DE102012004219A1 - Stabile, konzentrierbare chemisch-mechanische Polierzusammensetzung, die frei von wasserlöslicher Cellulose ist - Google Patents

Stabile, konzentrierbare chemisch-mechanische Polierzusammensetzung, die frei von wasserlöslicher Cellulose ist Download PDF

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Publication number
DE102012004219A1
DE102012004219A1 DE102012004219A DE102012004219A DE102012004219A1 DE 102012004219 A1 DE102012004219 A1 DE 102012004219A1 DE 102012004219 A DE102012004219 A DE 102012004219A DE 102012004219 A DE102012004219 A DE 102012004219A DE 102012004219 A1 DE102012004219 A1 DE 102012004219A1
Authority
DE
Germany
Prior art keywords
mechanical polishing
chemical mechanical
polishing composition
water
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102012004219A
Other languages
German (de)
English (en)
Inventor
Hamed Lakrout
Jinjie Shi
Joseph Letizia
Xu Li
Thomas Kalantar
Francis Kelley
Keith Harris
Christopher Tucker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dow Global Technologies LLC
DuPont Electronic Materials Holding Inc
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Dow Global Technologies LLC
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc, Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of DE102012004219A1 publication Critical patent/DE102012004219A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/403—Chemomechanical polishing [CMP] of conductive or resistive materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/06—Other polishing compositions
    • C09G1/14—Other polishing compositions based on non-waxy substances
    • C09G1/16—Other polishing compositions based on non-waxy substances on natural or synthetic resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE102012004219A 2011-03-03 2012-03-01 Stabile, konzentrierbare chemisch-mechanische Polierzusammensetzung, die frei von wasserlöslicher Cellulose ist Withdrawn DE102012004219A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13/039,705 US8440097B2 (en) 2011-03-03 2011-03-03 Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition
US13/039,705 2011-03-03

Publications (1)

Publication Number Publication Date
DE102012004219A1 true DE102012004219A1 (de) 2012-09-06

Family

ID=46671507

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102012004219A Withdrawn DE102012004219A1 (de) 2011-03-03 2012-03-01 Stabile, konzentrierbare chemisch-mechanische Polierzusammensetzung, die frei von wasserlöslicher Cellulose ist

Country Status (7)

Country Link
US (1) US8440097B2 (https=)
JP (1) JP6118501B2 (https=)
KR (1) KR101829639B1 (https=)
CN (1) CN102690609B (https=)
DE (1) DE102012004219A1 (https=)
FR (1) FR2972195B1 (https=)
TW (1) TWI602909B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013016780B4 (de) 2012-10-09 2023-03-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemisch-mechanische Polierzusammensetzung und Chemisch-Mechanisches Polierverfahren

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8435896B2 (en) * 2011-03-03 2013-05-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable chemical mechanical polishing composition and methods relating thereto
US20140308814A1 (en) * 2013-04-15 2014-10-16 Applied Materials, Inc Chemical mechanical polishing methods and systems including pre-treatment phase and pre-treatment compositions
US9984895B1 (en) * 2017-01-31 2018-05-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten
JP7209620B2 (ja) * 2017-03-14 2023-01-20 株式会社フジミインコーポレーテッド 研磨用組成物、その製造方法ならびにこれを用いた研磨方法および基板の製造方法
US10676646B2 (en) * 2017-05-25 2020-06-09 Fujifilm Electronic Materials U.S.A., Inc. Chemical mechanical polishing slurry for cobalt applications
KR102570805B1 (ko) * 2019-11-01 2023-08-24 삼성에스디아이 주식회사 텅스텐 패턴 웨이퍼 연마용 cmp 슬러리 조성물 및 이를 이용한 텅스텐 패턴 웨이퍼 연마 방법
TWI896724B (zh) * 2020-09-29 2025-09-11 日商福吉米股份有限公司 研磨用組成物及其製造方法、研磨方法以及基板的製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7086935B2 (en) 2004-11-24 2006-08-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cellulose-containing polishing compositions and methods relating thereto

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SG99289A1 (en) 1998-10-23 2003-10-27 Ibm Chemical-mechanical planarization of metallurgy
US6375693B1 (en) 1999-05-07 2002-04-23 International Business Machines Corporation Chemical-mechanical planarization of barriers or liners for copper metallurgy
JP3551238B2 (ja) * 1999-09-07 2004-08-04 三菱住友シリコン株式会社 シリコンウェーハの研磨液及びこれを用いた研磨方法
US6679928B2 (en) 2001-04-12 2004-01-20 Rodel Holdings, Inc. Polishing composition having a surfactant
US6632259B2 (en) 2001-05-18 2003-10-14 Rodel Holdings, Inc. Chemical mechanical polishing compositions and methods relating thereto
JP4641155B2 (ja) * 2004-06-03 2011-03-02 株式会社日本触媒 化学機械研磨用の研磨剤
US7303993B2 (en) 2004-07-01 2007-12-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing compositions and methods relating thereto
US20060000808A1 (en) * 2004-07-01 2006-01-05 Fuji Photo Film Co., Ltd. Polishing solution of metal and chemical mechanical polishing method
US7384871B2 (en) 2004-07-01 2008-06-10 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing compositions and methods relating thereto
US7824568B2 (en) 2006-08-17 2010-11-02 International Business Machines Corporation Solution for forming polishing slurry, polishing slurry and related methods
JP2008091411A (ja) * 2006-09-29 2008-04-17 Fujifilm Corp 金属用研磨液
US20090032765A1 (en) * 2007-08-03 2009-02-05 Jinru Bian Selective barrier polishing slurry
TW200920828A (en) * 2007-09-20 2009-05-16 Fujifilm Corp Polishing slurry for metal and chemical mechanical polishing method
US9633865B2 (en) * 2008-02-22 2017-04-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Low-stain polishing composition
US20090215266A1 (en) 2008-02-22 2009-08-27 Thomas Terence M Polishing Copper-Containing patterned wafers
JP4521058B2 (ja) * 2008-03-24 2010-08-11 株式会社Adeka 表面改質コロイダルシリカおよびこれを含有するｃｍｐ用研磨組成物
US8540893B2 (en) 2008-08-04 2013-09-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and methods relating thereto

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7086935B2 (en) 2004-11-24 2006-08-08 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Cellulose-containing polishing compositions and methods relating thereto

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
Comeau et al.
Thomas et al.

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013016780B4 (de) 2012-10-09 2023-03-30 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemisch-mechanische Polierzusammensetzung und Chemisch-Mechanisches Polierverfahren

Also Published As

Publication number Publication date
US8440097B2 (en) 2013-05-14
US20120225556A1 (en) 2012-09-06
JP2012199531A (ja) 2012-10-18
FR2972195B1 (fr) 2015-08-28
CN102690609A (zh) 2012-09-26
JP6118501B2 (ja) 2017-04-19
KR20120100820A (ko) 2012-09-12
FR2972195A1 (fr) 2012-09-07
TW201302997A (zh) 2013-01-16
KR101829639B1 (ko) 2018-03-29
TWI602909B (zh) 2017-10-21
CN102690609B (zh) 2014-11-26

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R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee