WO2014023633A1 - Support pour une pluralité de pièces en forme de disque - Google Patents

Support pour une pluralité de pièces en forme de disque Download PDF

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Publication number
WO2014023633A1
WO2014023633A1 PCT/EP2013/066110 EP2013066110W WO2014023633A1 WO 2014023633 A1 WO2014023633 A1 WO 2014023633A1 EP 2013066110 W EP2013066110 W EP 2013066110W WO 2014023633 A1 WO2014023633 A1 WO 2014023633A1
Authority
WO
WIPO (PCT)
Prior art keywords
holder
liquid
support rollers
support
impeller
Prior art date
Application number
PCT/EP2013/066110
Other languages
German (de)
English (en)
Inventor
Walter EDMAIER
Albert KÜHNSTETTER
Carmen Ratz
Gregor REESKE
Original Assignee
Siltronic Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siltronic Ag filed Critical Siltronic Ag
Publication of WO2014023633A1 publication Critical patent/WO2014023633A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements

Definitions

  • the invention relates to a holder for a plurality of disc-shaped workpieces, with which the workpieces can be held in a cleaning bath during cleaning.
  • silicon wafers which are used, for example, as substrates for the production of microelectronic components, usually silicon wafers, are repeatedly subjected to cleaning in the course of their manufacture, for example after polishing, epitaxial coating or after thermal treatment
  • the aim of the cleaning is, inter alia, on the wafer surface adhering particles as possible
  • EP0856873A2 describes such a bath cleaning process. Cleaning can be assisted by the action of ultra or megasonic. Since the cleaning effect is insufficient at the locations where the wafers are resting on the rollers or rods, and at the locations where the intensity of the megasonic is reduced by shadowing effects, EP0856873A2 provides a rotation of FIG Semiconductor disks in the cleaning bath. In this way, a uniform cleaning of the disc surfaces can be achieved.
  • the support rollers are driven by a motor and set in rotation about its longitudinal axis. The torque generated by the engine is represented by an im
  • EP0856873A2 provides a circulation and filtration of the cleaning fluid.
  • the flow conditions in the bath are optimized to minimize the number of particles from the gears to the
  • a holder for a plurality of disk-shaped workpieces comprising
  • Support rollers are rotatably mounted in the receptacles of the connecting elements and wherein the support rollers along their circumference grooves for receiving the workpieces.
  • the invention also relates to an arrangement
  • liquid pool comprising a holder of the type described above and a Liquid pool, wherein the liquid pool has complementary support and fixing elements, the
  • Liquid pool has means for driving the support rollers.
  • the rotatably supported support rollers are not part of the fluid pool in which the cleaning is performed, but part of a
  • rotatable support rollers are part of the removable holder, the workpieces must be brought into contact with the support rollers only once before the start of cleaning. When inserted into the cleaning bath or in several cleaning baths in succession, the workpieces always remain in the holder with the rotatable
  • Support rollers and do not need to be re-placed on support rollers in each cleaning bath.
  • the workpieces can be transported with the holder from cleaning bath to cleaning bath.
  • the invention therefore leads to a
  • Fig. 1 shows a holder according to the invention for
  • Fig. 2 shows a side view of an inventive
  • Fig. 3 shows a side view of an inventive
  • the holder 10 (FIG. 1) according to the invention for a multiplicity of disk-shaped workpieces 2 comprises two connecting elements 5 arranged in parallel and two or more rotatably mounted support rollers 1 extending between the connecting elements 5.
  • the connecting elements 5 are preferably flat elements, which may have one or more openings. Each of the connecting elements 5 has one of the number of
  • Support rollers 1 corresponding number of recordings, for example in the form of holes.
  • the support rollers 1 are parallel to each other and
  • the ends of the support rollers 1 are rotatably mounted in the receptacles of the two connecting elements 5.
  • the support rollers 1 are mounted in the receptacles by means of rolling bearings made of an abrasion-resistant and resistant to the cleaning liquids used material such as silicon carbide or aluminum oxide.
  • the support rollers 1 have a substantially cylindrical shape. Their lateral surface also has circumferential grooves 6, which can accommodate the disk-shaped workpieces and stabilize laterally.
  • Grooves are preferably designed so that only the outermost edge region of the disk-shaped workpieces 2 rests against the grooves 6 in order to keep the contact and thus the risk of contamination as low as possible.
  • the holder 10 has exactly three support rollers 1, since three support points allow safe storage of workpieces without risk of tipping. More than three
  • the parts of the holder are made of materials that are chemically resistant to the cleaning solutions used.
  • materials such as polytetrafluoroethylene
  • PTFE polyetheretherketone
  • PVDF polyvinylidene fluoride
  • the holder 10 can, as shown in FIGS. 2 and 3, insert into a liquid pool 21.
  • the liquid pool 21 has the shape of the holder 10 and complementary support ⁇ fixing elements 22, which support the holder from below and secure the side, without a fixed connection between the bracket 10 and the liquid pool 22
  • the liquid pool 21 has means for driving the support rollers 1.
  • Liquid pool 21 integrated means for driving the
  • Support rollers 1 are designed to be
  • the holder 10 according to the invention including the
  • the liquid pool 21 also preferably has the known from the prior art features such as supply and
  • the liquid pool 21 can with arbitrary
  • Cleaning fluids are filled according to the prior art. There may also be lines for a circulation of
  • Cleaning liquid possibly with filtration, be provided.
  • impellers 3 which are set in rotation by the supply of a liquid.
  • the holder 10 has in this case at least one impeller 3 per
  • Support roller 1 which is arranged coaxially with the relevant support roller 1 and fixedly connected thereto.
  • An impeller 3 is sufficient to the
  • Support role 1 to power. Therefore, it is preferable to have exactly one impeller 3 for each support roller 1
  • the impeller 3 is arranged at one end of the respective support roller 1 adjacent to one of the connecting elements 5. This is preferably Connecting element 5 between the impeller 3 and the grooved part of the support roller 1, which supports the workpieces. In this way, the greatest possible spatial separation of the drive is ensured by the workpieces. This is advantageous because possibly by the drive of the
  • the integrated into the liquid pool 21 means for
  • Liquid preferably leaves the liquid feed 23 through a nozzle which is oriented so that the
  • Fluid flow hits a portion of the blades of the impeller 3 and thus drives the impeller.
  • Rotation speed can be adjusted via the pressure of the liquid introduced.
  • the direction of rotation can be changed by adjusting the nozzle position.
  • the composition of the liquid supplied for the drive preferably corresponds to the composition of the cleaning liquid.
  • the liquid supplied to the drive is diverted from the supply of the cleaning liquid.
  • the impellers may be modified with bushes (see Fig. 1):
  • each of the impellers 3 is of a coaxially arranged bushing 4 in the form of a hollow cylinder surrounded, the lateral surface of which has a respect to the hollow cylinder along a secant inlet opening 7 and an outlet opening 8.
  • the bushes also have an end face, not shown in FIG. 1, so that the
  • Wheels 3 are completely separated from the cleaning fluid.
  • integrated liquid feeds 23 are preferably arranged complementary to the inlet openings 7 so that they are in the insertion of the holder 10 in the
  • Liquid pool 21 form a releasable, positive connection with the inlet openings 7.
  • liquid discharges 24 integrated in the liquid tank 21 are preferably arranged complementary to the outlet openings 8, so that, when the holder 10 is inserted into the liquid tank 21, they are detachable,
  • Liquid feeds 23 are supplied.
  • Holder in the liquid basin can be used for cleaning
  • Any disc-shaped, preferably round workpieces are used. Particularly preferred is the application for the cleaning of semiconductor wafers, for example consisting of silicon.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

L'invention concerne un support (10) pour une pluralité de pièces (2) en forme de disque, comprenant - deux éléments de liaison (5) disposés en parallèle dont chacun comporte au moins trois logements destinés à un nombre correspondant de rouleaux d'appui (1) et - au moins trois rouleaux d'appui (1) cylindrique lesquels sont disposés en parallèle et lesquels s'étendent entre les éléments de liaison (5), les extrémités des rouleaux d'appui (1) étant montées rotatives dans les logements des éléments de liaison (5), et les rouleaux d'appui (1) présentant le long de leur circonférence des rainures (6) destinées à recevoir les pièces (2). En outre, l'invention concerne un ensemble comprenant le support tel que décrit et un bassin de liquide.
PCT/EP2013/066110 2012-08-10 2013-07-31 Support pour une pluralité de pièces en forme de disque WO2014023633A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012214316.5A DE102012214316A1 (de) 2012-08-10 2012-08-10 Halterung für eine Vielzahl von scheibenförmigen Werkstücken
DE102012214316.5 2012-08-10

Publications (1)

Publication Number Publication Date
WO2014023633A1 true WO2014023633A1 (fr) 2014-02-13

Family

ID=48918390

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2013/066110 WO2014023633A1 (fr) 2012-08-10 2013-07-31 Support pour une pluralité de pièces en forme de disque

Country Status (2)

Country Link
DE (1) DE102012214316A1 (fr)
WO (1) WO2014023633A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110813864A (zh) * 2019-11-18 2020-02-21 长江存储科技有限责任公司 晶圆的清洗组件、清洗设备及清洗方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114433444B (zh) * 2022-04-11 2022-07-01 四川上特科技有限公司 用于晶圆涂覆玻璃粉的盛料转移装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0864572A (ja) * 1994-08-19 1996-03-08 Nec Corp ウエット処理装置
US5672212A (en) * 1994-07-01 1997-09-30 Texas Instruments Incorporated Rotational megasonic cleaner/etcher for wafers
EP0856873A2 (fr) 1997-02-04 1998-08-05 Canon Kabushiki Kaisha Appareil et méthode de traitement de galette semiconductrice et procédé de fabrication d'une galette semiconductrice de type SOI
US20070017901A1 (en) * 2003-07-31 2007-01-25 Komatsu Denshi Kinzoku Kabushiki Kaisha Method and apparatus for etching disk-like member
US20090159100A1 (en) * 2007-12-24 2009-06-25 Texas Instruments Incorporated Two-piece magnetically coupled substrate roller used in megasonic cleaning process
WO2011060443A2 (fr) * 2009-11-16 2011-05-19 Xyratex Technology Ltd. Réservoir à écoulement laminaire

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG63810A1 (en) * 1997-02-21 1999-03-30 Canon Kk Wafer processing apparatus wafer processing method and semiconductor substrate fabrication method
DE102005028167A1 (de) * 2005-06-17 2005-12-01 Siltronic Ag Vorrichtung und Verfahren zur Behandlung einer Halbleiterscheibe mit einem flüssigen Medium

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5672212A (en) * 1994-07-01 1997-09-30 Texas Instruments Incorporated Rotational megasonic cleaner/etcher for wafers
JPH0864572A (ja) * 1994-08-19 1996-03-08 Nec Corp ウエット処理装置
EP0856873A2 (fr) 1997-02-04 1998-08-05 Canon Kabushiki Kaisha Appareil et méthode de traitement de galette semiconductrice et procédé de fabrication d'une galette semiconductrice de type SOI
US20070017901A1 (en) * 2003-07-31 2007-01-25 Komatsu Denshi Kinzoku Kabushiki Kaisha Method and apparatus for etching disk-like member
US20090159100A1 (en) * 2007-12-24 2009-06-25 Texas Instruments Incorporated Two-piece magnetically coupled substrate roller used in megasonic cleaning process
WO2011060443A2 (fr) * 2009-11-16 2011-05-19 Xyratex Technology Ltd. Réservoir à écoulement laminaire

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110813864A (zh) * 2019-11-18 2020-02-21 长江存储科技有限责任公司 晶圆的清洗组件、清洗设备及清洗方法
CN110813864B (zh) * 2019-11-18 2021-11-23 长江存储科技有限责任公司 晶圆的清洗组件、清洗设备及清洗方法

Also Published As

Publication number Publication date
DE102012214316A1 (de) 2014-02-13

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