mit mindestens einem Mittel zur Reduktion des Einflusses von Druckschwankungen

Country Status (4)

Country Link
US (1) US10162267B2 (enExample)
JP (1) JP6502258B2 (enExample)
DE (1) DE102012219806A1 (enExample)
WO (1) WO2014067707A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111624731A (zh) * 2019-02-28 2020-09-04 上海微电子装备（集团）股份有限公司 一种物镜装置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109478025B (zh) 2016-07-21 2020-12-25 Asml荷兰有限公司 光刻方法
US10991544B2 (en) * 2019-05-29 2021-04-27 ICT Integrated Circuit Testing Gesellschaft für Halbleiterprüftechnik mbH Charged particle beam device, objective lens module, electrode device, and method of inspecting a specimen
JP2024169178A (ja) * 2023-05-25 2024-12-05 キヤノン株式会社 構造体、露光装置、および物品の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010026355A1 (en) * 2000-03-30 2001-10-04 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method

Family Cites Families (19)

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Publication number Priority date Publication date Assignee Title
JP2856626B2 (ja) * 1993-03-22 1999-02-10 株式会社日立製作所 縮小投影露光装置
JP3894509B2 (ja) * 1995-08-07 2007-03-22 キヤノン株式会社 光学装置、露光装置およびデバイス製造方法
US5877843A (en) * 1995-09-12 1999-03-02 Nikon Corporation Exposure apparatus
JP3552363B2 (ja) * 1995-09-12 2004-08-11 株式会社ニコン 走査型露光装置
WO1999010917A1 (en) * 1997-08-26 1999-03-04 Nikon Corporation Aligner, exposure method, method of pressure adjustment of projection optical system, and method of assembling aligner
US6197454B1 (en) * 1998-12-29 2001-03-06 Intel Corporation Clean-enclosure window to protect photolithographic mask
KR20020036951A (ko) * 1999-05-28 2002-05-17 시마무라 테루오 노광방법 및 장치
US6727981B2 (en) * 1999-07-19 2004-04-27 Nikon Corporation Illuminating optical apparatus and making method thereof, exposure apparatus and making method thereof, and device manufacturing method
JP2002151400A (ja) * 2000-11-15 2002-05-24 Canon Inc 露光装置、その保守方法並びに同装置を用いた半導体デバイス製造方法及び半導体製造工場
JP2003347194A (ja) * 2002-05-24 2003-12-05 Canon Inc 露光装置、露光方法、デバイス製造方法及びデバイス
JP5022914B2 (ja) * 2005-01-26 2012-09-12 カール・ツァイス・エスエムティー・ゲーエムベーハー 光学アセンブリ
US7492441B2 (en) * 2005-12-22 2009-02-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method incorporating a pressure shield
JP5141979B2 (ja) * 2006-09-29 2013-02-13 株式会社ニコン ステージ装置および露光装置
CN101636695B (zh) * 2007-01-30 2012-06-06 卡尔蔡司Smt有限责任公司 微光刻投射曝光设备的照明系统
US7969550B2 (en) * 2007-04-19 2011-06-28 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
NL1036192A1 (nl) * 2007-12-06 2009-06-09 Asml Netherlands Bv Lithographic apparatus having acoustic resonator.
NL1036290A1 (nl) * 2007-12-19 2009-06-22 Asml Netherlands Bv Lithographic apparatus.
NL1036433A1 (nl) * 2008-01-31 2009-08-03 Asml Netherlands Bv Lithographic apparatus, method and device manufacturing method.
NL2002902A1 (nl) * 2008-06-18 2009-12-22 Asml Netherlands Bv Lithographic apparatus having a feed forward pressure pulse compensation for the metrology frame.

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010026355A1 (en) * 2000-03-30 2001-10-04 Nikon Corporation Exposure apparatus, exposure method, and device manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111624731A (zh) * 2019-02-28 2020-09-04 上海微电子装备（集团）股份有限公司 一种物镜装置

Also Published As

Publication number Publication date
JP6502258B2 (ja) 2019-04-17
US10162267B2 (en) 2018-12-25
WO2014067707A1 (de) 2014-05-08
JP2015535096A (ja) 2015-12-07
US20150316854A1 (en) 2015-11-05

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