DE102012214316A1 - Halterung für eine Vielzahl von scheibenförmigen Werkstücken - Google Patents

Halterung für eine Vielzahl von scheibenförmigen Werkstücken Download PDF

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Publication number
DE102012214316A1
DE102012214316A1 DE102012214316.5A DE102012214316A DE102012214316A1 DE 102012214316 A1 DE102012214316 A1 DE 102012214316A1 DE 102012214316 A DE102012214316 A DE 102012214316A DE 102012214316 A1 DE102012214316 A1 DE 102012214316A1
Authority
DE
Germany
Prior art keywords
liquid
support
holder
impeller
support rollers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102012214316.5A
Other languages
German (de)
English (en)
Inventor
Walter Edmaier
Albert Kühnstetter
Carmen Ratz
Gregor Reeske
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siltronic AG
Original Assignee
Siltronic AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic AG filed Critical Siltronic AG
Priority to DE102012214316.5A priority Critical patent/DE102012214316A1/de
Priority to PCT/EP2013/066110 priority patent/WO2014023633A1/fr
Publication of DE102012214316A1 publication Critical patent/DE102012214316A1/de
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)
DE102012214316.5A 2012-08-10 2012-08-10 Halterung für eine Vielzahl von scheibenförmigen Werkstücken Withdrawn DE102012214316A1 (de)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE102012214316.5A DE102012214316A1 (de) 2012-08-10 2012-08-10 Halterung für eine Vielzahl von scheibenförmigen Werkstücken
PCT/EP2013/066110 WO2014023633A1 (fr) 2012-08-10 2013-07-31 Support pour une pluralité de pièces en forme de disque

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102012214316.5A DE102012214316A1 (de) 2012-08-10 2012-08-10 Halterung für eine Vielzahl von scheibenförmigen Werkstücken

Publications (1)

Publication Number Publication Date
DE102012214316A1 true DE102012214316A1 (de) 2014-02-13

Family

ID=48918390

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102012214316.5A Withdrawn DE102012214316A1 (de) 2012-08-10 2012-08-10 Halterung für eine Vielzahl von scheibenförmigen Werkstücken

Country Status (2)

Country Link
DE (1) DE102012214316A1 (fr)
WO (1) WO2014023633A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114433444A (zh) * 2022-04-11 2022-05-06 四川上特科技有限公司 用于晶圆涂覆玻璃粉的盛料转移装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110813864B (zh) * 2019-11-18 2021-11-23 长江存储科技有限责任公司 晶圆的清洗组件、清洗设备及清洗方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0856873A2 (fr) 1997-02-04 1998-08-05 Canon Kabushiki Kaisha Appareil et méthode de traitement de galette semiconductrice et procédé de fabrication d'une galette semiconductrice de type SOI
US6199563B1 (en) * 1997-02-21 2001-03-13 Canon Kabushiki Kaisha Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
DE102005028167A1 (de) * 2005-06-17 2005-12-01 Siltronic Ag Vorrichtung und Verfahren zur Behandlung einer Halbleiterscheibe mit einem flüssigen Medium

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5672212A (en) * 1994-07-01 1997-09-30 Texas Instruments Incorporated Rotational megasonic cleaner/etcher for wafers
JP2606150B2 (ja) * 1994-08-19 1997-04-30 日本電気株式会社 ウエット処理装置
JP4509501B2 (ja) * 2003-07-31 2010-07-21 Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 円板状部材のエッチング方法及び装置
US20090159100A1 (en) * 2007-12-24 2009-06-25 Texas Instruments Incorporated Two-piece magnetically coupled substrate roller used in megasonic cleaning process
US20110114121A1 (en) * 2009-11-16 2011-05-19 Miller Kenneth C Laminar flow tank

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0856873A2 (fr) 1997-02-04 1998-08-05 Canon Kabushiki Kaisha Appareil et méthode de traitement de galette semiconductrice et procédé de fabrication d'une galette semiconductrice de type SOI
US6199563B1 (en) * 1997-02-21 2001-03-13 Canon Kabushiki Kaisha Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method
DE102005028167A1 (de) * 2005-06-17 2005-12-01 Siltronic Ag Vorrichtung und Verfahren zur Behandlung einer Halbleiterscheibe mit einem flüssigen Medium

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114433444A (zh) * 2022-04-11 2022-05-06 四川上特科技有限公司 用于晶圆涂覆玻璃粉的盛料转移装置
CN114433444B (zh) * 2022-04-11 2022-07-01 四川上特科技有限公司 用于晶圆涂覆玻璃粉的盛料转移装置

Also Published As

Publication number Publication date
WO2014023633A1 (fr) 2014-02-13

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R016 Response to examination communication
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee