DE102011120100A1 - Flussmittelzusammensetzung und Lötverfahren - Google Patents

Flussmittelzusammensetzung und Lötverfahren Download PDF

Info

Publication number
DE102011120100A1
DE102011120100A1 DE102011120100A DE102011120100A DE102011120100A1 DE 102011120100 A1 DE102011120100 A1 DE 102011120100A1 DE 102011120100 A DE102011120100 A DE 102011120100A DE 102011120100 A DE102011120100 A DE 102011120100A DE 102011120100 A1 DE102011120100 A1 DE 102011120100A1
Authority
DE
Germany
Prior art keywords
group
flux composition
flux
solder
hydrogen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102011120100A
Other languages
German (de)
English (en)
Inventor
David D. Fleming
Mike K. Gallagher
Kim Sang Ho
Mark R. Winkle
Xiang-Qian Liu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Electronic Materials International LLC
Original Assignee
Rohm and Haas Electronic Materials LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials LLC filed Critical Rohm and Haas Electronic Materials LLC
Publication of DE102011120100A1 publication Critical patent/DE102011120100A1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C217/00—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton
    • C07C217/52—Compounds containing amino and etherified hydroxy groups bound to the same carbon skeleton having etherified hydroxy groups or amino groups bound to carbon atoms of rings other than six-membered aromatic rings of the same carbon skeleton
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B23K1/203—Fluxing, i.e. applying flux onto surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • B23K35/3615—N-compounds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/365—Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
DE102011120100A 2010-12-02 2011-12-02 Flussmittelzusammensetzung und Lötverfahren Withdrawn DE102011120100A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/958,495 US8070047B1 (en) 2010-12-02 2010-12-02 Flux composition and method of soldering
US12/958,495 2010-12-02

Publications (1)

Publication Number Publication Date
DE102011120100A1 true DE102011120100A1 (de) 2012-06-06

Family

ID=45034317

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011120100A Withdrawn DE102011120100A1 (de) 2010-12-02 2011-12-02 Flussmittelzusammensetzung und Lötverfahren

Country Status (7)

Country Link
US (1) US8070047B1 (enExample)
JP (1) JP5865682B2 (enExample)
KR (1) KR101923965B1 (enExample)
CN (1) CN102615453B (enExample)
DE (1) DE102011120100A1 (enExample)
FR (1) FR2968226B1 (enExample)
TW (1) TWI438179B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20120060774A (ko) * 2010-12-02 2012-06-12 롬 앤드 하스 일렉트로닉 머트어리얼즈, 엘.엘.씨. 폴리아민 플럭스 조성물 및 솔더링 방법
US8434666B2 (en) * 2011-09-30 2013-05-07 Rohm And Haas Electronic Materials Llc Flux composition and method of soldering
JP6398464B2 (ja) * 2014-08-26 2018-10-03 三菱マテリアル株式会社 ハンダペースト用水溶性フラックス及びハンダペースト
CN109719422B (zh) * 2017-10-27 2022-03-29 株式会社田村制作所 焊料组合物及电子基板
DE102018112982A1 (de) * 2018-05-30 2019-12-05 STANNOL GmbH & Co. KG Aktivator für Flussmittelsysteme sowie Lötmittel zum Weichlöten von Aluminium
CN114728359A (zh) * 2019-11-26 2022-07-08 株式会社富士 元件安装方法及元件安装系统

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Also Published As

Publication number Publication date
FR2968226B1 (fr) 2014-07-18
TW201231441A (en) 2012-08-01
US8070047B1 (en) 2011-12-06
JP5865682B2 (ja) 2016-02-17
JP2012135813A (ja) 2012-07-19
CN102615453B (zh) 2014-12-03
KR20120060766A (ko) 2012-06-12
FR2968226A1 (fr) 2012-06-08
KR101923965B1 (ko) 2018-11-30
CN102615453A (zh) 2012-08-01
TWI438179B (zh) 2014-05-21

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Legal Events

Date Code Title Description
R012 Request for examination validly filed
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee