DE102011112964A1 - PV-PSA-Laminat durch PSA-Lamination auf einen Release-Film - Google Patents

PV-PSA-Laminat durch PSA-Lamination auf einen Release-Film Download PDF

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Publication number
DE102011112964A1
DE102011112964A1 DE102011112964A DE102011112964A DE102011112964A1 DE 102011112964 A1 DE102011112964 A1 DE 102011112964A1 DE 102011112964 A DE102011112964 A DE 102011112964A DE 102011112964 A DE102011112964 A DE 102011112964A DE 102011112964 A1 DE102011112964 A1 DE 102011112964A1
Authority
DE
Germany
Prior art keywords
psa
film
composite
release film
laminate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE102011112964A
Other languages
German (de)
English (en)
Inventor
Thomas Rhein
Michael Diehl
Torsten Frank
Michael Olbrich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Evonik Industries AG
Original Assignee
Evonik Industries AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evonik Industries AG filed Critical Evonik Industries AG
Priority to DE102011112964A priority Critical patent/DE102011112964A1/de
Priority to PCT/EP2012/066754 priority patent/WO2013037640A1/de
Priority to TW101133300A priority patent/TW201324821A/zh
Publication of DE102011112964A1 publication Critical patent/DE102011112964A1/de
Withdrawn legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/561—Batch processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/264—Pressure equalizing layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • B32B2037/268—Release layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/12—Photovoltaic modules
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1009—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using vacuum and fluid pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Laminated Bodies (AREA)
  • Photovoltaic Devices (AREA)
DE102011112964A 2011-09-15 2011-09-15 PV-PSA-Laminat durch PSA-Lamination auf einen Release-Film Withdrawn DE102011112964A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
DE102011112964A DE102011112964A1 (de) 2011-09-15 2011-09-15 PV-PSA-Laminat durch PSA-Lamination auf einen Release-Film
PCT/EP2012/066754 WO2013037640A1 (de) 2011-09-15 2012-08-29 Verfahren zur herstellung eines laminats aus photovoltaik- zellen und pressure sensitive adhesive-folien mittels eines release-films
TW101133300A TW201324821A (zh) 2011-09-15 2012-09-12 藉由將壓感性黏著劑（ｐｓａ）層合至離型膜上而成之光伏打電池－壓感性黏著劑（ｐｖ－ｐｓａ）層合體

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102011112964A DE102011112964A1 (de) 2011-09-15 2011-09-15 PV-PSA-Laminat durch PSA-Lamination auf einen Release-Film

Publications (1)

Publication Number Publication Date
DE102011112964A1 true DE102011112964A1 (de) 2013-03-21

Family

ID=46796572

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102011112964A Withdrawn DE102011112964A1 (de) 2011-09-15 2011-09-15 PV-PSA-Laminat durch PSA-Lamination auf einen Release-Film

Country Status (3)

Country Link
DE (1) DE102011112964A1 (zh)
TW (1) TW201324821A (zh)
WO (1) WO2013037640A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015014646A1 (de) * 2013-08-01 2015-02-05 Tesa Se Verfahren zum formen eines körpers in einer form
CN110165007A (zh) * 2019-06-10 2019-08-23 浙江正泰太阳能科技有限公司 一种叠瓦电池串的连接方法及叠瓦组件的制造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111463321B (zh) * 2020-04-13 2021-09-24 上海绿兆新能源科技有限公司 一种反光贴膜光伏组件用焊接头

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3924393A1 (de) 1989-07-24 1991-01-31 Roehm Gmbh Wasserloeslicher druckempfindlicher hauthaftkleber, dessen verwendung und damit ausgeruestete mittel
DE19653605A1 (de) 1996-12-20 1998-06-25 Roehm Gmbh Haft- und Bindemittel für dermale oder transdermale Therapiesysteme
DE19653606A1 (de) 1996-12-20 1998-06-25 Roehm Gmbh Haft- und Bindemittel aus (Meth)acrylatpolymer, organischer Säure und Weichmacher
DE20220444U1 (de) * 2001-10-12 2003-09-04 Bayer Ag Photovoltaik-Module mit einer thermoplastischen Schmelzklebeschicht
DE102008024551A1 (de) * 2008-05-21 2009-11-26 Tesa Se Verfahren zur Verkapselung von optoelektronischen Bauteilen
DE102009047906A1 (de) * 2009-10-01 2011-04-07 Bayer Materialscience Ag Herstellung von Solarmodulen
DE102010030074A1 (de) 2010-06-15 2011-12-15 Evonik Degussa Gmbh Kunststoff-Photovoltaik-Modul und Verfahren zu seiner Herstellung
US20120067393A1 (en) * 2010-09-17 2012-03-22 Fuji Electric Co., Ltd. Solar cell module and method of manufacturing the same
DE102011084054A1 (de) 2010-12-07 2012-06-14 Evonik Degussa Gmbh Photovoltaik(PV)-PSA-Verbund und Verwendung zur Herstellung von PV-Modulen durch Flüssigeinbettung

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4443317A1 (de) * 1994-12-06 1996-06-13 Roehm Gmbh Kunststoff-Verbunde mit integrierten Energiegewinnungselementen
EP1302988A3 (de) * 2001-10-12 2007-01-24 Bayer MaterialScience AG Photovoltaik-Module mit einer thermoplastischen Schmelzklebeschicht sowie ein Verfahren zu ihrer Herstellung
US20060100299A1 (en) * 2002-07-24 2006-05-11 Ranjit Malik Transformable pressure sensitive adhesive tape and use thereof in display screens
KR100970194B1 (ko) * 2004-06-02 2010-07-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 제조방법
DE502007001359D1 (de) * 2006-03-17 2009-10-01 Polyic Gmbh & Co Kg Verfahren zur Herstellung eines aktiven oder passiven elektronischen Bauteils und elektronisches Bauteil

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3924393A1 (de) 1989-07-24 1991-01-31 Roehm Gmbh Wasserloeslicher druckempfindlicher hauthaftkleber, dessen verwendung und damit ausgeruestete mittel
DE19653605A1 (de) 1996-12-20 1998-06-25 Roehm Gmbh Haft- und Bindemittel für dermale oder transdermale Therapiesysteme
DE19653606A1 (de) 1996-12-20 1998-06-25 Roehm Gmbh Haft- und Bindemittel aus (Meth)acrylatpolymer, organischer Säure und Weichmacher
DE20220444U1 (de) * 2001-10-12 2003-09-04 Bayer Ag Photovoltaik-Module mit einer thermoplastischen Schmelzklebeschicht
DE102008024551A1 (de) * 2008-05-21 2009-11-26 Tesa Se Verfahren zur Verkapselung von optoelektronischen Bauteilen
DE102009047906A1 (de) * 2009-10-01 2011-04-07 Bayer Materialscience Ag Herstellung von Solarmodulen
DE102010030074A1 (de) 2010-06-15 2011-12-15 Evonik Degussa Gmbh Kunststoff-Photovoltaik-Modul und Verfahren zu seiner Herstellung
US20120067393A1 (en) * 2010-09-17 2012-03-22 Fuji Electric Co., Ltd. Solar cell module and method of manufacturing the same
DE102011084054A1 (de) 2010-12-07 2012-06-14 Evonik Degussa Gmbh Photovoltaik(PV)-PSA-Verbund und Verwendung zur Herstellung von PV-Modulen durch Flüssigeinbettung

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015014646A1 (de) * 2013-08-01 2015-02-05 Tesa Se Verfahren zum formen eines körpers in einer form
CN110165007A (zh) * 2019-06-10 2019-08-23 浙江正泰太阳能科技有限公司 一种叠瓦电池串的连接方法及叠瓦组件的制造方法

Also Published As

Publication number Publication date
WO2013037640A1 (de) 2013-03-21
TW201324821A (zh) 2013-06-16

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R163 Identified publications notified
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20140401